CN212933453U

CN212933453U - Radiating fin component

Info

Publication number: CN212933453U
Application number: CN202022447184.XU
Authority: CN
Inventors: 李启明; 周华军
Original assignee: Chuyue Huizhou Heat Transfer Technology Co ltd
Current assignee: Chuyue Huizhou Heat Transfer Technology Co ltd
Priority date: 2020-10-29
Filing date: 2020-10-29
Publication date: 2021-04-09
Anticipated expiration: 2030-10-29

Abstract

The utility model relates to a computer heat dissipation technical field just discloses a cooling fin assembly, including the fin body, the fin body is including settling the fin group piece in inside, be located the casing of fin group piece top surface and settle the radiator fan in fin group piece bottom surface, radiator fan is including settling the braced frame in the bottom surface and seting up the fixed orifices at the frame top surface. This heat sink component, through in heat sink body bottom with radiator fan device, and radiator fan periphery settles there is the frame, and the frame is fixed with radiator fan, prevents to harm the effect of chip or mainboard, because the fan is that directly press close to the mainboard and install with the chip position, the opening has been seted up to the side of casing, and the skin weld of opening has the siphunculus, the siphunculus can directly lead away the heat, even do not have fundamentally cooling, also can directly transport away the effect of heat.

Description

Radiating fin component

Technical Field

The utility model relates to a computer heat dissipation technical field specifically is a fin subassembly.

Background

The existing notebook computer has small volume, convenient movement and carrying, and is more and more widely applied in daily study, work and life, compared with a desktop computer, the heat generated by heat source components such as a CPU, a display card, a memory bank, a hard disk and the like in the internal space of the notebook computer is narrow, if the heat cannot be timely dissipated, the normal use of the notebook computer can be seriously influenced by high temperature, even the components can be burnt to generate larger loss, at present, the heat dissipation of the notebook computer generally takes a metal material with excellent heat conduction performance as a heat conduction carrier, one end of the heat conduction carrier is tightly attached to the heat source components with larger heat productivity such as the CPU, the display card and the like, the other end of the heat conduction carrier is connected with a plurality of sheet metal radiating fins on the side surface of the notebook computer, the heat generated by the heat source components such as the CPU, the display card and the like is transmitted to the radiating fins through the heat conduction carrier, a fan arranged, the radiating purpose of the notebook computer is achieved, but the radiating fin area is not large enough due to the restriction of narrow space on the side surface of the notebook computer, so that the radiating fin area in the inner cavity of the notebook computer is insufficient.

Therefore, people blow more air into the inner cavity from the air inlet on the bottom surface of the notebook computer by means of the external fan to improve the heat dissipation of the notebook computer, and the heat dissipation effect of the notebook computer is improved to a certain extent.

Disclosure of Invention

Technical problem to be solved

Not enough to prior art, the utility model provides a heat sink component possesses just dispel the heat to inside chip or mainboard, utilizes advantages such as thermal radiating mode of discharging away, has solved above-mentioned technical problem.

(II) technical scheme

In order to achieve the above object, the utility model provides a following technical scheme: a kind of air-cooling fin assembly, including the body of the air-cooling fin, the said air-cooling fin body includes the air-cooling fin group piece placed inside, locate the body of the top surface of the air-cooling fin group piece and position the heat-dissipating fan in the bottom surface of the air-cooling fin group piece;

the radiating fin assembly comprises a vertical plate vertically arranged on the top surface of the radiating fin assembly and a through hole arranged on the bottom surface of the radiating fin assembly, and the vertical plate comprises a clamping block and a filtering cooling plate which are arranged at two ends;

the shell comprises a through hole formed in the side surface, a through pipe fixedly connected with the through hole and a connecting block arranged on the bottom surface of the shell;

the heat radiation fan comprises a support frame arranged on the bottom surface and a fixing hole arranged on the top surface of the support frame.

Preferably, the heat sink fins are arranged inside the heat sink body, the shell is fixedly connected with the top surface of the heat sink fan above the heat sink fins, and the heat sink fan is arranged on the bottom surface of the heat sink body.

Through the technical scheme, the heat dissipation fin group piece comprises a plurality of single heat dissipation fins, can lead away the heat from the heat dissipation fin group piece, then the through-pipe leads to far away again, keep away from the mainboard of doing office, play the effect of the life-span of a protection owner, utilize the casing to concentrate the heat and collect then carry the mainboard with the heat from opening and siphunculus with the heat, settle radiator fan in radiator body bottom surface, radiator fan connects the mainboard, will open radiator fan when the mainboard functions, when the mainboard outage, inside radiator fan will cut off the power supply, be not operating, can play and dispel the heat to the mainboard, will stop radiating effect when inoperative, and be the connected mode of successive basic power off switch.

