CN212970566U - Radiating fin - Google Patents
Radiating fin Download PDFInfo
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- CN212970566U CN212970566U CN202021901431.2U CN202021901431U CN212970566U CN 212970566 U CN212970566 U CN 212970566U CN 202021901431 U CN202021901431 U CN 202021901431U CN 212970566 U CN212970566 U CN 212970566U
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- heat dissipation
- composite
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- passage
- capillary structure
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Abstract
The application provides a cooling fin, including the cooling fin body, the cooling fin body includes first composite sheet, first base plate and second base plate at least, first composite sheet respectively with first base plate and second base plate fixed connection, be equipped with the heat dissipation route in the first composite sheet, be equipped with capillary structure on the heat dissipation route inner wall, be provided with the refrigerant in the heat dissipation route. The application provides a fin has reduced the influence of inner wall adhesive force to the refrigerant circulation, reduces the influence of gravity to the refrigerant circulation simultaneously, is favorable to the refrigerant circulation, improves heat dispersion, reduces the fin cost, can replace the high temperature sintering capillary structure that the price/performance ratio is extremely low.
Description
Technical Field
The utility model relates to a heat transfer technical field especially relates to a fin.
Background
Along with the improvement of the performance of the high-power electronic device, more and more heat is generated when the electronic device works, if the heat generated by the electronic device is not timely dissipated, the temperature of a chip can be increased, so that the efficiency is reduced, the service life is shortened, and even the electronic device is failed. Thus, there is a need for a heat sink with better heat transfer properties to solve the heat dissipation problem.
The radiating fin in the prior art is formed by compounding two aluminum substrates, the shape of a radiating pipeline is printed on one aluminum substrate, the two aluminum substrates are subjected to hot rolling, compounding and blowing, and the radiating fin radiates heat through a refrigerant in the radiating pipeline. The refrigerant is changed into a gas state during working and then is condensed into a liquid state at a lower temperature part, but the condensed liquid refrigerant cannot flow back to the bottom due to the adhesive force of the inner wall of the heat dissipation pipeline, and the refrigerant in the pipeline is difficult to circulate, so that the heat dissipation performance of the heat dissipation fin is poor, and the heat dissipation requirement cannot be met. For the above problems, the prior art solves the problems by sintering the capillary structure on the aluminum substrate, but the sintering of the capillary structure is complex and high in cost, and the large-scale production is high in cost and low in cost performance.
Disclosure of Invention
In order to solve the technical problem, the utility model provides a heat sink.
The novel radiating fin comprises a radiating fin body, wherein the radiating fin body at least comprises a first composite plate, a first base plate and a second base plate;
the first composite board is fixedly connected with the first substrate and the second substrate respectively;
a heat dissipation passage is arranged in the first composite board, and a capillary structure is arranged on the inner wall of the heat dissipation passage;
and a refrigerant is arranged in the heat dissipation passage.
The first composite plate comprises a first composite layer and a second composite layer, and the first composite layer and the second composite layer are fused to form a first composite plate;
the first composite layer is fixedly connected with the first substrate to form a first plate; the second composite layer is fixedly connected with the second substrate to form a second plate;
a first heat dissipation passage is arranged on the first plate, and the heat dissipation passage at least comprises the first heat dissipation passage;
the thickness of the first composite layer is 2.5% -30% of the thickness of the first plate;
the thickness of the second composite layer is 2.5% -30% of the thickness of the second plate.
The capillary structure is fixed on the inner wall of the heat dissipation passage by a molten material of the first composite layer/the second composite layer, and the capillary structure is fixedly connected with the inner wall of the heat dissipation passage through the first composite layer/the second composite layer.
Wherein, a second heat dissipation passage is arranged on the second plate;
the position of the second heat dissipation passage corresponds to that of the first heat dissipation passage, so that the first heat dissipation passage and the second heat dissipation passage form a closed heat dissipation passage.
The end part of the first composite plate is provided with a filling port and an opening, and the filling port and the opening are in a sealed state;
the heat dissipation passage communicates with the fill port and the opening.
The radiating fin body is a structure formed by aligning and attaching two independent composite plates.
Wherein, the radiating fin body is of an integrated structure;
the radiating fin body is formed by folding a composite plate by taking a preset groove as a central line, and a hollow passage is formed after the groove is folded;
the hollow passage is communicated with the heat dissipation passage;
a capillary structure is arranged on the inner wall of the hollow passage;
a refrigerant is arranged in the hollow passage.
Wherein the capillary structure comprises at least one or more of: metal mesh, metal particles;
when the capillary structure is a metal net, the diameter of the meshes of the metal net is 0.1-1.0 mm;
when the capillary structure is metal particles, the diameter of the metal particles is 0.1-1.0 mm.
Wherein the thickness of the first composite layer is 5-15% of the thickness of the first plate;
the thickness of the second composite layer is 5% -15% of the thickness of the second plate.
The application provides a fin sets up capillary structure 2 on the inner wall of cavity route 130 and/or heat dissipation route 100, has reduced the influence of inner wall adhesive force to the refrigerant circulation, reduces gravity to the influence of refrigerant circulation simultaneously, and the fin that this application provided is favorable to the refrigerant circulation, improves heat dispersion, reduces the fin cost simultaneously, can replace the high temperature sintering capillary structure that the price/performance ratio is extremely low.
Drawings
Fig. 1 is a structural view of a fin 1 composed of two composite plates.
Fig. 2 is a sectional structural view of the heat sink 1.
Fig. 3 is a structural view of a fin 2 composed of a composite plate.
Fig. 4 is a sectional structural view of the heat sink 2.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without any inventive step, are within the scope of the present invention. It should be noted that, in the embodiments and examples of the present application, the feature vectors may be arbitrarily combined with each other without conflict.
The present application provides a heat sink, as shown in fig. 1-4, fig. 1 exemplarily shows a structural view of a heat sink 1 composed of two composite plates provided in the present application, fig. 2 exemplarily shows a structural view of a cross section of the heat sink 1 provided in the present application, fig. 3 exemplarily shows a structural view of a heat sink 2 composed of one composite plate, and fig. 4 exemplarily shows a structural view of a cross section of the heat sink 2.
As can be seen from fig. 1 to 4, the heat sink provided by the present application may include a heat sink body 1, where the heat sink body 1 at least includes a first composite board 10, a first substrate 11 and a second substrate 12, the first composite board 10 is respectively and fixedly connected to the first substrate 11 and the second substrate 12, a heat dissipation passage 100 is disposed in the first composite board 10, a capillary structure 2 is disposed on an inner wall of the heat dissipation passage 100, and a refrigerant is disposed in the heat dissipation passage 100.
The heat sink body 1 at least includes a first composite plate 10, a first base plate 11, and a second base plate 12, and forms a sandwich structure with the first composite plate 10 in between. The heat radiating fin body 1 can also be fixedly connected in sequence by the following structures: composite layer A, first substrate 11, first composite board 10, second substrate 12, composite layer B. The composite layer A is fixedly connected with the first substrate 11, the composite layer B is fixedly connected with the second substrate 12, the first composite board 10 is respectively fixedly connected with the first substrate 11 and the second substrate 12, the composite layer A and the composite layer B are composite layers with the same structure, but different from the first composite board 10 in structure, and the first composite board 10 is formed after two composite layers are fused.
The first composite board 10 is provided with a heat dissipation passage 100 therein, the inner wall of the heat dissipation passage 100 is provided with a capillary structure 2, and the heat dissipation passage 100 is provided with a refrigerant therein. During the working process of the refrigerant, the refrigerant is evaporated in the heat dissipation passage 100, rises to a part with lower temperature and is condensed into liquid, and the capillary structure 2 enables the refrigerant condensed into liquid to flow back again, so that the refrigerant in the heat dissipation passage 100 realizes cyclic phase change, the adhesive force of the inner wall is overcome, and the heat dissipation efficiency and the heat dissipation performance of the heat dissipation fin are improved.
In the heat sink provided by the present application, the first composite plate 10 includes a first composite layer 101 and a second composite layer 102, and the first composite layer 101 and the second composite layer 102 are fused to form the first composite plate 10; the first composite layer 101 is fixedly connected with the first substrate 11 to form a first plate 111, and the second composite layer 102 is fixedly connected with the second substrate 12 to form a second plate 122; the first plate 111 is provided with a first heat dissipation path 110, and the heat dissipation path 100 at least comprises the first heat dissipation path 110; the thickness of the first composite layer 101 is 2.5% -30% of the thickness of the first plate 111; the thickness of the second composite layer 102 is 2.5% -30% of the thickness of the second plate 122.
In one embodiment, the thickness of the first composite layer 101 is 2.5% to 30% of the thickness of the first plate 111, the thickness of the second composite layer 102 is 2.5% to 30% of the thickness of the second plate 122, and the first composite layer 101 and the second composite layer 102 are melted and then cooled to form the first composite plate 10. Specifically, the first composite layer 101 and the second composite layer 102 may be welded together by brazing at a temperature higher than the melting points of the first composite layer 101 and the second composite layer 102. The heat dissipation path 100 at least includes a first heat dissipation path 110, the first heat dissipation path 110 is disposed on the first plate 111, specifically, a connected groove is hot-rolled on the first plate 111 by stamping or the like to form the first heat dissipation path 110, and a refrigerant is disposed inside the first heat dissipation path 110.
The application provides a heat dissipation sheet, the melt after the first composite layer 101/the second composite layer 102 melts fixes the capillary structure 2 on the inner wall of the heat dissipation passage 100, and the capillary structure 2 is fixedly connected with the inner wall of the heat dissipation passage 100 through the first composite layer 101/the second composite layer.
The inner wall of the heat dissipation passage 100 is provided with a first composite layer 101/a second composite layer 102, after the first composite layer 101/the second composite layer 102 are melted, the melt fixes the capillary structure 2 placed in advance on the inner wall, and specifically, the melt also fills a connection gap between the capillary structure 2 and the inner wall, so that the capillary structure 2 and the inner wall are tightly and firmly connected together. The heat dissipation passage 100 is also internally provided with a refrigerant, the capillary structure 2 enables the refrigerant condensed into liquid state to flow back again, the circulating phase change of the refrigerant is realized, the obstruction of gravity and inner wall adhesive force to the backflow of the refrigerant is overcome, and the heat dissipation efficiency and the heat dissipation performance of the heat dissipation fin are improved
The present application provides a heat sink, a second heat dissipation path 120 may be disposed on the second plate 122, and the position of the second heat dissipation path 120 corresponds to the position of the first heat dissipation path 110, so that the first heat dissipation path 110 and the second heat dissipation path 120 form a closed heat dissipation path 100. Wherein the second heat dissipation path 120 may be formed by hot-rolling a communication groove on the second plate 122, and the capillary structure 2 may be disposed on the inner wall of the second heat dissipation path 120.
The application provides a heat sink, can be provided with on the tip of first composite sheet 10 and fill notes mouth 3 and opening 4, fills notes mouth 3 and opening 4 and is the encapsulated situation, and heat dissipation path 100 is linked together with filling mouthful 3 and opening 4.
In one embodiment, the first composite plate 10 has a filling opening 3 and an opening 4 at its end, the heat dissipation passage 100 is connected to the filling opening 3 and the opening 4, and the filling opening 3 and the opening 4 are sealed when the heat dissipation plate is in operation. Fill notes mouth 3 and opening 4 and all play a role in the fin manufacture process, opening 4 is used for filling in the frock to make when heat dissipation path 100 inner wall erection joint capillary structure 2, increase the pressure of capillary structure 2 and inner wall, thereby make capillary structure 2 and inner wall connection inseparabler firm, opening 4 is sealed after capillary structure 2 accomplishes erection joint and takes out the frock. The filling port 3 is used for filling refrigerant, and is sealed after filling. The purpose of sealing the fill port 3 and the opening 4 is to maintain the heat dissipation path 100 in a sealed state throughout the operation of the heat sink.
In the fin that this application provided, fin body 1 can be the structure that two independent composite sheet counterpoint laminating formed. Specifically, the composite plate constituting the heat sink body 1 may be two aluminum substrates.
In the first embodiment, as shown in fig. 1-2, after aligning, bonding and sealing two independent aluminum substrates, the heat sink body 1 is formed, the first plate 111 is provided with the first heat dissipation passage 110, the second plate 122 is provided with the second heat dissipation passage 120, and the first heat dissipation passage 110 and the second heat dissipation passage 120 are aligned and bonded to form the heat dissipation passage 100. The capillary structure 2 is arranged on the inner wall of the heat dissipation passage 100, and the capillary structure 2 is fixedly connected with the inner wall of the heat dissipation passage 100, so that the refrigerant condensed into a liquid state in the heat dissipation passage 100 flows back to other parts, the refrigerant circulation phase change is promoted, the heat dissipation performance of the heat dissipation fin is improved, and the production cost is reduced.
In the cooling fin provided by the application, the cooling fin body 1 can be an integral structure, the cooling fin body 1 is formed by folding a composite board by taking a preset groove as a central line, the groove is folded to form a hollow passage 130, the hollow passage 130 is communicated with the cooling passage 100, the inner wall of the hollow passage 130 is provided with a capillary structure 2, and a refrigerant is arranged in the hollow passage 130. Specifically, the heat sink body 1 may be formed of an aluminum substrate.
In the second embodiment, as shown in fig. 3-4, an aluminum substrate is folded, attached and sealed with a predetermined groove as a central line to form the heat sink body 1. The middle of the turned groove forms a hollow structure, namely a hollow passage 130, the hollow passage 130 is communicated with the heat dissipation passage 100, and the inner wall of the hollow passage 130 can be provided with a capillary structure 2, so that the refrigerant condensed into liquid state in the hollow passage 130 flows back to other parts, the refrigerant circulation phase change is promoted, the heat dissipation efficiency of the heat dissipation fin is improved, and the cost is reduced.
The present application provides a heat sink in which the capillary structure 2 comprises at least one or more of the following: when the capillary structure 2 is a metal net, the diameter of the meshes of the metal net is 0.1-1.0 mm; when the capillary structure 2 is a metal particle, the diameter of the metal particle is 0.1-1.0 mm.
The capillary structure 2 may also include other types than the above types and other sizes than the above sizes, and the types and sizes of the capillary structure 2 are not limited herein and are not described in detail.
In the embodiment, the thickness of the first composite layer 101 is 5% to 15% of the thickness of the first plate 111, and the thickness of the second composite layer 102 is 5% to 15% of the thickness of the second plate 122, at this time, the connection between the first plate 111 and the second plate 122 is the tightest and firmest, and the fitting and sealing effect is the best.
The application provides a fin sets up capillary structure 2 on the inner wall of cavity route 130 and/or heat dissipation route 100, has reduced the influence of inner wall adhesive force to the refrigerant circulation, reduces gravity to the influence of refrigerant circulation simultaneously, and the fin that this application provided is favorable to the refrigerant circulation, improves heat dispersion, reduces the fin cost simultaneously, has replaced the high temperature sintering capillary structure that the price/performance ratio is extremely low.
It is to be noted that, in this document, the terms "comprises", "comprising" or any other variation thereof are intended to cover a non-exclusive inclusion, so that an article or apparatus including a series of elements includes not only those elements but also other elements not explicitly listed or inherent to such article or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of additional like elements in the article or device comprising the element.
The above embodiments are merely to illustrate the technical solution of the present invention, not to limit the same, and the present invention is described in detail with reference to the preferred embodiments. It will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the true spirit and scope of the novel concept as defined by the appended claims.
Claims (9)
1. A heat sink, characterized in that it comprises a heat sink body (1), said heat sink body (1) comprising at least a first composite plate (10), a first base plate (11) and a second base plate (12);
the first composite board (10) is fixedly connected with the first substrate (11) and the second substrate (12) respectively;
a heat dissipation passage (100) is arranged in the first composite board (10), and a capillary structure (2) is arranged on the inner wall of the heat dissipation passage (100);
a refrigerant is arranged in the heat dissipation passage (100).
2. A heat sink according to claim 1, wherein the first composite sheet (10) comprises a first composite sheet (101) and a second composite sheet (102), the first composite sheet (101) and the second composite sheet (102) being fused to form the first composite sheet (10);
the first composite layer (101) is fixedly connected with the first substrate (11) to form a first plate (111); the second composite layer (102) is fixedly connected with the second substrate (12) to form a second plate (122);
a first heat dissipation passage (110) is arranged on the first plate (111), and the heat dissipation passage (100) at least comprises the first heat dissipation passage (110);
the thickness of the first composite layer (101) is 2.5-30% of the thickness of the first plate (111);
the thickness of the second composite layer (102) is 2.5% -30% of the thickness of the second plate (122).
3. The heat sink according to claim 2, wherein the melted first/second composite layers (101, 102) fix the capillary structure (2) to the inner wall of the heat dissipation channel (100), and the capillary structure (2) is fixedly connected to the inner wall of the heat dissipation channel (100) via the first/second composite layers (101, 102).
4. The heat sink as recited in claim 2, wherein the second plate (122) is provided with a second heat dissipation passage (120);
the second heat dissipation path (120) is located corresponding to the first heat dissipation path (110), so that the first heat dissipation path (110) and the second heat dissipation path (120) form a closed heat dissipation path (100).
5. A fin as claimed in claim 1, wherein said first composite plate (10) is provided at its ends with a fill opening (3) and openings (4), said fill opening (3) and openings (4) being in a sealed condition;
the heat dissipation passage (100) is communicated with the filling opening (3) and the opening (4).
6. A fin as claimed in claim 1, wherein said fin body (1) is a structure formed by two separate composite plates bonded together in alignment.
7. A heat sink according to claim 1, wherein the heat sink body (1) is of unitary construction;
the radiating fin body (1) is formed by folding a composite plate by taking a preset groove as a central line, and a hollow passage (130) is formed after the groove is folded;
the hollow passage (130) is communicated with the heat dissipation passage (100);
a capillary structure (2) is arranged on the inner wall of the hollow passage (130);
a refrigerant is arranged in the hollow passage (130).
8. A heat sink according to claim 1, wherein the capillary structure (2) comprises at least one or more of: metal mesh, metal particles;
when the capillary structure (2) is a metal net, the diameter of the meshes of the metal net is 0.1-1.0 mm;
when the capillary structure (2) is metal particles, the diameter of the metal particles is 0.1-1.0 mm.
9. A heat sink according to claim 2, wherein the thickness of the first composite layer (101) is 5-15% of the thickness of the first plate (111);
the thickness of the second composite layer (102) is 5% -15% of the thickness of the second sheet (122).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021901431.2U CN212970566U (en) | 2020-09-03 | 2020-09-03 | Radiating fin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021901431.2U CN212970566U (en) | 2020-09-03 | 2020-09-03 | Radiating fin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212970566U true CN212970566U (en) | 2021-04-13 |
Family
ID=75364998
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021901431.2U Expired - Fee Related CN212970566U (en) | 2020-09-03 | 2020-09-03 | Radiating fin |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212970566U (en) |
-
2020
- 2020-09-03 CN CN202021901431.2U patent/CN212970566U/en not_active Expired - Fee Related
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210413 Termination date: 20210903 |