CN212916641U

CN212916641U - Pressure sensor chip test system

Info

Publication number: CN212916641U
Application number: CN202021300991.2U
Authority: CN
Inventors: 程运栋; 朱兆喜
Original assignee: Wuxi Suntan Technology Co ltd
Current assignee: Wuxi Suntan Technology Co ltd
Priority date: 2020-07-06
Filing date: 2020-07-06
Publication date: 2021-04-09
Anticipated expiration: 2030-07-06

Abstract

The utility model discloses a pressure sensor chip test system, amplify measuring module, DAC operation and enlarge unit module and survey test panel including data processing unit module, power module able to programme, sorter communication module, small signal, power module able to programme with survey test panel electric connection, sorter communication module's signal input part is connected with the signal output part who surveys test panel, the signal output part who surveys test panel has connected gradually small signal and has amplified measuring module and DAC operation and enlarge unit module to be connected with the signal input part electricity of data processing unit module. The utility model discloses in, simplified communication mode and digital communication interface, through a large amount of test data of the inside automatic handling of test system, product test time is shortened to very big degree, improves product production efficiency, need not survey test panel and carry out frequent communication with the PC computer, and data processing unit module handles all intermediate processes, finally transmits for the PC computer realizes data preservation and visual operation.

Description

Pressure sensor chip test system

Technical Field

The utility model relates to a testing arrangement field specifically is a pressure sensor chip test system.

Background

The types of Automatic Test Equipment (ATE) are mainly classified according to the product categories, such as power device testers, digital chip testers, analog chip testers, digital-analog hybrid chip testers, and the like, and the analog chip testers are most widely used in production. At present, a common implementation scheme of a chip test scheme is to purchase automatic test equipment and develop a test scheme of a corresponding product under a platform of the automatic test equipment.

The pressure sensor chip has high requirements on the stability of a power supply and the measurement accuracy of weak signals, the common-mode voltage is high, differential-mode signals are small, and a special signal processing unit is required for carrying out electric signal conversion.

The existing automatic test equipment has large measurement range, and the measurement error of signals below mV is far larger than a small signal output by a pressure sensor, so that the test requirement cannot be finished; when the data communication is carried out with the test chip, a digital interface board is required to be added independently, and the control signal at the end of the tester is complex; the communication data transmission time between the equipment and the hardware is long, and for a chip with a large amount of test data interaction, the test time is long, the production efficiency is low, and the test cost is increased.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a pressure sensor chip test system to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

the utility model provides a pressure sensor chip test system, includes data processing unit module, programmable power module, sorter communication module, small signal amplification measuring module, DAC operation amplification unit module and surveys test panel, programmable power module with survey test panel electric connection, sorter communication module's signal input part is connected with the signal output part who surveys test panel, the signal output part who surveys the test panel has connected gradually small signal amplification measuring module and DAC operation amplification unit module to be connected with the signal input part electricity of data processing unit module, programmable power module's signal input part and the signal output part electricity of data processing unit module are connected.

Furthermore, the data processing unit module is a single chip microcomputer.

Furthermore, the signal output end of the separator communication module is electrically connected with an external separation device.

Further, the test board is a multilayer PCB.

Further, the common-mode signal capable of being processed by the small-signal amplification measuring module is 0V-80V.

Further, the data processing unit module is electrically connected with an external sorting device through a transmission cable.

Compared with the prior art, the beneficial effects of the utility model are that:

the utility model discloses in, simplified communication mode and digital communication interface, through a large amount of test data of the inside automatic handling of test system, product test time is shortened to very big degree, improves product production efficiency.

The test board is not required to be frequently communicated with the PC computer, and the data processing unit module processes all intermediate processes and finally transmits the intermediate processes to the PC computer to realize data storage and visual operation.

The programmable power supply module is used for providing a stable programmable power supply required by the tested chip so as to meet the power supply requirements of testing different chips.

The small-signal amplification measurement module can stably amplify the mV or even the uV signal on the 0V-80V common-mode signal without distortion so as to ensure the test requirement of the pressure sensor.

Drawings

FIG. 1 is a schematic diagram of a pressure sensor chip test system;

FIG. 2 is a schematic diagram of a data processing unit module in a pressure sensor chip test system;

FIG. 3 is a schematic diagram of a programmable power module in a pressure sensor chip test system;

FIG. 4 is a schematic diagram of a sorter communication module in a pressure sensor chip testing system;

FIG. 5 is a schematic diagram of a small signal amplification measurement module in a pressure sensor chip test system;

fig. 6 is a schematic diagram of a DAC operation amplifying unit module in a pressure sensor chip testing system.

