CN210864443U - Low-temperature environment control device and airborne photoelectric equipment - Google Patents
Low-temperature environment control device and airborne photoelectric equipment Download PDFInfo
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- CN210864443U CN210864443U CN201922012647.7U CN201922012647U CN210864443U CN 210864443 U CN210864443 U CN 210864443U CN 201922012647 U CN201922012647 U CN 201922012647U CN 210864443 U CN210864443 U CN 210864443U
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Abstract
The utility model discloses a low temperature ring accuse device, machine carry optoelectronic equipment. Cryogenic environment control device comprising: the heater is arranged in a region to be heated of the airborne photoelectric equipment; the thermistor is arranged close to the area to be heated so as to detect the temperature of the area to be heated; the heating control board is electrically connected with the thermistor and the heater and is used for controlling the working state of the heater according to the detection value of the thermistor; when the temperature of the area to be heated is lower than a first preset temperature, the heating control board controls the heater to heat the area to be heated; and when the temperature of the area to be heated is higher than the second preset temperature, the heating control board controls the heater to stop heating the area to be heated. Adopt the utility model discloses, can guarantee through simple technology form that the inside temperature of airborne photoelectric equipment maintains within the within range that can normally work, the effectual problem of airborne photoelectric equipment low temperature environment adaptability of having solved has great contribution to the low temperature ring accuse design technique under the airborne condition.
Description
Technical Field
The utility model relates to an airborne photoelectric equipment technical field especially relates to a low temperature ring accuse device, airborne photoelectric equipment.
Background
With the development of photoelectric reconnaissance technology, the application range of airborne photoelectric equipment is gradually expanded to the requirements of remote warning/early warning, quick striking, unmanned combat and the like by initial reconnaissance and monitoring, and the airborne photoelectric equipment plays an important role in the fields of disaster resistance, search and rescue, maritime rescue, fishery resource protection, geographic remote sensing and the like.
When the airborne photoelectric equipment is designed, the functional performance indexes of the whole equipment are guaranteed to meet the requirements, the environmental adaptability of the equipment is also considered, and the equipment can reliably and stably work in a very warm environment, so that the control of the environmental temperature inside the equipment is one of the key contents of design and research.
Generally, the airborne photoelectric equipment requires that the adaptive temperature of a low-temperature environment is-55 ℃, and when the temperature is-55 ℃, the performance of partial components in the equipment is reduced or the operation is unstable, and if the normal and stable operation of the equipment in the low-temperature environment is ensured, a certain low-temperature environmental control measure must be adopted in the equipment.
At present, the traditional low-temperature heating modes include heating by adopting a hot wire, refrigerating/heating by adopting a semiconductor, infrared heating and heating by adopting an air duct. The method of heating by adopting the hot wire is to arrange the hot wire in a heating area covered by a low-temperature sensitive device and heat the device by electrifying the wire to generate heat. The method is relatively complex in process and difficult to assemble and disassemble due to the fact that wiring is conducted in the heating area, and the method is not suitable for engineering application due to the fact that the lead is difficult to fix and difficult to disassemble and assemble. The semiconductor refrigerating/heating method is also called thermoelectric refrigerating, and is a refrigerating/heating method based on the Peltier effect. The semiconductor refrigerating/heating device is composed of an electric pile, a cooling plate and a heat dissipation plate, the volume of the semiconductor refrigerating/heating device is relatively large, and the application space of the method is small on the premise that the size and weight requirements of the airborne photoelectric equipment are strict. The infrared heating method mainly applies the far infrared technology, the infrared heating heats the device by radiation in a long distance, the heating area is relatively large, and the heating area is not easy to control. The method for heating by the air duct is characterized in that under the low-temperature working condition, an electric heating device buried in the air duct is electrified to heat gas in the air duct, the gas is conveyed into the cabin through a fan, and the environment temperature is raised by releasing heat. The temperature of the gas is reduced after the gas emits heat, the gas enters the air return channel and is continuously heated by the electric heating device, and the process is repeated. However, as the airborne equipment works in high altitude, the air in the high altitude environment is thin, the efficiency of the method for heating by using the air duct is low, and the use requirement is difficult to meet.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model provides a low temperature ring accuse device, machine carries optoelectronic device for solve among the prior art problem that machine carries optoelectronic device low temperature heating mode technology is complicated, inefficiency.
