CN213023900U - Heat dissipation dustproof construction - Google Patents
Heat dissipation dustproof construction Download PDFInfo
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- CN213023900U CN213023900U CN202022422961.5U CN202022422961U CN213023900U CN 213023900 U CN213023900 U CN 213023900U CN 202022422961 U CN202022422961 U CN 202022422961U CN 213023900 U CN213023900 U CN 213023900U
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- Prior art keywords
- heat dissipation
- image processing
- assembly
- processing assembly
- image acquisition
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 82
- 238000010276 construction Methods 0.000 title description 4
- 239000000428 dust Substances 0.000 claims description 10
- 239000000565 sealant Substances 0.000 claims description 8
- 230000002265 prevention Effects 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 5
- 238000001816 cooling Methods 0.000 description 8
- 230000005855 radiation Effects 0.000 description 6
- 238000007789 sealing Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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- Camera Bodies And Camera Details Or Accessories (AREA)
Abstract
The utility model discloses a heat dissipation dustproof structure, which comprises an image acquisition component with a sealed appearance and an image processing component with a sealed appearance; the image acquisition assembly and the image processing assembly are electrically connected through an inter-board connector; a heat dissipation channel is formed between the image acquisition assembly and the image processing assembly; the image processing assembly deviates from the right end of one side of the image acquisition assembly and is provided with an air inlet communicated with the heat dissipation channel, the air inlet is close to the bottom of the image processing assembly, and the top of the left end of the image processing assembly is provided with an air outlet communicated with the heat dissipation channel. The utility model discloses under the condition of having ensured the radiating effect, can also have dustproof effect.
Description
Technical Field
The utility model belongs to the technical field of the photography equipment and specifically relates to indicate a heat dissipation dustproof construction.
Background
In the application field of high-reliability aerial cameras, the requirement on the upper limit working temperature of the camera is high, heat dissipation treatment needs to be performed on high-power elements in the camera during structural design, a common heat dissipation mode is air cooling heat dissipation, the traditional air cooling heat dissipation design is divided into two types, one type is that a heat dissipation fan is fixed to a sealed structural shell in a screw locking mode, the other type is that a heat dissipation channel is arranged on the opposite side of the camera shell, and the fan is fixed to the heat dissipation channel.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the technical problem that will solve is: the heat dissipation dustproof structure is provided, so that stable heat dissipation of a camera is ensured, and meanwhile, dust can be prevented from entering the camera.
In order to solve the technical problem, the utility model discloses a technical scheme be:
a heat dissipation dustproof structure comprises an image acquisition assembly with a closed shape and an image processing assembly with a closed shape;
the image acquisition assembly and the image processing assembly are electrically connected through an inter-board connector;
a heat dissipation channel is formed between the image acquisition assembly and the image processing assembly;
the image processing assembly deviates from the right end of one side of the image acquisition assembly and is provided with an air inlet communicated with the heat dissipation channel, the air inlet is close to the bottom of the image processing assembly, and the top of the left end of the image processing assembly is provided with an air outlet communicated with the heat dissipation channel.
Further, the heat dissipation channel comprises an air inlet flow channel and a heat dissipation cavity;
the plane of the air inlet flow channel is vertical to the plane of the heat dissipation cavity;
the air inlet is communicated with the air outlet through the air inlet flow passage and the heat dissipation cavity. Air inlet channel and air inlet channel
Further, the board-to-board connector comprises a male head and a female head;
the male head is arranged on one side of the image acquisition assembly, and the female head is arranged on one side of the image processing assembly;
the male head and the female head are oppositely arranged.
Furthermore, the image acquisition assembly is connected with the male head and the image processing assembly is connected with the female head through sealing glue.
Further, the type of the sealant is GD 414.
Furthermore, the image acquisition assembly and the image processing assembly are detachably connected through screws.
Furthermore, a lens mounting ring for mounting a lens is arranged on one side of the image acquisition assembly, which is far away from the image processing assembly.
