CN213028305U - Heating element and infrared imaging equipment - Google Patents
Heating element and infrared imaging equipment Download PDFInfo
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- CN213028305U CN213028305U CN202022017217.7U CN202022017217U CN213028305U CN 213028305 U CN213028305 U CN 213028305U CN 202022017217 U CN202022017217 U CN 202022017217U CN 213028305 U CN213028305 U CN 213028305U
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Abstract
The utility model discloses a heating element and infrared imaging equipment, it includes: the heating device comprises a power supply, a power supply management module and a heating module; the power supply is connected with the power supply management module, the heating module acquires the current working temperature of the electronic equipment and controls the power supply management module to be powered on, the power supply management module after being powered on controls the heating module to work, so that the working temperature of the electronic equipment reaches the preset temperature, and when/after the working temperature of the electronic equipment reaches the preset temperature, the power supply management module controls the power supply to supply power to the electronic equipment. The heating component can heat electronic equipment such as an infrared detector and the like, so that the electronic equipment can normally work in an extremely low-temperature environment, such as a-55 ℃ environment, is small in size and is beneficial to system integration.
Description
Technical Field
The utility model relates to an infrared imaging field specifically is a heating element and infrared imaging equipment.
Background
The working environment temperature of the existing infrared imaging equipment capable of stably and accurately measuring the temperature is above-20 ℃. However, the working temperature of various conventional industrial semiconductor components for assembling and forming the infrared imaging equipment is above minus 40 ℃, and the working stability and reliability of the components are rapidly reduced as the temperature is closer to the lower limit of the temperature, so that the existing infrared imaging equipment cannot perform stable and accurate temperature measurement at the ambient temperature below minus 20 ℃, and cannot meet the working requirement in an extremely low temperature environment, such as a minus 55 ℃, and the application range of the infrared imaging equipment is greatly limited.
SUMMERY OF THE UTILITY MODEL
The utility model provides a not enough to prior art, the utility model provides a heating element and infrared imaging equipment, heating element can heat electronic equipment such as infrared detector, makes it under extreme low temperature environment, also can normally work if under the-55 ℃ environment, and small, is favorable to system integration.
In order to achieve the above object, the utility model provides a following technical scheme:
there is provided a heating assembly comprising: the heating device comprises a power supply, a power supply management module and a heating module;
the power supply is connected with the power supply management module, the heating module acquires the current working temperature of the electronic equipment and controls the power supply management module to be powered on, the power supply management module after being powered on controls the heating module to work, so that the working temperature of the electronic equipment reaches the preset temperature, and when/after the working temperature of the electronic equipment reaches the preset temperature, the power supply management module controls the power supply to supply power to the electronic equipment.
Preferably, the heating module includes: the heating device comprises a heating sheet, a temperature sensor and a heating control element;
the temperature sensor stores a low-temperature alarm threshold value, the temperature sensor is automatically loaded after being electrified, the current working temperature of the electronic equipment is obtained, when the obtained current working temperature of the electronic equipment is smaller than or equal to the low-temperature alarm threshold value, the temperature sensor outputs an alarm signal, and the heating control element receives the alarm signal and controls the heating sheet to preheat, so that the current working temperature of the electronic equipment is increased to a first preset value.
Preferably, the working temperature of the heating control element is less than or equal to-40 ℃.
Preferably, the heating control element is a MOSFET.
Preferably, when the current working temperature of the electronic device rises to a first preset value, the power management module is powered on, and at this time, the power management module receives a current working temperature signal of the electronic device, which is acquired by the temperature sensor in real time, and controls the heating control element to work according to the temperature signal, so that the heating sheet continues to heat under the control of the heating control element, and the current working temperature of the electronic device reaches a second preset value.
Preferably, when/after the current working temperature of the electronic device reaches a second preset value, the power management module controls the power supply to supply power to the electronic device.
Preferably, the second preset value is greater than the first preset value.
Preferably, the first preset value is-30 ℃ and the second preset value is-20 ℃.
An infrared imaging device including the heating assembly is also provided.
Preferably, the infrared imaging apparatus further includes: the device comprises a lens assembly, a middle mounting seat with an internal mounting space, a base and an infrared detector assembly; and the heating plate is arranged on the peripheral surface of the middle mounting seat. .
Compared with the prior art, the utility model discloses possess following beneficial effect:
the utility model discloses a heat supply subassembly only needs to select the MOSFET that can work at the ring temperature that is less than or equal to-40 ℃ (like-55 ℃) as heating control element, combines power management module, temperature sensor and heating plate simultaneously, can realize the gentle intensification to electronic equipment operational environment temperature to solve the problem that components and parts can't work in extremely cold environment, make electronic equipment can normally work under extremely low temperature environment, with the range of application of greatly expanded electronic equipment; meanwhile, the heat supply assembly is small in size and convenient to integrate, so that the whole size of equipment (such as infrared imaging equipment) containing the dry heat supply assembly can be greatly reduced, the whole weight of the equipment is favorably reduced, the carrying and the moving are convenient, and the application range of the equipment is further enlarged.
