CN212947224U - Placing mechanism for placing wafer in double-side polishing - Google Patents
Placing mechanism for placing wafer in double-side polishing Download PDFInfo
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- CN212947224U CN212947224U CN202021644211.6U CN202021644211U CN212947224U CN 212947224 U CN212947224 U CN 212947224U CN 202021644211 U CN202021644211 U CN 202021644211U CN 212947224 U CN212947224 U CN 212947224U
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- placing
- inner ring
- disc
- polishing
- sided polishing
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- 238000005498 polishing Methods 0.000 title claims abstract description 70
- 235000012431 wafers Nutrition 0.000 claims description 45
- 239000007788 liquid Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The utility model relates to a placing mechanism for placing a wafer in double-sided polishing, which is arranged at the inner side of a lower polishing disc of polishing equipment and is characterized by comprising an outer ring disc provided with an inner gear and a plurality of inner ring discs provided with outer gears, wherein the outer ring disc and the inner ring discs are mutually independent and the inner ring discs are uniformly arranged along the circumference of the outer ring disc; the adjacent inner ring discs are mutually meshed; the inner ring disc is respectively meshed with the inner gear of the outer ring disc and the outer gear of the hub wheel arranged on the inner side of the lower throwing disc. The utility model discloses especially, be applicable to the two-sided polishing of jumbo size wafer, can place the wafer in batches, adjacent inner circle dish of placing not only with throw the axle center wheel meshing in the dish down but also with outer lane dish internal gear meshing, simple structure, the stable performance, the cooperation operation uniformity is good.
Description
Technical Field
The utility model belongs to the technical field of semiconductor silicon chip polishing, especially, relate to a mechanism of placing that is used for placing the wafer among two-sided polishing.
Background
For large-size semiconductor wafers, particularly wafers of 12 inches or more than 12 inches, in the double-sided polishing process, how to arrange and place the wafers and enable the polishing solution to rapidly flow into the polishing surface far away from the polishing solution inlet side, and enable the wafers to be stably and uniformly placed in the polishing tank to rotate, and enable the wafers to rotate stably, is an important condition for ensuring that the wafers are qualified in batch polishing quality, consistent in polishing effect and accurate in surface geometric parameters.
SUMMERY OF THE UTILITY MODEL
The utility model provides a be used for placing the mechanism of placing of wafer among the double-sided polishing, especially be applicable to the double-sided polishing equipment of jumbo size wafer, can place the wafer in batches, adjacent inner circle dish of placing not only with throw the axle center wheel meshing in the dish down but also with outer lane dish internal gear meshing, simple structure, the stable performance, the cooperation operation uniformity is good.
In order to solve the technical problem, the utility model discloses a technical scheme is:
a placing mechanism for placing a wafer in double-sided polishing is arranged on the inner side of a lower polishing disc of polishing equipment and comprises an outer ring disc provided with an inner gear and a plurality of inner ring discs provided with outer gears, wherein the outer ring disc and the inner ring discs are mutually independent and are uniformly arranged along the circumference of the outer ring disc; the adjacent inner ring discs are mutually meshed; the inner ring disc is respectively meshed with the inner gear of the outer ring disc and the outer gear of the hub wheel arranged on the inner side of the lower throwing disc.
Furthermore, a plurality of through hole placing grooves for placing the wafer are formed in the inner ring disc, the placing grooves are evenly formed along the circumference of the inner ring disc and are adjacent to each other through a connecting piece.
Furthermore, a plurality of connecting pieces II and connecting pieces III are further arranged on the inner ring disc, and the connecting pieces II and the connecting pieces III are used for connecting the placing groove and the inner ring disc.
Furthermore, the second connecting piece and the third connecting piece are uniformly spaced along the circumference of the inner ring disc and are arranged independently.
Furthermore, the second connecting piece is arranged on one side, close to the inner ring disc, of the placing groove and is connected with the placing groove and the inner ring disc.
Furthermore, the area surrounded by three adjacent connecting pieces is a V-shaped hollow structure.
Furthermore, the area surrounded by three adjacent connecting pieces is of an X-shaped structure.
Furthermore, the three phases of the connecting piece are symmetrically arranged relative to the diameter of the inner ring disc and staggered with the first connecting piece.
Furthermore, a plurality of through holes are further formed in the third connecting piece, and the through holes are arranged on one side close to the placing groove.
Furthermore, at least three groups of inner ring discs are arranged on the inner side of the outer ring disc.
