CN212967690U

CN212967690U - High-reliability double-sided PBGA packaging substrate

Info

Publication number: CN212967690U
Application number: CN202022155887.5U
Authority: CN
Inventors: 张必燕
Original assignee: Jiangmen Hemei Jingyi Electronics Co ltd
Current assignee: Jiangmen Hemei Jingyi Electronics Co ltd
Priority date: 2020-09-27
Filing date: 2020-09-27
Publication date: 2021-04-13
Anticipated expiration: 2030-09-27

Abstract

The utility model discloses a two-sided PBGA packaging substrate of high reliability, including framework, cross connection branch and joint strip, the middle part of framework is embedded to have the packaging substrate subassembly, and the packaging substrate subassembly includes isolation thin slice, first chip base plate, first logical electric splicing, protection thin slice, second chip base plate, second logical electric splicing, solder ball, heat conduction gasket, spacing through-hole and heat dissipation thin slice, the rear end of isolation thin slice has first chip base plate, first logical electric splicing and protection thin slice from preceding laminating in proper order to the back, and the front end of isolation thin slice has linked in proper order second chip base plate, second logical electric splicing, heat conduction gasket and heat dissipation thin slice from the back to the front. This two-sided PBGA encapsulation base plate of high reliability wraps up and protects this holistic outside through the framework all around, utilizes joint strip to fill and seal the gap department between framework and the encapsulation base plate subassembly to this prevents that water or moisture from invading inside this PBGA encapsulation base plate's that leads to reliability reduction of encapsulation base plate subassembly.

Description

High-reliability double-sided PBGA packaging substrate

Technical Field

The utility model relates to a PBGA packaging substrate technical field specifically is a two-sided PBGA packaging substrate of high reliability.

Background

PBGA Package (Plastic Ball Grid Array Package) which uses BT resin/glass laminate as substrate, Plastic epoxy molding compound as sealing material, and eutectic solder 63Sn37Pb or quasi-eutectic solder 62Sn36Pb2Ag as solder Ball, some manufacturers have used lead-free solder, and the connection of solder Ball and Package body does not require additional solder. Some PBGA packages have a cavity structure, which is divided into two types, i.e., a cavity-up type and a cavity-down type. The PBGA with the cavity is called as a thermally enhanced BGA (electrically heated grid array), EBGA for short, and CPBGA cavity plastic solder ball arrays for enhancing the heat dissipation performance of the PBGA with the cavity.

The existing packaging substrate does not have good protection performance, so that the reliability is reduced after moisture invades the interior of the packaging substrate, and meanwhile, the edge is easy to warp due to the fact that the packaging substrate is too thin.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a two-sided PBGA packaging substrate of high reliability to the current packaging substrate who proposes in solving above-mentioned background does not possess better barrier propterty, makes moisture lead to the reliability to reduce after invading packaging substrate is inside, causes the problem of edge perk because of self is too thin simultaneously easily.

In order to achieve the above object, the utility model provides a following technical scheme: a high-reliability double-sided PBGA packaging substrate comprises a frame body, transverse connecting supporting rods and sealing rubber strips, wherein a packaging substrate assembly is embedded in the middle of the frame body and comprises an isolating sheet, a first chip substrate, a first power-on connecting sheet, a protective sheet, a second chip substrate, a second power-on connecting sheet, a solder ball, a heat conducting gasket, a limiting through hole and a heat radiating sheet, the rear end of the isolating sheet is sequentially attached with the first chip substrate, the first power-on connecting sheet and the protective sheet from front to back, the front end of the isolating sheet is sequentially attached with the second chip substrate, the second power-on connecting sheet, the heat conducting gasket and the heat radiating sheet from back to front, the solder ball is fixed at the front end of the second power-on connecting sheet, the limiting through hole is formed in the middle parts of the heat conducting gasket and the heat radiating sheet, the transverse connecting supporting rods are arranged on the two sides of the top and the bottom of the front end of the frame body, and, the vertical connecting supporting rods are connected with the transverse connecting supporting rods through the connecting long rods, the vertical connecting supporting rods are connected through the positioning supporting strips, and the sealing rubber strips are arranged at the connecting positions of the frame body and the packaging substrate assembly.

Preferably, the inner frame dimension of the frame body matches with the outer dimension of the package substrate assembly, and the joint of the frame body and the package substrate assembly forms a sealing structure by a sealing rubber strip.

