CN212966318U - Pull formula mainboard module that prevents dust - Google Patents

Pull formula mainboard module that prevents dust Download PDF

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Publication number
CN212966318U
CN212966318U CN202021687661.3U CN202021687661U CN212966318U CN 212966318 U CN212966318 U CN 212966318U CN 202021687661 U CN202021687661 U CN 202021687661U CN 212966318 U CN212966318 U CN 212966318U
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China
Prior art keywords
mainboard
module
pull
heat dissipation
plate
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CN202021687661.3U
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Chinese (zh)
Inventor
张春利
宁奇林
陈敬谦
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Guangzhou Luotu Terminal Technology Co ltd
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Guangzhou Luotu Terminal Technology Co ltd
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Abstract

The utility model discloses a pull formula mainboard module that prevents dust, lid, heating panel and handle behind mainboard, mainboard base, mainboard, the lid sets up behind the mainboard base side, the heating panel sets up mainboard base top, the mainboard sets up on the mainboard base, the handle sets up the mainboard base outside. The embodiment of the utility model forms a relatively closed space through the main board base, the main board rear cover and the heat dissipation plate, thereby reducing the dust entering the main board module; simultaneously through setting up the handle on the mainboard base, realize mainboard module's pull, greatly reduced mainboard module's the maintenance degree of difficulty. The utility model discloses can wide application in mainboard assembly technical field.

