CN212895041U - Electroplating device conductive device - Google Patents
Electroplating device conductive device Download PDFInfo
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- CN212895041U CN212895041U CN202021487618.2U CN202021487618U CN212895041U CN 212895041 U CN212895041 U CN 212895041U CN 202021487618 U CN202021487618 U CN 202021487618U CN 212895041 U CN212895041 U CN 212895041U
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- block
- copper
- cooling tank
- conductive
- cooling
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Abstract
The utility model discloses a conductive device of electroplating equipment, which comprises a conductive block, a copper block and a cooling tank, wherein the cooling tank is arranged on a frame, the cooling tank is of an upward opening structure, the copper block is arranged at the bottom of the cooling tank, and the copper block is connected with a power supply; the conductive block is arranged at the upper end of a fixing plate of the conveying mechanism and extends downwards into the cooling tank, the bottom end of the conductive block is contacted with the top end of the copper block in the cooling tank during operation, the fixing plate can conduct electricity, a clamp capable of clamping the circuit board is arranged at the lower end of the fixing plate, and the lower end of the circuit board extends into the electrolytic tank. The electric conduction device has good electric conduction performance and can prolong the service life of the electric conduction block.
Description
Technical Field
The utility model belongs to the technical field of electroplating equipment, concretely relates to electroplating equipment electric installation.
Background
Electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by using the principle of electrolysis, and is a process of attaching a layer of metal film on the surface of a metal or other material product by using the action of electrolysis so as to play roles of preventing metal oxidation, improving wear resistance, conductivity, light reflection, corrosion resistance, enhancing appearance and the like.
In the electroplating process, a circuit board to be electroplated is inserted into the electroplating bath as a cathode of the electroplating, so that metal ions in the electroplating solution in the electroplating bath obtain electrons and are precipitated and deposited on the surface of the circuit board, and the electroplating effect is achieved. The circuit board is generally clamped by a movable clamp assembly, the clamp assembly clamps the circuit board and moves to an electroplating bath for electroplating, and the method for electrifying the movable circuit board in the prior art is that a conductive carrying platform moving along with the clamp assembly is arranged at the top of the clamp assembly, a conductive block is arranged on an electroplating rack along the moving direction of the clamp assembly and is connected with a power supply, the conductive block is positioned above the conductive carrying platform, the movable conductive carrying platform is contacted with the conductive block, so that the current output by the power supply is conveyed to the conductive carrying platform through the conductive block, and the current is conducted to the circuit board through the conductive carrying platform.
The clamp assembly is in the removal in-process, and electrically conductive microscope carrier and conducting block need keep the effect of contact circular telegram constantly, can produce the looks mutual friction between electrically conductive microscope carrier and the conducting block, not only has the heat that the circular telegram produced on electrically conductive microscope carrier and the conducting block, and the heat that the friction produced in addition, electrically conductive microscope carrier and conducting block produce a large amount of heats and neither do benefit to electrically conductive effect, can influence the normal life of conducting block to a certain extent again.
The arrangement mode of the conductive carrying platform and the conductive block in the prior art does not have a mechanism capable of effectively reducing the heat generated by conduction, and the conductive carrying platform and the conductive block rub for a long time to generate abrasion to form a gap, so that the current passing performance is influenced, and the electroplating quality of a circuit board is finally influenced.
Disclosure of Invention
The utility model aims to solve the defects of the prior art and provides a conductive device of electroplating equipment.
The technical scheme of the utility model as follows:
a conductive device of electroplating equipment comprises a conductive block, a copper block and a cooling tank, wherein the cooling tank is arranged on a rack and is of a structure with cooling liquid and an upward opening; the conductive block is arranged at the upper end of a fixing plate of the conveying mechanism and extends downwards into the cooling tank, the bottom end of the conductive block is contacted with the top end of the copper block in the cooling tank during operation, the fixing plate can conduct electricity, a clamp capable of clamping the circuit board is arranged at the lower end of the fixing plate, and the lower end of the circuit board extends into the electrolytic tank.
The copper block is connected with a power supply through the copper flat, the lower end of the copper flat extends into the cooling tank and is tightly attached to the copper block, and the upper end of the copper flat is connected with the power supply.
And a cooling water inlet and a return port are formed in one side of the cooling tank.
And a spring is arranged at the position where the top end of the conductive block is connected with the fixing plate.
The utility model has the advantages as follows:
the utility model discloses the electric installation, set up the conducting block on the conveying mechanism who removes, and the conducting block stretches into downwards in the cooling bath and realizes switching on of electric current with electrified copper billet contact, the cooling bath is the ascending open structure who takes the coolant liquid, such mode of setting up, the conducting block can be cooled off through the coolant liquid with the heat that the copper billet friction is electrically conductive to produce, and simultaneously, the coolant liquid can also play lubricated effect to the friction process of conducting block and copper billet, reducing wear, the life of extension conducting block, the coolant liquid can also play electrically conductive effect, the performance of reinforcing electric current from the conducting block to circuit board conduction, ensure the quality that the circuit board is electroplated.
Drawings
Fig. 1 is a cross-sectional view of a conductive device according to the present invention;
FIG. 2 is a diagram of the assembly relationship between the conductive device and the frame of the present invention;
the numbers and their corresponding names in the figure are as follows:
1-conductive block, 2-copper block, 3-cooling tank, 4-frame, 5-conveying mechanism, 6-fixing plate, 7-circuit board, 8-clamp, 9-electrolytic tank, 10-copper flat, 11-cooling water inlet, 12-reflux port and 13-conveying plate.