Preferably, the outside four corners of framework is arc column structure, and horizontal connecting strut is the symmetric distribution about the horizontal axis of framework, erects connecting strut moreover and is the symmetric distribution about the vertical axis of framework.

Preferably, erect and constitute connection structure through the location branch between the connecting strut, and erect connecting strut and constitute connection structure through connecting stock and cross connecting strut, connecting the stock moreover and be the arc column structure.

Preferably, the second chip substrate and the first chip substrate are respectively attached to outer walls of front and rear ends of the isolation sheet, the second chip substrate and the second through connector are closely attached to each other, and the solder balls are equidistantly distributed outside the front end of the second through connector.

Preferably, the heat-conducting gasket and the heat-radiating sheet are tightly attached, the limiting through holes are equidistantly distributed around the middle parts of the heat-conducting gasket and the heat-radiating sheet, and the central points of the limiting through holes and the central points of the welding balls are overlapped.

Compared with the prior art, the beneficial effects of the utility model are that:

1. laminate in proper order between the internals of this two-sided PBGA package substrate subassembly of high reliability and form a whole, wrap up and protect around this holistic outside through the framework, utilize joint strip to fill and seal the gap department between framework and the package substrate subassembly to this prevents that water or moisture from invading inside reliability reduction that leads to this PBGA package substrate of package substrate subassembly.

2. This two-sided PBGA encapsulation base plate transverse connection branch of high reliability is perpendicular form between branch and the perpendicular branch of connecting and puts, port department between them connects through connecting the stock, make the framework at transverse connection branch, connect the stock, erect and connect the hardness that can strengthen edge position under the design that the branch ring shape connects the distribution, connect and bind two perpendicular connecting support poles through the location brace simultaneously, the stability of this framework is strengthened to an advanced degree, avoid this PBGA encapsulation base plate's corner position to take place the perk or bend.

3. The first chip substrate of the high-reliability double-sided PBGA packaging substrate, the first power-on contact pieces and the protection sheet are tightly attached to the rear end of the isolation sheet, the second chip substrate, the second power-on contact pieces, the heat conduction gasket and the heat dissipation sheet are tightly attached to the front end of the isolation sheet, wherein solder balls distributed on the surfaces of the second power-on contact pieces at equal intervals just protrude out of the middle of the limiting through hole, so that heat inside the second chip substrate and the second power-on contact pieces can be transferred to the heat dissipation sheet under the action of the heat conduction gasket, the heat dissipation speed is accelerated by the heat dissipation sheet, the isolation sheet is arranged to prevent the double-sided design of the PBGA packaging substrate from influencing the use effect of the PBGA packaging substrate, and the two sides are not interfered with each other.

Drawings

FIG. 1 is a schematic view of the overall front view structure of the present invention;

FIG. 2 is an exploded view of the package substrate assembly of the present invention;

fig. 3 is the schematic view of the sectional structure of the heat conducting gasket of the present invention.