Furthermore, the image processing device also comprises a heat radiation fan, wherein the heat radiation fan is arranged on one side of the image processing assembly, and an air outlet of the heat radiation fan is communicated with the air inlet.
The beneficial effects of the utility model reside in that: constitute heat dissipation channel between image acquisition subassembly and image processing subassembly, and the air intake is located the left end that image processing subassembly deviates from image acquisition subassembly one side, and be close to the bottom setting of image processing subassembly, and the air outlet is located the top of image processing subassembly right-hand member, a flow area for furthest extension heat dissipation channel, improve the radiating effect, heat dissipation channel sets up between two inclosed subassemblies, shorten inside high-power component heat-conduction path greatly, the radiating efficiency is improved, can also ensure the leakproofness of image acquisition subassembly and image acquisition subassembly simultaneously, avoid the dust to get into image acquisition subassembly and image processing subassembly and influence the electronic component performance, satisfy the requirement of high reliability camera to heat dissipation and dustproof performance.
Drawings
Fig. 1 is an exploded view of a heat dissipation and dust prevention structure of the present invention;
fig. 2 is a cross-sectional view of a heat dissipation dustproof structure of the present invention;
fig. 3 is a schematic view of a partial structure of a heat dissipation dustproof structure of the present invention;
fig. 4 is an exploded view of a heat dissipation dustproof structure of the present invention.
Description of reference numerals:
1. a lens mount ring; 2. an image acquisition component; 3. a male head; 4. a female head; 5. an image processing component; 6. a screw; 7. an air inlet; 8. an air outlet; 9. a heat dissipation channel; 91. an air inlet channel; 92. and a heat dissipation cavity.
Detailed Description
In order to explain the technical content, the objects and the effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.
Referring to fig. 1 to 4, a heat dissipation and dust prevention structure includes an image acquisition component with a sealed shape and an image processing component with a sealed shape;
the image acquisition assembly and the image processing assembly are electrically connected through an inter-board connector;
a heat dissipation channel is formed between the image acquisition assembly and the image processing assembly;
the image processing assembly deviates from the left end of one side of the image acquisition assembly and is provided with an air inlet communicated with the heat dissipation channel, the air inlet is close to the bottom of the image processing assembly, and the top of the right end of the image processing assembly is provided with an air outlet communicated with the heat dissipation channel.
The utility model discloses a theory of operation lies in:
the image acquisition assembly and the image processing assembly are arranged to be of a sealing structure, dustproof requirements are met, a heat dissipation channel is formed between the image acquisition assembly and the image processing assembly, and the purpose of heat dissipation of components is achieved.
From the above description, the beneficial effects of the present invention are: constitute heat dissipation channel between image acquisition subassembly and image processing subassembly, and the air intake is located the left end that image processing subassembly deviates from image acquisition subassembly one side, and be close to the bottom setting of image processing subassembly, and the air outlet is located the top of image processing subassembly right-hand member, a flow area for furthest extension heat dissipation channel, improve the radiating effect, heat dissipation channel sets up between two inclosed subassemblies, shorten inside high-power component heat-conduction path greatly, the radiating efficiency is improved, can also ensure the leakproofness of image acquisition subassembly and image acquisition subassembly simultaneously, avoid the dust to get into image acquisition subassembly and image processing subassembly and influence the electronic component performance, satisfy the requirement of high reliability camera to heat dissipation and dustproof performance.
Further, the heat dissipation channel comprises an air inlet flow channel and a heat dissipation cavity; the plane of the air inlet flow channel is vertical to the plane of the heat dissipation cavity; the air inlet is communicated with the air outlet through the air inlet flow passage and the heat dissipation cavity.
According to the above description, the arrangement of the air inlet channel and the heat dissipation cavity enlarges the heat dissipation area of the heat dissipation channel and improves the heat dissipation efficiency.
