CN102129275B - High-performance integrated machine and notebook computer - Google Patents

High-performance integrated machine and notebook computer Download PDF

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CN102129275B
CN102129275B CN201110066571.1A CN201110066571A CN102129275B CN 102129275 B CN102129275 B CN 102129275B CN 201110066571 A CN201110066571 A CN 201110066571A CN 102129275 B CN102129275 B CN 102129275B
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thermal conductivity
high thermal
server
conductivity metal
cpu
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CN102129275A (en
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孔繁忠
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

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Abstract

The invention discloses a high-performance integrated machine and a notebook computer, which comprise an integrated machine server and a notebook computer. The integrated machine server includes a single-screen integrated machine server, a dual-screen I type integrated machine server and a dual-screen II type integrated machine server; the notebook computer includes a notebook desktop computer, a notebook work station, a notebook server and a notebook super server; the integrated machine and the notebook computer are applied in the technical field of computers, and have the critical break-through on the aspect of heat dissipation technology; in the integrated machine and the notebook computer, a middle piece reliably connects main hot chips, such as a CPU (central processing unit), with an independent metallic opening water tank having high thermal conductivity, and the middle piece and the opening water tank are both insulating after surface treatment; the opening water tank is full of cooling liquid, such as water, and most of heat generated by the main hot chips, such as the CPU, is dissipated in evaporation of the cooling liquid; the conventional heat dissipation mode using a fan in the prior integrated machine and the notebook computer is discarded, the high-performance integrated machine and the notebook computer generate no noise, and can save energy and keep silence; and the heat dissipation effect of the high-performance integrated machine and the notebook computer is superior to the prior integrated machine and the notebook computer while the electrostatic protection thereof is equivalent to the prior integrated machine and the notebook computer.

Description

High-performance integrated machine and notebook
Technical field
The present invention is a high-performance integrated machine and notebook, it comprises all-in-one server and notebook, all-in-one server comprises single screen all-in-one server, double screen I type all-in-one server and double screen II type all-in-one server, and notebook comprises notebook desktop computer, notebook workstation, notebook server and notebook superserver; It is applied to computer realm.
Background technology
All-in-one and notebook computer, replace gradually desktop computer to become the main flow of PC in world's IT market, the fashionable whole world of product that comprises the world-famous IT vendor of apple and association is dazzling brilliant, but current worldwide all-in-one generally adopts the scheme of notebook or desktop computer, the power of processor used is all less than 95W; The processor thermal design power (TDP:Thermal Designing Power) that notebook computer adopts, generally not higher than 45W, is compared desktop computer processor (TDP:65~95W) and high-performance server processor (TDP: >=135W) performance is generally on the low side; As the so-called edge of apple iMAC all-in-one heat dissipation technology, add as association's so-called copper pipe of leonov notebook the heat radiation requirement that mini-fan heat dissipation technology is not enough to support high-powered processor work, i.e. the technical progress that has hindered all-in-one and notebook computer that heat radiation is not enough; The notebook server of the notebook computer of all-in-one server, desktop computer scheme, the notebook computer of workstation type and many CPU is still blank at present in the whole world; The present invention, will fill up these worlds blank, for Chinese Enterprise, in next two decades world's IT markets, seek dominance, establish solid technical foundation, because relate to global IT market very abundant income in future, so this invention will be maintained secrecy.
Summary of the invention
The present invention is a set of solution proposing for overcoming the configuration shortcoming too low, heat radiation deficiency of current all-in-one and notebook computer.
Objects and advantages of the present invention, be release can compatible high-power two server processor all-in-one and notebook, thereby further improve the performance of all-in-one and notebook, meet the market demands that become increasingly abundant.
For achieving the above object, the present invention adopts following technical scheme: by high-powered processor layout position near computer casing edge on motherboard, adopt high thermal conductivity middleware to be close to processor surface and motherboard and embedding shell edge or external, the uncovered water tank bottom plate of high thermal conductivity metal is reliably connected, in order to improve heat transfer efficiency, at all surface of contact, all coat heat-conducting silicone grease, in the uncovered water tank of computer booting forward direction, inject liquid coolant as water, the uncovered water tank of removable connection after shut down of computer.
Accompanying drawing explanation
Fig. 1 is single screen all-in-one server complete machine schematic diagram of the present invention.
Fig. 2 is single screen all-in-one server-centric sectional view of the present invention.
Fig. 3 is other central cross-section schematic diagram of three of single screen all-in-one server of the present invention.
Fig. 4 is single screen all-in-one server host decomposing schematic representation of the present invention.
Fig. 5 is double screen I type all-in-one server complete machine schematic diagram of the present invention.
Fig. 6 is double screen I type all-in-one server host decomposing schematic representation of the present invention.
Fig. 7 is case decomposing schematic representation in double screen I type all-in-one server of the present invention.
Fig. 8 is the auxiliary heat dissipation water tank scheme of installation of double screen I type all-in-one server of the present invention.
Fig. 9 is double screen II type all-in-one server complete machine schematic diagram of the present invention.
Figure 10 is double screen II type all-in-one server decomposing schematic representation of the present invention.
Figure 11 is double screen II type all-in-one server host case decomposing schematic representation of the present invention.
Figure 12 is the auxiliary water tank scheme of installation of double screen II type all-in-one server of the present invention.
Figure 13 is notebook desktop computer complete machine schematic diagram of the present invention.
Figure 14 is notebook workstation complete machine schematic diagram of the present invention.
Figure 15 is notebook server complete machine schematic diagram of the present invention.
