CN212967627U - Integrated cooling disc - Google Patents
Integrated cooling disc Download PDFInfo
- Publication number
- CN212967627U CN212967627U CN202022393771.5U CN202022393771U CN212967627U CN 212967627 U CN212967627 U CN 212967627U CN 202022393771 U CN202022393771 U CN 202022393771U CN 212967627 U CN212967627 U CN 212967627U
- Authority
- CN
- China
- Prior art keywords
- channel
- cooling
- shaped water
- cooling medium
- cross
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to an integrated cooling disc, which comprises a bottom plate and a cover plate; a cooling medium channel is arranged on the bottom plate; the cooling medium channel comprises a first channel, a second channel and a third channel which are arranged in sequence; the second channel is a U-shaped water channel. The utility model provides an integral type cooling pan through the combination that adopts different grade type passageway, utilizes the mutual promotion effect between U type passageway and other passageways, is showing the cooling performance who has promoted the cooling pan, has optimized the heat transfer performance of cooling pan, strengthens the life of cooling pan.
Description
Technical Field
The utility model relates to a cooling field, concretely relates to integral type cooling pan.
Background
At present, in the manufacturing process of semiconductor chips, temperature control is very important, the temperature can have important influence on the production process of wafers, and simultaneously, after the related manufacturing process is finished, the performance of devices on the wafers is still influenced to play a role in waste heat. For example, the wafer removed from a high temperature processing chamber such as a dry etching chamber, a vapor deposition chamber or a furnace chamber has different temperatures at various positions on the wafer surface due to different device densities distributed at various positions on the wafer, and if the wafer is naturally exposed to the atmospheric environment without immediately solving the temperature difference, the wafer surface may cause device performance degradation or even failure due to thermal expansion and cold contraction, and may also cause wafer contamination. Thus, after the wafer is removed from the high temperature process chamber, it is usually transferred to a cooling chamber for cooling.
For example, CN210535631U discloses a wafer cooling tray body and a wafer cooling device including the same, where the wafer cooling tray body includes a base body and a cover plate, at least one flow channel is processed on the base body, a cooling medium is introduced into the flow channel for cooling a wafer placed on the cooling tray body, and a thickness of the base body of 2-3mm is left between two adjacent flow channels; and supporting tables are arranged on two sides of the inner wall of the flow channel, and the cover plate is arranged on the supporting tables and used for sealing the flow channel. The utility model provides a wafer cooling disk body is under the condition that does not change exterior structure and current cooling disk body thickness, through the runner area who adds brace table and widen, has increased coolant's flow area, has promoted heat-conduction efficiency.
CN 207338314U discloses a cooling disc assembly, which comprises a cooling disc and a cooling disc bottom plate, wherein the cooling disc and the cooling disc bottom plate are oppositely buckled and fixed; a coolant groove and a first sealing groove are formed in one surface, opposite to the cooling disc bottom plate, of the cooling disc, and a second sealing groove is formed in one surface, opposite to the cooling disc, of the cooling disc bottom plate; and a sealing gasket is arranged between the cooling disc and the cooling disc bottom plate and covers the coolant groove, the first sealing groove and the second sealing groove and is used for preventing the coolant in the coolant groove from leaking. The second surface of the cooling disc, which is used for placing the wafer, is provided with an auxiliary cooling groove, and the longitudinal sections of the first sealing groove and the second sealing groove are both triangular and are arranged in a staggered manner.
However, the cooling plate in the prior art still has the problems of low cooling efficiency, poor heat dissipation performance, short service life and the like.
SUMMERY OF THE UTILITY MODEL
In view of the problem that exists among the prior art, the utility model aims to provide an integral type cooling plate, the integral type cooling plate is through the redesign to the water course structure, through the combination that adopts the different grade type passageway, and it is low to have solved the cooling efficiency that present cooling plate exists, and heat dispersion subalternation problem.
To achieve the purpose, the utility model adopts the following technical proposal:
the utility model provides an integrated cooling disc, which comprises a bottom plate and a cover plate;
a cooling medium channel is arranged on the bottom plate;
the cooling medium channel comprises a first channel, a second channel and a third channel which are arranged in sequence;
the second channel is a U-shaped water channel;
the distance between the straight water channels in the U-shaped water channel is smaller than the radius of the arc-shaped water channel in the U-shaped water channel.
