CN212934585U

CN212934585U - Substrate-mask plate in-situ holding device for high-density patterning

Info

Publication number: CN212934585U
Application number: CN202022332420.3U
Authority: CN
Inventors: 邓元; 王赫; 赵未昀; 张玮峰; 华小社
Original assignee: Hangzhou Innovation Research Institute of Beihang University
Current assignee: Hangzhou Innovation Research Institute of Beihang University
Priority date: 2020-10-19
Filing date: 2020-10-19
Publication date: 2021-04-09
Anticipated expiration: 2030-10-19

Abstract

The application relates to a substrate-mask plate in-situ holding device for high-density patterning, which comprises a vacuum connecting table, a base, a substrate holder and a mask plate holder, wherein the vacuum connecting table is provided with a first quick socket and an air port; the upper end surface of the base is provided with a first boss and a first air hole, the base is connected to the upper end surface of the vacuum connecting table, and the first air hole is communicated with the air port; the substrate holder is provided with a holding groove, a connecting hole and a fastening member; the mask plate holder is provided with a hollow hole and a cantilever, the upper end face of the cantilever is provided with a second quick socket, and the lower end face of the cantilever is provided with a second air hole. So set up, this device simple structure, the operation of being convenient for can keep substrate and mask plate fixed after the alignment operation, is favorable to realizing the high-efficient preparation of high density array structure thin film device to the quick transfer of sample between each technology of thin film device preparation.

Description

Substrate-mask plate in-situ holding device for high-density patterning

Technical Field

The application relates to the technical field of preparation of non-silicon-based thin film devices, in particular to a substrate-mask plate in-situ holding device for high-density patterning.

Background

In recent years, as the human society has advanced into the 5G era, semiconductor and communication devices have been developed toward high integration, miniaturization, and weight reduction; the preparation of non-silicon-based thin film devices with high-density array structures, the development of material and device micro-nano integration technology, and a new round of industrial revolution will be led. At present, the development of the non-silicon-based thin film device preparation technology is lagged, and the further miniaturization evolution of the non-silicon-based device is severely restricted. The key to the preparation of the micro non-silicon-based thin film device is how to realize the high-density and high-precision integrated processing of material patterns in the device with high quality and high efficiency. At present, the method is used for high-precision preparation means such as magnetron sputtering, thermal evaporation, molecular beam epitaxy and the like for preparing non-silicon-based thin film devices.

The process determines the quality and efficiency of high-density array micro-device preparation. The processes and the conversion process between the processes all involve mutual fastening and relative position maintaining of the device substrate and the mask plate, and a device for fixing and maintaining the substrate and the mask plate is urgently needed to match each process in the high-density array structure thin film preparation flow. The required apparatus must meet the following requirements: 1. the method is widely suitable for various film preparation processes; 2. the preparation conditions of the film are not influenced and changed; 3. the use and the execution are simple and convenient; 4. the cost is low; 5. the problem of the mask plate warping because of being fixed by the clamp is solved.

In the patent with application number CN202010701252.2, a special alignment device is designed for the alignment and attachment problem of the substrate (substrate) and the mask plate, so as to achieve the fast alignment of the substrate and the mask plate. In order to realize efficient preparation of the thin film device with the high-density array structure, the problems of rapid transfer and fixed holding of the sample between the processes of preparing the thin film device are still required to be solved except for alignment. Therefore, there is still a need for an apparatus that provides support and support for the substrate-mask plate during the entire device fabrication process while matching the alignment process and the thin film growth process in the high-density array structure thin film device fabrication process.

SUMMERY OF THE UTILITY MODEL

To overcome at least some of the problems in the related art, the present application is directed to a substrate-mask in-situ holding apparatus for high-density patterning, which is capable of facilitating efficient fabrication of a thin film device with a high-density array structure, and enabling a sample to be held and transferred quickly between processes of thin film device fabrication. The technical effects that can be produced by the preferred technical scheme in the technical schemes provided by the application are described in detail in the following.

