CN212907129U - Conductive film - Google Patents

Abstract

The invention discloses a conductive film, which comprises a plurality of conductive layers, wherein the conductive layers are arranged in a stacked manner and comprise a bearing body and a conductive circuit arranged on the bearing body; a plurality of conductive posts, the conductive posts penetrating the carrier; the plurality of conductive points are distributed on one side of the bearing body, on which the conductive circuit is arranged; the conductive points are electrically connected with the conductive circuit and the conductive columns, and the conductive layers which are stacked are electrically connected through the conductive columns. The conducting posts can lead the lead of one conducting layer to the other conducting layer, and can realize the electrical connection between two or more conducting layers, so that the conducting film is not limited by the area of the lead area, a narrow frame is realized, and the wiring is convenient.

Description

Conductive film

PRIORITY INFORMATION

This application claims priority and benefit to a patent application entitled "conductive film" with patent application number 201911038970.X filed on 29/10/2019 from the chinese intellectual property office and is incorporated herein by reference in its entirety.

Technical Field

The invention relates to the technical field of electronics, in particular to a conductive film.

Background

The conductive film is widely used in the fields of liquid crystal displays, OLED displays, touch panels, electromagnetic wave protection, solar cells, heat generating devices, light emitting devices, and the like. A conventional conductive film has a conductive layer, which generally includes an insulating carrier and a conductive structure disposed on the carrier, and the conductive structure generally includes a functional region and a lead region. The functional area is generally positioned in the middle area of the conductive layer, and functions such as touch control, shielding, heating and the like are realized; the lead regions are generally located at two side regions of the conductive layer, and the functional regions are electrically connected to other layers or a circuit board or the like through the lead regions. However, in some cases, for example, narrow frame requirements of touch control, or when multiple conductive layers are used, lead regions are required for the lower layer and also required to be set aside for lead regions of the upper layer, so that the lead regions are not provided with enough regions, and the functional regions are also limited, thereby resulting in poor adaptability of the conductive layers.

Disclosure of Invention

Based on this, it is necessary to provide a conductive film to solve the above technical problems.

The technical scheme of the invention is as follows:

a conductive film, comprising:

n layers of conducting layers are arranged in a stacked mode, each conducting layer comprises a bearing body and conducting circuits arranged on the bearing bodies, and N is larger than or equal to 2;

and the conductive column at least penetrates through one conductive layer and is electrically connected with the conductive circuits of at least two conductive layers.

In one embodiment, the carrier has a first side surface, wherein the first side surface is concavely provided with mutually communicated latticed grooves, and conductive materials are filled in the latticed grooves to form the latticed conductive lines; the conductive column comprises a through hole and a conductive material filled in the through hole.

In one embodiment, the conductive film includes a plurality of conductive pillars randomly distributed in the conductive trace; and/or the plurality of conductive columns are dispersed in the conductive circuit, and the distribution quantity of the conductive columns in unit area is not different by more than 10%.

In one embodiment, the conductive posts are electrically connected to the conductive traces of the N conductive layers.

In one embodiment, the through holes penetrate through the carrier and the conductive circuit of each conductive layer in a direction perpendicular to the first side surface, and the conductive material in the grid-shaped grooves is exposed to the through holes and electrically connected with the conductive layer material in the through holes.

In one embodiment, in the direction perpendicular to the first side face, the contact amount of the conductive material in the grid-shaped grooves and the conductive material in the through holes is 1-20 μm.

In one embodiment, the conductive lines are in a grid shape, and the width of the conductive columns is larger than the maximum spacing width between the grids of the conductive lines.

In one embodiment, the conductive posts are electrically connected to at least 3 grid lines of the conductive grid of the conductive layer.

In one embodiment, the width of the conductive pillar is in the range of 10 μm to 200 μm.

In one embodiment, a groove is formed in one side of the supporting body of one of the conductive layers, a conductive material located at the bottom of the groove and an insulating colored material located at the notch are filled in the groove, and the conductive column includes a through hole penetrating through the supporting body and communicating with the groove and a conductive circuit filled in the through hole and electrically connected with the conductive material in the groove and the other conductive layer.

In one embodiment, the grooves are arranged at intervals, the interval width gradually changes from small to large in the arrangement direction, and the conductive posts are arranged on one side with smaller intervals.

In one embodiment, the grooves are arranged at intervals, the conductive posts are arranged at the positions where the grooves with the interval width of 5 μm to 7 μm are distributed, and the width range of the conductive posts is 10 μm to 20 μm.

In one embodiment, the conductive film further includes a base layer, N conductive layers are distributed on the same side or two sides of the base layer, and the conductive posts may or may not penetrate through the base layer.

In one embodiment, the conductive film further includes a conductive point disposed in cooperation with the conductive pillar and electrically connected to the conductive trace and the conductive pillar.

In one embodiment, the conductive dots cover the conductive traces and the conductive posts; or, the conductive point covers the conductive circuit, and the conductive column penetrates through the conductive point.

In one embodiment, a plurality of conductive points are respectively disposed on the conductive traces of at least two of the conductive layers, the conductive points of each conductive layer are disposed in a one-to-one correspondence manner in a direction perpendicular to the conductive layer, and the conductive posts are connected in series with the conductive points of each conductive layer.

In one embodiment, the width of the conductive dots is greater than the width of the conductive pillars.

In one embodiment, the conductive lines are arranged at intervals, and the width of the conductive points is larger than the width of the maximum interval of the conductive lines.

In one embodiment, the conductive lines are in a grid shape, and the conductive points cover at least three grid lines.

In one embodiment, the conductive dots have a thickness in the range of 10nm to 10 μm and a width in the range of 50 μm to 300 μm.

The other scheme is as follows: a conductive film, comprising:

the first conducting layer comprises a first bearing body and a first conducting circuit arranged on the first bearing body;

the second conducting layer is laminated with the first conducting layer and comprises a second bearing body and a second conducting circuit arranged on the second bearing body;

a plurality of conductive posts penetrating the first conductive layer and/or the second conductive layer;

the plurality of conductive points are arranged on the first conductive layer and/or the second conductive layer in a covering mode;

the first conductive layer and the second conductive layer are electrically connected through the conductive posts and the conductive points.

In one embodiment, the conductive point is electrically connected to the first conductive trace or the second conductive trace, and the conductive pillar is electrically connected to the conductive point; or, the conductive column is electrically connected with the conductive point, the first conductive circuit and the second conductive circuit.

In one embodiment, the first conductive circuit is a conductive grid, the second conductive circuit is a conductive grid, and the width of the conductive point is greater than the distance of the maximum diagonal of the conductive grid.

In one embodiment, the conductive dots cover at least the grid lines of 3 conductive grids.

In one embodiment, the conductive dots cover the conductive posts and the conductive mesh.

In one embodiment, the conductive pillar covers the conductive point of the first conductive trace in a penetrating manner, and/or the conductive pillar covers the conductive point of the second conductive trace in a penetrating manner.

The invention has the beneficial effects that:

(1) the through-hole and the conductive column are arranged to lead the conductive circuit on one layer to the other layer, so that the arrangement of the conductive circuit on the conductive layer is facilitated, the narrow frame is realized, the space utilization rate is improved, and the conductive performance is improved.

(2) The plurality of conductive posts are arranged at intervals, so that the resistance of each conductive layer can be reduced, and the shielding efficiency, the heating efficiency and the like are improved.

(3) Through the matching arrangement of the conductive points and the conductive columns, the electric connection can be ensured, and the stability is improved.

(4) The decorative structure and the conductive structure are arranged on the same layer, so that the dual effects of decoration and conduction are realized, the thickness is reduced, and the utilization rate is improved.

Drawings

FIG. 1 is a schematic cross-sectional view of a conductive film according to the present invention;

fig. 2 is a schematic partial plan view of the first conductive traces and the conductive pillars of the conductive film of fig. 1, wherein the conductive pillar regions are shown filled to clearly show the positions of the conductive pillars;

FIG. 3 is another schematic plan view of FIG. 2;

FIG. 4 is another schematic plan view of FIG. 2;

FIGS. 5-14 are schematic cross-sectional views of conductive films of the present invention

FIG. 15 is a schematic cross-sectional view of another conductive film of the present invention;

fig. 16 is a schematic view of a partial plan view of the first conductive trace, the conductive pillar, and the conductive dot of the conductive film of fig. 15, wherein, in order to clearly show the positions of the conductive pillar and the conductive dot, the conductive pillar and the conductive dot are respectively shown in a filled state;

fig. 17-24 are schematic cross-sectional views of conductive films according to the present invention.

Detailed Description

To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. However, the present invention may be embodied in many different forms and is not limited to the embodiments described below. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

The invention discloses a conductive film, which comprises N layers of conductive layers and conductive columns which are arranged in a stacked mode. The conducting layer comprises a bearing body and a conducting circuit arranged on the bearing body, wherein N is more than or equal to 2. The conductive column at least penetrates through one conductive layer and is electrically connected with the conductive circuits of at least two conductive layers. The lead of one conductive layer can be led to the other conductive layer through the conductive column, and the electrical connection between two or more conductive layers can be realized, so that the conductive film is not limited by the area of the lead area, a narrow frame is realized, and the wiring is convenient; the electric connection among the multiple conducting layers can be realized, and the resistance of each conducting layer can be reduced, the shielding performance is improved and the like only by arranging a lead on one conducting layer.

The supporting body is provided with a first side surface, grid-shaped grooves which are communicated with each other are concavely arranged on the first side surface, and conductive materials are filled in the grid-shaped grooves to form grid-shaped conductive circuits; the conductive post comprises a through hole and a conductive material filled in the through hole. According to the arrangement of each conductive layer, holes are punched in the N conductive layers, and conductive materials are filled in the holes, so that the conductive layers are electrically connected. The grid is in the shape of honeycomb, random grid, circular grid, elliptic grid and the like.

The conductive film comprises a plurality of conductive columns which are randomly distributed in the conductive circuit; and/or the plurality of conductive columns are dispersed in the conductive circuit, and the distribution quantity of the conductive columns in unit area is not different by more than 10%. The plurality of conductive columns are distributed in the distribution area in a relatively uniform manner, whether the conductive columns are distributed randomly or regularly, the distribution amount of the conductive columns in the unit area can be within 10% and the interval distances are not large, and are relatively even, for example, the difference is not more than 20%, so that the conductive performance is stable, and when the transparent conductive layer is used, the uniformity of the transmittance can be realized without affecting the vision.

The conductive posts can be electrically connected with the conductive circuits of at least two of the N conductive layers. When N is greater than or equal to 3, the conductive posts may be all electrically connected to the conductive layers, or may be connected to only some of the conductive layers.

The through holes penetrate through the bearing bodies and the conducting circuits of the conducting layers in the direction perpendicular to the first side face, and the conducting materials in the grid-shaped grooves are exposed to the through holes and are electrically connected with the conducting layer materials in the through holes. Preferably, laser is adopted for opening the hole, at least one layer of conducting layer is penetrated through the laser to comprise a bearing body and a conducting circuit, conducting materials of the conducting circuit are exposed in the through hole after the hole is opened, and then the conducting materials are filled in the through hole, so that the electrical connection between the upper conducting layer and the lower conducting layer can be realized. Preferably, in a direction perpendicular to the first side surface, a contact amount between the conductive material in the grid-shaped trench and the conductive material in the through hole is 1 to 20 μm, so that the conductive circuit and the conductive pillar can be electrically connected.

The conducting lines are in a grid shape, and the width of the conducting columns is larger than the maximum interval width between grids of the conducting lines. The aperture of the through hole is larger than the maximum interval width between grids of the conducting circuit, so that the electric connection of the conducting columns and the conducting circuit can be guaranteed no matter where the through hole is formed, random punching can be achieved, and the process difficulty is reduced. Furthermore, the conductive columns are electrically connected with at least 3 grid lines of the conductive grid of the conductive layer, the size of the grid line grid and the aperture of the through holes are controlled, each through hole can be distributed over at least 3 grid lines, and therefore the conductive columns can be electrically connected with at least 3 grid lines, and the electrical connection of the conductive columns and the conductive layer is guaranteed.

The width of the conductive columns ranges from 10 μm to 200 μm. The conductive circuit is in a grid shape, the grid period or average period range is 100-300 μm, and the width range of the grid lines is 2-10 μm. The cross-sectional shape of the perforations is circular, elliptical, polygonal, or the like.

In one embodiment, a groove is formed in one side of the supporting body of one of the conductive layers, a conductive material located at the bottom of the groove and an insulating colored material located at the notch are filled in the groove, and the conductive column includes a through hole penetrating through the supporting body and communicating with the groove, and a conductive material filled in the through hole and electrically connected with the conductive material in the groove and the conductive circuit of the other conductive layer. Insulating coloured material can form the decorative layer, forms colour and/or picture and text etc. and insulating coloured material is located the recess upper strata and shows outward, and the recess lower floor is filled conductive material and is formed the conducting layer, and the conducting layer is difficult at external demonstration lead wire, then the accessible sets up the perforation downwards and causes the lower floor, simultaneously with the conducting wire electric connection who is located the lower floor, can realize decorating and electrically conductive simultaneously, sparingly technology, advantages such as thin shape design.

The grooves are arranged at intervals, in the arrangement direction, the interval width is gradually changed from large to small, and the conductive columns are arranged on one side with small intervals. In the direction of arranging, the recess is from little to big gradual change setting, and the interval between the recess is from big to little gradual change setting, can show the gradual change after the recess upper strata is filled with insulating coloured material. The perforations are on the side of the smaller spacing to reduce or eliminate the visual impact of the perforations on the gradient. For example, the grooves are arranged at intervals, and the conductive posts are arranged at the positions where the grooves with the interval width of 5 μm to 7 μm are distributed, the width range of the conductive posts is 10 μm to 20 μm, and the width range of the grooves is 90 μm to 110 μm. When the through holes are arranged, most of the through holes are positioned in the width of the groove and cannot extend to the spacing part beside the groove, the gradual color cannot be influenced, and when the individual through holes are positioned at the spacing part, the width range of the spacing is between 5 mu m and 7 mu m, the visual influence is small in the range, the conductive columns are almost invisible, and the gradual color basically cannot be influenced.

The conductive film also comprises a base layer, the N conductive layers are distributed on the same side or two sides of the base layer, and the conductive columns penetrate through or do not penetrate through the base layer. Such as: the conductive column penetrates through the 2 conductive layers to realize the electrical connection of the 2 conductive layers; the conductive column penetrates through the conductive layer on the first side, the base layer and the conductive layer on the second side and is electrically connected with the 2 conductive layers; the conductive column can penetrate through the 2 conductive columns on the first side of the base layer or the 3 conductive layers, or part of the conductive columns penetrates through the 2 conductive layers, and part of the conductive columns penetrates through the 3 conductive layers; when there are more conductive layers, the same applies.