The utility model provides an integral type cooling pan through the combination that adopts different grade type passageway, utilizes the mutual promotion effect between U type passageway and other passageways, is showing the cooling performance who has promoted the cooling pan, has optimized the heat transfer performance of cooling pan, strengthens the life of cooling pan.
As the utility model discloses preferred technical scheme, first passageway is including the sharp passageway and the arc passageway that set gradually.
As the utility model discloses preferred technical scheme, the third passageway is including the arc passageway and the sharp passageway that set gradually.
As a preferable aspect of the present invention, the cross-sectional shape of the first passage includes a circle or a polygon.
As a preferable aspect of the present invention, the cross-sectional shape of the second channel includes a circle or a polygon.
As a preferred embodiment of the present invention, the cross-sectional shape of the third channel includes a circle or a polygon.
As a preferred technical solution of the present invention, the polygon includes one of a square, a rectangle, a pentagon or a hexagon.
As a preferred embodiment of the present invention, the maximum width of the cooling medium channel is 10 to 12mm, for example, 10mm, 10.1mm, 10.2mm, 10.3mm, 10.4mm, 10.5mm, 10.6mm, 10.7mm, 10.8mm, 10.9mm, 11mm, 11.1mm, 11.2mm, 11.3mm, 11.4mm, 11.5mm, 11.6mm, 11.7mm, 11.8mm, 11.9mm, or 12mm, and the above-mentioned values are not limited to the above-mentioned values, and other values not mentioned in the range are also applicable, and the maximum width may be replaced by a circle-equivalent diameter, that is, the area of the cross-sectional shape of the polygonal channel is equal to the area of the circle-equivalent, and the diameter corresponding to the circle-equivalent diameter is the circle-equivalent diameter.
In a preferred embodiment of the present invention, the maximum height of the cooling medium passage is 5 to 7mm, and may be, for example, 5mm, 5.1mm, 5.2mm, 5.3mm, 5.4mm, 5.5mm, 5.6mm, 5.7mm, 5.8mm, 5.9mm, 6mm, 6.1mm, 6.2mm, 6.3mm, 6.4mm, 6.5mm, 6.6mm, 6.7mm, 6.8mm, 6.9mm, or 7mm, but not limited to the above-mentioned values, and other values not listed in the range are also applicable.
The utility model discloses in, the integral type cooling disc realizes integrated into one piece through modes such as friction weld.
Compared with the prior art, the utility model discloses following beneficial effect has at least:
the utility model provides an integral type cooling pan through the combination that adopts different grade type passageway, utilizes the mutual promotion effect between U type passageway and other passageways, is showing the cooling performance who has promoted the cooling pan, has optimized the heat transfer performance of cooling pan, strengthens the life of cooling pan.
Drawings
Fig. 1 is a schematic view of an integrated cooling plate provided in embodiment 1 of the present invention.
In the figure: 1-first channel, 2-second channel, 3-third channel.
The present invention will be described in further detail below. However, the following examples are only simple examples of the present invention, and do not represent or limit the scope of the present invention, which is defined by the appended claims.
Detailed Description
To better illustrate the present invention, facilitating the understanding of the technical solutions of the present invention, typical but not limiting embodiments of the present invention are as follows:
example 1
The present embodiment provides an integrated cooling pan, as shown in fig. 1, which includes a base plate and a cover plate;
a cooling medium channel is arranged on the bottom plate;
the cooling medium channel comprises a first channel 1, a second channel 2 and a third channel 3 which are arranged in sequence;
the first channel 1 comprises a linear channel and an arc channel which are arranged in sequence;
the second channel 2 is a U-shaped water channel;
the distance between the straight water channels in the U-shaped water channel is smaller than the radius of the arc-shaped water channel in the U-shaped water channel;
the third channel 3 comprises an arc channel and a straight channel which are arranged in sequence;
the cross section of the first channel 1 is circular;
the cross section of the second channel 2 is circular;
the cross section of the third channel 3 is circular;
the maximum width of the cooling medium channel is 11 mm;
the maximum height of the cooling medium channel is 6 mm.
