CN111998951A - Non-contact temperature measuring device - Google Patents
Non-contact temperature measuring device Download PDFInfo
- Publication number
- CN111998951A CN111998951A CN202010836365.3A CN202010836365A CN111998951A CN 111998951 A CN111998951 A CN 111998951A CN 202010836365 A CN202010836365 A CN 202010836365A CN 111998951 A CN111998951 A CN 111998951A
- Authority
- CN
- China
- Prior art keywords
- temperature
- power supply
- thermal imager
- thermal
- controller
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001681 protective effect Effects 0.000 claims abstract description 20
- 238000004321 preservation Methods 0.000 claims abstract description 16
- 239000010408 film Substances 0.000 claims description 28
- 238000009413 insulation Methods 0.000 claims description 13
- 239000010409 thin film Substances 0.000 claims description 12
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 claims description 5
- 229910052982 molybdenum disulfide Inorganic materials 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 4
- 230000002159 abnormal effect Effects 0.000 claims description 3
- 229920002545 silicone oil Polymers 0.000 claims description 2
- 238000012360 testing method Methods 0.000 abstract description 10
- 238000009529 body temperature measurement Methods 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 238000005461 lubrication Methods 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000003974 emollient agent Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/0003—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/04—Casings
- G01J5/041—Mountings in enclosures or in a particular environment
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/08—Protective devices, e.g. casings
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Radiation Pyrometers (AREA)
Abstract
The invention provides a non-contact temperature measuring device, which is applied to a spacecraft thermal test and comprises a thermal imager; the thermal imager is provided with a heat-preservation protective cover outside, a first thermal protection device is arranged between the surface of the thermal imager and the heat-preservation protective cover, the first thermal protection device is used for performing heat preservation protection on the thermal imager, and the thermal imager can be subjected to thermal protection by arranging the heat-preservation protective cover and the first thermal protection device on the surface of the thermal imager, so that the thermal imager can adapt to a vacuum low-temperature environment; the thermal imager can be used for measuring the temperature of the surface of the spacecraft under the condition of not contacting the surface of the spacecraft.
Description
Technical Field
The invention relates to the technical field of spacecraft ground test and experiments, in particular to a non-contact temperature measuring device.
Background
The spacecraft vacuum thermal test is used as a test item with the most complex state, the most expensive and the most time-consuming in the spacecraft development process, and the temperature measurement of a test piece product is one of key technologies. The current commonly used temperature measurement modes comprise thermocouple, platinum resistor, thermistor and other contact temperature measurement modes, and are mainly used for accurately measuring the temperature in the thermal balance and thermal vacuum test process and providing effective data for the temperature control of a test piece. Along with the improvement of the design complexity of the spacecraft model and the subsystem structure, the irregularity of the structure surface is further increased, the difficulty requirement of the temperature measurement sensor pasting process is increased, and the conventional contact temperature measurement is difficult to realize in individual areas. In addition, the interior of the vacuum thermal test equipment is in a cold and black environment, so that the structure or the motion state of a product in the equipment cannot be observed through a common visible light monitoring camera.
Disclosure of Invention
In view of the above defects or shortcomings in the prior art, it is desirable to provide a non-contact temperature measuring device, which can meet the use requirements of vacuum low-temperature environment conditions, provide a technical means for the non-contact temperature measurement of the structure surface of a spacecraft product and the monitoring of the structure motion state, and has important engineering value and positive practical significance.
In a first aspect, the invention provides a non-contact temperature measuring device, comprising a thermal imager; the thermal imager is characterized in that a heat-preservation protective cover is arranged outside the thermal imager, a first thermal protection device is arranged between the surface of the thermal imager and the heat-preservation protective cover, the first thermal protection device is used for performing heat preservation protection on the thermal imager, the thermal imager can be subjected to thermal protection by arranging the heat-preservation protective cover and the first thermal protection device on the surface of the thermal imager, the thermal imager can adapt to a vacuum low-temperature environment, and the thermal imager can be used for measuring the temperature of the surface of the spacecraft under the condition of not contacting the surface of the spacecraft.
Further, the outer surface of the heat-preservation protective cover is polished, so that heat exchange between the thermal imager and the outside radiation is reduced.