The application provides a substrate-mask plate in-situ holding device for high-density patterning, which comprises:

the vacuum connection table is provided with a first quick socket for being connected with a vacuum pump and a gas port which is positioned on the upper end face and communicated with the first quick socket;

the upper end surface of the base is provided with a first boss and a first air hole which is positioned on the first boss and penetrates through the base, the base is connected to the upper end surface of the vacuum connecting table, and the first air hole is communicated with the air hole;

the substrate holder is provided with a holding groove which is positioned on the upper end surface and is used for embedding a substrate, a connecting hole which is positioned at the groove bottom of the holding groove and penetrates through the substrate holder and is used for embedding the first boss, and a fastening assembly which is positioned on the periphery of the holding groove and is used for fixing the substrate and the mask plate;

the mask plate holder is provided with a hollow hole penetrating through the mask plate holder and a cantilever positioned in the middle of the hollow hole, the upper end face of the cantilever is provided with a second quick socket used for being connected with a vacuum pump, and the lower end face of the cantilever is provided with a second air hole communicated with the second quick socket and used for adsorbing a mask plate.

Preferably, the upper end face of vacuum connection platform is provided with the second boss, the lower terminal surface of base is provided with the confession the connection socket that the second boss embedding is connected, first gas vent run through in the connection socket.

Preferably, the upper end surface of the first boss is provided with a first vacuum groove, and the first air holes are provided in plurality and distributed in the first vacuum groove.

Preferably, the mask holder further comprises a frame-shaped connecting support, the mask holder is located in the middle of the connecting support and is provided with a plurality of connecting rods extending towards the connecting support, and the connecting support is provided with clamping grooves for the connecting rods to be embedded in.

Preferably, the number of the cantilevers is two, the first end of each cantilever is fixed to the mask holder, the second end of each cantilever is located in the middle of the corresponding hollow hole, and the second quick socket and the second air hole are formed in the corresponding cantilever.

Preferably, a second vacuum groove is formed in a lower end surface of the second end of the cantilever, and the second air holes are distributed in the second vacuum groove.

Preferably, the fastening assembly includes a fastening plate and a fastening screw, a plurality of fastening screw holes are formed on the periphery of the holding groove, and the fastening screw penetrates through the fastening plate and is screwed in the fastening screw holes.

Preferably, the fastening tab is provided as a rigid tab or an elastic tab.

Preferably, the sample holder further comprises a sample tray, the upper end face of the sample tray is provided with a plurality of bearing grooves for embedding the substrate holder, the bottom of each bearing groove is provided with a bearing hole for exposing the substrate and the mask plate, and the periphery of each bearing groove is provided with a spring fixing piece for fixing the substrate holder.

Preferably, the depth of the carrier groove corresponds to the thickness of the substrate holder.

The technical scheme provided by the application can comprise the following beneficial effects:

in use, the substrate holder is assembled to the base, the base is attached to the vacuum attachment table such that the first gas port and the gas port are in communication, and the vacuum attachment table is secured to the underlying moving platform; placing the substrate into a holding groove of a substrate holder; the substrate is adsorbed and fixed in the holding groove of the substrate holder by the adsorption action formed at the position of the first air hole by the vacuum air path; placing a reticle to a lower end of a reticle holder; the mask plate is adsorbed and fixed on the mask plate holder through the adsorption action formed by the vacuum gas circuit at the second air hole; the alignment operation is realized by controlling the upper moving platform and the lower moving platform, and the mask plate holder is lowered to enable the mask plate and the substrate to be mutually attached; the substrate and the mask plate are tightly installed on the upper end face of the substrate holder through a fastening assembly; releasing the pedestal and the reticle holder from the vacuum clamped state by turning off the vacuum pump; the substrate holder is taken down, and the in-situ holding and the accommodation of the substrate-mask plate can be realized. After the alignment operation is finished, the substrate-mask plate can be directly placed into a matched tray suitable for various film preparation devices together with the substrate holder for film preparation, additional fixation is not needed, the substrate-mask plate is suitable for various sample libraries or load-lock devices, the taking and placing of samples cannot be influenced, and the preparation efficiency of devices can be greatly improved. So set up, this device simple structure, the operation of being convenient for can keep substrate and mask plate fixed after the alignment operation, is favorable to realizing the high-efficient preparation of high density array structure thin film device to the quick transfer of sample between each technology of thin film device preparation.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and together with the description, serve to explain the principles of the application.

