CN213027972U

CN213027972U - P-waveband miniature broadband ceramic power divider

Info

Publication number: CN213027972U
Application number: CN202021585329.6U
Authority: CN
Inventors: 于沛洋; 刘俊清
Original assignee: CETC 43 Research Institute
Current assignee: CETC 43 Research Institute
Priority date: 2020-08-03
Filing date: 2020-08-03
Publication date: 2021-04-20
Anticipated expiration: 2030-08-03

Abstract

The utility model discloses a ware is divided to miniature broadband pottery merit of P wave band, it includes: a laminated body formed by stacking a plurality of dielectric sheets; the P-band miniature broadband ceramic power divider comprises a metal circuit, two isolation resistors and a P-band miniature broadband ceramic power divider body, wherein the metal circuit comprises a first branch circuit and a second branch circuit which are connected in parallel, the metal circuit is composed of four inductors, three capacitors and the P-band miniature broadband ceramic power divider body is small in size, light in weight, wide in bandwidth, low in loss and low in cost, and is suitable for batch production.

Description

P-waveband miniature broadband ceramic power divider

Technical Field

The utility model belongs to the technical field of the microwave function device, concretely relates to ware is divided to miniature broadband pottery merit of P wave band.

Background

The power divider is an important passive device in a microwave system circuit, and has the function of realizing power distribution from one path of signal to multiple paths of signals or realizing power synthesis from multiple paths of signals to one path of signal. A good power divider should have low in-band loss, wide operating bandwidth, good phase and amplitude balance between output signals and high isolation between output signals, while also being as small as possible. The traditional power divider is mainly realized in a form of a microstrip transmission line or a strip line, belongs to a planar structure, occupies a large area, cannot meet the miniaturization requirement of a microwave system, and is difficult to integrate. In order to meet the miniaturization requirement of the device, the initial method is to reduce the size of the resonator and further reduce the size of the device by adopting a dielectric material with high dielectric constant, high quality factor and low loss, but the traditional process technology cannot effectively reduce the size area of the device.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model discloses it is necessary to provide a ware is divided to miniature broadband pottery merit of P wave band, and this ware is divided to miniature broadband pottery merit utilizes LTCC multilayer ceramic technology to obtain based on the principle circuit that the ware was divided to two-stage lumped parameter Wilkinson merit, and it has small, light in weight, wide, the loss of bandwidth is little, with low costs, is fit for batch production's advantage, has solved the technical problem that current traditional handicraft can't effectively reduce device size area.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model discloses a ware is divided to miniature broadband pottery merit of P wave band, it includes:

a laminated body formed by stacking a plurality of dielectric sheets;

the metal circuit is positioned in the laminated body and comprises a first branch and a second branch which are connected in parallel, the first branch is formed by connecting a first inductor L1 and a third inductor L3 in series, the second branch is formed by connecting a second inductor L2 and a fourth inductor L4 in series, and the input ends of the first inductor L1 and the second inductor L2 are connected with a first grounding capacitor C1; the metal circuit further comprises a first isolation resistor R1 and a second isolation resistor R2, two ends of the first isolation resistor R1 are respectively connected between the output end of the first inductor L1 and the input end of the third inductor L3 and between the output end of the second inductor L2 and the input end of the third inductor L4, two ends of the first isolation resistor R1 are further respectively connected with a second grounding capacitor C2 and a third grounding capacitor C3, two ends of the second isolation resistor R2 are respectively connected with the output end of the third inductor L3 and the output end of the fourth inductor L4.

Further, the dielectric plate is an LTCC ceramic substrate.

Furthermore, the dielectric plate is provided with a metal conduction band, a metal pattern and a via hole, and the metal circuit is communicated through the adjacent via hole on the dielectric plate.

Further, the metal circuit further comprises an input end, a first output end and a second output end, the first branch is connected between the input end and the first output end, and the second branch is connected between the input end and the second output end. Preferably, the dielectric plate further comprises at least one ground layer, and the surface of the laminated body is provided with the input end, the first output end, the second output end and the electrode of the ground end.

Further, the first inductor L1, the second inductor L2, the third inductor L3, and the fourth inductor L4 are all spiral inductor structures, the spiral inductors are formed by metal conduction bands on the dielectric boards, and the metal conduction bands on each layer of dielectric board are wound into 1/2 rectangles.

Further, the first grounded capacitor C1, the second grounded capacitor C2, and the third grounded capacitor C3 are plate capacitor structures, and the plate capacitors are formed by metal patterns on the dielectric plate.

Further, the first isolation resistor R1 and the second isolation resistor R2 are thick film printed resistors.