The embodiment of the utility model provides a machine carries optoelectronic device's low temperature ring accuse device is provided, include:
the heater is arranged in a region to be heated of the airborne photoelectric equipment;
the thermistor is arranged close to the area to be heated so as to detect the temperature of the area to be heated;
the heating control board is electrically connected with the thermistor and the heater and is used for controlling the working state of the heater according to the detection value of the thermistor;
when the temperature of the area to be heated is lower than a first preset temperature, the heating control board controls the heater to heat the area to be heated; and when the temperature of the area to be heated is higher than a second preset temperature, the heating control board controls the heater to stop heating the area to be heated.
According to some embodiments of the invention, the first predetermined temperature is less than the second predetermined temperature.
In some embodiments of the present invention, the first predetermined temperature is-18 ℃ and the second predetermined temperature is-12 ℃.
According to some embodiments of the invention, the heating control panel comprises:
the low-temperature reference circuit is used for generating a first preset voltage corresponding to the first preset temperature;
the high-temperature reference circuit is used for generating a second preset voltage corresponding to the second preset temperature;
the thermistor circuit is electrically connected with the thermistor and is used for acquiring the voltage division of the thermistor;
the hysteresis comparison circuit is electrically connected with the low-temperature reference circuit, the high-temperature reference circuit, the thermistor circuit and the heater, and is used for comparing the magnitude relation between the first preset voltage and the divided voltage of the thermistor and the magnitude relation between the second preset voltage and the divided voltage of the thermistor and controlling the working state of the heater;
when the partial pressure of the thermistor is less than the first preset voltage, controlling the heater to heat the area to be heated; and when the partial pressure of the thermistor is greater than the second preset voltage, controlling the heater to stop heating the area to be heated.
Further, the hysteresis comparison circuit includes:
the comparison circuit is electrically connected with the low-temperature reference circuit, the high-temperature reference circuit and the thermistor circuit and is used for comparing the magnitude relation between the first preset voltage and the divided voltage of the thermistor and the magnitude relation between the second preset voltage and the divided voltage of the thermistor and outputting a comparison result signal;
and the relay is electrically connected with the comparison circuit and the thermistor and is used for controlling the working state of the thermistor according to the comparison result signal.
According to some embodiments of the invention, the device further comprises:
a fan disposed adjacent to the heater.
According to some embodiments of the utility model, the heater is the heating film, the heating film subsides are located machine carries opto-electronic equipment treats the heating region.
The embodiment of the utility model provides a still provide an airborne optoelectronic device, include:
a body having a region to be heated;
the low-temperature ring control device is the low-temperature ring control device of the airborne photoelectric equipment.
According to some embodiments of the invention, the area to be heated is plural;
the number of the heaters is multiple, and the heaters correspond to the multiple regions to be heated one by one;
the number of the thermistors is multiple, and the plurality of the thermistors correspond to the plurality of the heaters one by one;
the area to be heated comprises a main board surface, a gyroscope surface and a bearing mechanism surface.
Adopt the embodiment of the utility model provides a, can guarantee through simple technology form that the inside temperature of airborne photoelectric equipment maintains within the within range that can normally work, the effectual problem of airborne photoelectric equipment low temperature environment adaptability of having solved has great contribution to the low temperature ring accuse design technique under the airborne condition.
The above description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention may be implemented according to the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more obvious and understandable, the following detailed description of the present invention is given.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to refer to like parts throughout the drawings. In the drawings:
fig. 1 is a schematic structural diagram of an onboard optoelectronic device in an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a low-temperature environmental control device of an onboard optoelectronic device in an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a hysteresis comparator circuit of a low temperature environmental control apparatus of an onboard optoelectronic device according to an embodiment of the present invention;
fig. 4 is a heating control board PCB manufacturing diagram of the low temperature environmental control device of the onboard optoelectronic device in the embodiment of the present invention.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
As shown in fig. 1-2, an embodiment of the present invention provides a low temperature environmental control device for an airborne optoelectronic device, including: a heater 1, a thermistor 2 and a heating control board 3. The heater 1 is arranged in the area 4 to be heated of the on-board photovoltaic device 100. Generally, the onboard optoelectronic device 100 requires a low-temperature environment adaptive temperature of-55 ℃, and at a low temperature of-55 ℃, some components inside the device may have performance degradation or unstable operation, and if it is to be ensured that the device can normally and stably operate in a low-temperature environment, certain low-temperature environmental control measures must be taken inside the device. For example, the main plate, the top, and the bearing mechanism are all parts that need to be heated. Therefore, the areas on the surface of the main board, the top, the bearing mechanism, and the like or in the vicinity of each of them are all the areas to be heated 4.