In one embodiment, the conductive film further includes a conductive point, and the conductive point is disposed in cooperation with the conductive pillar and electrically connected to the conductive circuit and the conductive pillar, so as to further ensure that the conductive pillar is electrically connected to each conductive layer. The conductive dots have a thickness in the range of 10nm to 10 μm and a width in the range of 50 μm to 300 μm. The conductive points are dispersed in the conductive circuit of the conductive layer, and the conductive points are circular, elliptical or polygonal.

The conductive points cover the conductive circuit and the conductive columns; or, the conductive point covers the conductive circuit, and the conductive column penetrates through the conductive point. The conductive points cover the conductive circuit and are electrically connected with the conductive circuit; the conductive point covers the conductive column arc and is electrically connected with the conductive column, or the conductive column penetrates through the conductive point and is electrically connected with the conductive point.

The conductive circuit of at least two layers of conductive layers is respectively provided with a plurality of conductive points, the plurality of conductive points of each layer of conductive layer are arranged in a one-to-one correspondence mode in the direction perpendicular to the conductive layers, and the conductive columns are connected with the conductive points of each layer in series.

The width of the conductive point is larger than that of the conductive column, so that the arrangement of the conductive column and the stability of the electrical connection between the conductive column and the conductive column are ensured. The conductive points completely cover the conductive posts, or the conductive posts penetrate through the range of the conductive points; in other embodiments, the conductive points and conductive posts also allow for proper misalignment.

The conducting circuits are arranged at intervals, and the width of the conducting points is larger than the width of the maximum interval of the conducting circuits, so that the conducting points are electrically connected with the adjacent conducting circuits and ensure the electrical connection with the conducting columns.

The conducting circuit is in a grid shape, and the conducting points at least cover three grid lines, so that the electrical connection between the conducting points and the conducting circuit is ensured.

The conductive circuit, the conductive column and the conductive point are made of metal conductive materials such as silver particles, silver wires, copper particles and copper wires, or organic conductive materials, or ITO and the like.

Another embodiment of the present invention is a conductive film, which includes a first conductive layer, a second conductive layer, a plurality of conductive pillars, and a plurality of conductive dots. The first conducting layer comprises a first bearing body and a first conducting circuit arranged on the first bearing body; the second conducting layer and the first conducting layer are arranged in a laminated mode, and the second conducting layer comprises a second bearing body and a second conducting circuit arranged on the second bearing body; the conductive column penetrates through the first conductive layer and/or the second conductive layer; the plurality of conductive points are arranged on the first conductive layer and/or the second conductive layer in a covering mode; the first conductive layer and the second conductive layer are electrically connected through the conductive posts and the conductive points. The lead of the first conducting layer can be led to the second conducting layer through the conducting column, so that the first conducting layer and the second conducting layer are electrically connected, the conducting film is not limited by the area of the lead area, a narrow frame is realized, and wiring is convenient; the first conducting layer and the second conducting layer can be electrically connected, and only the first conducting layer or the second conducting layer is required to be provided with a lead, so that the resistance of each conducting layer can be reduced, the shielding performance is improved, and the like. The conductive film further comprises a third conductive layer, a fourth conductive layer, a fifth conductive layer and the like, and the conductive columns and the conductive points realize the electrical connection of at least two layers or the electrical connection between all the conductive layers. The conductive film may further include a base layer, and the first conductive layer and the second conductive layer are located at one side or both sides of the base layer. When the conductive column is positioned at one side, the conductive column can not penetrate through the base layer; when the conductive columns are positioned on two sides, the conductive columns penetrate through the base layer.

The conductive point is electrically connected with the first conductive circuit or the second conductive circuit, and the conductive column is electrically connected with the conductive point; or, the conductive column is electrically connected with the conductive point, the first conductive circuit and the second conductive circuit. The conductive point covers the first conductive circuit, and/or the conductive point covers the second conductive circuit. The plurality of conductive points arranged on the first conductive layer and the plurality of conductive points arranged on the second conductive layer are arranged in a one-to-one correspondence manner, and the conductive columns penetrate through the first conductive layer and the second conductive layer and are electrically contacted with the conductive points.

The first conductive circuit is a conductive grid, the second conductive circuit is a conductive grid, and the width of the conductive points is greater than the distance of the maximum diagonal of the conductive grid, so that the electrical connection can be ensured.

The conductive points cover at least the grid lines of 3 conductive grids, so that the electrical connection can be ensured.

The conductive dots cover the conductive posts and the conductive mesh.

The conductive column penetrates through and covers the conductive point of the first conductive circuit, and/or the conductive column penetrates through and covers the conductive point of the second conductive circuit.

Hereinafter, specific embodiments of the conductive film of the present invention will be described by way of example with reference to the drawings.

Please refer to fig. 1 and fig. 2, example 1. The conductive film 1 includes a first conductive layer 101, a second conductive layer 102, and a conductive pillar 105. The first conductive layer 101 includes a first carrier 1011, a first groove 1012 in a grid shape, and a first conductive trace 1013. The second conductive layer 102 includes a second carrier 1021, a second grid-shaped groove 1022, and a second conductive trace 1023. The first carrier 1011 is made of UV glue, a first groove 1012 is formed on the first carrier 1011 by stamping and curing, and a first conductive trace 1013 is formed by filling a conductive material (such as silver paste) into the first groove 1012 and sintering the conductive material. The second carrier 1021 is made of UV glue, a second groove 1022 is formed by stamping and curing the second carrier 1021, and a second conductive trace 1023 is formed by filling a conductive material (such as silver paste) in the second groove 1022 and sintering the conductive material. In this embodiment, the first carrier 1011 and the second carrier 1021 are disposed by the same layer of UV glue. The conductive post 105 includes a through hole 1051 and a conductive material filled in the through hole 1051. The conductive post 105 electrically connects the first conductive layer 101 and the second conductive layer 103, which facilitates wiring and reduces resistance.

The first conductive traces 1013 are in the form of interconnected grids, each grid is in the form of a random polygonal grid, and the uniform period W of each grid is in the range of 100 μm to 300 μm, for example, 120 μm; the width D of the grid lines is in the range of 2 μm to 10 μm, for example 6 μm. Conductive post 105 has a width S in the range of 10 μm to 200 μm, such as 120 μm. In the vertical direction of the first conductive layer 101, the contact amount H of the first conductive line 1013 and the conductive pillar 105 is in the range of 1-20 μm, for example, 4 μm; the electrical connection between the conductive pillar 105 and the first conductive layer 101 can be ensured. The second conductive layer 102 has the same dimensional requirements as the conductive post 105, and will not be described in detail here.

Referring to fig. 2, the width S of the aperture of the through hole of the conductive post 105 is greater than the maximum spacing width between the grids of the first conductive trace 1013. The conductive posts 105 are electrically connected to at least 3 grid lines of the conductive grid of the first conductive trace 1013. The conductive pillars 105 are randomly distributed in the grid of the first conductive trace 1013, and although randomly distributed, the conductive pillars are relatively uniformly distributed as a whole, and the distribution number of the conductive pillars in a unit area is not different by more than 10%. In other embodiments, the shape of the cells may also be honeycomb like fig. 3, or circular like fig. 4; in other embodiments, the conductive pillars may also be regularly distributed.

Please refer to fig. 5, example 2. Example 2 differs from example 1 in that: the first carrier 2011 and the second carrier 2021 of the conductive film of embodiment 2 are two layers of UV glue and are fused with each other; the conductive pillar 205 is disposed on one side of the conductive film, and leads the lead of the first conductive trace 2013 of the first conductive layer 201 to the second conductive trace 2023 of the second conductive layer 202, and the second conductive trace 2023 may be disposed independently of other conductive traces of the second conductive layer 202.

Please refer to fig. 6, example 3. Example 3 differs from example 1 in that: the conductive film of embodiment 3 further includes a base layer 306; the base layer 306 includes oppositely disposed first and second sides 3061, 3062. The first conductive layer 301 is disposed on the first side 3061, the second conductive layer 302 is disposed on the second side 3062, and the conductive pillar 305 penetrates through the first conductive layer 301, the base layer 306, and the second conductive layer 302. The base layer 306 may be PET, PC, PI, CPI, PMMA, or a combination thereof.

Please refer to fig. 7, example 4. The difference from example 3 is that: the first conductive layer 401 and the second conductive layer 402 of the conductive film of embodiment 4 are stacked on the first side 4061 of the base layer 406, and the conductive post 405 penetrates through the first conductive layer 401 and the second conductive layer 402, and the conductive post 405 does not penetrate through the base layer 406.

Please refer to fig. 8, example 5. Example 5 differs from example 4 in that: the conductive film of embodiment 5 further includes a third conductive layer 503; a first conductive layer 501, a second conductive layer 502, and a third conductive layer 503 are stacked on a first side 5061 of the base layer 506; the conductive post 505 penetrates through the first conductive layer 501, the second conductive layer 502 and the third conductive layer 503 to electrically connect the first conductive layer 501, the second conductive layer 502 and the third conductive layer 503. If the conductive film is used in the electromagnetic shielding field, the plurality of conductive pillars 505 are randomly distributed, and after the conductive pillars 505 are electrically connected to each layer, the resistance of each layer is reduced, thereby improving the shielding effectiveness.

Please refer to fig. 9, example 6. Example 6 differs from example 5 in that: the conductive film of embodiment 6 further includes a fourth conductive layer 604; the fourth conductive layer 604 is disposed on the second side 6062 of the base layer 606, the conductive post 605 does not penetrate through the base layer 606, and the fourth conductive layer 604 is not electrically connected to other conductive layers.

Please refer to fig. 10, example 7. Example 7 differs from example 6 in that: the conductive pillar 705 of the conductive film of embodiment 7 penetrates through the base layer 705, and the fourth conductive layer 704 is electrically connected to other conductive layers.

Please refer to fig. 11, example 8. Example 8 differs from example 4 in that: the conductive film of embodiment 8 further includes a third conductive layer 803 and a fourth conductive layer 804; the third conductive layer 803 and the fourth conductive layer 804 are stacked on the second side 806 of the base layer 806; the conductive post 805 penetrates through the third conductive layer 803 and the fourth conductive layer 804, so that the third conductive layer 803 and the fourth conductive layer 804 are electrically connected; the conductive post 805 does not penetrate through the base layer 806, and the first conductive layer 801 and the second conductive layer 802 are not electrically connected to the third conductive layer 803 and the fourth conductive layer 804.

Please refer to fig. 12, example 9. Example 9 differs from example 8 in that: the conductive film conductive post 905 of embodiment 9 penetrates the base layer 906; a conductive post 905 sequentially penetrates through the second conductive layer 902, the first conductive layer 901, the base layer 906, the third conductive layer 903 and the fourth conductive layer 904, so as to electrically connect the first conductive layer 901, the second conductive layer 902, the third conductive layer 903 and the fourth conductive layer 904.

Please refer to fig. 13, example 10. Example 10 differs from example 8 in that: the conductive film of embodiment 10 further includes a conductive post 1005 penetrating the first conductive layer 1001, the base layer 1006, and the third conductive layer 1003, so as to electrically connect the first conductive layer 1001, the second conductive layer 1002, the third conductive layer 1003, and the fourth conductive layer 1004.

Please refer to fig. 14, example 11. The conductive film includes a first conductive layer 111, a base layer 116, a second conductive layer 112, and a conductive pillar 115. The first conductive layer 111 is disposed on the first side 1161 of the base layer 116, and the second conductive layer 112 is disposed on the second side 1162 of the base layer 116. The first conductive layer 111 includes a first carrier 1111 and a first groove 1112 disposed on the first carrier 1111. The conductive material filling the bottom of the first groove 1112 forms a first conductive trace 1113, and the insulating colored material filling the opening of the first groove 1112 forms a decorative structure 1114. The conductive pillar 115 penetrates the first conductive trace 1113, the first carrier 1111, the base layer 116, and the second conductive trace 112, so as to electrically connect the first conductive trace 1113 and the second conductive trace 1123. The conductive posts 115 do not penetrate the trim structure 1114, and the visual effect of the trim structure 1114 is not affected. The first conductive layer 111 is electrically connected with the second conductive layer 112 through the conductive post 115, so that the decorative effect of the decorative structure 1114 cannot be affected, functions of touch control, antenna, light and the like can be realized, and meanwhile, the problem that the first conductive layer 111 is difficult to lead is solved.

In the arrangement direction of the first grooves 1112 from left to right in fig. 14, the width of the first grooves 1112 gradually increases from small to large, the width of the space between adjacent first grooves 1112 gradually decreases from large to small, the conductive posts 115 are disposed on the right side with small space, and the decorative structure 1114 presents a gradient color. Preferably, the width of the conductive post 115 is smaller than the width of the first groove 1112 that is penetrated. The interval width of the first grooves 1112 in the distribution area of the conductive posts 115 is in the range of 5 μm to 7 μm.

In other embodiments, the conductive film further includes a reflective layer and a colored layer disposed between the first conductive layer and the second conductive layer, so that the visual effect of the decorative structure is more excellent.

In other embodiments, the first grooves are not arranged in a gradual change manner, the decorative structure presents images and texts, for example, logo, the interval of the first grooves is controlled to be less than 7 μm, and the conductive columns cannot influence the visual effect.

Please refer to fig. 15 and fig. 16, example 12. The conductive film includes a first conductive layer 121, a second conductive layer 122, a conductive pillar 125, and a conductive dot 127. The first conductive layer 121 includes a first carrier 1211, a first groove 1212 disposed on the first carrier 1211, and a first conductive trace 1213 formed in the first groove 1212. The second conductive layer 122 includes a second carrier 1221, a second groove 1222 disposed on the second carrier 1221, and a second conductive trace 1223 filled in the second groove 1222. The first carrier 1211 and the second carrier 1221 are provided for the same UV layer. The conductive pillar 125 includes a through hole 1251 penetrating through the first conductive layer 121 and the second conductive layer 122 and a conductive material filled in the through hole 1251, where the conductive material in the through hole 1251 electrically connects the first conductive trace 1213 and the second conductive trace 1223, so as to electrically connect the first conductive layer 121 and the second conductive layer 122 which are stacked. The plurality of conductive dots 127 are distributed on the first conductive traces 1213 and the second conductive traces 1223, and each conductive dot 127 is disposed corresponding to the position of the conductive pillar. On the first conductive layer 121, the conductive dots 127 cover the first conductive traces 1213 and the conductive pillars 125 to ensure the electrical connection between the first conductive traces 1213 and the conductive pillars 125; on the second conductive layer 122, the conductive dots 127 cover the second conductive traces 1223 and the conductive pillars 125 to ensure the electrical connection between the second conductive traces 1223 and the conductive pillars 125.

The manufacturing process includes, for example, providing a UV glue layer, and stamping and curing the UV glue layer on two sides to form a first trench 1212 and a second trench 1222, respectively; filling conductive silver paste in the first trench 1212 and the second trench 1222, and sintering to form a first conductive line 1213 and a second conductive line 1223; laser drilling is performed on the UV glue layer to form a plurality of through holes, and the through holes 1251 are filled with a conductive material to form the conductive posts 125; conductive dots 127 are formed by screen printing or plating a conductive material on the conductive posts 125. The conductive dots 127 can at least overlie the conductive pillars 125 and the first conductive traces 1213 or the second conductive traces 1223.

Referring to fig. 16, the first conductive traces 1213 are in a random grid shape, and the conductive posts 125 contact with at least 3 grid lines, and the width of the conductive dots 127 is greater than the width of the conductive posts. The conductive dots 127 have a thickness in the range of 10nm to 10 μm, such as 1 μm, and a width in the range of 50 μm to 300 μm, such as 150 μm. In other embodiments, the first conductive traces 1213 are in a honeycomb or circular grid pattern, with the conductive traces of the other layers referenced to the first conductive traces.

Please refer to fig. 17, example 13. The conductive film includes a first conductive layer 131, a second conductive layer 132, a conductive post 135, and a conductive dot 137. The first conductive layer 131 includes a first carrier layer 1311, a first trench 1312 recessed on one side of the first carrier layer 1311, and a first conductive line 1313 formed by filling a conductive material in the first trench 1312. The second conductive layer 132 includes a second carrier layer 1321, a second trench 1322 recessed at one side of the second carrier layer 1321, and a second conductive trace 1323 formed by filling a conductive material in the second trench 1322. The second carrier layer 1321 is disposed on a side of the first carrier layer 1311 having the first trenches 1312, and a side of the second carrier layer 1321 facing away from the first conductive traces 1313 forms second conductive traces 1323. A plurality of conductive dots 137 are distributed on the first conductive layer 131 and the second conductive layer 132. The conductive post 135 sequentially penetrates the conductive point 137, the first conductive layer, the conductive point 137 and the second conductive layer 132 to electrically connect the first conductive trace 1313 and the second conductive trace 1323.

The process comprises the following steps: arranging a first bearing layer 1311, forming a first groove 1312 in a concave mode on one side of the first bearing layer 1311, and filling a conductive material in the first groove 1312 to form a first conductive line 1313; randomly screen-printing a plurality of conductive dots 137 on the first conductive traces 1313; disposing a second carrier layer 1321 on the first conductive traces 1313 and the conductive dots 137, forming second trenches 1322 on the opposite side of the second carrier layer 1321, and filling a conductive material in the second trenches 1322 to form second conductive traces 1323; a plurality of conductive points 137 are randomly arranged on the second conductive traces 1323 and are arranged corresponding to the conductive points 137 on the first conductive traces 1313 one by one; in the same distribution, vias 1351 are laser drilled through where the conductive dots 137 are located, and the vias 1351 are filled with conductive material to form the conductive pillars 135. In other embodiments, the conductive dots 137 on the second conductive trace 1323 can be punched before being disposed.

Please refer to fig. 18, example 14. Example 14 differs from example 12 in that: the conductive film of embodiment 14 further includes a base layer 146, and the first conductive layer 141 and the second conductive layer 142 are provided on both sides of the base layer 146; the conductive pillar 145 penetrates the conductive dot 147, the first conductive layer 141, the base layer 146, the second conductive layer 142, and the conductive dot 147 in this order.

Please refer to fig. 19, example 15. Example 15 differs from example 13 in that: the conductive film of embodiment 15 further includes a base layer 156, the first conductive layer 151 and the second conductive layer 152 being disposed on the same side of the base layer 156; the conductive post 155 sequentially penetrates through the first conductive layer 151, the conductive point 157 and the second conductive layer 152; the conductive dots 157 on the first conductive layer 151 are overlaid with the first conductive traces 1513 and the conductive posts 155.

Please refer to fig. 20, example 16. Example 16 differs from example 13 in that: the conductive film of embodiment 16 further includes a base layer 166, a third conductive layer 163, and a fourth conductive layer 164; the first conductive layer 161, the second conductive layer 162, the third conductive layer 163, and the fourth conductive layer 164 are stacked on the same side of the base layer 166; conductive posts 165 extend through each conductive layer and corresponding conductive points 167.

Please refer to fig. 21, example 17. Example 17 differs from example 11 in that: the conductive film of embodiment 17 further comprises conductive dots 177; the conductive dots 177 cover the second conductive layer 172 and electrically connect the second conductive traces 1723 and the conductive posts 175.

Please refer to fig. 22, example 18. Example 18 differs from example 15 in that: the first conductive traces 1813 of the conductive film of embodiment 18 are not in direct electrical contact with the conductive pillars 185, and the first conductive traces 1813 are indirectly electrically connected to the conductive pillars 185 through the conductive dots 187.

In other embodiments, the second conductive trace and the conductive post are not in direct electrical contact, the conductive point is in electrical contact with the conductive trace of each conductive layer, and the conductive post is electrically connected to the conductive point on each conductive layer, so as to achieve electrical connection of each conductive layer.

Please refer to fig. 23, example 19. Example 19 differs from example 18 in that: the conductive film of embodiment 19 further includes a third conductive layer 193, and the first conductive layer 191, the second conductive layer 192, and the third conductive layer 193 are stacked in this order on one side of the base layer 196; the conductive posts 195 penetrate the layers and the conductive points 197 disposed thereon.

Please refer to fig. 24, example 20. Example 20 differs from example 18 in that: the conductive film of embodiment 20 further includes a third conductive layer 2003 and a fourth conductive layer 2004, the first conductive layer 2001 and the second conductive layer 2003 being disposed on a first side 20061 of the base layer 2006, the third conductive layer 2003 and the fourth conductive layer 2005 being disposed on a second side 20062 of the base layer 2006; the conductive post 2005 penetrates through each conductive layer, the conductive dots 2007 provided on each conductive layer, and the base layer 2006; the first conductive layer 2001, the second conductive layer 2002, the third conductive layer 2003, and the fourth conductive layer 2004 are electrically connected to each other.

The conductive film leads the conductive circuit on one layer to the other layer through the through holes and the conductive columns, thereby being beneficial to the arrangement of the conductive circuit on the conductive layer, realizing narrow frames, improving the space utilization rate and improving the conductive performance. The plurality of conductive posts are arranged at intervals, so that the resistance of each conductive layer can be reduced, and the shielding efficiency, the heating efficiency and the like are improved. Through the matching arrangement of the conductive points and the conductive columns, the electric connection can be ensured, and the stability is improved. The decorative structure and the conductive structure are arranged on the same layer, so that the dual effects of decoration and conduction are realized, the thickness is reduced, and the utilization rate is improved.

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail. In the above description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Moreover, the technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. A conductive film, comprising:

the conductive layers are arranged in a stacked mode and comprise a bearing body and conductive circuits arranged on the bearing body;

a plurality of conductive posts, the conductive posts penetrating the carrier;

the plurality of conductive points are distributed on one side of the bearing body, on which the conductive circuit is arranged;

the conductive points are electrically connected with the conductive circuit and the conductive columns, and the conductive layers which are stacked are electrically connected through the conductive columns.

2. The conductive film of claim 1, wherein the conductive trace overlies the conductive trace and the conductive post, or the conductive post extends through the conductive trace.

3. The conductive film of claim 1, wherein the width of the conductive pillars ranges from 10 μ ι η to 200 μ ι η; the thickness range of the conductive points is 10nm-10 mu m, and the width range is 50 mu m-300 mu m.

4. The conductive film of claim 1 wherein said conductive traces are in a grid pattern, and each of said conductive dots covers at least 3 grid lines of said conductive traces.

5. The conductive film of claim 1, wherein the carrier has a first side surface, a trench is recessed on the first side surface, the trench is filled with a conductive material to form the conductive circuit, the conductive pillar includes a through hole and a conductive material filled in the through hole, and the through hole is communicated with the trench.

6. The conductive film of claim 5, wherein the conductive material in the trench is disposed in contact with the conductive material in the via in a direction perpendicular to the first side by an amount of 1-20 μm.

7. The conductive film of claim 1, wherein a plurality of conductive points are respectively disposed on the conductive traces of at least two of the conductive layers, the plurality of conductive points of each of the conductive layers are disposed in a one-to-one correspondence in a direction perpendicular to the conductive layers, and the conductive posts are connected in series with the conductive points of each of the conductive layers.

8. The conductive film of claim 1, wherein the conductive traces of each conductive layer are covered with a plurality of conductive dots, the conductive dots of each conductive layer are correspondingly disposed, the conductive posts penetrate the conductive layers from the conductive dots, and the conductive traces of the conductive layers are electrically connected.

9. The conductive film of claim 8, wherein the width of the conductive dots is greater than the width of the conductive pillars.

10. The conductive film of claim 1, wherein the plurality of conductive layers includes a first conductive layer and a second conductive layer, a groove is disposed on one side of the carrier of the first conductive layer, a bottom of the groove is filled with a conductive material to form the conductive circuit, a notch of the groove is filled with an insulating colored material to form a decorative structure, the conductive circuit of the second conductive layer is provided with the conductive point, and the conductive column is electrically connected to the conductive circuit of the first conductive layer and the conductive point.

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