Further, the first thermal protection device comprises a first thin film heater arranged on the surface of the thermal imager and a first thermal insulation film arranged on the outer side of the first thin film heater.
Furthermore, the focusing mechanical accessory of the thermal imager is lubricated by the mixture of molybdenum disulfide and silicon oil, so that the lens of the thermal imager is not polluted, and the normal use of the thermal imager is ensured.
The surface of the cradle head is provided with a second film heater and a second heat insulation film arranged on the outer side of the second film heater; the second film heater and the second heat insulation film are arranged on the surface of the tripod head, so that the tripod head can work normally in a vacuum low-temperature environment;
the thermal imager is fixedly arranged on the holder, the field range of the thermal imager can be adjusted through the holder, and the utilization rate of the thermal imager is improved.
The control system comprises a control box, wherein an electric connector, an LAN interface and a power supply interface are arranged on the control box, a controller and an exchanger are arranged in the control box, the controller is electrically connected with the exchanger, and the exchanger is connected with an industrial personal computer outside the control box through the LAN interface; the switch and the power supply interface are both connected with the electric connector, and the thermal imager can be electrically connected with the power supply interface and the switch through the electric connector; the holder is electrically connected with the power supply interface and the controller through the electric connector;
furthermore, a first temperature controller and a first temperature control power supply are arranged in the control box, and a signal output end of the first temperature controller is connected with the first temperature control power supply and is used for controlling the on-off of the first temperature control power supply;
a first temperature measuring head of the first temperature controller is arranged between the first film heater and the thermal imager, and the first temperature measuring head can be electrically connected with the first temperature measuring instrument through the electric connector; the voltage input end of the first temperature control power supply is connected with the power supply interface, the voltage output end of the first temperature control power supply is connected with the electric connector, and the first film heater can pass through the electric connector and be connected with the voltage output end of the first temperature control power supply.
Furthermore, a second temperature control instrument and a second temperature control power supply are arranged in the electric control box, and a signal output end of the second temperature control instrument is connected with the second temperature control power supply and is used for controlling the on-off of the second temperature control power supply;
the second temperature measuring head of the second temperature controller is arranged between the holder and the second film heater, and the second temperature measuring head can be electrically connected with the second temperature controller through the electric connector; the voltage input end of the second temperature control power supply is electrically connected with the power supply interface, the voltage output end of the second temperature control power supply is electrically connected with the electric connector, and the second film heater can pass through the electric connector and be connected with the voltage output end of the second temperature control power supply.
Furthermore, the first temperature controller and the second temperature controller are both electrically connected with the controller.
Furthermore, a temperature control alarm is arranged in the control box, the temperature control alarm is electrically connected with the controller, and the thermal imager or/and the holder give an alarm when the temperature is abnormal.
Advantageous effects
The invention provides a non-contact temperature measuring device, which is applied to a spacecraft thermal test and comprises a thermal imager; the thermal imager is characterized in that a heat-preservation protective cover is arranged outside the thermal imager, a first thermal protection device is arranged between the surface of the thermal imager and the heat-preservation protective cover, the first thermal protection device is used for performing heat preservation protection on the thermal imager, the thermal imager can be subjected to thermal protection by arranging the heat-preservation protective cover and the first thermal protection device on the surface of the thermal imager, the thermal imager can adapt to a vacuum low-temperature environment, and the thermal imager can be used for measuring the temperature of the surface of the spacecraft under the condition of not contacting the surface of the spacecraft.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:
FIG. 1 is a schematic diagram of a non-contact temperature measuring device of the present invention;
FIG. 2 is a schematic structural diagram of a thermal imager and a pan-tilt according to an embodiment of the invention;
fig. 3 is a schematic diagram of a control box of an embodiment of the present invention.
Detailed Description
The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and not restrictive of the invention. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.
In a first aspect, the non-contact temperature measuring device provided by the application is mainly applied to aerospace systems and component-level vacuum thermal experiments: the experiment is carried out by setting the vacuum container 107 to simulate the temperature lower than 100K and the vacuum degree higher than 6.65 multiplied by 10-3Pa, the cradle head 13 and the thermal imager 11 are arranged inside the vacuum container 107, the cradle head 13 can be fixed on the inner wall of the vacuum container through the connecting cable 104, the control box 14 is arranged on the outer side of the vacuum container 107, the cradle head 13 and the thermal imager 11 are communicated through the cable 104, and the thermal imager 11 and the cradle head 13 are powered, controlled in temperature and communicated.