Preferably, the vertical plates are vertically arranged on the top surfaces of the radiating fins, the number of the vertical plates is five, the ventilation openings are formed in the top surfaces of the radiating fins, and the number of the ventilation openings is multiple.

Through above-mentioned technical scheme, the perpendicular installation of riser can fall into a plurality of regions with the fin group piece, can pass through the mode heat dissipation that the macrostoma changes the osculum with the heat, can form the effect that sprays the heat, reaches quick radiating effect, and riser quantity is five, and last riser is reverse arrangement, and the vent is seted up at fin group piece top surface, then a plurality of rectangular channels have been seted up at the top, can be convenient for and the fixed effect of plug-in type between the riser.

Preferably, the clamping blocks are arranged on the bottom surface of the vertical plate, the number of the clamping blocks is two, and the filtering and cooling plate is arranged inside the vertical plate.

Through above-mentioned technical scheme, the joint piece is settled at the both ends of riser bottom surface, and with the mutual joint of rectangular channel of fin group piece top surface, can reach the effect of joint with the riser, filters the cooling board and be current simple filter, can filter the dust with the impurity in the air, prevents the dust to the damage of mainboard, reduces the life who hosts.

Preferably, the opening is opened on the casing left side, the opening is the rectangle form, siphunculus fixed welding is at the opening.

Through above-mentioned technical scheme, the opening of a rectangle is seted up on the casing left side, is the welding between opening and the siphunculus, can carry far away through the siphunculus by the heat, also can play radiating effect to mainboard and chip.

Preferably, the frame is arranged at the periphery of the heat radiation fan, and the fixing hole is formed in the top surface of the frame.

Through above-mentioned technical scheme, radiator fan installs the frame in the periphery, and the arrangement of frame top has the backup pad of cross form, can fix radiator fan and settle at the center, and the frame is the effect that can carry out the connection with the casing of fin body top surface, utilizes the gim peg to set up the fixed effect of rotatory screwing up of fixed orifices with the frame top surface.

Compared with the prior art, the utility model provides a cooling fin component possesses following beneficial effect:

1. the radiating fin component is characterized in that the radiating fan is arranged at the bottom of the radiating fin body, the frame is arranged on the periphery of the radiating fan, the radiating fan is fixed by the frame, the chip or the mainboard is prevented from being damaged, and the fan is directly mounted close to the position of the mainboard and the position of the chip, so that the targeted radiating effect is achieved.

2. This fin subassembly, through settle at the peripheral top of fin body has the casing, the opening has been seted up to the side of casing, and the skin weld of opening has the siphunculus, and the siphunculus can directly lead away the heat, even do not have fundamentally cooling, also can directly transport away the effect of heat.

Drawings

FIG. 1 is a schematic view of the present invention showing a split structure;

FIG. 2 is a schematic view of the structure of the present invention;

fig. 3 is a schematic view of the structure of the present invention.

Wherein: 1. a heat sink body; 2. assembling the radiating fins; 3. a housing; 4. a heat radiation fan; 201. a vertical plate; 202. a through hole; 2011. a clamping block; 2012. a filtering cooling plate; 301. a port; 302. pipe passing; 303. connecting blocks; 401. a frame; 402. and (7) fixing holes.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, a heat sink assembly includes a heat sink body 1, the heat sink body 1 includes a heat sink assembly 2 disposed inside, a housing 3 disposed on a top surface of the heat sink assembly 2, and a heat sink fan 4 disposed on a bottom surface of the heat sink assembly 2;

the radiating fin group 2 comprises a vertical plate 201 vertically arranged on the top surface of the radiating fin group 2 and a through hole 202 arranged on the bottom surface of the radiating fin group 2, and the vertical plate 201 comprises a clamping block 2011 and a filtering cooling plate 2012 which are arranged at two ends;

the shell 3 comprises a through hole 301 arranged on the side surface, a through pipe 302 fixedly connected with the through hole 301, and a connecting block 303 arranged on the bottom surface of the shell 3;

the heat radiating fan 4 includes a support frame 401 disposed on a bottom surface and a fixing hole 402 opened on a top surface of the frame 401.

Specifically, the heat sink fins 2 are arranged inside the heat sink body 1, the housing 3 is fixedly connected with the top surface of the heat sink fan 4 above the heat sink fins 2, and the heat sink fan 4 is arranged on the bottom surface of the heat sink body 1. the advantage is that the heat sink fins 2 are composed of a plurality of single heat sinks, which can conduct heat away from the heat sink fins 2 and then conduct heat to a far place through the pipe 302 away from the host motherboard, thereby protecting the service life of the host motherboard, the housing 3 is utilized to collect the heat in a concentrated manner and then transport the heat to the far place from the motherboard from the through hole 301 and the pipe 302, the heat sink fan 4 is arranged on the bottom surface of the heat sink body 1, the heat sink fan 4 is connected with the motherboard, the heat sink fan 4 is turned on when the motherboard is in operation, when the motherboard is in power off, the heat sink fan 4 inside is powered off and is not in operation, thereby playing a role of, and is the connection mode of the successive basic power-off switches.