Further, the board-to-board connector comprises a male head and a female head;
the male head is arranged on one side of the image acquisition assembly, and the female head is arranged on one side of the image processing assembly;
the male head and the female head are oppositely arranged.
Furthermore, the image acquisition assembly is connected with the male head and the image processing assembly is connected with the female head through sealing glue.
As can be seen from the above description, the image acquisition assembly and the image processing assembly are connected through the male head and the female head, so that electric signal transmission is realized, the image acquisition assembly and the image processing assembly are not communicated with the heat dissipation channel, and are connected through the sealant, the tightness of the image acquisition assembly and the image processing assembly is ensured, and dust is prevented from entering the image acquisition assembly and the image processing assembly.
Further, the type of the sealant is GD 414.
As can be seen from the above description, the sealing performance is better when the sealant with the type GD14 is adopted.
Furthermore, the image acquisition assembly and the image processing assembly are detachably connected through screws.
As can be seen from the above description, the image acquisition assembly and the image processing assembly are detachably connected through screws, so that the assembly and the disassembly are convenient, and the dust removal of the heat dissipation channel is convenient.
Furthermore, a lens mounting ring for mounting a lens is arranged on one side of the image acquisition assembly, which is far away from the image processing assembly.
As can be seen from the above description, the lens mounting ring is installed to facilitate the installation of the lens, so that the image capturing assembly can capture images.
Furthermore, the image processing device also comprises a heat radiation fan, wherein the heat radiation fan is arranged on one side of the image processing assembly, and an air outlet of the heat radiation fan is communicated with the air inlet.
As can be seen from the above description, the image processing device further includes a cooling fan for conveying cold air to the cooling channel, so that the image acquisition assembly and the image processing assembly realize air-cooling.
Example one
Referring to fig. 1, a heat dissipation dustproof structure includes an image acquisition assembly 2 with a closed shape and an image processing assembly 5 with a closed shape; the image acquisition component 2 and the image processing component 5 are connected through an inter-board connector; a heat dissipation channel 9 is formed between the image acquisition assembly 2 and the image processing assembly 5; the left end of one side of the image processing assembly 5, which is far away from the image acquisition assembly 2, is provided with an air inlet 7 communicated with a heat dissipation channel 9, the air inlet 7 is arranged at the bottom of the image processing assembly 5, and the top of the right end of the image processing assembly 5 is provided with an air outlet 8 communicated with the heat dissipation channel 9. Preferably, the length dimension of the board-to-board connector is 16 CM; wherein the board-to-board connector is also known as a board-to-board connector.
Example two
The difference between this embodiment and the first embodiment is that the specific structure of the heat dissipation channel 9 and the board-to-board connector is defined.
Referring to fig. 2, the heat dissipation channel 9 includes an intake runner 91 and a heat dissipation chamber 92; the plane of the inlet runner 91 is perpendicular to the plane of the heat dissipation cavity 92; the air inlet 7 is communicated with the air outlet 8 through an air inlet flow passage 91 and a heat dissipation chamber 92. Referring to fig. 3 and 4, the board-to-board connector comprises a male connector 3 and a female connector 4; the male head 3 is arranged at one side of the image acquisition component 2, and the female head 4 is arranged at one side of the image processing component 5; the male head 3 and the female head 4 are oppositely arranged. Preferably, the image acquisition assembly 2 and the male head 3 and the image processing assembly 5 and the female head 4 are connected through a sealant, and the type of the sealant is GD 414.
Referring to fig. 1 and 4, the image capturing assembly 2 and the image processing assembly 5 are detachably coupled by a plurality of screws 6.
Referring to fig. 1, a lens mounting ring 1 for mounting a lens is mounted on a side of the image capturing assembly 2 facing away from the image processing assembly 5. Specifically, the lens mounting ring 1 is connected with the image acquisition assembly 2 in a buckling manner.