By adopting the utility model to design a placing mechanism for placing wafer disks in double-sided polishing, wafer disks can be placed in batches, and the inner ring disks which are adjacently placed are not only meshed with a shaft center wheel in a lower polishing disk but also meshed with an inner gear of an outer ring disk, so that the stability and consistency of the operation of the wafer disks are ensured; simultaneously still be equipped with the through-hole that a plurality of fretworks set up on the inner circle dish and be used for the polishing solution circulation, not only consolidate the intensity of inner circle dish, still more do benefit to the sufficient polishing solution that flows in under in throwing the dish, the high just polishing effect of overall control precision is good moreover.
Drawings
Fig. 1 is a schematic structural view of a placement mechanism and a lower throwing disk according to an embodiment of the present invention;
fig. 2 is a top view of a placement mechanism according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of an inner ring disc according to a first embodiment of the present invention;
fig. 4 is a schematic structural view of an inner ring disc according to a second embodiment of the present invention;
fig. 5 is a schematic structural diagram of an inner ring disc according to a third embodiment of the present invention.
In the figure:
100. placing mechanism 110, outer ring disc 120 and inner ring disc
121. A placing groove 122, a first connecting piece 123 and a second connecting piece
124. Three 125 connecting pieces, through hole 200 and pressing disc
300. Axle wheel
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
In the present embodiment, a placing mechanism for placing a wafer in double-side polishing is provided, as shown in fig. 1, the placing mechanism 100 is built inside a lower polishing plate 200 of a polishing apparatus and is driven by the lower polishing plate 200 to rotate. Specifically, the placing mechanism 100 includes an outer ring disk 110 provided with an internal gear and a plurality of inner ring disks 120 provided with an external gear, wherein the outer ring disk 110 and the inner ring disks 120 are arranged independently of each other, the inner ring disks 120 are arranged inside the outer ring disk 110 and uniformly along the circumference of the outer ring disk 110, and the inner ring disks 120 are a plurality of circular disks with the same structure. The outer ring disk 110 has an outer diameter smaller than that of the lower throwing disk 200 and is disposed within the lower throwing disk 200. When the inner ring discs 120 are in gear engagement with the outer ring disc 110, the adjacent inner ring discs 120 are in mutual engagement; and all the inner ring disks 120 are engaged with the outer gear of the hub wheel 300 disposed at the center of the upper end surface of the lower throwing disk 200, and the hub wheel 300 is disposed through the axis of the lower throwing disk 200.
Further, as shown in fig. 2, a plurality of through hole placing grooves 121 for placing wafers are arranged on the inner ring disc 120, the diameter of each placing groove 121 is matched with the diameter of each wafer, the thickness of each placing groove 121 is slightly smaller than that of each wafer, so that the double-sided damage layers of the wafers can be conveniently removed, and the placing grooves 121 are prevented from interfering with the polishing in the thickness direction of the wafers. The placing grooves 121 are uniformly arranged along the circumference of the inner ring disk 120 and adjacent placing grooves 120 are connected with each other through a connecting piece 122. The placing grooves 121 are connected through the first connecting piece 122 to form a closed hole, so that the placing grooves 121 can be stably connected with each other and can be used for the circulation of polishing liquid.
Further, a plurality of second connecting pieces 123 and third connecting pieces 124 are further arranged on the inner ring disc 120, and the second connecting pieces 123 and the third connecting pieces 124 are used for connecting the placing groove 121 and the inner diameter of the inner ring disc 120; the second connecting piece 123 and the third connecting piece 124 are uniformly spaced along the circumference of the inner ring disk 120 and are independently arranged.
Further, the second connecting piece 123 is disposed on one side of the placing groove 121 close to the inner ring disc 120 and connects the placing groove 121 and the inner side wall of the inner ring disc 120, that is, the placing groove 121 may be internally tangent and connected to the inner ring disc 120, or may be connected to the inner ring disc 120 through the second connecting piece 123. This configuration is provided so that the number of placing grooves 121 to be placed may be determined according to the outer diameter of the inner ring disc 120, and at least the number of placing grooves 121 is two. Preferably, in the present embodiment, the placement grooves 121 are three in number and are connected to the inner ring disk 120 through a second connecting piece 123.