Detailed Description
The present invention will be further explained with reference to the accompanying drawings.
The electroplating equipment conducting device shown in fig. 1-2 comprises a conducting block 1, a copper block 2 and a cooling tank 3, wherein the cooling tank is arranged on a rack 4, the cooling tank is of a structure with cooling liquid and is opened upwards, the copper block 2 is arranged at the bottom of the cooling tank, and the copper block is connected with a power supply; the conductive block 1 is arranged at the upper end of a fixing plate 6 of the conveying mechanism 5 and extends downwards into the cooling tank, the bottom end of the conductive block and the top end of a copper block are contacted in the cooling tank during operation, the fixing plate can conduct electricity, a clamp 8 capable of clamping a circuit board 7 is arranged at the lower end of the fixing plate, the lower end of the circuit board extends into an electrolytic tank 9, and the copper block is of a long strip-shaped structure and is arranged along the length direction of the cooling tank. The fixed plate is fixedly arranged on the conveying mechanism, the conveying plate 13 is arranged on one side of the fixed plate, and the clamp is arranged at the lower end of the conveying plate.
The copper block 2 is connected with a power supply through a copper flat 10, the lower end of the copper flat extends into the cooling tank and is tightly attached to the copper block, and the upper end of the copper flat is connected with the power supply.
And a cooling water inlet 11 and a return port 12 are arranged on one side of the cooling tank 3, cooling water is injected into the cooling tank from the cooling water inlet, and the cooling water working in the cooling tank flows out from the return port.
The position that the top of conducting block 1 is connected with the fixed plate sets up the spring, can produce wearing and tearing after conducting block and the long-term friction contact of copper billet, sets up the spring and can exert in decurrent pressure to the conducting block, ensures that the conducting block contacts with the copper billet at the removal in-process, guarantees that the electric current switches on to the electrolysis trough in to carry out continuous electroplating to the circuit board.
The operating principle of the conductive device is as follows: the conveying mechanism clamps a circuit board 7 to be electroplated on the rack and moves towards the electrolytic bath 9, when the circuit board enters the electrolytic bath, the conductive block 1 positioned at the upper end of the fixing plate 6 is contacted with the copper block 2 in the cooling bath 3, and the copper block is connected with a power supply through the copper flat, so that the conductive block is electrified, current output by the power supply is conducted to the circuit board 7 through the conductive block, the fixing plate, the conveying plate and the clamp, so that electrolyte in the electrolytic bath is electrified, and metal ions in the electrolyte are separated out and deposited on the surface of the circuit board to complete electroplating.
The utility model discloses the electric installation, set up the conducting block on the conveying mechanism who removes, and the conducting block stretches into downwards in the cooling bath and realizes switching on of electric current with electrified copper billet contact, the cooling bath is the ascending open structure who takes the coolant liquid, such mode of setting up, the conducting block can be cooled off through the coolant liquid with the heat that the copper billet friction is electrically conductive to produce, and simultaneously, the coolant liquid can also play lubricated effect to the friction process of conducting block and copper billet, reducing wear, the life of extension conducting block, the coolant liquid can also play electrically conductive effect, the performance of reinforcing electric current from the conducting block to circuit board conduction, ensure the quality that the circuit board is electroplated.
Claims (4)
1. The utility model provides an electroplating device electric installation which characterized in that: the cooling device comprises a conductive block (1), a copper block (2) and a cooling tank (3), wherein the cooling tank is arranged on a rack (4), the cooling tank is of a structure with cooling liquid and an upward opening, the copper block (2) is arranged at the bottom of the cooling tank, and the copper block is connected with a power supply; the upper end of fixed plate (6) at conveying mechanism (5) is installed in conducting block (1), and inside the conducting block stretched into the cooling bath downwards, during operation, the bottom of conducting block and the top of copper billet contacted in the cooling bath, and the fixed plate can electrically conduct, and the lower extreme of fixed plate sets up anchor clamps (8) that can centre gripping circuit board (7), and the lower extreme of circuit board stretches into in electrolysis trough (9).
2. The plating apparatus conductive device according to claim 1, wherein: the copper block (2) is connected with a power supply through the copper flat (10), the lower end of the copper flat extends into the cooling tank and is tightly attached to the copper block, and the upper end of the copper flat is connected with the power supply.
3. The plating apparatus conductive device according to claim 1, wherein: and a cooling water inlet (11) and a return port (12) are formed in one side of the cooling tank (3).
4. The plating apparatus conductive device as recited in any one of claims 1 to 3, wherein: and a spring is arranged at the position where the top end of the conductive block (1) is connected with the fixing plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021487618.2U CN212895041U (en) | 2020-07-24 | 2020-07-24 | Electroplating device conductive device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021487618.2U CN212895041U (en) | 2020-07-24 | 2020-07-24 | Electroplating device conductive device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212895041U true CN212895041U (en) | 2021-04-06 |
Family
ID=75292545
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021487618.2U Active CN212895041U (en) | 2020-07-24 | 2020-07-24 | Electroplating device conductive device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212895041U (en) |
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2020
- 2020-07-24 CN CN202021487618.2U patent/CN212895041U/en active Active
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