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is an exploded view of the present high density patterning processed substrate-reticle in-situ holding apparatus, shown in accordance with some exemplary embodiments;

FIG. 2 is a block diagram of a sample tray shown in accordance with some exemplary embodiments;

FIG. 3 is a top view of a vacuum attachment station shown in accordance with some exemplary embodiments;

FIG. 4 is a front view of a vacuum docking station shown in accordance with some exemplary embodiments;

FIG. 5 is a top view of a base shown in accordance with some exemplary embodiments;

FIG. 6 is a bottom view of the base shown in accordance with some exemplary embodiments;

FIG. 7 is a perspective view of a substrate holder shown in accordance with some exemplary embodiments;

FIG. 8 is a mounting structure diagram of a substrate holder holding a substrate and a reticle according to some exemplary embodiments;

FIG. 9 is a top view of a reticle holder shown in accordance with some exemplary embodiments;

FIG. 10 is a bottom view of a reticle holder shown in accordance with some exemplary embodiments;

FIG. 11 is a block diagram illustrating the fastening tab as a rigid tab in accordance with some exemplary embodiments;

figure 12 is a block diagram illustrating the fastening tab as an elastic tab according to some exemplary embodiments.

In the figure: 1. a vacuum connection station; 11. a first quick socket; 12. a gas port; 13. an air tank; 14. a second boss; 2. a base; 21. a first boss; 22. a first air hole; 23. a first vacuum tank; 24. a connecting socket; 3. a substrate holder; 31. a holding groove; 32. connecting holes; 33. fastening screw holes; 34. a fastening tab; 35. fastening screws; 4. a reticle holder; 41. a cantilever; 42. a connecting rod; 43. a second quick socket; 44. a second air hole; 45. a second vacuum tank; 5. connecting a bracket; 51. a card slot; 6. a sample tray; 61. a bearing groove; 62. and a bearing hole.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus or methods consistent with aspects of the present application.

In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be described in detail below. It is to be understood that the embodiments described are only some embodiments of the invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

Hereinafter, embodiments will be described with reference to the drawings. The embodiments described below do not limit the scope of the invention described in the claims. Further, the entire contents of the configurations shown in the following embodiments are not limited to those necessary as a solution of the invention described in the claims.

Referring to fig. 1 to 12, the present embodiment provides a substrate-reticle in-situ holding apparatus for high-density patterning, which includes a vacuum connection stage 1, a base 2, a substrate holder 3, and a reticle holder 4.

The vacuum connecting platform 1 is used for being connected to a moving platform below, and the moving platform below drives the vacuum connecting platform 1 to realize displacement. Be provided with first quick socket 11 and gas port 12 on vacuum connection platform 1, first quick socket 11 is used for being connected with the vacuum pump, and gas port 12 is located the up end of vacuum connection platform 1 and communicates with first quick socket 11 to the access through the vacuum pump can make gas port 12 position form vacuum adsorption. Specifically, the vacuum connection table 1 is set to be a disk type, the first quick socket 11 is disposed at one side of the vacuum connection table 1, and the air port 12 is located at the middle of the upper end surface of the vacuum connection table 1 and is communicated with the first quick socket 11 through an air passage inside the vacuum connection table 1.

In order to facilitate the connection between the vacuum connection table 1 and the lower moving platform, a plurality of counter bores are formed in the upper end surface of the vacuum connection table 1 and surround the periphery of the air port 12.

The middle part of the upper end face of the base 2 upwards protrudes to form a first boss 21, a first air hole 22 is arranged on the upper end face of the first boss 21, the first air hole 22 extends downwards and penetrates through the base 2, the base 2 is connected to the upper end face of the vacuum connecting table 1, so that the first air hole 22 is communicated with the air port 12, and when the vacuum connecting table 1 is connected with a vacuum pump, the position of the first air hole 22 at the first boss 21 can provide vacuum adsorption fixing effect on the substrate.