Preferably, the electrodes of the input terminal, the first output terminal, the second output terminal and the ground terminal are printed on the side face of the laminated body, the laminated body is formed by stacking 19 layers of dielectric plates, no metal layer is printed on the dielectric plates of the

layers

1, 2, 3, 4, 5, 13, 14, 15, 16 and 17, and the metal conduction bands forming the first inductor L1, the second inductor L2, the third inductor L3 and the fourth inductor L4 are located on the dielectric plates of the

layers

6, 7, 8, 9, 10, 11 and 12;

the metal patterns forming the first grounded capacitor C1, the second grounded capacitor C2 and the third grounded capacitor C3 are located on 18 th and 19 th layers of dielectric slabs, wherein the metal pattern on the 19 th layer of dielectric slab is a ground layer, the ground layer forms a ground electrode plate of the first grounded capacitor C1, the second grounded capacitor C2 and the third grounded capacitor C3, and the metal pattern on the 18 th layer of dielectric slab forms another electrode plate of the first grounded capacitor C1, the second grounded capacitor C2 and the third grounded capacitor C3;

the first isolation resistor R1 is printed on the upper surface of the 18 th-layer dielectric board, and the second isolation resistor R2 is printed on the upper surface of the 6 th-layer dielectric board.

Further, the size thereof was 4.5mm × 3.2mm × 0.8 mm.

Compared with the prior art, the utility model provides a ware is divided to miniature broadband pottery merit of P wave band is small, light in weight, wide, the loss is little, with low costs, be fit for batch production for this miniature broadband pottery merit of P wave band divides the ware workable for the paster form, also can imbed in the base plate, and is fit for very much and be convenient for integrate in microwave system.

In addition, the P-band miniature broadband ceramic power divider embeds the resistor in the laminated body, so that the resistor does not need to be externally connected when the power divider is used, and the reliability of a product is improved.

Drawings

Fig. 1 is a schematic structural diagram of a P-band micro broadband ceramic power divider according to a preferred embodiment of the present invention;

FIG. 2 is a schematic circuit diagram of the P-band miniature broadband ceramic power divider shown in FIG. 1;

fig. 3 is a schematic diagram of a layered structure of the P-band micro broadband ceramic power divider stack in fig. 1.

Detailed Description

To facilitate an understanding of the present invention, the present invention will be described more fully with reference to the following specific embodiments. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

The embodiment of the utility model provides an in disclose a miniature broadband pottery merit of P wave band divides ware, as shown in fig. 1, it is piled up the laminate that forms by a plurality of layers of dielectric slab to constitute with the metal circuit that is located the laminate. The number of layers of the stacked body can be adjusted according to actual needs, and therefore, the number of layers is not particularly limited, and the stacking manner of the stacked body is a conventional means in the art, and therefore, will not be described one by one. In this embodiment, the stacked body is formed by stacking 19 dielectric plates, the dielectric plates in this embodiment are LTCC ceramic substrates, and the size of the power divider in this embodiment is 4.5mm × 3.2mm × 0.8mm, and further, the dielectric plates in this embodiment are provided with metal conduction bands, metal patterns, and via holes, and the metal conduction bands and the metal patterns on the dielectric plates are communicated through the via holes to form a metal circuit.

Further, as shown in fig. 1 and fig. 2, the metal circuit of the power divider in this embodiment is composed of an Input port, a first branch, a second branch, a first Output port1, and a second Output port2, which are connected in parallel. The first branch is connected between the Input port and the first Output port1, and the second branch is connected between the Input port and the second Output port 2. Specifically, the dielectric board further includes at least one ground layer, and electrodes of an Input end port, a first Output end port1, a second Output end port2, and a ground terminal GND are disposed on a surface of the laminate, in this embodiment, as shown in fig. 1, electrodes of the Input end port, the first Output end port1, the second Output end port2, and the ground terminal GND are printed on side surfaces of the laminate, and distribution thereof may be adjusted according to a requirement of a circuit diagram, so that specific limitation may not be made.

Specifically, as shown in fig. 2, the first branch is formed by connecting a first inductor L1 and a third inductor L3 in series, the second branch is formed by connecting a second inductor L2 and a fourth inductor L4 in series, and input ends of the first inductor L1 and the second inductor L2 are connected with a first grounding capacitor C1; the metal circuit further comprises a first isolation resistor R1 and a second isolation resistor R2, two ends of the first isolation resistor R1 are respectively connected between the output end of the first inductor L1 and the input end of the third inductor L3 and between the output end of the second inductor L2 and the input end of the third inductor L4, two ends of the first isolation resistor R1 are further respectively connected with a second grounding capacitor C2 and a third grounding capacitor C3, two ends of the second isolation resistor R2 are respectively connected with the output end of the third inductor L3 and the output end of the fourth inductor L4.

Further, in this embodiment, the first inductor L1, the second inductor L2, the third inductor L3, and the fourth inductor L4 are all spiral inductor structures, and all of them are formed by metal conduction bands on the dielectric board, and in this embodiment, the first inductor L1, the second inductor L2, the third inductor L3, and the fourth inductor L4 are all formed by 1/2 rectangles formed by metal conduction bands with a width of 0.1 mm.

In addition, the first grounded capacitor C1, the second grounded capacitor C2, and the third grounded capacitor C3 are plate capacitor structures, and the plate capacitors are formed by metal patterns on the dielectric plate.