The thermistor 2 is arranged close to the region 4 to be heated, and the thermistor 2 can detect the temperature of the region 4 to be heated. The term "close" here is to be understood as meaning that the mounting position of the thermistor 2 is at any position where the temperature of the region 4 to be heated can be accurately detected.
The heating control board 3 is electrically connected with the thermistor 2 and the heater 1, and the heating control board 3 is used for controlling the working state of the heater 1 according to the detection value of the thermistor 2;
when the temperature of the region to be heated 4 is lower than a first preset temperature, the heating control board 3 controls the heater 1 to heat the region to be heated 4; when the temperature of the area 4 to be heated is higher than the second preset temperature, the heating control board 3 controls the heater 1 to stop heating the area 4 to be heated.
It should be noted that, as used herein, the term "low-temperature environmental control device" is understood to be capable of adjusting the temperature of the onboard optoelectronic device 100 in a low-temperature range, which may refer to an environment below 0 ℃.
Adopt the embodiment of the utility model provides a, can guarantee through simple technology form that the inside temperature of airborne photoelectric device 100 maintains within the within range that can normally work, the effectual problem of having solved airborne photoelectric device 100 low temperature environmental suitability has great contribution to the low temperature environmental control design technique under the airborne condition.
On the basis of the above-described embodiment, various modified embodiments are further proposed, and it is to be noted herein that, in order to make the description brief, only the differences from the above-described embodiment are described in the various modified embodiments.
According to some embodiments of the invention, the first predetermined temperature is less than the second predetermined temperature.
In some embodiments of the present invention, the first predetermined temperature is-18 ℃ and the second predetermined temperature is-12 ℃.
As shown in fig. 2-4, according to some embodiments of the present invention, the heating control plate 3 may include:
a low temperature reference circuit for generating a first preset voltage corresponding to a first preset temperature;
the high-temperature reference circuit is used for generating a second preset voltage corresponding to a second preset temperature;
the thermistor circuit is electrically connected with the thermistor 2 and is used for acquiring the voltage division of the thermistor 2;
the hysteresis comparison circuit is electrically connected with the low-temperature reference circuit, the high-temperature reference circuit, the thermistor circuit and the heater 1, and is used for comparing the magnitude relation between the first preset voltage and the divided voltage of the thermistor 2 and the magnitude relation between the second preset voltage and the divided voltage of the thermistor 2 and controlling the working state of the heater 1;
when the partial pressure of the thermistor 2 is less than a first preset voltage, controlling the heater 1 to heat the area to be heated 4; and when the partial pressure of the thermistor 2 is greater than a second preset voltage, controlling the heater 1 to stop heating the area to be heated 4.
As shown in fig. 3-4, further, the hysteresis comparison circuit includes:
the comparison circuit is electrically connected with the low-temperature reference circuit, the high-temperature reference circuit and the thermistor circuit and is used for comparing the magnitude relation between the first preset voltage and the divided voltage of the thermistor 2 and the magnitude relation between the second preset voltage and the divided voltage of the thermistor 2 and outputting a comparison result signal;
and the relay is electrically connected with the comparison circuit and the thermistor 2 and is used for controlling the working state of the thermistor 2 according to the comparison result signal.
As shown in fig. 2, according to some embodiments of the invention, the apparatus further comprises:
and a fan disposed adjacent to the heater 1. The fan can drive the interior of the onboard photovoltaic device 100 to form a circulation of air, so as to adjust the temperature balance inside the device.
According to some embodiments of the present invention, the heater 1 is a heating film, and the heating film is attached to the region 4 to be heated of the airborne optoelectronic device 100.
As shown in fig. 1, an embodiment of the present invention further provides an airborne optoelectronic device 100, including:
a body 5, the body 5 having a region to be heated 4;
the low-temperature ring control device is the low-temperature ring control device of the airborne photoelectric equipment.
According to some embodiments of the present invention, the area to be heated 4 is plural;
the number of the heaters 1 is multiple, and the heaters 1 correspond to the heaters 4 to be heated one by one;
the number of the thermistors 2 is multiple, and the plurality of the thermistors 2 correspond to the plurality of heaters 1 one by one;
the region 4 to be heated includes a surface of a main board, a surface of a gyro, and a surface of a bearing mechanism.
