CN212874448U

CN212874448U - IC positioning device

Info

Publication number: CN212874448U
Application number: CN202022106035.7U
Authority: CN
Inventors: 何为华
Original assignee: Huaxin Zhichuang Technology Shenzhen Co ltd
Current assignee: Huaxin Zhichuang Technology Shenzhen Co ltd
Priority date: 2020-09-23
Filing date: 2020-09-23
Publication date: 2021-04-02
Anticipated expiration: 2030-09-23

Abstract

The utility model discloses a IC positioner, including device bottom plate, Y axle motion slide rail, Y axle motion linear electric motor, X axle motion bottom plate, X axle motion slide rail, X axle motion linear electric motor, vacuum platform and location cutter, Y axle motion slide rail is located on the device bottom plate, Y axle motion bottom plate slides and locates on the Y axle motion slide rail and be connected with Y axle motion linear electric motor's output, X axle motion slide rail symmetry is located on the Y axle motion bottom plate, X axle motion bottom plate slides and locates on the X axle motion slide rail and be connected with X axle motion linear electric motor's output, vacuum platform locates the one end of device bottom plate, the location cutter is located on the X axle motion bottom plate. The utility model relates to a IC chip processing technology field specifically is to provide an utilize location cutter to drive IC chip and be the IC positioner that two-dimensional motion realized final accurate positioning on vacuum platform.

Description

IC positioning device

Technical Field

The utility model relates to a IC chip processing technology field specifically indicates an IC positioner.

Background

At present, a substrate plate is conveyed to a working position on a clamp by a feeding mechanism, a dispensing mechanism dispenses a position of a wafer to be bonded on the substrate, a bonding arm moves to a wafer sucking position from an original position, the wafer is placed on an expander wafer tray supported by a film, a suction nozzle moves downwards after the bonding arm is in place, the suction nozzle moves upwards to jack up the wafer, the bonding arm returns to the original position (a crystal leakage detection position) after picking up the wafer, the bonding arm moves to the bonding position from the original position, and the suction nozzle returns to the original position again after bonding the wafer downwards, so that a complete bonding process is realized.

In the process, the IC chip is required to be placed at a fixed position on the wafer disc, the wafer disc is made of a thin film as a base material, when the wafer head adsorbs the wafer, the wafer and the wafer disc are adsorbed by the vacuum device, the position of the wafer is fixed, the position precision of the wafer is improved by placing the fixed position, and the process is time-consuming and labor-consuming. The invention mainly solves the problem that the position of the IC is not fixed before the chip is mounted and fixed through a positioning device.

SUMMERY OF THE UTILITY MODEL

To the above situation, for overcoming prior art's defect, the utility model provides an utilize location cutter to drive IC chip and be two-dimensional motion on vacuum platform and realize the final accurate positioning's IC positioner.

The utility model adopts the following technical scheme: the utility model relates to an IC positioning device, which comprises a device bottom plate, a Y-axis motion slide rail, a Y-axis motion linear motor, an X-axis motion bottom plate, an X-axis motion slide rail, an X-axis motion linear motor, a vacuum platform and a positioning cutter, wherein the Y-axis motion slide rail is symmetrically arranged on the device bottom plate, the Y-axis motion linear motor is arranged on the device bottom plate, the Y-axis motion bottom plate is slidably arranged on the Y-axis motion slide rail and one end of the Y-axis motion linear motor is connected with the output end of the Y-axis motion linear motor, the X-axis motion slide rail is symmetrically arranged on the Y-axis motion bottom plate, the X-axis motion linear motor is arranged on the Y-axis motion bottom plate, the X-axis motion bottom plate is slidably arranged on the X-axis motion slide rail and is connected with the output end of the X-axis, utilize Y axle motion linear electric motor and X axle motion linear electric motor to pass through X axle motion bottom plate and drive the location cutter and do two-dimensional space and move on vacuum platform, will place the IC chip on vacuum platform at will and promote to the technological effect that set position realized the location, the air current flows and produces the negative pressure on vacuum platform and adsorb fixedly with the IC chip that fixes a position, makes things convenient for suction nozzle bonding IC chip.

Further, the location cutter is the setting of L type structure, the long limit one end of location cutter is located on the X axle motion bottom plate, the expansion end of location cutter is located wafer dish top, be equipped with X on the location cutter and walk wind gap and Y to walking the wind gap, utilize X to walk wind gap and Y to walking the wind gap and conveniently ventilate, avoid the location cutter to promote IC chip in-process and vacuum platform between form airtight space, cause the movement resistance, influence positioning accuracy.

Furthermore, a Y-axis motion encoder is arranged on the device bottom plate and electrically connected with the Y-axis motion linear motor.

Furthermore, an X-axis motion encoder is arranged on the Y-axis motion base plate and electrically connected with the X-axis motion linear motor.

Further, the width of the gap between the positioning cutter and the vacuum platform is smaller than the thickness of the IC chip.

Furthermore, the X-axis moving slide rail and the Y-axis moving slide rail are arranged vertically.

Adopt above-mentioned structure the utility model discloses the beneficial effect who gains as follows: according to the scheme, the positioning cutter is used for driving the IC chip to do two-dimensional motion on the vacuum platform to realize final accurate positioning, and the problem that the position of the IC chip is not fixed before mounting and die bonding is solved; the IC chip is conveniently pushed bidirectionally by utilizing the L-shaped structure of the positioning cutter, and the air inlet in the X direction and the air inlet in the Y direction are utilized for convenient ventilation, so that the phenomenon that the positioning cutter forms a closed space between the positioning cutter and a vacuum platform in the process of pushing the IC chip to cause movement resistance and influence on positioning precision is avoided.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:

fig. 1 is a front view of an IC positioning device according to the present invention;

fig. 2 is a left side view of an IC positioning device according to the present invention;

fig. 3 is a right side view of an IC positioning apparatus of the present invention;

fig. 4 is a perspective view of an IC positioning device according to the present invention;

fig. 5 is an exploded view of an IC positioning device according to the present invention;

fig. 6 is a schematic structural view of the positioning tool of the IC positioning device of the present invention.

The device comprises a device base plate 1, a Y-axis movement base plate 2, a Y-axis movement sliding rail 3, a Y-axis movement linear motor 4, a Y-axis movement linear motor 5, an X-axis movement base plate 6, an X-axis movement sliding rail 7, an X-axis movement linear motor 8, a vacuum platform 9, a positioning cutter 10, an X-direction air inlet, an 11 and Y-direction air inlet, a 12 and Y-axis movement encoder 13 and an X-axis movement encoder.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments; based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

As shown in FIGS. 1-6, the IC positioning device of the present invention comprises a device bottom plate 1, a Y-axis moving bottom plate 2, a Y-axis moving slide rail 3, a Y-axis moving linear motor 4, an X-axis moving bottom plate 5, an X-axis moving slide rail 6, an X-axis moving linear motor 7, a vacuum platform 8 and a positioning tool 9, wherein the Y-axis moving slide rail 3 is symmetrically arranged on the device bottom plate 1, the Y-axis moving linear motor 4 is arranged on the device bottom plate 1, the Y-axis moving bottom plate 2 is slidably arranged on the Y-axis moving slide rail 3, one end of the Y-axis moving linear motor is connected with the output end of the Y-axis moving linear motor 4, the X-axis moving slide rail 6 is symmetrically arranged on the Y-axis moving bottom plate 2, the X-axis moving linear motor 7 is arranged on the Y-axis moving bottom plate 2, the X-axis moving bottom plate 5 is slidably arranged on the X-, the vacuum platform 8 is arranged at one end of the device bottom plate 1, and the positioning cutter 9 is arranged on the X-axis moving bottom plate 5.

The utility model discloses a device for fixing position cutter 9, including device bottom plate 1, fixing position cutter 9, locating cutter 9 and X axle motion bottom plate 5, the expansion end of fixing position cutter 9 is located wafer dish top, be equipped with X on the fixing position cutter 9 to walking wind gap 10 and Y to walking wind gap 11, be equipped with Y axle motion encoder 12 on the device bottom plate 1, Y axle motion encoder 12 is connected with Y axle motion linear electric motor 4 electricity, be equipped with X axle motion encoder 13 on the Y axle motion bottom plate 2, X axle motion encoder 13 is connected with X axle motion linear electric motor 7 electricity, the gap width between fixing position cutter 9 and the vacuum platform 8 is less than IC chip's thickness, X axle motion slide rail 6 sets up with Y axle motion slide rail 3 is perpendicular.

When the vacuum positioning device is used, in an initial state, the movable end of the positioning tool 9 is positioned at the far end of the vacuum platform 8, an IC chip is randomly placed on the vacuum platform 8, then the Y-axis motion encoder 12, the Y-axis motion linear motor 4, the X-axis motion encoder 13 and the X-axis motion linear motor 7 are started, after the Y-axis motion linear motor 4 is started, the positioning tool 9 is driven to move in the Y direction through the Y-axis motion base plate 2 and the X-axis motion base plate 5 under the control of the Y-axis motion encoder 12, meanwhile, after the X-axis motion linear motor 7 is started, the positioning tool 9 is driven to move in the X direction through the X-axis motion base plate 5 under the control of the X-axis motion encoder 13, the positioning tool 9 moves through a two-dimensional space, contacts the IC chip on the vacuum platform 8 and pushes the IC chip to a set position to realize positioning, after the positioning is finished, the vacuum platform 8 is started to start, the suction nozzle is convenient to bond the IC chip.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above, it will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, but that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. An IC positioning apparatus, comprising: including device bottom plate, Y axle motion slide rail, Y axle motion linear electric motor, X axle motion bottom plate, X axle motion slide rail, X axle motion linear electric motor, vacuum platform and location cutter, Y axle motion slide rail symmetry is located on the device bottom plate, Y axle motion linear electric motor locates on the device bottom plate, Y axle motion bottom plate slides and locates on the Y axle motion slide rail and one end is connected with Y axle motion linear electric motor's output, X axle motion slide rail symmetry is located on the Y axle motion bottom plate, X axle motion linear electric motor locates on the Y axle motion bottom plate, X axle motion bottom plate slides and locates on the X axle motion slide rail and be connected with X axle motion linear electric motor's output, vacuum platform locates the one end of device bottom plate, the location cutter is located on the X axle motion bottom plate.

2. The IC positioning apparatus of claim 1, wherein: the positioning cutter is arranged in an L-shaped structure, one end of the long edge of the positioning cutter is arranged on the X-axis moving bottom plate, the movable end of the positioning cutter is positioned above the wafer tray, and the positioning cutter is provided with an X-direction air outlet and a Y-direction air outlet.

3. The IC positioning apparatus of claim 1, wherein: and a Y-axis motion encoder is arranged on the device bottom plate and is electrically connected with the Y-axis motion linear motor.

4. The IC positioning apparatus of claim 1, wherein: and an X-axis motion encoder is arranged on the Y-axis motion base plate and is electrically connected with the X-axis motion linear motor.

5. An IC positioning apparatus as recited in claim 2, wherein: the width of the gap between the positioning cutter and the vacuum platform is smaller than the thickness of the IC chip.

6. The IC positioning apparatus of claim 1, wherein: the X-axis moving slide rail and the Y-axis moving slide rail are arranged vertically.