Drawings
Fig. 1 is a schematic structural view of a heating assembly in embodiment 1 of the present invention;
fig. 2 is an overall structure diagram of an infrared imaging device in embodiment 2 of the present invention;
fig. 3 is an exploded view of an infrared imaging device in embodiment 2 of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Example 1:
the present embodiment provides a heating assembly for heating electronic devices such as an infrared detector, as shown in fig. 1, which includes: the system comprises a power supply 1, a power supply management module 2 and a heating module 3;
the power supply 1 is respectively connected with the power supply management module 2 and the heating module 3, the heating module 3 acquires the current working temperature of the electronic device P (such as an infrared detector), the power supply management module 2 is controlled to be powered on, the powered power supply management module 2 controls the power supply 1 to supply power to the heating module 3, the heating module 3 works, the working temperature of the electronic device reaches the preset temperature, and when the working temperature of the electronic device P reaches the preset temperature/after the working temperature of the electronic device P reaches the preset temperature, the power supply management module 2 controls the power supply 1 to supply power to the electronic device P.
Specifically, the heating module 3 includes: a heating sheet 31, a temperature sensor 32, and a heating control element 33; wherein, the temperature sensor 32 has a memory (such as an EEPROM memory) and an alarm unit, and the memory stores a low temperature alarm threshold value; the temperature sensor 32 is powered on and then automatically loads the low-temperature alarm threshold value, and obtains the current working temperature of the electronic device P, when the obtained current working temperature of the electronic device P is less than or equal to the low-temperature alarm threshold value, the alarm unit outputs an alarm signal, and the heating control element 33 receives the alarm signal (which is also a preheating signal) and then controls the heating sheet 31 (powered by the power supply 1) to preheat, so that the current working temperature of the electronic device P rises to a first preset value (such as-30 ℃); in this embodiment, the heating control element 33 is a Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) with an operating temperature less than or equal to-40 ℃ (e.g., -55 ℃), wherein when the MOSFET is used as a control switch of the heating plate 31, the MOSFET has the advantages of sensitive response, small volume, capability of operating in an extremely low temperature environment, and the like, and can timely and rapidly realize heating control of the heating plate 31.
In addition, when the current working temperature of the electronic device P rises to the first preset value, the power management module 2 is powered on, and at this time, the power management module 2 receives the current working temperature signal of the electronic device P acquired by the temperature sensor 32 in real time, and controls the heating control element 33 to work through a PWM controller and the like according to the temperature signal, so that the heating sheet 31 continues to heat under the control of the heating control element 33, and the current working temperature of the electronic device P reaches a second preset value (the second preset value is greater than the first preset value, for example, the second preset value is-20 ℃);
when/after the current working temperature of the electronic device P reaches a second preset value, the power management module 2 controls the power supply 1 to supply power to the electronic device P, so as to complete the starting operation of the electronic device P.
In addition, because some electronic devices P, such as infrared detectors, are sensitive to temperature, in order to ensure stable operation and accurate temperature measurement of the infrared detectors, here, the temperature sensor 31, the heating plate 32, the heating control unit 33 and the power management module 2 operate in a closed-loop control mode (which can be implemented by a PID control algorithm), that is, the temperature sensor 32 obtains the current operating temperature of the electronic device P in real time and feeds the current operating temperature back to the power management module 2, the power management module 2 controls the heating control unit 33, and the heating control unit 33 controls the heating plate 32 to operate again, so that the temperature can rise gently in the heating process, the temperature fluctuation is reduced to a small extent, and the thermostatic control is realized.
Therefore, in the embodiment, only the MOSFET which can work at the ring temperature of less than or equal to-40 ℃ (such as-55 ℃) is selected as the heating control element, and meanwhile, the power management module, the temperature sensor and the heating sheet are combined, so that the mild temperature rise of the working environment temperature of the electronic equipment can be realized, the problem that components cannot work in an extremely cold environment is solved, the electronic equipment can normally work in the extremely low temperature environment, and the application range of the electronic equipment is greatly expanded.
Example 2:
the present embodiment provides an infrared imaging apparatus 100, as shown in fig. 2 to 3, the infrared imaging apparatus 100 including: a lens assembly 101, a middle mount 102 having an inner mounting space S, a base 103, an infrared detector assembly 104, and a heating assembly in embodiment 1;
two ends of the middle mounting seat 102 are detachably connected with the lens assembly 101 and the base 103 respectively, and the infrared detector assembly 104 is partially/integrally mounted in the internal mounting space S of the middle mounting seat 102; meanwhile, at least one heating plate mounting position 1021 for mounting the heating plate 31 is arranged on the peripheral surface of the middle mounting seat 102.