The embodiment of the utility model also provides a control method of the low-temperature ring control device of the airborne photoelectric equipment, the low-temperature ring control device of the airborne photoelectric equipment is the low-temperature ring control device of the airborne photoelectric equipment;
the control method comprises the following steps:
a heater and a thermistor are arranged in a region to be heated of the onboard photoelectric equipment;
the thermistor detects the temperature of the area to be heated;
judging whether the temperature of the to-be-heated area detected by the thermistor is lower than a first preset temperature or not, if so, controlling the heater to heat the to-be-heated area by the heating control board;
and judging whether the temperature of the area to be heated is higher than a second preset temperature, if so, controlling the heater to stop heating the area to be heated by the heating control board.
Adopt the embodiment of the utility model provides a, can guarantee through simple technology form that the inside temperature of airborne photoelectric equipment maintains within the within range that can normally work, the effectual problem of airborne photoelectric equipment low temperature environment adaptability of having solved has great contribution to the low temperature ring accuse design technique under the airborne condition.
The airborne optoelectronic device 100 and the control method thereof according to the embodiments of the present invention are described in detail below in a specific embodiment with reference to fig. 1 to 4. It is to be understood that the following description is illustrative only and is not intended as a specific limitation on the invention. All adopt the utility model discloses a similar structure and similar change all should be listed in the protection scope of the utility model.
In order to be suitable for the onboard photoelectric device 100 working in a low-temperature environment, the problem that the onboard photoelectric device 100 cannot stably work under a low-temperature condition is solved. Be different from traditional low temperature heating's mode, ensure that machine carries optoelectronic device 100 can keep normal operating condition under low temperature environment, the embodiment of the utility model provides an adopt low temperature ring accuse device to realize the heating to machine carries the inside of optoelectronic device 100. As shown in fig. 1-3, the embodiment of the present invention adopts the heating control board 3 with full analog control circuit to control, and cooperates with the thermistor 2 and the heating film to realize the closed-loop control of low-temperature heating, and has the characteristics of low cost, high reliability, good heating effect, high space utilization rate, simple process, etc., and is very suitable for being applied to the airborne equipment.
As shown in fig. 1-3, the arrangement and installation of the thermistor and the heating film are firstly performed on the low-temperature sensitive area to be heated, the thermistor can monitor the ambient temperature in real time, and the acquired signal is fed back to the full-analog control circuit. The heating film adopts a surface-mounted mode, responds to a heating switch control signal of the full-analog control circuit, and heats or stops heating. The temperature control working principle of the full-analog control circuit is as follows: the thermistor generates partial voltage to be compared with a reference power supply to generate a control level signal to control the opening and closing of the relay. The relay is disconnected, the heating film is powered off, and heating is stopped; the relay is closed, the heating film is electrified, and heating is started.
The full analog control circuit uses analog devices to build a hysteresis comparator circuit, as shown in fig. 2 and 3. The hysteresis comparator circuit can ensure that the system does not frequently switch the heating circuit near the approach temperature to generate relay discharge interference. And the working reliability and stability of the system are improved. The working principle is as follows: in the process of temperature reduction, when the temperature is lower than minus 18 ℃ (87.1k ohm), the design ensures that the comparator is started to output high level to control the relay to be closed and start heating; in the temperature rising process, when the temperature is higher than-12 ℃ (62.06k ohm), the comparator is started to output low level to control the relay to be disconnected, and the heating is stopped. Specifically, the method comprises the following steps:
1. and (3) installing temperature test points, namely installing the thermistor at positions needing to be heated, such as a circuit board needing to be heated, a gyroscope, a bearing mechanism and the like, and monitoring the temperature value of a low-temperature sensitive area of the airborne photoelectric equipment.
2. And (3) mounting the heating film, namely selecting the heating film with a pasting surface, and pasting the heating film on the position of a heating mounting surface such as a circuit board, a gyroscope, a bearing mechanism and the like which need to be heated.
3. After the circuit board processing is completed by the heating control board, the PCB printed board is as shown in fig. 4. After debugging is finished, the circuit board is installed in the equipment and is connected with each thermistor and the heating film through the connectors on the board.
4. After the equipment is powered on, the low-temperature environment control system starts to work, if the thermistor monitors that the temperature of the surrounding area is at a low temperature value of minus 18 ℃, the heating control panel controls the heating film to heat until the feedback temperature of the thermistor is heated to minus 12 ℃, and the heating work is finished. In this way, closed loop control of temperature is achieved.