In the figure: 1. a frame body; 2. a package substrate assembly; 201. a separator sheet; 202. a first chip substrate; 203. a first energizing tab; 204. a protective sheet; 205. a second chip substrate; 206. a second contact tab; 207. a solder ball; 208. a thermally conductive gasket; 209. a limiting through hole; 210. a heat dissipating sheet; 3. the supporting rod is transversely connected; 4. the support rod is vertically connected; 5. connecting a long rod; 6. sealing rubber strips; 7. and positioning the branch bars.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: a high-reliability double-sided PBGA packaging substrate comprises a frame body 1, a packaging substrate assembly 2, an isolation sheet 201, a first chip substrate 202, a first electrifying connecting piece 203, a protective sheet 204, a second chip substrate 205, a second electrifying connecting piece 206, a solder ball 207, a heat conduction gasket 208, a limiting through hole 209, a heat dissipation sheet 210, a transverse connecting support rod 3, a vertical connecting support rod 4, a connecting long rod 5, a sealing rubber strip 6 and a positioning support rod 7, wherein the packaging substrate assembly 2 is embedded in the middle of the frame body 1, the packaging substrate assembly 2 comprises the isolation sheet 201, the first chip substrate 202, the first electrifying connecting piece 203, the protective sheet 204, the second chip substrate 205, the second electrifying connecting piece 206, the solder ball 207, the heat conduction gasket 208, the limiting through hole 209 and the heat dissipation sheet 210, the first chip substrate 202, the first electrifying connecting piece 203 and the protective sheet 204 are sequentially attached to the rear end of the isolation sheet 201 from front to back, and the front end of the isolation sheet 201 is connected with a second chip substrate 205, a second connection tab 206, a heat conduction gasket 208 and a heat dissipation sheet 210 in sequence from back to front, the front end of the second connection tab 206 is fixed with a solder ball 207, the middle parts of the heat conduction gasket 208 and the heat dissipation sheet 210 are both provided with a limit through hole 209, a horizontal connection support rod 3 is arranged at the top and bottom two sides of the front end of the frame 1, the left and right sides of the front end of the frame 1 are both provided with vertical connection support rods 4, the vertical connection support rods 4 are connected with the horizontal connection support rods 3 through connection long rods 5, the vertical connection support rods 4 are connected through positioning support strips 7, sealing rubber strips 6 are arranged at the connection part of the frame 1 and the packaging substrate component 2, the size of the inner frame 1 is identical with the external size of the packaging substrate component 2, the connection part of the frame 1 and the packaging substrate component 2 forms a sealing structure through the sealing rubber strips 6, the, the periphery of the whole body is wrapped and protected by the frame body 1, and the sealing joint strip 6 is used for filling and sealing the gap between the frame body 1 and the packaging substrate assembly 2, so that the reliability of the PBGA packaging substrate is prevented from being reduced due to the fact that water or moisture invades the packaging substrate assembly 2;

the four outer corners of the frame body 1 are arc-shaped structures, the transverse connecting support rods 3 are symmetrically distributed about the transverse central axis of the frame body 1, the vertical connecting support rods 4 are symmetrically distributed about the vertical central axis of the frame body 1, the vertical connecting support rods 4 form a connecting structure through the positioning support rods 7, the vertical connecting support rods 4 form a connecting structure with the transverse connecting support rods 3 through the connecting long rods 5, the connecting long rods 5 are arc-shaped structures, the transverse connecting support rods 3 and the vertical connecting support rods 4 are vertically arranged, the port parts of the transverse connecting support rods 3 and the vertical connecting support rods 4 are connected through the connecting long rods 5, so that the frame body 1 can enhance the hardness of edge parts under the design of annular connecting distribution of the transverse connecting support rods 3, the connecting long rods 5 and the vertical connecting support rods 4, meanwhile, the positioning support rods 7 are used for connecting and binding the two vertical connecting support rods 4, the stability of the frame body 1 is enhanced to a certain degree, and the corner, the second chip substrate 205 and the first chip substrate 202 are respectively attached to the outer walls of the front end and the rear end of the isolation sheet 201, the second chip substrate 205 and the second through-contact 206 are closely attached, the solder balls 207 are equidistantly distributed outside the front end of the second through-contact 206, the heat-conducting gasket 208 and the heat dissipation sheet 210 are closely attached, the limiting through holes 209 are equidistantly distributed around the middle portions of the heat-conducting gasket 208 and the heat dissipation sheet 210, the center points of the limiting through holes 209 coincide with the center points of the solder balls 207, the first chip substrate 202, the first through-contact 203 and the protection sheet 204 are closely attached to the rear end of the isolation sheet 201, the second chip substrate 205, the second through-contact 206, the heat-conducting gasket 208 and the heat dissipation sheet 210 are closely attached to the front end of the isolation sheet 201, wherein the solder balls 207 equidistantly distributed on the surface of the second through-contact 206 protrude from the middle portions of the limiting through holes 209, the structure can transfer the heat inside the second chip substrate 205 and the second through connector 206 to the heat dissipation sheet 210 under the action of the heat conduction gasket 208, and the heat dissipation speed is increased by using the heat dissipation sheet 210, wherein the isolation sheet 201 is arranged to prevent the use effect of the PBGA package substrate from being influenced by the design of the two sides, so that the two sides do not interfere with each other.

The working principle is as follows: for this kind of high reliability double-sided PBGA package substrate, first, with the isolation sheet 201 as a reference, the first chip substrate 202, the first conducting contact 203 and the protection sheet 204 are closely attached to the back end of the isolation sheet 201, the second chip substrate 205, the second conducting contact 206, the heat conduction gasket 208 and the heat dissipation sheet 210 are closely attached to the front end of the isolation sheet 201, the isolation sheet 201 is disposed to prevent the double-sided design of the PBGA package substrate from affecting its own use effect, so that the two-sided structure is not interfered with each other, at this time, the solder balls 207 equally distributed on the surface of the second conducting contact 206 just protrude from the middle of the limiting through hole 209, the heat generated around the solder balls 207 and inside the second conducting contact 206 is conducted out and transferred to the heat dissipation sheet 210 through the heat conduction gasket 208, at this time, the heat is dissipated to the outside of the structure through the heat dissipation sheet 210, thereby avoiding the heat accumulation from affecting the service life of the PBGA package substrate, wrap up and strengthen sealing performance between the two with joint strip 6 through framework 1 to the outside of packaging substrate subassembly 2 all around subsequently, reach the effect that improves this PBGA packaging substrate reliability with this, horizontal connection branch 3 follows, connect the stock 5 and erect and connect between the branch 4 with clockwise ring connection in framework 1 both ends edge around, the design of this structure can strengthen hardness and wholeness on framework 1's basis, effectively prevent PBGA packaging substrate edge part position the condition of perk from taking place, and utilize location brace 7 to connect two perpendicular connection branch 4, GA PBGA packaging substrate self can not bend easily.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a two-sided PBGA packaging substrate of high reliability, includes framework (1), cross connection branch (3) and joint strip (6), its characterized in that: the middle part of the frame body (1) is embedded with a packaging substrate assembly (2), the packaging substrate assembly (2) comprises an isolation sheet (201), a first chip substrate (202), a first electrifying tab (203), a protective sheet (204), a second chip substrate (205), a second electrifying tab (206), a solder ball (207), a heat-conducting gasket (208), a limiting through hole (209) and a radiating sheet (210), the rear end of the isolation sheet (201) is sequentially attached with the first chip substrate (202), the first electrifying tab (203) and the protective sheet (204) from front to back, the front end of the isolation sheet (201) is sequentially attached with the second chip substrate (205), the second electrifying tab (206), the heat-conducting gasket (208) and the radiating sheet (210) from back to front, the solder ball end of the second electrifying tab (206) is fixed with the solder ball (207), the limiting through hole (209) is formed in the middle parts of the heat-conducting gasket (208) and the radiating sheet (210), horizontal connection branch (3) set up in the front end top bottom both sides of framework (1), and the front end left and right sides of framework (1) all is provided with erects connecting rod (4), erect connecting rod (4) and be connected with horizontal connection branch (3) through connecting stock (5), and erect and be connected through location branch strip (7) between connecting rod (4), joint strip (6) set up in the junction of framework (1) and encapsulation base plate subassembly (2).

2. The high-reliability double-sided PBGA package substrate of claim 1, wherein: the size of the inner frame of the frame body (1) is matched with the external size of the packaging substrate assembly (2), and the joint of the frame body (1) and the packaging substrate assembly (2) forms a sealing structure through a sealing rubber strip (6).

3. The high-reliability double-sided PBGA package substrate of claim 1, wherein: the outside four corners of framework (1) are arc column structure, and horizontal connecting strut (3) is the symmetric distribution about the horizontal axis of framework (1), erects connecting strut (4) moreover and is the symmetric distribution about the vertical axis of framework (1).

4. The high-reliability double-sided PBGA package substrate of claim 1, wherein: erect and connect between branch (4) and constitute connection structure through location branch (7), and erect and connect branch (4) and constitute connection structure through connecting stock (5) and cross connection branch (3), connect stock (5) moreover and be arc column structure.

5. The high-reliability double-sided PBGA package substrate of claim 1, wherein: the second chip substrate (205) and the first chip substrate (202) are respectively attached to the outer walls of the front end and the rear end of the isolation sheet (201), the second chip substrate (205) and the second electricity-connecting tabs (206) are closely attached to each other, and the solder balls (207) are equidistantly distributed outside the front ends of the second electricity-connecting tabs (206).

6. The high-reliability double-sided PBGA package substrate of claim 1, wherein: the heat conduction gasket (208) and the heat dissipation sheet (210) are tightly attached, the limiting through holes (209) are distributed around the middle parts of the heat conduction gasket (208) and the heat dissipation sheet (210) at equal intervals, and the central points of the limiting through holes (209) and the central points of the welding balls (207) are overlapped.