Referring to fig. 1 and 2, a non-contact temperature measuring device provided by the present invention includes a thermal imager 11; a heat-insulating protective cover 12 is arranged outside the thermal imager 11, a first thermal protection device 110 is arranged between the surface of the thermal imager 11 and the heat-insulating protective cover 12, and the first thermal protection device 110 is used for heat-insulating protection of the thermal imager 11; the thermal protection of the thermal imager can be performed by arranging the heat-insulating protective cover 12 and the first thermal protection device 110 on the surface of the thermal imager 11, so that the thermal imager can adapt to a vacuum low-temperature environment. The surface of the spacecraft can be measured by the thermal imager under the condition of not contacting the surface of the spacecraftThe device can be used at a temperature of less than 100K and a vacuum degree of more than 6.65X 10-3The temperature measurement device can normally work under the Pa environment, the measurement range is-40-150 ℃, the temperature measurement accuracy is better than +/-2 ℃, and an effective non-contact temperature measurement means is provided for a spacecraft thermal test.
Referring to fig. 1 and 2, the thermal imager 11 is isolated from the outside by the thermal insulation protective cover 12, and the outer surface of the thermal insulation protective cover 12 is polished to reduce the radiation heat exchange between the thermal imager and the outside and achieve the thermal insulation effect, wherein the thermal insulation protective cover 12 may be made of, but not limited to, aluminum alloy or stainless steel; the thermal imager can also work normally at high temperature by arranging the heat-insulating protective cover 12 on the surface of the thermal imager.
Further, referring to fig. 1 and 2, the first thermal protection device 110 includes a first thin film heater 112 disposed on the surface of the thermal imager 11 and a first thermal insulation film 111 disposed outside the first thin film heater 112, and the thermal imager 11 is heated by the first thin film heater 112, so as to ensure that the surface of the thermal imager 11 can be at 0-20 ℃ in a low temperature environment, and ensure that the thermal imager 11 normally operates. The thermal imager 11 is wrapped by the first thermal insulation film 111 outside the first thin film heater 112 to reduce the radiation heat exchange between the thermal imager 11 and the outside, and the first thermal insulation film 111 may be, but is not limited to, an aluminum-plated film.
Further, the thermal imager 11's in this application focusing subassembly adopts anhydrous acetone to wash, washs the grease on focusing subassembly surface, then adopts the mixture lubrication of molybdenum disulfide and silicon oil, and this kind of processing mode can avoid the grease to pollute the lens, and silicon oil can not solidify under the condition that is less than-50 degrees centigrade yet, and the molybdenum disulfide powder is fine emollient. Therefore, the mixture of the silicone oil and the molybdenum disulfide can also ensure the lubrication of mechanical parts in a low-temperature environment, thereby ensuring the normal use of the thermal imager 11.
Further, referring to fig. 1 and 2, the non-contact temperature measuring device further includes a holder 13, and a second film heater 132 and a second heat insulation film 131 arranged outside the second film heater 132 are arranged on the surface of the holder 13; the second film heater 132 and the second heat insulation film 131 are arranged on the surface of the pan/tilt head 13, so that the pan/tilt head 13 can work normally in a vacuum low-temperature environment.
The holder has the motion functions of horizontal-180 degrees- +180 degrees and vertical-60 degrees- +60 degrees, the thermal imager 11 is fixedly arranged on the holder 13, the field range of the thermal imager 11 can be adjusted through the holder 13, and the utilization rate of the thermal imager 11 is improved.