The substrate holder 3 is provided with a holding groove 31, a connecting hole 32 and a fastening member, wherein the holding groove 31 is provided at an upper end face of the substrate holder 3 for the substrate to be embedded; the connecting hole 32 is formed in the bottom of the holding groove 31 and penetrates through the substrate holder 3, the connecting hole 32 and the first boss 21 are consistent in size and shape, so that the first boss 21 extends into the connecting hole 32, the upper end face of the first boss 21 is coplanar with the bottom of the holding groove 31, and meanwhile, the substrate holder 3 is nested on the upper end face of the base 2, so that the base 2 and the substrate holder 3 are fixed; the fastening assembly is provided with a plurality of fastening members distributed on the periphery of the holding groove 31 for fixing the aligned substrate and mask plate so that the aligned substrate and mask plate are held on the substrate holder 3 for easy taking and handling.

In order to ensure the stability of the connection between the base 2 and the substrate holder 3, the first bosses 21 and the connection holes 32 are rectangular to prevent the substrate holder 3 from rotating relative to the base 2.

Moreover, the vacuum connection table 1, the base 2 and the substrate holder 3 are designed in a modularized way, so that the substrate and the mask plate can be conveniently matched and transferred between the alignment process and the film preparation process flow.

It should be noted that the substrate holder 3 can be designed to be of different sizes to match the base 2, thereby providing support for substrates of different sizes; the substrate holder 3 can be made of various metal or alloy materials to adapt to different film preparation processes; the substrate holder 3 and the base 2 together provide support for the substrate during the alignment operation, and after the alignment operation is finished, the substrate holder 3 can be separated from the base 2 to independently provide support for the substrate and the mask plate, and does not contain a vacuum gas path or other complex structures.

The mask holder 4 is provided with a hollowed hole and a cantilever 41, wherein the mask holder 4 is plate-shaped, and the hollowed hole is formed in the middle area, and the hollowed hole can be larger than the substrate and the mask, so that the substrate and the mask can be exposed through the hollowed hole, and the substrate and the mask can be conveniently fixed on the substrate holder 3 through a fastening assembly; the cantilever 41 extends to the middle of the hollow hole, specifically, the first end of the cantilever 41 is disposed on the mask holder 4, and the second end extends to the middle from the edge of the hollow hole, so that a hollow area is formed around the cantilever 41, and meanwhile, the substrate and the mask to be aligned can be observed through the CCD micro-imaging system in the alignment process.

The upper end face of the cantilever 41 is provided with a second quick socket 43 for connecting with a vacuum pump, wherein the upper end face of the cantilever 41 is provided with a screw hole, and the second quick socket 43 is screwed in the screw hole; the lower terminal surface of cantilever 41 is provided with second air hole 44, and second air hole 44 switches on with quick socket 43 of second, when quick socket 43 of second connects the vacuum pump, can form vacuum adsorption power in the position of second air hole 44, and then adsorbs fixedly to the mask slice.

Of course, in order to facilitate the alignment operation, the mask holder 4 needs to be fixed to the upper moving stage, and by moving the upper moving stage and the lower moving stage, the alignment of the substrate on the substrate holder 3 and the mask on the mask holder 4 is achieved.

In use, the substrate holder 3 is assembled to the base 2, the base 2 is attached to the vacuum attachment table 1 so that the first air vent 22 and the air port 12 are in conduction, and the vacuum attachment table 1 is fixed to the lower moving platform; placing the substrate in the holding groove 31 of the substrate holder 3, and adsorbing and fixing the substrate in the holding groove 31 of the substrate holder 3 by the adsorption action formed at the position of the first air hole 22 by the vacuum air path; placing the mask plate on the lower end of the mask plate holder 4, and enabling the mask plate to be adsorbed and fixed on the mask plate holder 4 through the adsorption action formed by the vacuum air path at the position of the second air hole 44; the alignment operation is realized by controlling the upper moving platform and the lower moving platform, the mask plate holder is lowered to enable the mask plate and the substrate to be mutually attached, and the substrate and the mask plate are fixedly arranged on the upper end surface of the substrate holder 3 through the fastening assembly; the substrate-reticle can be held and stored in situ by releasing the base 2 and the reticle holder 4 from the vacuum-clamped state by turning off the vacuum pump and removing the substrate holder 3. After the alignment operation is completed, the substrate-mask plate can be directly placed into a matched tray suitable for various film preparation devices together with the substrate holder 3 for film preparation without additional fixation, and the substrate-mask plate is suitable for various sample libraries or load-lock devices without influencing the taking and placing of samples, so that the preparation efficiency of the device can be greatly improved.