Furthermore, in the present embodiment, there are a plurality of, for example, 4, heating plate installation locations 1021, which are uniformly arranged on the outer peripheral surface of the middle installation seat 102, and each heating plate installation location 1021 is correspondingly provided with one heating plate 31, so as to uniformly heat the working environment of the infrared detector assembly 104 inside the middle installation seat 102.
Meanwhile, to prevent the heating sheet 31 from falling off, the infrared imaging apparatus 100 further includes a fixing sheet 105 which fixes the heating sheet 31 on the heating sheet mounting portion 1021 by detachable connection with the heating sheet mounting portion 1021 of the middle mounting base 102.
Further, to facilitate uniform heating and rapid heat transfer, the mid-mount 102 and/or base 103 is made of a thermally conductive material, such as a metal.
In this embodiment, since the heat supply module in embodiment 1 is small in size and easy to integrate, the size of the infrared imaging device can be reduced to 60mm × 100mm × 60mm, which is beneficial to reducing the overall weight, facilitating carrying and moving, and further increasing the application range of the device.
To sum up, the heat supply assembly of the present invention only needs to select the MOSFET capable of working at the ring temperature of less than or equal to-40 ℃ (e.g., -55 ℃) as the heating control element, and combines the power management module, the temperature sensor and the heating plate, so as to realize the gentle temperature rise of the working environment temperature of the electronic device, so as to solve the problem that the components and parts cannot work in the extremely cold environment, so that the electronic device can normally work in the extremely low temperature environment, and the application range of the electronic device is greatly expanded; meanwhile, the heat supply assembly is small in size and convenient to integrate, so that the whole size of equipment (such as infrared imaging equipment) containing the dry heat supply assembly can be greatly reduced, the whole weight of the equipment is favorably reduced, the carrying and the moving are convenient, and the application range of the equipment is further enlarged.
It should be noted that the technical features of the above embodiments 1 to 2 can be arbitrarily combined, and the technical solutions obtained by combining the technical features belong to the scope of the present application. And in this document, terms such as "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. A heating assembly, comprising: the heating device comprises a power supply, a power supply management module and a heating module;
the power supply is connected with the power supply management module, the heating module acquires the current working temperature of the electronic equipment and controls the power supply management module to be powered on, the power supply management module after being powered on controls the heating module to work, so that the working temperature of the electronic equipment reaches the preset temperature, and when/after the working temperature of the electronic equipment reaches the preset temperature, the power supply management module controls the power supply to supply power to the electronic equipment.
2. The heating assembly of claim 1, wherein the heating module comprises: the heating device comprises a heating sheet, a temperature sensor and a heating control element;
the temperature sensor stores a low-temperature alarm threshold value, the temperature sensor is automatically loaded after being electrified, the current working temperature of the electronic equipment is obtained, when the obtained current working temperature of the electronic equipment is smaller than or equal to the low-temperature alarm threshold value, the temperature sensor outputs an alarm signal, and the heating control element receives the alarm signal and controls the heating sheet to preheat, so that the current working temperature of the electronic equipment is increased to a first preset value.
3. The heating assembly of claim 2, wherein the heating control element operating temperature is less than or equal to-40 ℃.
4. The heating assembly of claim 2, wherein the heating control element is a MOSFET.
5. The heating assembly of claim 2, wherein when the current operating temperature of the electronic device rises to the first preset value, the power management module is powered on, and at this time, the power management module receives the current operating temperature signal of the electronic device, which is obtained by the temperature sensor in real time, and controls the heating control element to operate according to the temperature signal, so that the heating sheet continues to heat under the control of the heating control element, and the current operating temperature of the electronic device reaches the second preset value.
6. The heating assembly of claim 5, wherein the power management module controls the power source to supply power to the electronic device when/after a current operating temperature of the electronic device reaches a second preset value.
7. The heating assembly of claim 5, wherein the second predetermined value is greater than the first predetermined value.
8. The heating assembly of claim 7, wherein the first predetermined value is-30 ℃ and the second predetermined value is-20 ℃.
9. An infrared imaging device comprising the heating assembly of any of claims 2-8.
10. The infrared imaging device of claim 9, characterized in that the infrared imaging device further comprises: the device comprises a lens assembly, a middle mounting seat with an internal mounting space, a base and an infrared detector assembly; and the heating plate is arranged on the peripheral surface of the middle mounting seat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022017217.7U CN213028305U (en) | 2020-09-15 | 2020-09-15 | Heating element and infrared imaging equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022017217.7U CN213028305U (en) | 2020-09-15 | 2020-09-15 | Heating element and infrared imaging equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213028305U true CN213028305U (en) | 2021-04-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202022017217.7U Active CN213028305U (en) | 2020-09-15 | 2020-09-15 | Heating element and infrared imaging equipment |
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| CN (1) | CN213028305U (en) |
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- 2020-09-15 CN CN202022017217.7U patent/CN213028305U/en active Active
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