Further, referring to fig. 1 and 3, the non-contact temperature measuring device further includes a control system, the control system is connected to the thermal imager 11 and the cradle head 13 through a cable 104, and specifically, the control system can be connected to the thermal imager 11 and the cradle head 13 through a plug-in type electrical connector. Referring to fig. 3, the control system includes a control box 14, an electrical connector 218, a LAN interface 210 and a power supply interface 220 are disposed on the control box 14, the electrical connector 218 is an integrated electrical connector of type Y2-36; a controller 209 and a switch 208 are arranged in the control box 14, the controller 209 is a PLC controller, the controller 209 is electrically connected with the switch 208, and the switch 208 is connected with an industrial personal computer 15 located outside the control box 14 through the LAN interface 210; the switch 208 and the power supply interface 220 are both connected to the electrical connector 218, and the thermal imager 11 can be electrically connected to the power supply interface 220 and the switch 208 through the electrical connector 218; the cradle head 13 is electrically connected with the power supply interface 220 and the controller 208 through the electric connector 218; referring to fig. 3, the power supply interface 220 is connected to a power supply to supply power to the inside of the control box 14, the thermal imager power supply module 215 and the power supply switch 214 form power supply control for the thermal imager 11, the cradle head power supply module 217 and the power supply switch 216 form power supply control for the cradle head 13, and the switch 208 can establish communication with the thermal imager 11 through the electric connector 218 to acquire temperature data detected by the thermal imager 11; the controller 209 establishes a communication connection with the pan/tilt head 13 through the electrical connector 218 to control the motion of the pan/tilt head 13, referring to fig. 1, in which the industrial personal computer 15 and the control box 14 are integrally disposed in the integration cabinet 101.
Further, referring to fig. 2 and 3, a first temperature controller 203 and a first temperature-controlled power supply 204 are disposed in the control box 14, and a signal output end of the first temperature controller 203 is connected to the first temperature-controlled power supply 204 and is configured to control on/off of the first temperature-controlled power supply 204.
Referring to FIG. 2, the first temperature measuring head 2030 of the first temperature controller 203 is disposed between the first thin film heater 112 and the thermal imager 11, and the first temperature measuring head 2030 can be electrically connected to the first temperature measuring instrument 203 through the electrical connector 218; the voltage input end of the first temperature-controlled power supply 204 is connected with the power supply interface 220, the voltage output end of the first temperature-controlled power supply 204 is connected with the electrical connector 218, the first thin film heater 112 is connected with the voltage output end of the first temperature-controlled power supply 204 through the electrical connector 218, specifically, the temperature of the surface of the thermal imager 11 is measured through the first temperature measuring head 2030, the temperature parameter is set through the first temperature measuring instrument 203, the first temperature measuring instrument 203 controls the first temperature-controlled power supply 204 to be closed when the temperature of the surface of the thermal imager is a first preset value, the first thin film heater 112 is powered on to heat the thermal imager 11, and the first temperature-controlled power supply 204 is disconnected when the temperature reaches the preset value, so that a closed-loop temperature control circuit for the thermal imager 11 is formed, and the temperature of the surface of the thermal imager 11 can be automatically controlled.
Further, a second temperature controller 205 and a second temperature-controlled power supply 206 are arranged in the electronic control box 14, and a signal output end of the second temperature controller 205 is connected with the second temperature-controlled power supply 206 and is used for controlling on/off of the second temperature-controlled power supply 206;
the second temperature measuring head 2050 of the second temperature controller 205 is arranged between the pan/tilt head 13 and the second film heater 132, and the second temperature measuring head 2050 can be electrically connected with the second temperature controller 205 through the electric connector 218; the voltage input terminal of second temperature-controlled power supply 206 is electrically connected to power supply interface 220, the voltage output terminal of second temperature-controlled power supply 206 is electrically connected to electrical connector 218, and second thin film heater 132 can be connected to the voltage output terminal of second temperature-controlled power supply 206 via electrical connector 218.
The second temperature controller 205 and the second temperature control power supply 206 form a closed-loop temperature control circuit for the pan/tilt head 13, so as to realize automatic temperature control of the pan/tilt head 13.
Further, referring to fig. 3, the first temperature controller 203 and the second temperature controller 205 are electrically connected to the controller 209, and the controller 209 is electrically connected to the industrial personal computer 15, so that parameters of the first temperature controller 203 and the second temperature controller 205 can be remotely set by the industrial personal computer 15, thereby implementing remote control.
Further, a temperature control alarm 213 is arranged in the control box 14, the temperature control alarm 213 is electrically connected with the controller 209, an alarm is given when the thermal imager 11 or/and the pan-tilt 13 are abnormal in temperature, and a cooling fan 207 is further arranged in the control box 14, so that heat is dissipated in the control box 14 through the cooling fan 207.