So set up, this device simple structure, the operation of being convenient for can keep substrate and mask plate fixed after the alignment operation, is favorable to realizing the high-efficient preparation of high density array structure thin film device to the quick transfer of sample between each technology of thin film device preparation.

In this embodiment, the up end of vacuum connection platform 1 is provided with second boss 14, correspondingly, lower terminal surface at base 2 is provided with connection socket 24, second boss 14 is unanimous with connection socket 24's big or small shape to make second boss 14 imbed fixedly to connecting socket 24 in, and then make base 2 pull out fast and insert on vacuum connection platform 1, can change not unidimensional base 2 conveniently, thereby provide support and vacuum adsorption for not unidimensional substrate. In particular, the second boss 14 and the connection socket 24 may be provided in a cylindrical shape. Here, the connection socket 24 and the first boss 21 are positioned so that the first air hole 22 penetrates the connection socket 24, and the air groove 13 is provided on the upper end surface of the second boss 14, and the plurality of air ports 12 are provided in the air groove 13, thereby facilitating communication between the first air hole 22 and the air ports 12.

In order to provide a uniform vacuum adsorption force, the upper end surface of the first boss 21 is provided with a first vacuum groove 23, and the first air holes 22 are provided with a plurality of air holes and distributed in the first vacuum groove 23, so that when a substrate is adsorbed, the substrate is adsorbed through the first vacuum groove 23, and the plurality of first air holes 22 are uniformly and stably stressed. Here, the first vacuum groove 23 has an X-shape, which contributes to enhancing the suction effect on the substrate.

In some embodiments, the substrate-reticle in-situ holding apparatus for high-density patterning further includes a frame-shaped connecting bracket 5, the reticle holder 4 is located in the middle of the connecting bracket 5 and is provided with a plurality of connecting rods 42 extending toward the connecting bracket 5, a slot 51 for embedding the connecting rod 42 is provided on the connecting bracket 5, and the connecting rod 42 is fixed in the slot 51, thereby fixing the reticle holder 4 and the connecting bracket 5. Specifically, the connecting bracket 5 has four square grooves formed in the lower surface and four through circular holes aligned with the centers of the grooves, and the reticle holder 4 is provided with four links 42 and can be fixed in the square grooves of the lower surface of the connecting bracket 5 by screws; meanwhile, the connecting bracket 5 is also provided with a through round hole formed on one side and used for being connected and fixed with the upper moving platform.

The cantilevers 41 of the mask plate holder 4 are symmetrically provided with two cantilevers, the first end of each cantilever 41 is fixed to the mask plate holder 4, the second end of each cantilever 41 is located in the middle of the corresponding hollowed-out hole and is provided with a second quick socket 43 and a second air hole 44, so that the hollowed-out holes in the middle of the mask plate holder 4 are in an I shape, in this way, the adsorption effect on the mask plates can be enhanced through the two groups of symmetrical second air holes 44, and meanwhile, the I-shaped hollowed-out holes simplify the vacuum adsorption fixing of the hollowed-out metal mask plates in the alignment process and the fixing operation of the hollowed-out metal mask plates and.

Wherein the reticle holder 4 is a square cross-shaped profile, and the four links 42 are located at four vertices of the reticle holder 4 and extend outward in a diagonal direction. Moreover, the two cantilevers 41 are provided at the apex position of the mask holder 4 and extend toward the middle in the diagonal direction, the structure is stable and symmetrical, and the processing is facilitated.

In order to provide a more uniform vacuum adsorption force, the lower end surface of the second end of the cantilever 41 is provided with a second vacuum groove 45, and the second air holes 44 are provided with a plurality of air holes and distributed in the second vacuum groove 45, so that when a mask plate is adsorbed, the mask plate is adsorbed through the second vacuum groove 45, and the plurality of second air holes 44 are uniformly and stably stressed.