Specifically, riser 201 is settled perpendicularly at 2 top surfaces of fin group piece, riser 201 quantity is five, opening hole 202 is seted up at 2 top surfaces of fin group piece, opening hole 202 quantity is a plurality ofly, the advantage is that riser 201 is installed perpendicularly can fall into a plurality of regions with fin group piece 2, can pass through the mode heat dissipation that the macrostoma changes the osculum with the heat, can form the thermal effect of injection, reach quick radiating effect, and riser 201 quantity is five, last riser 201 is reverse settlement, opening hole 202 is seted up at 2 top surfaces of fin group piece, then a plurality of rectangular channels have been seted up at the top, can be convenient for and the fixed effect of plug-in type between the riser 201.

Specifically, joint piece 2011 is settled in riser 201 bottom surface, joint piece 2011 quantity is two, it settles inside riser 201 to filter cooling board 2012, the advantage is that joint piece 2011 settles at the both ends of riser 201 bottom surface, and with the mutual joint of rectangular channel of 2 top surfaces of fin group piece, can reach the effect of joint with riser 201, it is current simple filter to filter cooling board 2012, can filter dust and the impurity in the air, prevent the damage of dust to the mainboard, reduce the life who hosts.

Specifically, opening 301 sets up on the left side of casing 3, and opening 301 is the rectangle form, and the fixed welding of siphunculus 302 is at opening 301, and the advantage is that the opening 301 of a rectangle is seted up on the left side of casing 3, is the welding between opening 301 and the siphunculus 302, can carry far away through siphunculus 302 by the heat, also can play radiating effect to mainboard and chip.

Specifically, frame 401 is settled in radiator fan 4 periphery, and fixed orifices 402 are seted up at frame 401 top surface, and the advantage is that frame 401 is installed to radiator fan 4 periphery, and frame 401 top is settled there is the backup pad of cross form, can fix radiator fan 4 and settle at the center, and frame 401 is the effect that can be connected with the casing 3 of fin body 1 top surface, utilizes the gim peg to set up the fixed effect of rotatory screw up of fixed orifices 402 with frame 401 top surface.

When the heat radiating fin body 1 is used, the shell 3 is sleeved on the top surface of the heat radiating fin group piece 2, then the fixing holes 402 on the top surface of the framework 401 of the heat radiating fan 4 and the fixing bolts on the top surface of the connecting block 303 are screwed in a rotating mode to be installed, and then the heat radiating fin body 1 is fixed and pressed at a place needing cooling and heat radiating.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A heat sink assembly comprising a heat sink body (1), characterized in that: the radiating fin body (1) comprises a radiating fin group piece (2) arranged inside, a shell (3) positioned on the top surface of the radiating fin group piece (2) and a radiating fan (4) arranged on the bottom surface of the radiating fin group piece (2);

the radiating fin group piece (2) comprises a vertical plate (201) vertically arranged on the top surface of the radiating fin group piece (2) and a through hole (202) formed in the bottom surface of the radiating fin group piece (2), and the vertical plate (201) comprises a clamping block (2011) and a filtering and cooling plate (2012) which are arranged at two ends;

the shell (3) comprises a through hole (301) formed in the side surface, a through pipe (302) fixedly connected with the through hole (301), and a connecting block (303) arranged on the bottom surface of the shell (3);

the heat radiation fan (4) comprises a support frame (401) arranged on the bottom surface and a fixing hole (402) arranged on the top surface of the frame (401).

2. A heat sink assembly as recited in claim 1, wherein: the radiating fin group piece (2) is arranged inside the radiating fin body (1), the shell (3) is fixedly connected with the top surface of a radiating fan (4) positioned above the radiating fin group piece (2), and the radiating fan (4) is positioned on the bottom surface of the radiating fin body (1).

3. A heat sink assembly as recited in claim 1, wherein: the vertical plates (201) are vertically arranged on the top surfaces of the radiating fin groups (2), the number of the vertical plates (201) is five, the through holes (202) are formed in the top surfaces of the radiating fin groups (2), and the number of the through holes (202) is multiple.

4. A heat sink assembly as recited in claim 1, wherein: the joint piece (2011) is arranged on the bottom surface of the vertical plate (201), the number of the joint pieces (2011) is two, and the filtering and cooling plate (2012) is arranged inside the vertical plate (201).

5. A heat sink assembly as recited in claim 1, wherein: opening (301) are seted up on casing (3) left side, opening (301) are the rectangle form, siphunculus (302) fixed welding is at opening (301).

6. A heat sink assembly as recited in claim 1, wherein: the frame (401) is arranged at the periphery of the heat radiation fan (4), and the fixing hole (402) is formed in the top surface of the frame (401).