The above description is only a preferred embodiment of the application and is illustrative of the principles of the technology employed. It will be appreciated by a person skilled in the art that the scope of the invention as referred to in the present application is not limited to the embodiments with a specific combination of the above-mentioned features, but also covers other embodiments with any combination of the above-mentioned features or their equivalents without departing from the inventive concept. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.
Claims (10)
1. A non-contact temperature measuring device is characterized by comprising a thermal imager; the thermal imager is characterized in that a heat-preservation protective cover is arranged outside the thermal imager, a first thermal protection device is arranged between the surface of the thermal imager and the heat-preservation protective cover, and the first thermal protection device is used for heat preservation protection of the thermal imager.
2. The non-contact temperature measuring device of claim 1, wherein the outer surface of the heat-insulating protective cover is polished.
3. The non-contact thermometric device of claim 2, wherein the first thermal shield comprises a first thin film heater disposed on the thermographic instrument surface and a first thermally insulating film disposed outside the first thin film heater.
4. The non-contact temperature measuring device of claim 3, wherein the focusing mechanical attachment of the thermal imager is lubricated with a mixture of molybdenum disulfide and silicone oil.
5. The non-contact temperature measuring device according to any one of claims 1 to 4, further comprising a holder, wherein a second film heater and a second heat insulation film arranged outside the second film heater are arranged on the surface of the holder;
the thermal imager is fixedly arranged on the holder, and the field range of the thermal imager can be adjusted through the holder.
6. The non-contact temperature measuring device according to claim 5, further comprising a control system, wherein the control system comprises a control box, an electric connector, a LAN interface and a control box power supply interface are arranged on the control box, a controller and a switch are arranged inside the control box, the controller is electrically connected with the switch, and the switch is connected with an industrial personal computer located outside the control box through the LAN interface; the switch and the power supply interface are both connected with the electric connector, and the thermal imager can be electrically connected with the power supply interface and the switch through the electric connector; the holder can be electrically connected with the power supply interface and the controller through the electric connector.
7. The non-contact temperature measuring device according to claim 6,
a first temperature controller and a first temperature control power supply are arranged in the control box, and a signal output end of the first temperature controller is connected with the first temperature control power supply and is used for controlling the on-off of the first temperature control power supply;
a first temperature measuring head of the first temperature controller is arranged between the first film heater and the thermal imager, and the first temperature measuring head can be electrically connected with the first temperature measuring instrument through the electric connector; the voltage input end of the first temperature control power supply is connected with the power supply interface, the voltage output end of the first temperature control power supply is connected with the electric connector, and the first film heater can pass through the electric connector and be connected with the voltage output end of the first temperature control power supply.
8. The non-contact temperature measuring device according to claim 6, wherein a second temperature control instrument and a second temperature control power supply are arranged in the electric control box, and a signal output end of the second temperature control instrument is connected with the second temperature control power supply and is used for controlling the on-off of the second temperature control power supply;
the second temperature measuring head of the second temperature controller is arranged between the holder and the second film heater, and the second temperature measuring head can be electrically connected with the second temperature controller through the electric connector; the voltage input end of the second temperature control power supply is electrically connected with the power supply interface, the voltage output end of the second temperature control power supply is electrically connected with the electric connector, and the second film heater can pass through the electric connector and be connected with the voltage output end of the second temperature control power supply.
9. The non-contact temperature measuring device of claim 8, wherein the first temperature controller and the second temperature controller are electrically connected to the controller.