Description

Pull formula mainboard module that prevents dust
Technical Field
The utility model relates to a mainboard assembly technical field especially relates to a dustproof mainboard module of pull formula.
Background
The mainboard of the prior lottery ticket betting machine mostly adopts the installation mode of the mainboard of the computer case, and the developed assembly mode can accumulate dust inside the case, especially on the mainboard after the machine is used for a period of time, so that the fault rate of the mainboard module is higher. In addition, when maintenance is performed, maintenance personnel need to use up a good spare machine to replace a betting machine with a mainboard problem, more spare machines are needed, resource waste is caused, and maintenance difficulty is increased.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the utility model aims at providing a dustproof mainboard module of pull formula can reduce the maintenance degree of difficulty of lottery ticket betting machine mainboard.
The utility model adopts the technical proposal that:
the utility model provides a pull formula mainboard module that prevents dust, covers, heating panel and handle behind mainboard, mainboard base, mainboard, the lid sets up behind the mainboard the mainboard base side, the heating panel sets up mainboard base top, the mainboard sets up on the mainboard base, the handle sets up the mainboard base outside.
Furthermore, the pull-out dustproof mainboard module further comprises a fan, and the fan is arranged on the heat dissipation plate.
Furthermore, the pull-out dustproof mainboard module further comprises a heat dissipation module, and the heat dissipation module is arranged between the mainboard and the heat dissipation plate.
Further, the radiating module includes backup pad, bottom suspension fagging and a plurality of cooling tube, the cooling tube sets up go up the backup pad with between the bottom suspension fagging, go up the backup pad with the bottom suspension fagging passes through a plurality of spring screw fixation.
Further, go up the backup pad and be last support aluminum plate, the bottom suspension fagging is lower support aluminum plate.
Further, the radiating pipe is a radiating copper pipe.
Furthermore, the pull-out dustproof mainboard module further comprises an adapter plate, and the adapter plate is connected with the mainboard.
Further, the heat dissipation plate is a heat dissipation aluminum alloy plate.
Furthermore, the pull-out dustproof mainboard module further comprises a display card, and the display card is arranged on the inner side of the mainboard base.
Furthermore, the pull-out dustproof mainboard module further comprises a display card upper cover, and the display card upper cover is arranged on the display card.
The embodiment of the utility model forms a relatively closed space through the main board base, the main board rear cover and the heat dissipation plate, thereby reducing the dust entering the main board module; simultaneously through setting up the handle on the mainboard base, realize mainboard module's pull, greatly reduced mainboard module's the maintenance degree of difficulty.
Drawings
Fig. 1 is a front view of a drawing type dustproof motherboard module according to an embodiment of the present invention;
fig. 2 is a left side view of a drawing type dustproof motherboard module according to an embodiment of the present invention;
fig. 3 is a top view of a drawing type dustproof motherboard module according to an embodiment of the present invention;
fig. 4 is an axial view of a drawing type dustproof motherboard module according to an embodiment of the present invention;
fig. 5 is a sectional view of a drawing-out dust-proof motherboard module according to an embodiment of the present invention;
fig. 6 is a structural diagram of a motherboard base of a pull-out dust-proof motherboard module according to an embodiment of the present invention;
fig. 7 is a structural diagram of a rear cover of a main board of a pull-out dust-proof main board module according to an embodiment of the present invention;
fig. 8 is a structural diagram of a heat dissipation module of a pull-out dustproof motherboard module according to an embodiment of the present invention;
fig. 9 is a structural diagram of an upper cover of a display card of a pull-out dustproof motherboard module according to an embodiment of the present invention;
fig. 10 is a structural diagram of a heat dissipation plate of a pull-out dustproof motherboard module according to an embodiment of the present invention;
fig. 11 is a structural diagram of a fan of a pull-out dust-proof motherboard module according to an embodiment of the present invention;
fig. 12 is a connection diagram of an adapter plate of a pull-out type dustproof motherboard module according to an embodiment of the present invention.
Detailed Description
The present invention will be further explained with reference to the drawings and examples.
The embodiment of the utility model provides a pull formula mainboard module that prevents dust refers to 1, fig. 2, fig. 3, fig. 4 and fig. 5, including behind mainboard 506, mainboard base 508, the mainboard lid 505, heating panel 502 and handle 510, lid 505 sets up in mainboard base 508 side behind the mainboard, and heating panel 502 sets up at mainboard base 508 top, and mainboard 506 sets up on mainboard base 508, and handle 510 sets up in the mainboard base 508 outside.
Specifically, the pull-out dustproof motherboard module forms an internal accommodating cavity through the motherboard base 508, the motherboard rear cover 505 and the heat dissipation plate 502, and the motherboard 506 is arranged on the motherboard base 508 inside the formed accommodating cavity, so that the motherboard 506 is located in the relatively closed accommodating cavity, and dust on the motherboard 506 is greatly reduced. Meanwhile, the handle 510 is arranged outside the main board base 508, and the main board module can be pulled out of the lottery ticket betting machine through the handle 510, so that the main board module of the lottery ticket betting machine can be replaced more conveniently.
The main board 506, referring to fig. 6, is called a main board, a system board or a motherboard, and is installed inside the casing, which is one of the most basic and important key components of the lottery ticket machine. The main board is divided into a commercial main board and an industrial main board, and the lottery ticket betting machine generally adopts the industrial main board. The main board 506 plays a very important role in the whole betting machine system, and its performance directly affects the performance of the whole betting machine system, and the main board 506 can be fixed on the main board base 508 by 4M 3 screws.
The main board base 508, referring to fig. 6, is used for receiving the main board 506, and a handle 510 is disposed thereon.
Lid 505 behind the mainboard, referring to fig. 7, lid 505 can dismantle behind the mainboard and set up the rear portion at mainboard base 508, and lid 505 is provided with 2 toper five metals pins that play the guiding orientation effect behind the mainboard, and lid 505 riveting is in the same place behind this toper five metals pin through the mode of riveting under pressure and the mainboard.
Referring to fig. 10, the heat dissipation plate 502 is used for heat dissipation of the motherboard module, and a groove is disposed in the middle of the heat dissipation plate 502 and is used for accommodating a fan or other cooling and heat dissipation components.