EXAMPLE III
The difference between this embodiment and the second embodiment is as follows:
the image processing device also comprises a cooling fan, wherein the cooling fan is arranged on one side of the image processing component 5, and an air outlet of the cooling fan is communicated with the air inlet 7.
To sum up, the utility model provides a pair of heat dissipation dustproof construction constitutes the heat dissipation passageway between the image acquisition subassembly that is encapsulated situation and the image processing subassembly that is encapsulated situation, shortens inside high-power component heat-conduction route greatly, and then improves the radiating efficiency, and inclosed image acquisition subassembly and image processing subassembly can ensure again around it that the dust in the heat dissipation passageway can not influence inside electronic component performance simultaneously, satisfies the high reliability camera to heat dissipation and dirt-proof requirement.
The above mentioned is only the embodiment of the present invention, and not the limitation of the patent scope of the present invention, all the equivalent transformations made by the contents of the specification and the drawings, or the direct or indirect application in the related technical field, are included in the patent protection scope of the present invention.
Claims (8)
1. A heat dissipation dustproof structure is characterized by comprising an image acquisition assembly with a closed shape and an image processing assembly with a closed shape;
the image acquisition assembly and the image processing assembly are electrically connected through an inter-board connector;
a heat dissipation channel is formed between the image acquisition assembly and the image processing assembly;
the image processing assembly deviates from the right end of one side of the image acquisition assembly and is provided with an air inlet communicated with the heat dissipation channel, the air inlet is close to the bottom of the image processing assembly, and the top of the left end of the image processing assembly is provided with an air outlet communicated with the heat dissipation channel.
2. The heat dissipation dustproof structure of claim 1, wherein the heat dissipation channel comprises an air inlet channel and a heat dissipation cavity;
the plane of the air inlet flow channel is vertical to the plane of the heat dissipation cavity;
the air inlet is communicated with the air outlet through the heat dissipation cavity.
3. The heat dissipating dust protected structure of claim 1, wherein the board-to-board connector includes a male connector and a female connector;
the male head is arranged on one side of the image acquisition assembly, and the female head is arranged on one side of the image processing assembly;
the male head and the female head are oppositely arranged.
4. The heat dissipation and dust prevention structure of claim 3, wherein the image acquisition assembly and the male head and the image processing assembly and the female head are connected by a sealant.
5. The heat-dissipating and dust-preventing structure according to claim 4, wherein the type of the sealant is GD 414.
6. The heat dissipation dustproof structure of claim 1, wherein the image acquisition assembly and the image processing assembly are detachably connected by screws.
7. The heat-dissipating and dust-preventing structure of claim 1, wherein a lens mounting ring for mounting a lens is mounted on a side of the image capturing assembly facing away from the image processing assembly.
8. The heat dissipation dustproof structure of claim 1, further comprising a heat dissipation fan, wherein the heat dissipation fan is installed at one side of the image processing assembly, and an air outlet of the heat dissipation fan is communicated with the air inlet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022422961.5U CN213023900U (en) | 2020-10-27 | 2020-10-27 | Heat dissipation dustproof construction |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022422961.5U CN213023900U (en) | 2020-10-27 | 2020-10-27 | Heat dissipation dustproof construction |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213023900U true CN213023900U (en) | 2021-04-20 |
Family
ID=75481675
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022422961.5U Active CN213023900U (en) | 2020-10-27 | 2020-10-27 | Heat dissipation dustproof construction |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213023900U (en) |
-
2020
- 2020-10-27 CN CN202022422961.5U patent/CN213023900U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20231117 Address after: 3 / F, building 5, wanwanshe intelligent industrial park, 2 Yangqi Branch Road, Cangshan District, Fuzhou City, Fujian Province, 350000 Patentee after: FUZHOU INDIGO IMAGING TECHNOLOGY CO.,LTD. Address before: 130000 Yingkou Road, Changchun economic and Technological Development Zone, Jilin 77 Patentee before: Changchun yingdige Imaging Technology Co.,Ltd. |
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| TR01 | Transfer of patent right |