In some embodiments, the fastening assembly includes a fastening plate 34 and a fastening screw 35, a plurality of fastening screw holes 33 are formed in the periphery of the retaining groove 31, one end of the fastening plate 34 is provided with a hole for the fastening screw 35 to pass through, when in use, the fastening screw 35 passes through the fastening plate 34 and is screwed in the fastening screw hole 33, so that one end of the fastening plate 34 is located at the position of the fastening screw hole 33, the other end of the fastening plate extends to the position of the retaining groove 31, and the substrate and the mask plate are further abutted by the fastening plate 34, which is simple in structure, convenient and reliable.

As shown in fig. 11 to 12, the fastening tab 34 is a rigid tab or an elastic tab, and the fastening tab 34 can be selected according to different rigid or flexible substrates, and can be widely applied to various rigid and flexible substrate materials; moreover, the fastening pieces 34 are distributively provided as the elastic pieces and the rigid pieces, so that the warping of the metal mask plate during the fixing process is suppressed.

It should be noted that the substrate holder 3 is provided with a plurality of fastening screw holes 33, and the number of fastening pieces 34 can be selected according to the substrate with different rigidity or flexibility.

In some embodiments, the substrate-mask plate in-situ holding apparatus for high-density patterning process further includes a sample tray 6, wherein the sample tray 6 is provided with a plurality of carrying grooves 61 on an upper end surface thereof for the substrate holder 3 to be inserted, wherein a surface of the substrate holder 3 having the holding grooves 31 faces the carrying grooves 61, and the bottom of the carrying grooves 61 is provided with carrying holes 62, and the carrying holes 62 can expose the holding grooves 31 of the substrate holder 3 and the fastening assemblies, so that the portions of the substrate-mask plate requiring the preparation of the thin film are completely exposed for the preparation. Further, a spring fixing piece is attached to the upper end face of the sample tray 6 so that the substrate holder 3 can be fixed after being fitted into the sample tray 6.

Wherein the depth of the bearing groove 61 is consistent with the thickness of the substrate mask plate, so that the substrate holder 3 can not shield the sample from being heated after being embedded in the sample tray 6.

It should be noted that the substrate holder 3 has a thickness of 1-2mm and can be adapted to the sample tray 6 of a variety of thin film preparation devices; the substrate holder 3 is a frame body with an opening in the middle, and when the frame body is assembled on the sample tray 6 for thin film preparation, the substrate can be directly heated by a heat source through heat radiation, so that the heating condition of the substrate is improved.

The substrate-mask in-situ holding apparatus for high-density patterning will be described in detail with reference to the above embodiments.

The vacuum connection table 1, the base 2 and the substrate holder 3 are designed in a modularized way, so that the substrate and the mask plate are portable, adaptive and transferable between the alignment process and the film preparation process flow;

the I-shaped hollow hole in the middle of the mask plate holder 4 simplifies the vacuum adsorption fixation of the hollow metal mask plate and the fixation operation of the hollow metal mask plate and the substrate in the alignment process;

by distributively providing the fastening pieces 34 as the elastic pieces and the rigid pieces, suppression of warping in the fixing process of the metal mask plate is achieved.

It should be noted that the terms "first," "second," and the like, as used herein, are not intended to limit the specific order, but merely to distinguish one element or function from another. The terms "horizontal", "vertical", "up", "down", "left" and "right" are used when the substrate-mask in-situ holding apparatus for high-density patterning is in the state of being laid as shown in fig. 1.

The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

It is understood that the same or similar parts in the above embodiments may be mutually referred to, and the same or similar parts in other embodiments may be referred to for the content which is not described in detail in some embodiments. The multiple schemes provided by the application comprise basic schemes of the schemes, are independent of each other and are not restricted to each other, but can be combined with each other under the condition of no conflict, so that multiple effects are achieved together.

While embodiments of the present application have been shown and described above, it is to be understood that the above embodiments are exemplary and not to be construed as limiting the present application, and that changes, modifications, substitutions and alterations may be made to the above embodiments by those of ordinary skill in the art within the scope of the present application.