10. The non-contact temperature measuring device according to claim 8, wherein a temperature control alarm is arranged in the control box, the temperature control alarm is electrically connected with the controller, and an alarm is given when the temperature of the thermal imager or/and the holder is abnormal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010836365.3A CN111998951A (en) | 2020-08-19 | 2020-08-19 | Non-contact temperature measuring device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010836365.3A CN111998951A (en) | 2020-08-19 | 2020-08-19 | Non-contact temperature measuring device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111998951A true CN111998951A (en) | 2020-11-27 |
Family
ID=73473564
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010836365.3A Pending CN111998951A (en) | 2020-08-19 | 2020-08-19 | Non-contact temperature measuring device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111998951A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113295283A (en) * | 2021-06-17 | 2021-08-24 | 北京卫星环境工程研究所 | Infrared temperature measuring device for vacuum, low-temperature and strong electromagnetic field environment |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102564595A (en) * | 2011-12-14 | 2012-07-11 | 北京卫星环境工程研究所 | Infrared thermal-wave detecting system for vacuum low-temperature environment |
| CN105136314A (en) * | 2015-08-24 | 2015-12-09 | 北京环境特性研究所 | Infrared thermal imaging system realization method under vacuum low temperature environment and device |
| CN105784170A (en) * | 2015-12-28 | 2016-07-20 | 北京卫星环境工程研究所 | Portable nano-satellite atmospheric-pressure thermal test measurement and control system |
| CN106197674A (en) * | 2016-07-11 | 2016-12-07 | 上海卫星装备研究所 | A kind of novel facial heat sink temperature measuring equipment and scaling method |
| CN110397937A (en) * | 2019-07-05 | 2019-11-01 | 中国特种设备检测研究院 | A kind of garbage burning boiler insulation of wall structure measurement designing system and design method |
-
2020
- 2020-08-19 CN CN202010836365.3A patent/CN111998951A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102564595A (en) * | 2011-12-14 | 2012-07-11 | 北京卫星环境工程研究所 | Infrared thermal-wave detecting system for vacuum low-temperature environment |
| CN105136314A (en) * | 2015-08-24 | 2015-12-09 | 北京环境特性研究所 | Infrared thermal imaging system realization method under vacuum low temperature environment and device |
| CN105784170A (en) * | 2015-12-28 | 2016-07-20 | 北京卫星环境工程研究所 | Portable nano-satellite atmospheric-pressure thermal test measurement and control system |
| CN106197674A (en) * | 2016-07-11 | 2016-12-07 | 上海卫星装备研究所 | A kind of novel facial heat sink temperature measuring equipment and scaling method |
| CN110397937A (en) * | 2019-07-05 | 2019-11-01 | 中国特种设备检测研究院 | A kind of garbage burning boiler insulation of wall structure measurement designing system and design method |
Non-Patent Citations (1)
| Title |
|---|
| 刘泽元 等.: ""红外测温设备的空间环境影响及防护研究"", 《电子测量与仪器学报》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113295283A (en) * | 2021-06-17 | 2021-08-24 | 北京卫星环境工程研究所 | Infrared temperature measuring device for vacuum, low-temperature and strong electromagnetic field environment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5178464A (en) | Balance infrared thermometer and method for measuring temperature | |
| US4906105A (en) | Measurement of thermal conditions | |
| US6866391B2 (en) | Thermal condensate reducer for optical devices | |
| CN111998951A (en) | Non-contact temperature measuring device | |
| EP1615065B1 (en) | Infrared camera | |
| CN111811662B (en) | Non-contact infrared thermal imaging device for high-temperature oven and thermal compensation method thereof | |
| US20210223111A1 (en) | Supply Unit for Generating Electric Energy, Kitchen Utensil as well as Kitchen System | |
| US20220307915A1 (en) | Temperature-Measuring Device | |
| Hagart-Alexander | Temperature measurement | |
| CN113686461B (en) | T-shaped cable connector self-power-taking temperature sensor, cable connector fault detection system and method | |
| US2627530A (en) | Ambient-temperature compensated device | |
| CN210640983U (en) | Multifunctional monitoring device for electrical equipment | |
| US20170163065A1 (en) | Constant power supply for thermo-electric cells | |
| NL2030144A (en) | The temperature-vacuum impacting device | |
| CN110398290A (en) | Self-constant temperature infrared temperature sensor and the product for applying it | |
| Rusby | Introduction to temperature measurement. | |
| CN217212377U (en) | Heat insulation performance testing device for flexible heat insulation material | |
| CN112254826A (en) | Thermal infrared imager temperature control system for restraining detector temperature drift | |
| CN110514120A (en) | Displacement measurement system for vacuum low-temperature environment | |
| CN220025027U (en) | Body temperature measuring device | |
| SU1001036A1 (en) | Thermostating device | |
| CN212082619U (en) | Hand-held type field calibration black body radiation source | |
| CN215767390U (en) | Wireless temperature monitoring measuring instrument | |
| US20230375418A1 (en) | Thermopile laser sensor with response time acceleration and methods of use and manufacture | |
| RU2780703C2 (en) | Method for control of polarity of thermoelectrodes |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20201127 |