In the figure: 1. a data processing unit module; 2. a programmable power module; 3. a sorter communication module; 4. a small signal amplification measuring module; 5. a DAC operation amplifying unit module; 6. and (6) testing the board.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution:

the utility model provides a pressure sensor chip test system, including data processing unit module 1, programmable power module 2, sorter communication module 3, the small-signal amplifies measuring module 4, DAC operation amplification unit module 5 and survey test panel 6, programmable power module 2 and survey test panel 6 electric connection, sorter communication module 3's signal input part is connected with the signal output part who surveys test panel 6, survey test panel 6's signal output part and has connected gradually small-signal amplifies measuring module 4 and DAC operation amplification unit module 5, and be connected with data processing unit module 1's signal input part electricity, programmable power module 2's signal input part and data processing unit module 1's signal output part electricity are connected.

The data processing unit module 1 can be a single chip microcomputer and is used for processing data operation, processing data signals input by the DAC operation amplification unit module 5 and adjusting the voltage and current output by the programmable power supply module 2 according to test requirements.

Meanwhile, the test board 6 does not need to be frequently communicated with a PC (personal computer) (shown as a in the figure), and the data processing unit module 1 processes all intermediate processes and finally transmits the intermediate processes to the PC to realize data storage and visual operation.

The programmable power supply module 2 is used for providing a stable programmable power supply required by the tested chip so as to meet the power supply requirements of testing different chips.

The signal output end of the sorter communication module 3 is electrically connected with an external sorting device (as shown in a b) and used for sending signals to the sorting device, so that the sorting device can accurately and timely complete the functions of feeding, testing, discharging and the like, and batch testing is realized.

The action of the sorting device mainly generates a signal according to a chip to be tested (as shown in a figure c), and the signal is received by the communication module 3 of the sorting machine, so that the action of the sorting device is controlled, meanwhile, the data processing unit module 1 is electrically connected with an external sorting device through a transmission cable, the sorting device can be regulated and controlled through the data processing unit module 1, and parameters with low testing requirements are obtained.

The test board 6 is a multilayer PCB board to meet the test requirements of the chip to be tested, and meanwhile, the test board 6 is connected with the data processing unit module 1 and the sorter communication module 3 (namely, connected with the sorting device), so that the cooperative work is realized, and the test task of the chip is completed.

The small-signal amplification measurement module 4 can stably amplify the mV or even the uV signal on the 0V-80V common-mode signal without distortion so as to ensure the test requirement of the pressure sensor.

According to the technical scheme, the communication mode and the digital communication interface (the control operation unit is provided with the digital communication interface) are simplified, a large amount of test data are automatically processed in the test system, the product test time is greatly shortened, and the product production efficiency is improved.

During detection, the chip to be tested is transported through the sorting device and is connected with the test board 6 in the transportation process to be tested, and the sorting device sends the chip to be tested to the next procedure or a scrapped part according to the test result to complete the functions of loading, testing, unloading and the like.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a pressure sensor chip test system, includes data processing unit module (1), programmable power module (2), sorter communication module (3), small-signal amplification measuring module (4), DAC operation amplification unit module (5) and survey test panel (6), its characterized in that: the programmable power supply module (2) is electrically connected with the test board (6), the signal input end of the sorter communication module (3) is connected with the signal output end of the test board (6), the signal output end of the test board (6) is sequentially connected with the small-signal amplification measuring module (4) and the DAC operation amplification unit module (5) and is electrically connected with the signal input end of the data processing unit module (1), and the signal input end of the programmable power supply module (2) is electrically connected with the signal output end of the data processing unit module (1).

2. The pressure sensor die test system of claim 1, wherein: the data processing unit module (1) comprises a single chip microcomputer.

3. The pressure sensor die test system of claim 1, wherein: and the signal output end of the separator communication module (3) is electrically connected with an external separation device.

4. The pressure sensor die test system of claim 1, wherein: the test board (6) is a PCB with a multilayer structure.

5. The pressure sensor die test system of claim 1, wherein: the common-mode signal which can be processed by the small-signal amplification measuring module (4) is 0-80V.

6. The pressure sensor chip test system of claim 3, wherein: the data processing unit module (1) is electrically connected with an external sorting device through a transmission cable.