The handle 510, referring to fig. 6, is disposed on the motherboard base 508, and by disposing the handle 510 on the motherboard base 508, the entire motherboard module can be conveniently pulled out during maintenance. The handle 510 may be a hardware handle, and the handle 510 may be fixed to the motherboard base 508 by M4 screws.
In some embodiments, referring to fig. 5, the pull-out dust-proof motherboard module further includes a fan 501, and the fan 501 is disposed on the heat dissipation plate 502.
Specifically, referring to fig. 11, the fan 501 is mounted on the heat dissipation plate 502, and is used to accelerate cooling of the heat dissipation plate 502, take away heat, and ensure that the temperature of the heat dissipation plate 502 is kept within a normal range, thereby ensuring that the temperature of the motherboard and the CPU on the motherboard is kept within a normal range.
In some embodiments, referring to fig. 8, the pull-out dust-proof motherboard module further comprises a heat dissipation module 504, and the heat dissipation module 504 is disposed between the motherboard 506 and the heat dissipation plate 502.
Specifically, the heat dissipation module 504 is used for heat conduction of the motherboard module, the heat dissipation module 504 is connected to the motherboard 506 and the heat dissipation plate 502, and can conduct heat generated on the motherboard 506 to the heat dissipation plate 502, and the heat dissipation module 504 is generally fixed on a CPU of the motherboard 506.
In some embodiments, referring to fig. 5 and 8, the heat dissipating module 504 includes an upper supporting plate 511, a lower supporting plate 514, and a plurality of heat dissipating pipes 513, wherein the heat dissipating pipes 513 are riveted between the upper supporting plate 511 and the lower supporting plate 514, and the upper supporting plate 511 and the lower supporting plate 514 are fixed by 4 spring screws 512.
Specifically, the heat dissipation module 504 mainly conducts heat through a heat dissipation pipe 513, and the heat dissipation pipe 513 is fixed between the main board 506 and the heat dissipation plate 502 through an upper support plate 511 and a lower support plate 514. The upper supporting plate 511 and the lower supporting plate 514 are fixed by the spring screws 512, so that the upper supporting plate 511 and the lower supporting plate 514 can keep a certain distance, and the heat sink 507 is generally adhered to the surface of the lower supporting plate 514 to improve the heat dissipation efficiency.
In some embodiments, the upper support plate is an upper support aluminum plate and the lower support plate is a lower support aluminum plate.
Specifically, aluminum is a silver white light metal. Is malleable. Aluminum is light, not only is oxidation resistant and has good heat conductivity, and the weight of the heat dissipation module can be reduced by using aluminum as the support plate, and meanwhile, the temperature property and the heat dissipation effect of the heat dissipation module are kept.
In some embodiments, the heat dissipation tube is a heat dissipation copper tube.
Specifically, copper's ductility is good, and heat conductivity and electric conductivity are high, through using copper as the cooling tube, can be better carry out thermal transmission, with the heat transfer of mainboard to the heating panel on.
In some embodiments, referring to fig. 12, the pull-out dust-proof motherboard module further includes an adapter board, and the adapter board is connected to the motherboard.
Specifically, the interface module of the mainboard comprises an internal connection module and an external connection module, wherein the external connection module is used for connecting external equipment of the lottery betting machine and comprises 4 USB interfaces, 3 VGA interfaces, 2 HDMI interfaces, 2 network ports, 1 COM interface, 1 DVI interface, 1 audio input interface and 1 audio output interface; the interconnection module is a 96pin male terminal, is connected with female terminal on the keysets, for whole machine provides data interchange, has the interface of each module of lottery ticket betting machine on the keysets, for example: the ticket machine comprises a power supply interface, a ticket reading machine interface, a printer interface, a USB interface, a battery module interface, a display screen interface and a loudspeaker interface.
In the conventional method for replacing the mainboard module, the mainboard module needs to be reconnected after the mainboard module is replaced, and the steps are complex. Through setting up the integrated interface connection of a keysets and mainboard module, only need be to being connected to integrated kneck alright with the realization to mainboard module's change with the mainboard when changing mainboard module, mainboard module's change is more simple convenient.
In some embodiments, the heat spreader plate is a heat spreader aluminum alloy plate.
Specifically, an aluminum alloy is one of light metal materials. In addition to the general characteristics of aluminum, aluminum alloys have certain alloy specific characteristics due to the variety and amount of alloying elements added. The specific strength is close to that of high alloy steel, the specific rigidity exceeds that of steel, and the alloy steel has good casting performance, plastic processing performance, electric conduction performance, heat conduction performance, corrosion resistance and weldability and can be used as a structural material. The aluminum alloy is used as the heat dissipation plate, so that the strength of the heat dissipation module is ensured under the condition of keeping the good heat dissipation performance of the heat dissipation module.
In some embodiments, referring to fig. 6, the pull-out dust-proof motherboard module further includes a display card 509, and the display card 509 is disposed on the inner side of the motherboard base 508.
Specifically, the display card 509 is further integrated on the main board module, the display card 509 can be replaced simultaneously when the main board module is replaced, and the display card 509 can use an ITX display card.
In some embodiments, referring to fig. 6 and 9, the pull-out dust-proof motherboard module further includes a display card upper cover 503, and the display card upper cover 503 is disposed on the display card 509.
Specifically, the graphics card upper cover 503 is used for covering the graphics card 509 and preventing dust from entering the graphics card 509, and a relatively closed space is formed by the motherboard base, the motherboard rear cover, the graphics card upper cover and the heat dissipation plate, so that the dust can be prevented from entering the module to the greatest extent.
In some embodiments, the pull-out dustproof motherboard module further comprises a hard disk, the hard disk can be replaced simultaneously when the motherboard is replaced, and the hard disk can be implemented by using MSATA.
It should be noted that, in the present specification, the embodiments are all described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments may be referred to each other. In addition, for convenience of description, only a part of the structure related to the present invention, not the whole structure, is shown in the drawings.
While the preferred embodiments of the present invention have been described in detail, it will be understood by those skilled in the art that the foregoing and various other changes, omissions and deviations in the form and detail thereof may be made without departing from the scope of this invention.