Example 2
The present embodiments provide an integrated cooling pan comprising a base plate and a cover plate;
a cooling medium channel is arranged on the bottom plate;
the cooling medium channel comprises a first channel 1, a second channel 2 and a third channel 3 which are arranged in sequence;
the first channel 1 comprises a linear channel and an arc channel which are arranged in sequence;
the second channel 2 is a U-shaped water channel;
the distance between the straight water channels in the U-shaped water channel is smaller than the radius of the arc-shaped water channel in the U-shaped water channel;
the third channel 3 comprises an arc channel and a straight channel which are arranged in sequence;
the cross section of the first channel 1 is circular;
the cross section of the second channel 2 is square;
the cross section of the third channel 3 is circular;
the maximum width of the cooling medium channel is 10 mm;
the maximum height of the cooling medium channel is 5 mm.
Example 3
The present embodiments provide an integrated cooling pan comprising a base plate and a cover plate;
a cooling medium channel is arranged on the bottom plate;
the cooling medium channel comprises a first channel 1, a second channel 2 and a third channel 3 which are arranged in sequence;
the first channel 1 comprises a linear channel and an arc channel which are arranged in sequence;
the second channel 2 is a U-shaped water channel;
the distance between the straight water channels in the U-shaped water channel is smaller than the radius of the arc-shaped water channel in the U-shaped water channel;
the third channel 3 comprises an arc channel and a straight channel which are arranged in sequence;
the cross section of the first channel 1 is circular;
the cross section of the second channel 2 is rectangular;
the cross section of the third channel 3 is square;
the maximum width of the cooling medium channel is 12 mm;
the maximum height of the cooling medium channel is 7 mm.
Example 4
The present embodiments provide an integrated cooling pan comprising a base plate and a cover plate;
a cooling medium channel is arranged on the bottom plate;
the cooling medium channel comprises a first channel 1, a second channel 2 and a third channel 3 which are arranged in sequence;
the first channel 1 comprises a linear channel and an arc channel which are arranged in sequence;
the second channel 2 is a U-shaped water channel;
the distance between the straight water channels in the U-shaped water channel is smaller than the radius of the arc-shaped water channel in the U-shaped water channel;
the third channel 3 comprises an arc channel and a straight channel which are arranged in sequence;
the cross section of the first channel 1 is rectangular;
the cross section of the second channel 2 is square;
the cross section of the third channel 3 is pentagonal;
the maximum width of the cooling medium channel is 10 mm;
the maximum height of the cooling medium channel is 7 mm.
Example 5
The present embodiments provide an integrated cooling pan comprising a base plate and a cover plate;
a cooling medium channel is arranged on the bottom plate;
the cooling medium channel comprises a first channel 1, a second channel 2 and a third channel 3 which are arranged in sequence;
the first channel 1 comprises a linear channel and an arc channel which are arranged in sequence;
the second channel 2 is a U-shaped water channel;
the distance between the straight water channels in the U-shaped water channel is smaller than the radius of the arc-shaped water channel in the U-shaped water channel;
the third channel 3 comprises an arc channel and a straight channel which are arranged in sequence;
the cross section of the first channel 1 is rectangular;
the cross section of the second channel 2 is circular;
the cross section of the third channel 3 is circular;
the maximum width of the cooling medium channel is 12 mm;
the maximum height of the cooling medium channel is 5 mm.
Example 6
The present embodiments provide an integrated cooling pan comprising a base plate and a cover plate;
a cooling medium channel is arranged on the bottom plate;
the cooling medium channel comprises a first channel 1, a second channel 2 and a third channel 3 which are arranged in sequence;
the first channel 1 comprises a linear channel and an arc channel which are arranged in sequence;
the second channel 2 is a U-shaped water channel;
the distance between the straight water channels in the U-shaped water channel is smaller than the radius of the arc-shaped water channel in the U-shaped water channel;
the third channel 3 comprises an arc channel and a straight channel which are arranged in sequence;
the cross section of the first channel 1 is square;
the cross section of the second channel 2 is rectangular;
the cross section of the third channel 3 is rectangular;
the maximum width of the cooling medium channel is 11 mm;
the maximum height of the cooling medium channel is 7 mm.