The first isolation resistor R1 and the second isolation resistor R2 are thick film printed resistors, that is, the first isolation resistor R1 and the second isolation resistor R2 are both printed on the dielectric board by means of thick film printing, and are embedded in the laminated body, and the thick film printing is a conventional means in the art, and therefore, is not specifically described here, and in this embodiment, is printed by thick film resistor paste.

As shown in fig. 3, the metal circuit distribution in the power divider stack in this embodiment is specifically that no metal layer is printed on the dielectric boards of the 1 st, 2 nd, 3 rd, 4 th, 5 th, 13 th, 14 th, 15 th, 16 th and 17 th layers, and the metal conduction bands constituting the first inductor L1, the second inductor L2, the third inductor L3 and the fourth inductor L4 are located on the dielectric boards of the 6 th, 7 th, 8 th, 9 th, 10 th, 11 th and 12 th layers; the metal patterns forming the first grounded capacitor C1, the second grounded capacitor C2 and the third grounded capacitor C3 are positioned on 18 th and 19 th layers of dielectric slabs, wherein the metal pattern on the 19 th layer of dielectric slab is a ground layer, the ground layer forms a ground electrode plate of the first grounded capacitor C1, the second grounded capacitor C2 and the third grounded capacitor C3, and the metal pattern on the 18 th layer of dielectric slab forms another electrode plate of the first grounded capacitor C1, the second grounded capacitor C2 and the third grounded capacitor C3; the first isolation resistor R1 is printed on the upper surface of the 18 th-layer dielectric plate, the second isolation resistor R2 is printed on the upper surface of the 6 th-layer dielectric plate, and the first isolation resistor R2 is connected with the upper surface of the 6 th-layer dielectric plate through a via hole on each dielectric plate, so that a metal circuit is formed.

The size of the P-band miniature broadband ceramic power divider in the embodiment is only 4.5mm × 3.2mm × 0.8mm, the size is small, the weight is light, the working frequency is 360-840 MHz, the relative bandwidth reaches 80%, the maximum insertion loss in the working frequency band is less than 0.5dB, the bandwidth is wide, the loss is small, the cost is low, the processing is simple, the P-band miniature broadband ceramic power divider is suitable for batch production, can be processed into a patch type, can be embedded in a substrate, and is very suitable for and convenient to integrate in a microwave system. And the P-band miniature broadband ceramic power divider embeds the isolation resistor in the laminated body, and does not need to be externally connected with a resistor when in use, thereby increasing the reliability of the product.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. A P-band miniature broadband ceramic power divider is characterized by comprising:

a laminated body formed by stacking a plurality of dielectric sheets;

2. The P-band miniature wideband ceramic power divider of claim 1, wherein said dielectric slab is an LTCC ceramic substrate.

3. The P-band micro broadband ceramic power divider of claim 1, wherein the dielectric plate is provided with a metal conduction band, a metal pattern and via holes, and the metal circuits are communicated through the via holes on the adjacent dielectric plates.

4. The P-band micro broadband ceramic power divider of claim 1, wherein the metal circuit further comprises an input, a first output, and a second output, the first branch being connected between the input and the first output, and the second branch being connected between the input and the second output.

5. The P-band micro broadband ceramic power divider of claim 4, further comprising at least one ground plane in the dielectric plate, wherein the surface of the stacked body is provided with electrodes of the input terminal, the first output terminal, the second output terminal, and the ground terminal.

6. The P-band micro broadband ceramic power divider of claim 1, wherein the first inductor L1, the second inductor L2, the third inductor L3 and the fourth inductor L4 are all spiral inductors, and each spiral inductor is formed by a metal conduction band on the dielectric plate, and the metal conduction bands on each dielectric plate are wound into 1/2 rectangles.

7. The P-band micro broadband ceramic power divider of claim 1, wherein the first grounded capacitor C1, the second grounded capacitor C2, and the third grounded capacitor C3 are flat capacitor structures, and the flat capacitors are formed by metal patterns on the dielectric plate.

8. The P-band micro broadband ceramic power divider of claim 1, wherein the first isolation resistor R1 and the second isolation resistor R2 are thick film printed resistors.

9. The P-band micro broadband ceramic power divider of claim 5, wherein the electrodes of the input terminal, the first output terminal, the second output terminal and the ground terminal are printed on the side of the stacked body, the stacked body is formed by stacking 19 dielectric plates, no metal layer is printed on the dielectric plates of the 1 st, 2 nd, 3 th, 4 th, 5 th, 13 th, 14 th, 15 th, 16 th and 17 th layers, and the metal conduction bands forming the first inductor L1, the second inductor L2, the third inductor L3 and the fourth inductor L4 are located on the dielectric plates of the 6 th, 7 th, 8 th, 9 th, 10 th, 11 th and 12 th layers;

10. The P-band miniature broadband ceramic power divider of claim 1, having dimensions of 4.5mm x 3.2mm x 0.8 mm.