Claims (10)

1. The utility model provides a pull formula mainboard module that prevents dust, its characterized in that covers, heating panel and handle behind mainboard, mainboard base, the mainboard, the lid sets up behind the mainboard base side, the heating panel sets up mainboard base top, the mainboard sets up on the mainboard base, the handle sets up the mainboard base outside.
2. The pull-out dustproof mainboard module as claimed in claim 1, further comprising a fan, wherein the fan is disposed on the heat dissipation plate.
3. The pull-out dustproof mainboard module as claimed in claim 1, further comprising a heat dissipation module, wherein the heat dissipation module is disposed between the mainboard and the heat dissipation plate.
4. The pull-out dustproof mainboard module as claimed in claim 3, wherein the radiating module comprises an upper supporting plate, a lower supporting plate and a plurality of radiating pipes, the radiating pipes are arranged between the upper supporting plate and the lower supporting plate, and the upper supporting plate and the lower supporting plate are fixed through a plurality of spring screws.
5. The pull-out dustproof main board module according to claim 4, wherein the upper support plate is an upper support aluminum plate, and the lower support plate is a lower support aluminum plate.
6. The pull-out dust-proof main board module as claimed in claim 4, wherein the heat dissipation pipe is a heat dissipation copper pipe.
7. The pull-out dustproof mainboard module as claimed in claim 1, further comprising an adapter plate, wherein the adapter plate is connected with the mainboard.
8. The pull-out dustproof main board module as claimed in claim 1, wherein the heat dissipation plate is a heat dissipation aluminum alloy plate.
9. The pull-out dustproof mainboard module as claimed in claim 1, further comprising a display card, wherein the display card is arranged on the inner side of the mainboard base.
10. The pull-out dustproof mainboard module according to claim 9, further comprising a display card upper cover, wherein the display card upper cover is disposed on the display card.
CN202021687661.3U 2020-08-13 2020-08-13 Pull formula mainboard module that prevents dust Active CN212966318U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021687661.3U CN212966318U (en) 2020-08-13 2020-08-13 Pull formula mainboard module that prevents dust

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021687661.3U CN212966318U (en) 2020-08-13 2020-08-13 Pull formula mainboard module that prevents dust

Publications (1)

Publication Number Publication Date
CN212966318U true CN212966318U (en) 2021-04-13

Family

ID=75352166

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202021687661.3U Active CN212966318U (en) 2020-08-13 2020-08-13 Pull formula mainboard module that prevents dust

Country Status (1)

Country Link
CN (1) CN212966318U (en)

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Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
PE01 Entry into force of the registration of the contract for pledge of patent right

Denomination of utility model: A pull-out dustproof motherboard module

Effective date of registration: 20230621

Granted publication date: 20210413

Pledgee: Bank of China Limited by Share Ltd. Guangzhou Panyu branch

Pledgor: GUANGZHOU LUOTU TERMINAL TECHNOLOGY Co.,Ltd.

Registration number: Y2023980045238

PE01 Entry into force of the registration of the contract for pledge of patent right