Meanwhile, a fan can be arranged in the equipment to form a circulation flow of air in the equipment so as to adjust the temperature in the equipment to be balanced.
Adopt the embodiment of the utility model provides a, when airborne photoelectric device is in low temperature environment, this low temperature environmental control system can guarantee that the inside temperature of equipment maintains within the within range that can normally work through simple technology form, and the effectual problem of having solved airborne photoelectric device low temperature environment adaptability has great contribution to the low temperature environmental control design technique under the airborne condition.
It should be noted that the above-mentioned embodiments are only preferred embodiments of the present invention, and are not intended to limit the present invention, and those skilled in the art can make various modifications and changes. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (9)
1. A low temperature environmental control device of an airborne photoelectric device is characterized by comprising:
the heater is arranged in a region to be heated of the airborne photoelectric equipment;
the thermistor is arranged close to the area to be heated so as to detect the temperature of the area to be heated;
the heating control board is electrically connected with the thermistor and the heater and is used for controlling the working state of the heater according to the detection value of the thermistor;
when the temperature of the area to be heated is lower than a first preset temperature, the heating control board controls the heater to heat the area to be heated; and when the temperature of the area to be heated is higher than a second preset temperature, the heating control board controls the heater to stop heating the area to be heated.
2. The apparatus of claim 1, wherein the first predetermined temperature is less than the second predetermined temperature.
3. The apparatus of claim 2, wherein the first predetermined temperature is-18 ℃ and the second predetermined temperature is-12 ℃.
4. The apparatus of claim 1, wherein the heat control plate comprises:
the low-temperature reference circuit is used for generating a first preset voltage corresponding to the first preset temperature;
the high-temperature reference circuit is used for generating a second preset voltage corresponding to the second preset temperature;
the thermistor circuit is electrically connected with the thermistor and is used for acquiring the voltage division of the thermistor;
the hysteresis comparison circuit is electrically connected with the low-temperature reference circuit, the high-temperature reference circuit, the thermistor circuit and the heater, and is used for comparing the magnitude relation between the first preset voltage and the divided voltage of the thermistor and the magnitude relation between the second preset voltage and the divided voltage of the thermistor and controlling the working state of the heater;
when the partial pressure of the thermistor is less than the first preset voltage, controlling the heater to heat the area to be heated; and when the partial pressure of the thermistor is greater than the second preset voltage, controlling the heater to stop heating the area to be heated.
5. The apparatus of claim 4, the hysteresis comparison circuit comprising:
the comparison circuit is electrically connected with the low-temperature reference circuit, the high-temperature reference circuit and the thermistor circuit and is used for comparing the magnitude relation between the first preset voltage and the divided voltage of the thermistor and the magnitude relation between the second preset voltage and the divided voltage of the thermistor and outputting a comparison result signal;
and the relay is electrically connected with the comparison circuit and the thermistor and is used for controlling the working state of the thermistor according to the comparison result signal.
6. The apparatus of claim 1, further comprising:
a fan disposed adjacent to the heater.
7. The apparatus of claim 1, wherein the heater is a heating film attached to a region of the on-board photovoltaic device to be heated.
8. An airborne optoelectronic device, comprising:
a body having a region to be heated;
a cryogenic environment control device, the cryogenic environment control device being a cryogenic environment control device of an airborne optoelectronic apparatus according to any one of claims 1-7.
9. The airborne optoelectronic apparatus according to claim 8, wherein the area to be heated is plural;
the number of the heaters is multiple, and the heaters correspond to the multiple regions to be heated one by one;
the number of the thermistors is multiple, and the plurality of the thermistors correspond to the plurality of the heaters one by one;
the area to be heated comprises a main board surface, a gyroscope surface and a bearing mechanism surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922012647.7U CN210864443U (en) | 2019-11-20 | 2019-11-20 | Low-temperature environment control device and airborne photoelectric equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922012647.7U CN210864443U (en) | 2019-11-20 | 2019-11-20 | Low-temperature environment control device and airborne photoelectric equipment |
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| Publication Number | Publication Date |
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| CN210864443U true CN210864443U (en) | 2020-06-26 |
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| CN201922012647.7U Active CN210864443U (en) | 2019-11-20 | 2019-11-20 | Low-temperature environment control device and airborne photoelectric equipment |
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