Figure 16 is notebook superserver complete machine schematic diagram of the present invention.
Figure 17 is notebook desktop computer start schematic diagram of the present invention.
Figure 18 is notebook desktop computer main frame decomposing schematic representation of the present invention.
Figure 19 is notebook workstation start schematic diagram of the present invention.
Figure 20 is notebook workstation main frame decomposing schematic representation of the present invention.
Figure 21 is notebook server start schematic diagram of the present invention.
Figure 22 is notebook server host decomposing schematic representation of the present invention.
Figure 23 is notebook superserver start schematic diagram of the present invention.
Figure 24 is notebook superserver main frame decomposing schematic representation of the present invention.
Be described as follows:
1 motherboard 2CPU 3 memory bar 4 hard disks
5 CD-ROM drive 6 CD-ROM drive button 7 video card 8 power supply adaptors
9DC interface 10RJ45 interface 11USB interface 12MIC interface
13 stereo output interface 14VFD lamp 15 keyboard 16 mouses
17LCD screen 18LCD display 19 lithium battery 20 function buttons
21 drive plate 22 main frame 23 face-piece 24 side plates
25 uncovered water tank 26U type metal base plate 27 screw 28 bases
29 support 30 screw column 31 dividing plate 32 power panels
Interior case 35 framework 36 battery case lids of 33 battery case 34
37 video card master chip 38 line hole 39 touch pad 40 rotating shafts
41 button 42 screens 44 lithium batteries
Embodiment
Please refer to Fig. 1 and 2,, shown in single screen all-in-one server complete machine of the present invention and central cross-section schematic diagram, example is integrated machine server.See Fig. 1, this single screen all-in-one server is comprised of 15,16,22,28,25 and one lithium battery, and the 8th, external power supply is connected with 22; 22 fronts are 17 and one group 20,20 is respectively that on/off button, reset button, DOWN button, UP button and 17 parameters regulate button from right to left, right side distributing CD-ROM drive and DC interface, left side distributing 12,13, eight USB interface and two RJ45 interfaces, respectively 100-M network Ethernet and gigabit network interface, 22 bottom is a battery case, is fixed wtih 20 button panel and lithium battery in box; Wireless 15,16 USB transmitter is inserted in 22 USB interface; 22 shells, 28 and 25 are to be made by high thermal conductivity metal material, all pass through surface treatment and insulate, and 22 shells and 28 use screws are connected and fixed; Before startup of server, be full of liquid coolant as water in 25,25 is larger, and liquid coolant is as more in water, and radiating effect is better.See Fig. 2,28 and 25 have two kinds of connected modes be integrated and stack screw fix, Fig. 1 adopts integrated connected mode.
Please refer to shown in other central cross-section schematic diagram of three of Fig. 3 single screen all-in-one of the present invention server, example is integrated machine server.Other three machine is slightly different from Fig. 1's, and 25 sizes are different from position, the upper figure of Fig. 3, and 25 is taller and bigger, can hold more liquid coolant as water, and thermal equilibrium temperature can be very low, is applicable to high-power server CPU (TDP >=135W); Lower two figure of Fig. 3, bottom left figure 25 from 22 close to, 22 of bottom right figure has certain inclination, better appearance is succinct, two figure are applicable to the server CPU below dress 135W, thermal equilibrium temperature can be high.
Please refer to shown in Fig. 4 single screen all-in-one of the present invention server host assembling schematic diagram, example is integrated machine server.This main frame by 23,17,21,31,1, two 2, two 3,5,32,24 and three 4 form, 31 are close to 33 tops is screwed in 23,21, three 4 and 1,5,32,24 are arranged on 31 not coplanar, in fact can install at most eight 4 on 31; Respectively there is the hole of three embedded nuts 31 both sides, and 21,1 and 32 projecting planes on 31 are planted and are welded with the double-screw bolt of fixing them, and 5 are directly fixed on 31 not coplanar by two 29 and three 4, on 31 edges, plant be welded with five fix 24 30; Two 2 and two 3 are arranged on 1, and two 2, ICH and IOH chip are all contained in 1 the back side, the height that the heat radiator of ICH and IOH chip is the same with pairs 2, and their radiating surface is close to 31; 23, the 24, the 31st, by high thermal conductivity metal material, made, all pass through surface treatment and insulate; Before 23, have screen window, biside plate has the fixed orifice of interface holes and dividing plate 31, and base is 33,33 in-built lithium battery and button panels, and screen window both sides respectively have two to fix 29 30,17 both sides and be screwed two stands 29.The assemble flow of this main frame is; 17 put into 23 screen window, by two 29, are screwed on four 30; Heat-conducting silicone grease is coated in the surface of two 2, IOH and ICH conducting strip, 1,5,32,21, three 4 is arranged on 31 to tensioning screw; Interface line 17 is connected with 21 with backlight electric power line, and 21 and 1 and 32 line is connected; Then 17 the back side is close in 31 insertions 23,31 that both sides scribbled to heat-conducting silicone grease, to the porose position of good institute, with key screw 31, is fixed in 23, and surface of contact is coated heat-conducting silicone grease; Connect all connecting lines, 24, be screwed in 31 five 30 on, just complete the assembling of all-in-one server host.Liquid coolant is full of to 25 as water, main frame energising, two 2, IOH and ICH chip and three 4 heats that produce, by 31 guiding 23, by 23 guiding 24, 28 and 25, a part of heat can be distributed in their surface, liquid coolant in 25 can evaporate most of heat as water, finally realize thermal equilibrium and temperature constant, equilibrium temperature is subject to environmental factor as temperature, wind speed and humidity effect, temperature is lower, wind speed is faster, humidity is larger, it is lower, otherwise it is higher, experimental results show that, it is far below the hot shutdown temperature of two CPU2, so design can meet the heat radiation requirement of the normal work of this single screen all-in-one server.