As shown in fig. 3, the region enclosed by the adjacent three connecting pieces 124 is a V-shaped hollow structure and is symmetrically arranged relative to the diameter of the inner ring plate 120, and the three connecting pieces 123 are staggered from the first connecting piece 122. One end of each adjacent connecting piece 124 is connected with the inner side wall of the inner ring disc 120, the other end of each adjacent connecting piece 124 is connected with the adjacent placing groove 121, and the two adjacent connecting pieces 124 connected with the inner ring disc 120 are not in cross connection, so that the flow area of polishing liquid can be further increased, the connecting mode is simple, and the processing and the manufacturing are easy.
As shown in fig. 4, in order to further improve the stability of the connection between the inner ring disc 120 and the placement groove 121, the region enclosed by the adjacent three pieces 124 is an X-shaped structure, that is, the adjacent three pieces 124 are connected with each other in a crossing manner, and the crossing point may be disposed near the inner ring disc 120 body side, or near the placement groove 121 side, and preferably near the placement groove 121 side, so as to further improve the stability of the connection between the adjacent placement grooves 121.
The third connecting piece 124 with the two structures is simple in structure, the flow area of the polishing liquid is increased to the maximum extent, the distribution uniformity of the double-sided polishing liquid is further improved, the foundation is made for next double-sided polishing, the uniformity of the polishing liquid used for double-sided polishing is guaranteed, and the utilization rate of the polishing liquid is also improved.
Even the structure that piece 122, even piece two 123 and even piece three 124 are crisscross and mutual independent setting for standing groove 121 circumference has a plurality of tie points of being connected with inner circle dish 120, not only improves the intensity that inner circle dish integral connection, also improves the steadiness that places dish 121 and place, improves the stability that the inner circle dish 120 was placed to the wafer, improves polishing effect, keeps polishing performance unanimous.
Further, as shown in fig. 5, in order to further improve the circulation of the polishing liquid and at the same time, without affecting the strength of the inner ring plate 120, a plurality of through holes 125 may be further formed in the connecting member 124, and the through holes 125 are disposed near the placing groove 121, because the connecting section near the placing groove 121 has high strength, there is no need to worry about the connecting strength.
Further, at least three groups of inner ring discs 120 may be disposed inside the outer ring disc 110, in this embodiment, preferably, the number of the inner ring discs 120 is five, that is, three wafers are disposed in each inner ring disc 120, and 15 wafers may be disposed in a polishing device during each batch of polishing.
When the device works, the outer ring plate 110 is placed on the lower throwing plate 200 and has the same rotating speed and the same rotating direction as the lower throwing plate 200; the diameter of an upper throwing disc (omitted in the figure) in the polishing equipment is slightly smaller than that of the lower throwing disc 200, namely the diameter of the outer ring disc 110, the rotation direction of the upper throwing disc is opposite to that of the lower throwing disc 200, the rotating speed of the upper throwing disc is greater than that of the lower throwing disc 200, namely the rotation directions of the upper throwing disc and the outer ring disc 110 are opposite; the rotation direction of the arbor wheel 300 is the same as that of the lower throwing disk 200, but the rotation speed is different, and because the external diameter of the arbor wheel 300 is smaller, in order to ensure the running consistency of the arbor wheel 300 and the lower throwing disk 200, the rotation speed of the arbor wheel 300 is higher, and the rotation speed of the lower throwing disk 200 is lower; furthermore, since the inner ring disk 120 carrying the wafer and the outer ring disk 110 have a certain speed ratio difference, the inner ring disk 120 carrying the wafer can perform a planetary motion around the axis wheel 300, and the upper polishing disk rotates in a reverse direction with respect to the lower polishing disk 200, so that the wafer is rotated along with the lower polishing disk 200 and also rotated in a reverse direction. Meanwhile, polishing pads are arranged on the lower end face of the upper polishing disc and the upper end face of the polishing disc 200, so that the wafer is subjected to double-face contact grinding by the polishing pads rotating up and down in opposite directions, and the double-face surfaces of the wafer are subjected to chemical mechanical polishing by using polishing liquid sprayed in real time, so that double-face polishing of the wafer is realized, and double-face damaged layers are removed.
By adopting the utility model to design a placing mechanism for placing wafer disks in double-sided polishing, wafer disks can be placed in batches, and the inner ring disks which are adjacently placed are not only meshed with a shaft center wheel in a lower polishing disk but also meshed with an inner gear of an outer ring disk, so that the stability and consistency of the operation of the wafer disks are ensured; simultaneously still be equipped with the through-hole that a plurality of fretworks set up on the inner circle dish and be used for the polishing solution circulation, not only consolidate the intensity of inner circle dish, still more do benefit to the sufficient polishing solution that flows in under in throwing the dish, the high just polishing effect of overall control precision is good moreover.