Claims

1. A substrate-mask plate in-situ holding device for high-density patterning is characterized by comprising:

the vacuum connection platform (1) is provided with a first quick socket (11) used for being connected with a vacuum pump and a gas port (12) which is positioned on the upper end face and communicated with the first quick socket (11);

the upper end surface of the base (2) is provided with a first boss (21) and a first air hole (22) which is positioned on the first boss (21) and penetrates through the base (2), the base (2) is connected to the upper end surface of the vacuum connecting table (1), and the first air hole (22) is communicated with the air port (12);

the substrate holder (3) is provided with a holding groove (31) which is positioned on the upper end surface and is used for embedding a substrate, a connecting hole (32) which is positioned at the groove bottom of the holding groove (31) and penetrates through the substrate holder (3) and is used for embedding the first boss (21), and a fastening assembly which is positioned at the periphery of the holding groove (31) and is used for fixing the substrate and a mask plate;

the mask plate holder (4) is provided with a hollow hole penetrating through the mask plate holder (4) and a cantilever (41) located in the middle of the hollow hole, a second quick socket (43) used for being connected with a vacuum pump is arranged on the upper end face of the cantilever (41), and a second air hole (44) communicated with the second quick socket (43) and used for adsorbing a mask plate is arranged on the lower end face of the cantilever.

2. The substrate-mask in-situ holding apparatus for high-density patterning according to claim 1, wherein an upper end surface of the vacuum connection stage (1) is provided with a second boss (14), a lower end surface of the base (2) is provided with a connection socket (24) for the second boss (14) to be inserted into and connected with, and the first air hole (22) penetrates through the connection socket (24).

3. The substrate-mask in-situ holding apparatus for high-density patterning according to claim 1, wherein the first bosses (21) are provided at upper end surfaces thereof with first vacuum grooves (23), and the first air holes (22) are provided in plurality and distributed in the first vacuum grooves (23).

4. The substrate-mask in-situ holding apparatus for high-density patterning according to claim 1, further comprising a frame-shaped connecting bracket (5), wherein the mask holder (4) is located at a middle portion of the connecting bracket (5) and is provided with a plurality of connecting rods (42) extending toward the connecting bracket (5), and the connecting bracket (5) is provided with a clamping groove (51) for the connecting rods (42) to be embedded in.

5. The substrate-reticle in-situ holding apparatus for high density patterning according to claim 1, wherein the cantilevers (41) are symmetrically arranged in two, and a first end of the cantilever (41) is fixed to the reticle holder (4) and a second end is located in the middle of the hollow hole and is provided with the second quick socket (43) and the second air hole (44).

6. The substrate-mask in-situ holding apparatus for high-density patterning according to claim 5, wherein the lower end surface of the second end of the cantilever (41) is provided with a second vacuum groove (45), and the second air holes (44) are provided in plurality and distributed in the second vacuum groove (45).

7. The substrate-mask in-situ holding apparatus for high-density patterning according to claim 1, wherein the fastening assembly comprises a fastening plate (34) and a fastening screw (35), a plurality of fastening screw holes (33) are formed in the outer periphery of the holding groove (31), and the fastening screw (35) penetrates through the fastening plate (34) and is screwed into the fastening screw hole (33).

8. The substrate-mask blank in-situ holding apparatus for high-density patterning according to claim 7, wherein the fastening tab (34) is provided as a rigid tab or an elastic tab.

9. The substrate-mask in-situ holding apparatus for high-density patterning according to claim 1, further comprising a sample tray (6), wherein the sample tray (6) is provided at an upper end thereof with a plurality of carrying grooves (61) for the substrate holder (3) to be inserted into, the bottom of the carrying grooves (61) is provided with carrying holes (62) for exposing the substrate and the mask, and the outer circumference of the carrying grooves (61) is provided with spring fixing pieces for fixing the substrate holder (3).

10. The substrate-mask in-situ holding apparatus for high-density patterning according to claim 9, wherein a depth of the carrying groove (61) coincides with a thickness of the substrate holder (3).