Example 7
The present embodiments provide an integrated cooling pan comprising a base plate and a cover plate;
a cooling medium channel is arranged on the bottom plate;
the cooling medium channel comprises a first channel 1, a second channel 2 and a third channel 3 which are arranged in sequence;
the first channel 1 comprises a linear channel and an arc channel which are arranged in sequence;
the second channel 2 is a U-shaped water channel;
the distance between the straight water channels in the U-shaped water channel is smaller than the radius of the arc-shaped water channel in the U-shaped water channel;
the third channel 3 comprises an arc channel and a straight channel which are arranged in sequence;
the cross section of the first channel 1 is circular;
the cross section of the second channel 2 is circular;
the cross section of the third channel 3 is circular;
the maximum width of the cooling medium channel is 10 mm;
the maximum height of the cooling medium channel is 6 mm.
Example 8
The present embodiments provide an integrated cooling pan comprising a base plate and a cover plate;
a cooling medium channel is arranged on the bottom plate;
the cooling medium channel comprises a first channel 1, a second channel 2 and a third channel 3 which are arranged in sequence;
the first channel 1 comprises a linear channel and an arc channel which are arranged in sequence;
the second channel 2 is a U-shaped water channel;
the distance between the straight water channels in the U-shaped water channel is smaller than the radius of the arc-shaped water channel in the U-shaped water channel;
the third channel 3 comprises an arc channel and a straight channel which are arranged in sequence;
the cross section of the first channel 1 is rectangular;
the cross section of the second channel 2 is circular;
the cross section of the third channel 3 is pentagonal;
the maximum width of the cooling medium channel is 10 mm;
the maximum height of the cooling medium channel is 6 mm.
When being used for cooling the wafer with above-mentioned cooling water dish, it utilizes the mutual promotion effect between U type passageway and other passageways through adopting the combination of different grade type passageways, is showing the cooling performance who has promoted the cooling dish, has optimized the heat transfer performance of cooling dish, strengthens the life of cooling dish.
The applicant states that the present invention is described by the above embodiments, but the present invention is not limited to the above detailed structural features, i.e. the present invention can be implemented only by relying on the above detailed structural features. It should be clear to those skilled in the art that any modifications to the present invention, to the equivalent replacement of selected parts and the addition of auxiliary parts, the selection of specific modes, etc., all fall within the scope of protection and disclosure of the present invention.
The above detailed description describes the preferred embodiments of the present invention, but the present invention is not limited to the details of the above embodiments, and the technical idea of the present invention can be within the scope of the present invention, and can be right to the technical solution of the present invention, and these simple modifications all belong to the protection scope of the present invention.
It should be noted that the various technical features described in the above embodiments can be combined in any suitable manner without contradiction, and in order to avoid unnecessary repetition, the present invention does not need to describe any combination of the features.
Claims (9)
1. An integrated cooling pan, comprising a base plate and a cover plate;
a cooling medium channel is arranged on the bottom plate;
the cooling medium channel comprises a first channel, a second channel and a third channel which are arranged in sequence;
the second channel is a U-shaped water channel;
the distance between the straight water channels in the U-shaped water channel is smaller than the radius of the arc-shaped water channel in the U-shaped water channel.
2. The integrated cooling disc of claim 1 wherein the first channel comprises a linear channel and an arcuate channel in series.
3. The integrated cooling disc of claim 1 wherein the third channel comprises an arcuate channel and a linear channel in series.
4. The integrated cooling disc of claim 1 wherein the cross-sectional shape of the first channel comprises a circle or a polygon.
5. The integrated cooling disc of claim 1 wherein the cross-sectional shape of the second channel comprises a circle or a polygon.
6. The integrated cooling disc of claim 1 wherein the cross-sectional shape of the third channel comprises a circle or a polygon.
7. The one-piece cooling pan of any of claims 4-6, wherein the polygon comprises one of a square, rectangle, pentagon, or hexagon.