The embodiments of the present invention have been described in detail, and the description is only for the preferred embodiments of the present invention, and should not be construed as limiting the scope of the present invention. All the equivalent changes and improvements made according to the application scope of the present invention should still fall within the patent coverage of the present invention.
Claims (10)
1. A placing mechanism for placing a wafer in double-sided polishing is arranged on the inner side of a lower polishing disc of polishing equipment and is characterized by comprising an outer ring disc provided with an inner gear and a plurality of inner ring discs provided with outer gears, wherein the outer ring disc and the inner ring discs are mutually independent and are uniformly arranged along the circumference of the outer ring disc; the adjacent inner ring discs are mutually meshed; the inner ring disc is respectively meshed with the inner gear of the outer ring disc and the outer gear of the hub wheel arranged on the inner side of the lower throwing disc.
2. A placing mechanism for placing wafers during double-sided polishing as recited in claim 1, wherein a plurality of through-hole placing slots for placing wafers are provided on the inner ring disc, the placing slots are uniformly arranged along the circumference of the inner ring disc, and adjacent placing slots are connected with each other through a connecting piece.
3. A placing mechanism for placing wafers during double-sided polishing as recited in claim 2, wherein a plurality of second connecting pieces and third connecting pieces are further provided on the inner ring disk, and the second connecting pieces and the third connecting pieces are used for connecting the placing groove and the inner ring disk.
4. A placing mechanism for placing wafers during double-sided polishing as recited in claim 3, wherein the second connecting piece and the third connecting piece are uniformly spaced along the circumference of the inner ring disk and are independent of each other.
5. The double-sided polishing wafer placing mechanism as claimed in claim 3 or 4, wherein the second connecting member is disposed on a side of the placing groove close to the inner ring disk and connects the placing groove and the inner ring disk.
6. A placement mechanism for placing wafers during double-sided polishing as recited in claim 5, wherein the area enclosed by adjacent links is V-shaped.
7. A placement mechanism for placing wafers during double-sided polishing as recited in claim 5, wherein the area enclosed by adjacent links is X-shaped.
8. A placing mechanism for placing wafers during double-sided polishing as recited in any one of claims 3 to 4 and 6 to 7, wherein the three phases of the link are arranged symmetrically with respect to the diameter of the inner ring disk and are staggered with respect to the one phase of the link.
9. A placing mechanism for placing wafers during double-sided polishing as recited in claim 8, wherein a plurality of through holes are further formed on the third connecting member, and the through holes are disposed near one side of the placing groove.
10. A placing mechanism for placing wafers in double-sided polishing as recited in any one of claims 1 to 4, 6 to 7 and 9, wherein at least three sets of said inner ring disks are provided inside said outer ring disk.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021644211.6U CN212947224U (en) | 2020-08-10 | 2020-08-10 | Placing mechanism for placing wafer in double-side polishing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021644211.6U CN212947224U (en) | 2020-08-10 | 2020-08-10 | Placing mechanism for placing wafer in double-side polishing |
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| Publication Number | Publication Date |
|---|---|
| CN212947224U true CN212947224U (en) | 2021-04-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021644211.6U Active CN212947224U (en) | 2020-08-10 | 2020-08-10 | Placing mechanism for placing wafer in double-side polishing |
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| Country | Link |
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| CN (1) | CN212947224U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113681444A (en) * | 2021-09-02 | 2021-11-23 | Oppo广东移动通信有限公司 | Polishing jig, polishing jig assembly and roll polishing machine |
-
2020
- 2020-08-10 CN CN202021644211.6U patent/CN212947224U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113681444A (en) * | 2021-09-02 | 2021-11-23 | Oppo广东移动通信有限公司 | Polishing jig, polishing jig assembly and roll polishing machine |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 300384 Tianjin Binhai New Area high tech Zone Huayuan Industrial Area (outside the ring) Hai Tai Road 12 inside. Patentee after: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Country or region after: China Patentee after: Zhonghuan Leading Semiconductor Technology Co.,Ltd. Address before: No.12 Haitai East Road, Huayuan Industrial Zone, Binhai New Area, Tianjin Patentee before: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Country or region before: China Patentee before: Zhonghuan leading semiconductor materials Co.,Ltd. |
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| CP03 | Change of name, title or address |