Please refer to Fig. 5,6 and 7,, shown in double screen I type all-in-one server complete machine of the present invention, main frame decomposition and interior case decomposing schematic representation, example is integrated machine server.See Fig. 5, this double screen I type all-in-one server can support dual user to use, and two 15, two 16,22,28 and one lithium battery, consists of, and two 15, two 16 and 22 is wireless connections, and their receiver is inserted in 22 USB interface, the 8th, external power supply connect 22 9; 22 top is a uncovered water tank, inside is full of liquid coolant as water, front and back two 17 are embedded in 22, two 17 below respectively has two group 20,20 difference gauge tap machines, reset, the unlatching of screen menu, DOWN, UP and OK, 22 right sides are distributing 5,9, and there are respectively eight USB interface, two RJ45 interface, two MIC interface and bicubic sound output interface in left side; 22 bottoms are battery cases, box in-built lithium battery and two button panels, lid is under two 17,22 are fixed on 28.See Fig. 6, main frame forms by 23, two 17,34 and 24, and two 17 and 34 are placed in 23, each 17 both sides is fixed wtih two 29, two 29 are directly screwed on 34, are reserved with wire casing on 34, for being communicated with 17 power lead and signal wire, 34 are screwed in 23 both sides, surface of contact scribbles heat-conducting silicone grease, and 24 are fixed on 34, and 23 top is a uncovered water tank, before energising start, be full of liquid coolant as water.See Fig. 7, the 34th, by 35,24,1,21,5, two 2, two 3,7,32 and four 4 form, on the screw column that 1,21,5,32 and four 4 is fixed in 35; On 1, be installed with two 2, two 3 and 7, two 2 and be positioned at 1 the back side and be close to 35,1 IOH and ICH chip, be also positioned at 1 the back side, by heat radiator and 35 close contacts, 7 master chip is also by heat radiator and 35 close contacts, and all surface of contact all scribble heat-conducting silicone grease; On two stands, filling four 4, be separately fixed on 35, connecting interconnector, 24, be screwed on 35; 28,23,24,35,24 is all to be made by high-thermal conductive metal material, all passes through surface treatment and insulate.Like this; all heats that 35 interior accessories produce; first lead 35 and 24; by 35 guiding 23,24 and 28, a part of heat can be distributed in three surface, and the liquid coolant in 23 uncovered water tanks is as water evaporative heat loss; can dissipate most of heat; finally realize thermal equilibrium and temperature constant, equilibrium temperature can be lower than two 2 and the hot shutdown temperature of video card master chip, so this design can meet the heat radiation requirement of the normal work of all this double screen II type all-in-one servers.
Please refer to shown in the auxiliary water tank scheme of installation of Fig. 8 double screen I of the present invention type all-in-one server, example is integrated machine server.Along with the performance of CPU is more and more higher, the power consumption of CPU is also increasing, the CPU that surpasses 150W for simple grain, the equilibrium temperature of Fig. 5 can be higher, make us feeling under the weather, so the design of launch plan 8, the two water tanks 25,25th of band base, are made by high-thermal conductive metal material, through surface treatment, insulate, before server work, will be full of liquid coolant as water, 25 to 28 is lower slightly, and two 25 base plates extend to 28 both sides, extension board upper and 28 under, by screw, they are fixed, had twoly 25, equilibrium temperature can be compared with 5~10 ℃ of the reductions of Fig. 5.The double screen all-in-one server of Fig. 5 and Fig. 8 is relatively applicable to using compared with narrow space, such as aircraft cockpit, submarine battle station.
Please refer to Fig. 9,10 and 11, shown in double screen II type all-in-one server complete machine schematic diagram of the present invention, main frame decomposing schematic representation and mainframe box decomposing schematic representation, example is integrated machine server.
See Fig. 9, this double screen II type all-in-one server supports dual user to use simultaneously, two 15, two 16, two 18,22 and two lithium batteries, consists of, two 15, two 16 and 22 is wireless connections, their receiver is inserted in 22 USB interface, and the 8th, external power supply, is connected by 9 with 22; Two 18 are connected under 22 top water tanks by hollow axle, and power lead and signal wire enter mainframe box by spindle central, two 18 can freely rotate, stop arbitrarily, hand-reset; 22 tops are uncovered water tanks, and bottom is two 33, and two 33 inside are filling two lithium batteries, and 22 left sides have 5,9, two 12 and two 13, and there are eight USB interface and two RJ45 interfaces in right side, is respectively 100-M network Ethernet and gigabit network interface.See Figure 10, this main frame is by cabinet, 32, 5, three 4, 1, 7, two 2 and two 3 form, cabinet forms by 35 and 24, one of 4 and 5 are fixed on a support, support is fixed on 35 inside screw posts, 4 two be fixed on a support, support is directly fixed in 35, on 1, be installed with two 2, two 3 and 7, 1 IOH and ICH chip, two CPU are installed in 1 the back side, the heat radiator of IOH and ICH is identical with the height of two CPU, their radiating surface scribbles heat-conducting silicone grease and is close to 35, 1 is fixed on 35 screw column, 37 heat radiator scribble heat-conducting silicone grease and are close to 35, 24 are screwed on 35 edge, wired hole 38 all on 24 and 35, convenient two 18 power lead and the introducing of signal wire.See Figure 11, this mainframe box forms by 35,24, the two is made, is all passed through surface treatment and insulate by high-thermal conductive metal material, 35 tops are uncovered water tanks, before server work, will be full of liquid coolant as water, 35 bottoms are can place lithium battery in two 33, two 33, as the standby electricity of server, 24 use screws can be fixed on 33.Like this; the heat that 35 interior all accessories produce; to directly lead 24 and liquid coolant as water; a part of heat can be distributed in 35 and 24 surface; liquid coolant can evaporate most of heat as water; last thermal equilibrium and temperature constant, equilibrium temperature can be far below two 2 and 37 hot shutdown temperature, so this design can meet the heat radiation requirement of the normal work of double screen II type all-in-one server.
Please refer to shown in the auxiliary heat dissipation water tank scheme of installation of Figure 12 double screen II of the present invention type all-in-one server, example is double screen all-in-one server.Because the top water tank of Fig. 9 is less, liquid coolant finite capacity, along with the performance of CPU is more and more higher, the power consumption of CPU is also increasing, the CPU that surpasses 150W for simple grain, the equilibrium temperature of Fig. 9 can be very high, can make us feeling under the weather, so release the design of Figure 12, two auxiliary heat dissipation water tanks 25, be to be made by high-thermal conductive metal material, through surface treatment, insulate, two 25 extension base plate is connected with 35 side plates, joint face scribbles heat-conducting silicone grease, before server work, will be full of liquid coolant as water, have twoly 25, equilibrium temperature can reduce by 5~10 ℃.The double screen all-in-one server of Fig. 9 and Figure 12 can meet the needs of multiple occasion.
Please refer to Figure 13,14,15 and 16,, shown in notebook desktop computer of the present invention, workstation, server and superserver complete machine schematic diagram, example is notebook.Figure 13 is notebook desktop computer, that adopt is desktop computer scheme and desktop computer list CPU (TDP:65~95W), and current notebook computer, that adopt is scheme and the notebook list CPU (TDP :≤45W) of notebook, notebook desktop computer is compared with at present best notebook computer, configuration and performance at least double, and price is less than half, and the former is more quiet than the latter; Figure 14 is notebook workstation, adopts workstation scheme and single workstation CPU (TDP:65~300W), and preposition water tank is twice compared with Figure 13; Figure 15 is notebook server, adopts server scheme and two server CPU (TDP:130~200W), and preposition water tank is twice than Figure 14, than the many gigabit network interfaces of Figure 14; Figure 16 is notebook superserver, adopts server scheme and two server CPU (TDP: >=200W), large more than one times than Figure 15, preposition water tank, is also two network interfaces: gigabit network interface and 100-M network Ethernet; Before above-mentioned four start work, to be full of liquid coolant as water in 25; In above-mentioned four figure, the upper figure of every width figure is notebook complete machine, and figure below is central cross-section figure, and every notebook complete machine all forms by 18,22,44 and 25, and 18 are connected with 22 by rotating shaft, and 44 are contained on 22; The 25th, uncovered water tank independently, to be made by high thermal conductivity metal material, all pass through surface treatment and insulate, before use, 25 base plates and 22 sheet metals are screwed connection, and surface of contact scribbles heat-conducting silicone grease, long-time use will constantly supplement liquid coolant as water, after shutdown, treat that temperature is reduced to environment temperature, twist off connecting screw and make 22 separated with 25.
Please refer to Figure 16 and 17,, shown in notebook desktop computer start schematic diagram of the present invention and main frame decomposing schematic representation, example is notebook.This notebook desktop computer forms by 18,22,25 and 44.The 18th, by liquid crystal display, drive plate and plastic casing, formed, liquid crystal display and drive plate and the two line are encapsulated in plastic casing, at the bottom of shell, two protuberances have axis hole, drive plate and 22 line are passed by axis hole, shell top has two 42, for being stuck in 22 18 altogether, by 2 40,18, is fixed on 22,40 hollows, 18 power lead and signal wire pass and enter 22 from 40.The 22nd, by a set of plastic casing, two 40,1,2,3,7,4,5,44 and 26, formed; Plastic casing forms by 23 and 28, is distributing from front to back on 23 in 2 40, one group 20,15,39, two 41 and 14,28 and is being installed with 5,4,1,2,3,7 and 26; The 1st, desktop computer motherboard, on 1, be installed with 2,3 and 7, the 2nd, desktop computer CPU, IOH and ICH and 2 seat are welded in 1 the back side, on 1, the welding of other components and parts is positioned at front, and the heat radiator of IOH and ICH and 2 is in sustained height, and their surfaces all scribble heat-conducting silicone grease and are close to 26,1 is fixed on 26 screw column, and 7 master chip is also close to 26; 26 are fixed in 28, and 26 stretch out 28 through 5,11 and 9,10 bottoms, become 25 web joint; 25, the 26th, by high-thermal conductive metal material, made, all pass through surface treatment and insulate; 1 computer interface is distributed in 28 the left and right sides, and left side is the bilayer 11 being connected with 1 by line, and right side is respectively from front to back 10,9, four 11,13 and 12,44 and is arranged on 28 front side, and 23 are arranged on 28.After 25 base plates, stretch, with 28 26 be connected by screw, surface of contact scribbles heat-conducting silicone grease, before start, is full of liquid coolant as water in 25.Like this; the heat that ICH, IOH, 2 and 7 master chips produce; by 26 guiding 25 and liquid coolant as water; a part of heat can be distributed in 25 surfaces; liquid coolant can evaporate most heats as water; equilibrium temperature is higher than room temperature; but equilibrium temperature is well below the hot shutdown temperature of 2 and 7 master chips; the liquid coolant of take is that water is example; at normal temperatures, 1 gram of water evaporation can absorb the heat of 2.236KW, and the not enough 200W of total TDP of ICH, IOH, 2 and 7 master chips; so this design can meet the heat radiation requirement of the normal work of notebook desktop computer.
Please refer to Figure 18 and 19,, shown in notebook workstation start of the present invention and main frame decomposing schematic representation, example is notebook.The composition of Figure 18 and Figure 16 is identical, and except 25,25 volumes of Figure 18 will be twice, and the liquid coolant that can hold is as also many one times, water; The difference of Figure 19 and Figure 17 is that to concentrate on the scheme of desktop computer and workstation different: 1,2 and 3 of Figure 17, belong to the desktop computer accessory of desktop computer scheme, and 2 TDP is at 65~95W; 1,2 and 3 of Figure 19 belongs to the server accessory of server scheme, and 2 TDP is at 65~200W; In other side, Figure 19 is identical with Figure 17.
Please refer to Figure 20 and 21,, shown in notebook server start of the present invention and main frame decomposing schematic representation, example is notebook.The composition of Figure 20 and Figure 18 is identical, and except 25 and 10 differences, Figure 20 will be twice than 25 volumes of Figure 18, and the liquid coolant that can hold is wanted many one times as water, and Figure 18's is two 10, be respectively gigabit network interface and 100-M network Ethernet, and the list 10 of Figure 18 is 100-M network Ethernets; The difference of Figure 21 and Figure 19 is that the scheme of workstation and server is different, Figure 21 1 on be two 2 and two 3, Figure 19 1 on be single 2 single 3; In other side, Figure 21 is identical with Figure 19.
Please refer to Figure 22 and 23,, shown in notebook superserver start schematic diagram of the present invention and main frame decomposing schematic representation, example is notebook supercomputer.This notebook superserver, forms by 18,22 and 25, and 18 plastic housings are fixed on 22 by two 40, and power lead and signal wire Cong40 center enter in 22; The 22nd, by 23,28,4,5,1, two 2, two 3,7 and 44, form, two 2, two 3 and 7 are arranged on 1, two 2, ICH with IOH chips welding on plate faces different from other components and parts, the heat radiator of ICH and IOH and 2 is in sustained height same level, the heat radiator of ICH and IOH and 2 surfaces scribble heat-conducting silicone grease and are close to 28 base plate, 1,4 and 5 be fixed in 28, interface on 1 is near 28 preformed hole, 23 and 44 are fixed on 28,23 can be plastics face-piece, can be also the high thermal conductivity metal face-piece insulating through surface treatment; 28 base plates stretch out forward, and two stretch out the hole that respectively has two embedded nuts on plate, for fixing 25; 25 and 28 is to be made by high thermal conductivity metal, through surface treatment, insulate, and 25 can be called super uncovered water tank, hold more liquid coolant as water, and the superserver of the special super 400W of TDP for the super 200W of TDP of single CPU, two CPU prepares.Like this, in 25, fill it up with liquid coolant as water, energising start, the heat that two 2, ICH and IOH produce, by 28 guiding 25 and liquid coolant, as water, a part of heat can be distributed in 28 and 25 surfaces, liquid coolant can evaporate most of heat as water, last thermal equilibrium and temperature constant, equilibrium temperature is than the high 10 ℃ of left and right of environment temperature, and complete machine noise comes from hard disk motor sound.
Totally four sections of notebooks, desktop computer scheme is simple, and pcb board can be done little, and notebook desktop computer can mate 14 inches of following liquid crystal display; Workstation is the server master board scheme of Single-Server CPU, relative complex, and mainboard is larger, so notebook workstation will mate 15 inches of above liquid crystal display; Server is that to take two server CPU and double-memory be main server master board scheme, and motherboard circuit is very complicated, needs space configuration polylith notebook hard disk, so notebook server at least mates the liquid crystal display of 17 inches simultaneously; Notebook superserver, the high-performance two server CPU design for super high power, has adopted high thermal conductivity metal drain pan and super water tank, considers to install desktop computer big capacity hard disk array, at least mates the liquid crystal display of 19 inches.
The high thermal conductivity metal of above mentioning, refers to that aluminium alloy and temperature conductivity are not less than metal and the complex thereof of fine aluminium, such as copper, aldary and diamond-copper, and aluminium and adamas-aluminium.The TDP mentioning in literary composition is the abbreviation of Thermal Design Power, the Chinese meaning " TDP "; The IOH mentioning is the abbreviation of Input/Output Hub, the Chinese meaning " I/O multiplexer "; The ICH mentioning is the abbreviation of Input/Output Controller Hub, the Chinese meaning " I/O multiplexer "; The VFD mentioning is the abbreviation of Vacuum Fluorescent Display, the Chinese meaning " vacuum fluorescent display screen ".

Claims (36)

1. a notebook desktop computer, is applied to computer realm, main frame, lithium battery and liquid crystal display, consists of; Liquid crystal display is that plastic casing is fixed on main frame by two rotating shafts, its signal wire and power lead are by two hollow axle access hosts, main frame comprises a shell, a CD-ROM drive, a lithium battery, lithium battery is contained in shell front end, CD-ROM drive is cased, and keyboard, touch pad, two big keys, one group of adhesive sticker button and a VFD lamp are housed on shell; It is characterized in that: this notebook desktop computer also comprises:
One desktop computer mainboard, a desktop computer CPU, a desktop computer memory bar,
One hard disk,
The U-shaped plate of one high thermal conductivity metal, the uncovered water tank of a high thermal conductivity metal;
Wherein, desktop computer memory bar and desktop computer CPU are arranged on desktop computer mainboard, keyboard, touch pad, two big keys, one group of adhesive sticker button and a VFD lamp, hard disk, CD-ROM drive, liquid crystal display signal line is connected with desktop computer mainboard with power lead, the U-shaped plate of high thermal conductivity metal at lower and desktop computer mainboard upper, and hard disk, CD-ROM drive is all installed in the enclosure, lithium battery is connected with desktop computer mainboard, the DC seat of external power supply adapter by being distributed in one of shell side surface function interface powered for other accessory, the uncovered water tank of high thermal conductivity metal is connected with the U-shaped plate screw of the high thermal conductivity metal that stretches out shell front end, liquid coolant is housed in case.
2. notebook desktop computer according to claim 1, described desktop computer mainboard is characterised in that: its CPU seat, IOH and ICH chips welding are at the pcb board face different from other components and parts, desktop computer CPU in the heat radiator of IOH and ICH and seat is in equal height, and the U-shaped plate of high thermal conductivity metal of fixing it is close to respectively on the heat radiator of IOH and ICH, desktop computer CPU surface.
3. notebook desktop computer according to claim 1, described desktop computer CPU is characterised in that: it is desktop computer CPU used, its TDP (Thermal Design Power) is 65W~95W.
4. notebook desktop computer according to claim 1, is further characterized in that: it adopts the shell of notebook.
5. notebook desktop computer according to claim 1, the U-shaped plate of described high thermal conductivity metal and uncovered water tank are characterised in that: they are to be made by high thermal conductivity metal material, all pass through surface treatment and insulate.
6. a notebook workstation, is applied to computer realm, main frame, lithium battery and liquid crystal display, consists of; Liquid crystal display is that plastic casing is fixed on main frame by two rotating shafts, its signal wire and power lead are by two hollow axle access hosts, main frame comprises a shell, a CD-ROM drive, a lithium battery, lithium battery is contained in shell front end, CD-ROM drive is cased, and keyboard, touch pad, two big keys, one group of adhesive sticker button and a VFD are housed on shell; It is characterized in that: this notebook workstation also comprises:
One workstation mainboard, a workstation CPU, a workstation memory bar,
One hard disk,
The U-shaped plate of one high thermal conductivity metal, the uncovered water tank of a high thermal conductivity metal;
Wherein, workstation memory bar and workstation CPU are arranged on workstation mainboard, keyboard, touch pad, two big keys, one group of adhesive sticker button and a VFD lamp, hard disk, CD-ROM drive, liquid crystal display signal line is connected with workstation mainboard with power lead, the U-shaped plate of high thermal conductivity metal at lower and workstation mainboard upper, and hard disk, CD-ROM drive is all installed in the enclosure, lithium battery is connected with workstation mainboard, the DC seat of external power supply adapter by being distributed in one of shell side surface function interface powered for other accessory, the uncovered water tank of high thermal conductivity metal is connected with the U-shaped plate screw of the high thermal conductivity metal that stretches out shell front end, liquid coolant is housed in case.
7. notebook workstation according to claim 6, described workstation mainboard is characterised in that: its CPU seat, IOH and ICH chips welding are at the pcb board face different from other components and parts, workstation CPU in the heat radiator of IOH and ICH and seat is in equal height, and the U-shaped plate of high thermal conductivity metal of fixing it is close to respectively on the heat radiator of IOH and ICH, workstation CPU surface.
8. notebook workstation according to claim 6, described workstation CPU is characterised in that: it is workstation CPU used, and the TDP of CPU is between 65~300W.
9. notebook workstation according to claim 6, is further characterized in that: it adopts the shell of notebook.
10. notebook workstation according to claim 6, the U-shaped plate of described high thermal conductivity metal and uncovered water tank are characterised in that: they are to be made by high thermal conductivity metal material, all pass through surface treatment and insulate.
11. 1 notebook servers, are applied to computer realm, main frame, lithium battery and liquid crystal display, consist of; Liquid crystal display is that plastic casing is fixed on main frame by two rotating shafts, its signal wire and power lead are by two hollow axle access hosts, main frame comprises a shell, a CD-ROM drive, a lithium battery, lithium battery is contained in shell front end, CD-ROM drive is cased, and keyboard, touch pad, two big keys, one group of adhesive sticker button and a VFD are housed on shell; It is characterized in that: this notebook server also comprises:
One server master board, two server CPU, two server memory bars,
One hard disk,
The U-shaped plate of one high thermal conductivity metal, the uncovered water tank of a high thermal conductivity metal;
Wherein, two server memory bars and two server CPU are arranged on server master board, keyboard, touch pad, two big keys, one group of adhesive sticker button and a VFD lamp, hard disk, CD-ROM drive, liquid crystal display signal line is connected with server master board with power lead, the U-shaped plate of high thermal conductivity metal at lower and server master board upper, and hard disk, CD-ROM drive is all installed in the enclosure, lithium battery is connected with server master board, the DC seat of external power supply adapter by being distributed in one of shell side surface function interface powered for other accessory, the uncovered water tank of high thermal conductivity metal is connected with the U-shaped plate screw of the high thermal conductivity metal that stretches out shell front end, liquid coolant is housed in case.
12. notebook servers according to claim 11, described server master board is characterised in that: its two CPU seats, IOH and ICH chips welding is at the pcb board face different from other components and parts, server CPU in the heat radiator of IOH and ICH and seat is in equal height, and the fixedly U-shaped plate of high thermal conductivity metal of mainboard is close to respectively on the heat radiator of IOH and ICH, server CPU surface.
13. notebook servers according to claim 11, described server CPU is characterised in that: it is server CPU used, the TDP of single CPU (Thermal Design Power) is 130W~200W.
14. notebook servers according to claim 11, are further characterized in that: it adopts the shell of notebook.
15. notebook servers according to claim 11, the U-shaped plate of described high thermal conductivity metal and uncovered water tank are characterised in that: they are to be made by high thermal conductivity metal material, all pass through surface treatment and insulate.
16. 1 notebook superservers, are applied to computer realm, main frame, lithium battery and liquid crystal display, consist of; Liquid crystal display is that plastic casing is fixed on main frame by two rotating shafts, its signal wire and power lead are by two hollow axle access hosts, main frame comprises a shell, a CD-ROM drive, a lithium battery, lithium battery is contained in shell front end, CD-ROM drive is cased, and keyboard, touch pad, two big keys, one group of adhesive sticker button and a VFD are housed on shell; It is characterized in that: this notebook server also comprises;
One server master board, two server CPU, two server memory bars,
One hard disk,
The U-shaped plate of one high thermal conductivity metal, the uncovered water tank of a high thermal conductivity metal;
Wherein, two server memory bars and two server CPU are arranged on server master board, keyboard, touch pad, two big keys, one group of adhesive sticker button and a VFD lamp, hard disk, CD-ROM drive, liquid crystal display signal line is connected with server master board with power lead, the U-shaped plate of high thermal conductivity metal at lower and server master board upper, and hard disk, CD-ROM drive is all installed in the enclosure, lithium battery is connected with server master board, the DC seat of external power supply adapter by being distributed in one of shell side surface function interface powered for other accessory, the uncovered water tank of high thermal conductivity metal is reliably connected with the U-shaped plate of high thermal conductivity metal that stretches out shell, liquid coolant is housed in case.
17. notebook superservers according to claim 16, described server master board is characterised in that: its two CPU seat, IOH and ICH chips welding are at the pcb board face different from other components and parts, server CPU in the heat radiator of IOH and ICH and seat is in equal height, and the fixedly U-shaped plate of high thermal conductivity metal of mainboard is close to respectively on the heat radiator of IOH and ICH, server CPU surface.
18. notebook superservers according to claim 16, described server CPU is characterised in that: it is server CPU used, its TDP (Thermal Design Power) is greater than 200W.
19. notebook superservers according to claim 16, are further characterized in that: it adopts the shell of notebook.
20. notebook superservers according to claim 16, the U-shaped plate of described high thermal conductivity metal and uncovered water tank are characterised in that: they are to be made by high thermal conductivity metal material, all pass through surface treatment and insulate.
21. 1 single screen all-in-one servers, are applied to computer realm, peripheral hardware and main frame, consist of; Peripheral hardware comprises a mouse and a keyboard, and main frame comprises a U-shaped metal partion (metp), a liquid crystal display, a drive plate, a power panel, a lithium battery and a CD-ROM drive; It is characterized in that: this single screen all-in-one server also comprises:
One server master board, two server CPU, two server memory bars,
Three hard disks,
One high thermal conductivity metal shell, a high thermal conductivity metab, the uncovered water tank of a high thermal conductivity metal;
Wherein, two server CPU and two server memory bars are arranged on server master board, server master board, power panel and CD-ROM drive are fixed on the front of U-shaped metal partion (metp), three hard disks and drive plate are fixed on the U-shaped metal partion (metp) back side, liquid crystal display front and U-shaped metal partion (metp) after be fixed in high thermal conductivity metal shell, mouse, keyboard, CD-ROM drive, drive plate is connected with server master board with three hard disks, lithium battery is contained in the battery case bottom high thermal conductivity metal shell and is connected with power panel, external power supply adapter is that other accessory is powered by power panel, high thermal conductivity metal shell is fixed on high thermal conductivity metab, the uncovered water tank bottom plate of high thermal conductivity metal is connected with high thermal conductivity metab.
22. single screen all-in-one servers according to claim 21, described server master board is characterised in that: its Servers-all CPU seat, IOH and ICH chips welding are at the pcb board face different from other components and parts, server CPU in the heat radiator of IOH and ICH and seat is in equal height, and the fixedly U-shaped metal partion (metp) of mainboard is close to respectively on the heat radiator of IOH and ICH, server CPU surface.
23. single screen all-in-one servers according to claim 21, described high thermal conductivity metal shell, base and uncovered water tank are characterised in that: they are to be made by high thermal conductivity metal material, all pass through surface treatment and insulate.
24. single screen all-in-one servers according to claim 21, the feature of described high thermal conductivity metal shell is also: there are two RJ45 its side, are the reserved opening of 100-M network Ethernet and gigabit network interface respectively.
25. single screen all-in-one servers according to claim 21, the feature of described server CPU and the uncovered water tank of high thermal conductivity metal is also: the TDP of server CPU is larger, just requires uncovered water tank larger; Before server CPU energising work, in uncovered water tank, to be full of liquid coolant.
26. single screen all-in-one servers according to claim 21, described connection is characterised in that: it is a kind of of two kinds of connected modes of the uncovered water tank bottom plate of high thermal conductivity metab and high thermal conductivity metal, and these two kinds of connected modes are integrated and stack screw is fixed.
27. 1 double screen I type all-in-one servers, are applied to computer realm, peripheral hardware and main frame, consist of; Peripheral hardware comprises two mouses and two keyboards, and main frame comprises a power panel, a lithium battery and a CD-ROM drive; It is characterized in that: this double screen I type all-in-one server also comprises:
Two liquid crystal displays, a drive plate,
One video card, a server master board, two server memory bars, two server CPU,
Four hard disks,
Case, a high thermal conductivity metab, a high thermal conductivity metal shell in one high thermal conductivity metal I shape,
The uncovered water tank of two high thermal conductivity metals;
Wherein, video card, two server CPU and two server memory bars are arranged on server master board, two mouses, two keyboards, drive plate, CD-ROM drive is connected with server master board with four hard disks, server master board, drive plate, power panel, CD-ROM drive and four hard disks are fixed in the interior case of high thermal conductivity metal I shape, two liquid crystal displays are fixed on the interior case of high thermal conductivity metal I shape and are connected with drive plate, drive plate is connected with video card, in high thermal conductivity metal I shape, case is fixed in high thermal conductivity metal shell, lithium battery is contained in the battery case of outer casing bottom and is connected with power panel, external power supply adapter is that other accessory is powered by power panel, high thermal conductivity metal shell top is a uncovered water tank, liquid coolant is housed in case, high thermal conductivity metal shell is fixed on high thermal conductivity metab, the base plate of the uncovered water tank of two high thermal conductivity metals is connected with high thermal conductivity metab.
28. double screen I type all-in-one servers according to claim 27, case, high thermal conductivity metab and high thermal conductivity metal shell in described high thermal conductivity metal I shape, it is characterized in that: they are all to be made by high thermal conductivity metal material, all pass through surface treatment and insulate.
29. double screen I type all-in-one servers according to claim 27, described high thermal conductivity metal shell, is further characterized in that: it comprises side plate 24 and face-piece 23, has a screen window on side plate 24; Face-piece 23 sides are distributed with the reserved opening of two RJ45, and two RJ45 are respectively 100-M network Ethernet and gigabit network interface; Two groups of function buttons before and after being provided with in face-piece 23 bottom battery boxes, every group of function button difference gauge tap machine, reset, the unlatching of screen menu, DOWN, UP and OK.
30. double screen I type all-in-one servers according to claim 27, described server master board, it is characterized in that: its CPU seat, IOH and ICH chips welding are at the pcb board face different from other components and parts, the heat radiator of IOH and ICH and the server CPU on mainboard are in equal height, and the fixedly interior case of high thermal conductivity metal I shape of mainboard is close to respectively on the heat radiator of IOH and ICH, server CPU surface; It has binaural output and two-way MIC input.
31. double screen I type all-in-one servers according to claim 27, described drive plate, is characterized in that: it has Double liquid crystal screen and drives control function.
32. double screen I type all-in-one servers according to claim 27, the feature of the uncovered water tank of described two high thermal conductivity metal is also: their inside is full of liquid coolant.
33. 1 double screen II type all-in-one servers, are applied to computer realm, peripheral hardware and main frame, consist of; Peripheral hardware comprises two mouses and two keyboards, and main frame comprises two liquid crystal display, a video card, a power panel, a CD-ROM drive and two lithium batteries; It is characterized in that: this double screen II type all-in-one server also comprises:
One high thermal conductivity metal shell,
The uncovered water tank of two high thermal conductivity metals,
Three hard disks,
One server master board, two server memory bars, two server CPU;
Wherein, video card, two server CPU and two server memory bars are arranged on server master board, two mouses, two keyboards, CD-ROM drive is connected with server master board with three hard disks, three hard disks, CD-ROM drive, power panel, server master board is fixed in high thermal conductivity metal shell, two lithium batteries are arranged in the battery case of both sides at the bottom of shell and are connected with power panel, two liquid crystal display displays are linked on shell by hollow axle, power lead and signal wire enter in shell by spindle central, external power supply adapter is that other accessory is powered by power panel, cover top portion is a uncovered water tank, in uncovered water tank case, liquid coolant is housed, the uncovered water tank bottom plate of two high thermal conductivity metals is connected with shell both sides.
34. double screen II type all-in-one servers according to claim 33, described high thermal conductivity metal shell, is characterized in that: it is to be made by high thermal conductivity metal, through surface treatment, insulate; Shell side is distributed with the reserved opening of two RJ45.
35. double screen II type all-in-one servers according to claim 33, described server master board, it is characterized in that: its CPU seat, IOH and ICH chips welding are at the pcb board face different from other components and parts, the heat radiator of IOH and ICH and the server CPU on mainboard are in equal height, and the fixedly outer casing inner wall of mainboard is close to respectively on the heat radiator of IOH and ICH, server CPU surface.
36. double screen II type all-in-one servers according to claim 33, the feature of the uncovered water tank of described two high thermal conductivity metal is also: they are all full of liquid coolant.
CN201110066571.1A 2010-12-02 2011-03-14 High-performance integrated machine and notebook computer Expired - Fee Related CN102129275B (en)

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CN105224027A (en) * 2015-10-22 2016-01-06 泰逸电子(昆山)有限公司 A kind of nylon glass fiber composite material notebook computer drain pan and Shooting Technique thereof
CN109002175B (en) * 2018-08-02 2021-11-12 东营市天泉包装印刷有限责任公司 Keyboard of portable high-efficient cooling
CN109065084A (en) * 2018-10-12 2018-12-21 苏州普福斯信息科技有限公司 A kind of mobile hard disk of high efficiency and heat radiation

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