8. The integrated cooling disc according to claim 1, wherein the maximum width of the cooling medium passage is 10-12 mm.
9. The integrated cooling disc according to claim 1, wherein the maximum height of the cooling medium passage is 5 to 7 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022393771.5U CN212967627U (en) | 2020-10-23 | 2020-10-23 | Integrated cooling disc |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022393771.5U CN212967627U (en) | 2020-10-23 | 2020-10-23 | Integrated cooling disc |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212967627U true CN212967627U (en) | 2021-04-13 |
Family
ID=75372908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022393771.5U Active CN212967627U (en) | 2020-10-23 | 2020-10-23 | Integrated cooling disc |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212967627U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115096031A (en) * | 2022-05-11 | 2022-09-23 | 北京华卓精科科技股份有限公司 | Silicon chip bearing device in photoetching equipment |
| CN116123779A (en) * | 2023-04-17 | 2023-05-16 | 中国空气动力研究与发展中心超高速空气动力研究所 | Water-cooling heat insulation device applied to hypersonic high-temperature wind tunnel and processing method |
-
2020
- 2020-10-23 CN CN202022393771.5U patent/CN212967627U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115096031A (en) * | 2022-05-11 | 2022-09-23 | 北京华卓精科科技股份有限公司 | Silicon chip bearing device in photoetching equipment |
| WO2023216463A1 (en) * | 2022-05-11 | 2023-11-16 | 北京华卓精科科技股份有限公司 | Silicon wafer bearing device in photoetching device |
| CN115096031B (en) * | 2022-05-11 | 2024-01-26 | 北京华卓精科科技股份有限公司 | Silicon wafer bearing device in lithography equipment |
| CN116123779A (en) * | 2023-04-17 | 2023-05-16 | 中国空气动力研究与发展中心超高速空气动力研究所 | Water-cooling heat insulation device applied to hypersonic high-temperature wind tunnel and processing method |
| CN116123779B (en) * | 2023-04-17 | 2023-06-13 | 中国空气动力研究与发展中心超高速空气动力研究所 | Water-cooling heat insulation device applied to hypersonic high-temperature wind tunnel and processing method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN212967627U (en) | Integrated cooling disc | |
| US6800172B2 (en) | Interfacial structure for semiconductor substrate processing chambers and substrate transfer chambers and for semiconductor substrate processing chambers and accessory attachments, and semiconductor substrate processor | |
| CA2780658C (en) | Cooling device for a power module, and a related method thereof | |
| JP2010003841A (en) | Vertical type schottky diode | |
| CN108987323B (en) | Bearing device and semiconductor processing equipment | |
| KR970063549A (en) | Wafer chiller and method and assembly thereof | |
| US8201618B2 (en) | Heat dissipation module and heat column thereof | |
| CN107546090B (en) | X-ray conversion target | |
| CN111106411A (en) | Power battery module based on loop heat pipe and phase-change material coupling cooling | |
| CN208861953U (en) | A kind of etching carrier | |
| JP2935487B2 (en) | Equipment for processing substrates at liquefied gas temperature | |
| US20070102143A1 (en) | Heat dissipation module and heat pipe thereof | |
| KR100817400B1 (en) | Heat treatment equipment | |
| CN109932875B (en) | Heating plate, plasma photoresist remover using same and plasma photoresist removing method | |
| CN107768300A (en) | Chuck, reaction chamber and semiconductor processing equipment | |
| CN213660354U (en) | Integrated cooling disc | |
| CN201383496Y (en) | Static chuck | |
| CN109585877B (en) | Cooling system and heat dissipation method for fuel cell | |
| CN102842526B (en) | High temperature etching process tank | |
| CN215418093U (en) | Cooling water pipe for target disc of ion implanter | |
| CN113670099A (en) | Liquid cooling plate structure of power battery | |
| EP1535303A1 (en) | Gas tube end cap for a microwave plasma generator | |
| CN115635205B (en) | Porous part surface machining method and welding type spray disc manufacturing method | |
| US20050062381A1 (en) | Electron collector | |
| CN219199284U (en) | Ceramic tube and electric stove |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |