CN212859972U - Knife sharpening device and wafer cutting machine - Google Patents
Knife sharpening device and wafer cutting machine Download PDFInfo
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- CN212859972U CN212859972U CN202020702065.1U CN202020702065U CN212859972U CN 212859972 U CN212859972 U CN 212859972U CN 202020702065 U CN202020702065 U CN 202020702065U CN 212859972 U CN212859972 U CN 212859972U
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Abstract
The application discloses a knife sharpening device and a wafer cutting machine, wherein the knife sharpening device comprises a fixed support, a knife sharpening board carrying platform and a guide rail, wherein the fixed support is provided with at least one knife sharpening board carrying platform, and a first surface of the knife sharpening board carrying platform is used for fixing a knife sharpening stone; the fixed support can move along the axial direction of the guide rail, so that the knife sharpening plate carrying platform moves to the position of the blade, and the knife sharpening operation is carried out through the knife sharpening stone. The knife sharpening device has wide application range, and can be used for sharpening, so that the working efficiency of the blade type cutting machine can be improved.
Description
Technical Field
The invention relates to the technical field of machining, in particular to a knife sharpening device and a wafer cutting machine.
Background
The blade type cutting machine is a common machining apparatus in machining processes, for example, in semiconductor manufacturing, wafer cutting is an important process in a chip packaging process, the wafer cutting process is generally completed by the wafer cutting machine, and the wafer cutting process mainly includes blade sharpening operation and wafer cutting operation which are performed alternately.
The wafer cutting machine generally comprises a case, a workbench, blades, blade fixing rods and a connecting piece. In the wafer cutting process, when the blade sharpens the knife, a sharpening plate needs to be placed on the workbench to sharpen the blade, the sharpening operation is completed, the sharpening plate is moved away, and then the wafer is placed on the workbench to cut the wafer, so that the wafer cutting machine is low in working efficiency.
Disclosure of Invention
In view of the above-mentioned drawbacks and deficiencies of the prior art, it is desirable to provide a knife sharpening device and a wafer cutting machine that can improve the working efficiency of the blade cutting machine.
In a first aspect, an embodiment of the present application provides a knife sharpening device, including: a fixed bracket, a knife sharpening board carrying platform and a guide rail,
the fixed support is provided with at least one knife sharpening plate carrying platform, and the first surface of the knife sharpening plate carrying platform is used for fixing a knife sharpening stone;
the fixed support can move along the axial direction of the guide rail, so that the knife sharpening plate carrying platform moves to the position of the blade, and the knife sharpening operation is carried out through the knife sharpening stone.
In a second aspect, an embodiment of the present application provides a wafer cutting machine, including: a frame, a workbench, at least one blade, a blade fixing rod, at least one connecting piece and a knife sharpening device as the first aspect,
the guide rail of the knife grinder is fixedly connected with the rack, the workbench is movably connected with the rack, two ends of the blade fixing rod are fixedly connected with the rack, at least one end of each connecting piece is connected with the blade fixing rod, and the other end of each connecting piece is movably connected with the through hole in the center of the blade.
The technical scheme provided by the embodiment of the application can have the following beneficial effects:
the knife sharpening device comprises a fixed support, a knife sharpening board carrying platform and a guide rail, wherein the fixed support is provided with at least one knife sharpening board carrying platform, and a first surface of the knife sharpening board carrying platform is used for fixing a knife sharpening stone; the fixed support can move along the axial direction of the guide rail, so that the knife sharpening plate carrying platform moves to the position of the blade, and the knife sharpening operation is carried out through the knife sharpening stone. The knife sharpening device has wide application range, and can be used for sharpening, so that the working efficiency of the blade type cutting machine can be improved.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:
fig. 1 is a schematic mechanical diagram of a wafer cutting apparatus provided in the related art;
fig. 2 is a schematic structural view of a knife sharpening device according to an embodiment of the present application;
fig. 3 is a schematic cross-sectional view of a knife sharpening board carrying platform in the knife sharpening device according to the embodiment of the present application;
fig. 4 is a schematic structural diagram of a first surface of a carrier of a sharpening plate in the sharpening device according to the embodiment of the present application;
fig. 5 is a schematic structural diagram of a first surface of a carrier of another sharpening plate in the sharpening device according to the embodiment of the present application;
fig. 6 is a schematic cross-sectional view of another knife sharpening board carrying platform in the knife sharpening device provided in the embodiment of the present application;
FIG. 7 is a schematic cross-sectional view of a further knife sharpening board carrying platform in the knife sharpening device according to the embodiment of the present application;
FIG. 8 is a schematic view of a fixing bracket of the knife sharpener of the present application;
FIG. 9 is a schematic structural diagram of a guide rail of the knife sharpening device according to the embodiment of the present application;
FIG. 10 is a schematic view of another guide rail of the knife sharpening device according to the embodiment of the present application;
FIG. 11 is a schematic structural view of another guide rail of the knife sharpening device according to the embodiment of the present application;
fig. 12 is a schematic structural diagram of a wafer cutting machine according to an embodiment of the present application;
fig. 13 is a schematic structural diagram of another wafer cutting machine according to an embodiment of the present application.
Detailed Description
The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and not restrictive of the invention. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.
As shown in fig. 1, a wafer cutting machine 1 provided in the prior art may include a frame 10, a worktable 11, a blade 12, a blade fixing rod 13, and a connecting member 14, wherein the worktable 11 is movably connected to the frame 10, and two ends of the blade fixing rod 13 are fixedly connected to the frame 10; one end of the connecting piece 14 is connected with the blade fixing rod 12, and the other end of the connecting piece 14 is movably connected with a through hole in the center of the blade 12, and the blade can be a circular blade.
In the wafer cutting process, when the wafer cutting operation is carried out, the wafer can be placed on the workbench, and the workbench is moved to the position of the blade to carry out the wafer cutting operation; when the knife sharpening stone is needed to be determined, the workbench is moved to a position far away from the position of the blade, the wafer is taken down from the workbench, the knife sharpening stone is placed on the workbench, and then the workbench is moved to the position of the blade to sharpen the knife.
In the process, the wafer cutting operation and the knife grinding operation are required to be completed on the workbench, the time required in the process of handing over the wafer cutting operation and the knife grinding operation is long, and the working efficiency is low; and when the knife sharpening operation is carried out, the knife sharpening stone placed on the workbench needs to be pasted with the scribing film, so that the scribing film is wasted.
The embodiment of the present application provides a knife sharpening device, this knife sharpening device can be applied to and carry out the operation of whetting a knife in various blade formula cutting machines, as shown in fig. 2, this knife sharpening device includes: a fixed support 21, a sharpening board carrier 22 and a guide rail 23,
at least one sharpening board carrying platform 22 is arranged on the fixed support 21, a first surface A1 of the sharpening board carrying platform 22 is used for fixing a sharpening stone, and the sharpening board carrying platform 22 is movably connected or fixedly connected with the fixed support 21;
the fixed support 21 can move axially along the guide rail 23, so that the knife sharpening plate carrier 22 can move to the position of the blade in the wafer cutting process, and the knife sharpening operation can be carried out through the knife sharpening stone. The knife sharpening device has wide application range and strong operability. For example, the knife grinding device can be applied to a wafer cutting machine in a semiconductor processing technology, and the knife grinding device is used for grinding the knife, so that the time required by the handover process of the wafer cutting operation and the knife grinding operation is reduced, and the working efficiency of the wafer cutting machine is improved.
And (4) optional. This knife sharpening device still includes: the first vacuum controller and the first air pipe, the sharpening board carrying platform is of a plate-shaped structure, as shown in fig. 3, fig. 3 is a schematic cross-sectional view of the sharpening board carrying platform in the sharpening device, at least one first opening k1 may be provided on a first surface a1 of the sharpening board carrying platform 22, a second opening k2 is provided on a second surface a2 of the sharpening board carrying platform 22, and the first surface of the sharpening board carrying platform and the second surface of the sharpening board carrying platform may be two surfaces that are oppositely arranged on the sharpening board carrying platform.
The second opening k2 is connected with the first end of the first vacuum controller 24 and the first air pipe 25, the second end of the first air pipe 25 is connected with the outside vacuum box, the first opening and the second opening are communicated to form a space for air circulation, compressed air is conveyed into the knife sharpening plate carrying platform by controlling the on-off of the first vacuum controller, and the knife sharpening stone is fixedly placed on the first surface. In order to ensure the airtightness of the sharpening board carrier, it is preferable that the material of the sharpening board carrier may be ceramic. Wherein, the vacuum box can be used for providing a device for compressed gas in the blade type cutting machine.
In the embodiments of the present application, the shape and the number of the first openings provided on the first surface of the sharpening board carrier can be determined based on actual needs, and the embodiments of the present application do not limit this. For example, fig. 4 shows a schematic structural diagram of a first surface of a sharpening board carrier in a sharpening device, wherein first openings k1 provided on the first surface a1 of the sharpening board carrier are rectangular in shape and four in number; fig. 5 shows a schematic structural diagram of a first surface of a sharpening board carrier in a sharpening device, wherein the first openings k1 provided on the first surface a1 of the sharpening board carrier are circular, and nine openings are provided, so that the first openings and the second openings on the sharpening board carrier can be communicated to form a space for air circulation.
Optionally, as shown in fig. 6, fig. 6 shows a schematic cross-sectional view of another sharpening plate carrying table in the knife sharpening device, a first groove C1 is arranged on a first surface a1 of the sharpening plate carrying table 22, and the first groove is used for clamping a sharpening stone, so that the stability of the sharpening stone placed on the first surface of the sharpening plate carrying table can be further improved, and the sharpening stone is prevented from being easily separated from the sharpening plate carrying table. It should be noted that, when the sharpening board carrying stage is the sharpening board carrying stage as shown in fig. 3, at least one first opening on the first surface of the sharpening board carrying stage is disposed on the groove surface of the first groove.
Optionally, the fixed support is a plate-shaped structure or a ring-shaped structure (as shown in fig. 2), the sharpening plate carrier and the fixed support can be movably connected or fixedly connected, and the material of the fixed support can be metal and alloy material. When the fixed bracket is movably connected to the sharpening board carrier, as shown in fig. 7, fig. 7 is a schematic cross-sectional view of another sharpening board carrier in the sharpening device, the second surface a2 of the sharpening board carrier 22 is provided with a second groove C2, the sharpening board carrier is clamped on the fixed bracket through the second groove, and the sharpening board carrier can move along the axial direction of the fixed bracket. The shape of the groove is the same as the shape of the cross section of the fixing support perpendicular to the axial direction of the fixing support. In order to reduce the friction resistance when the sharpening board carrier moves on the fixing support, preferably, the fixing support is of an annular structure, and the cross section of the fixing support perpendicular to the axial direction of the fixing support is circular, then the second surface of the sharpening board carrier is provided with two semicircular grooves, and the sharpening board carrier is clamped on the fixing support of the annular structure through the two semicircular second grooves.
Preferably, the fixed support is an air cushion support. The apparatus may further include a third vacuum controller and a third air tube. Fig. 8 is a schematic view of a fixing bracket of the knife sharpening device, as shown in fig. 8. The fixing support is of an annular structure, a third opening k3 can be formed in the fixing support 21, the third opening is connected with a first end of a k3 third air pipe 26 and a third vacuum controller 27, a second end of the third air pipe 26 is connected with an external vacuum box, an air hole is formed in the position where the fixing support and the sharpening plate carrier are connected in a clamped mode, compressed air is conveyed into the fixing support through controlling the on-off of the vacuum controller, the compressed air overflowing from the air hole of the fixing support can enable the fixing support to be far away from the sharpening plate carrier, and the sharpening plate carrier can move along the axial direction of the fixing support.
In the embodiment of the present application, the guide rail provided in the knife sharpening device may be a strip structure, as shown in fig. 2, the fixing bracket 21 is lapped on one surface of the guide rail 23, and the fixing bracket can move axially along the contact surface of the fixing bracket and the guide rail, so as to change the position of the knife sharpening plate carrier; or, two guide rails may be provided in the knife sharpening device, and the opposite surfaces of the two guide rails are respectively provided with a third groove, as shown in fig. 9, fig. 9 is a schematic structural view of one guide rail in the knife sharpening device, the guide rail 23 is provided with a third groove C3, two ends of the fixing bracket are clamped in the third groove, and the fixing bracket can move in the third groove along the axial direction of the guide rail, so as to change the position of the knife sharpening plate carrier.
Preferably, the apparatus may further comprise: a second air pipe and a second vacuum controller. When the guide rail in the knife sharpening device provided in the embodiment of the invention is the guide rail structure in fig. 2, as shown in fig. 10, fig. 10 is a schematic structural diagram of another guide rail in the knife sharpening device, the guide rail 23 may be provided with a fourth opening k4, the fourth opening is connected to a first end of a second air pipe 28 and a second vacuum controller 29, a second end of the second air pipe 28 is connected to an external vacuum box, the guide rail is provided with an air hole on a surface overlapping with the fixed bracket, and by controlling on/off of the vacuum controller to deliver compressed air into the guide rail, the compressed air overflowing from the air hole of the guide rail can prevent the fixed bracket from contacting with the guide rail and make the fixed bracket move along the axial direction of the guide rail.
When the guide rail in the knife sharpening device provided in the embodiment of the invention is the guide rail structure in fig. 9, as shown in fig. 11, fig. 11 is a schematic structural diagram of another guide rail in the knife sharpening device, the guide rail may be provided with a fourth opening k4, the fourth opening is connected to the first end of the second air pipe 28 and the second vacuum controller 29, the second end of the second air pipe 28 is connected to an external vacuum box, the third groove is provided with an air hole, compressed air is delivered into the guide rail by controlling the on-off state of the vacuum controller, and the compressed air overflowing from the air hole of the guide rail can prevent the fixing bracket from contacting with the guide rail and make the fixing bracket move along the axial direction of the guide rail.
Optionally, the apparatus may further include: and the display can be arranged on the guide rail and can be electrically connected with the first vacuum controller, the second vacuum controller and/or the third vacuum controller, and the display is used for displaying the vacuum value in the knife sharpening board carrying platform, the fixed support and/or the guide rail. The first, second, and/or third vacuum controllers may be controlled to adjust the amount of compressed gas based on the vacuum value.
In summary, the knife sharpening device provided by the embodiment of the application comprises a fixed support, a knife sharpening board carrying platform and a guide rail, wherein the fixed support is provided with at least one knife sharpening board carrying platform, and a first surface of the knife sharpening board carrying platform is used for fixing a knife sharpening stone; the fixed support can move along the axial direction of the guide rail, so that the knife sharpening plate carrying platform moves to the position of the blade, and the knife sharpening operation is carried out through the knife sharpening stone. The knife sharpening device has wide application range, and can be used for sharpening, so that the working efficiency of the blade type cutting machine can be improved.
The embodiment of the present application provides a wafer cutting machine 1, as shown in fig. 12, including: the device comprises a frame 10, a workbench 11, at least one blade 12, a blade fixing rod 13, at least one connecting piece 14 and the knife sharpening device 2 provided by the embodiment of the application.
The guide rail 23 of the knife sharpening device is fixedly connected with the frame 10, the workbench 11 is movably connected with the frame 10, the workbench can move along the axial direction of the guide rail, and two ends of the blade fixing rod 13 are fixedly connected with the frame 10; one end of at least one connecting piece 14 is connected with blade dead lever 12, and the other end of every connecting piece 14 and the through-hole swing joint in blade 12 center, this blade can be circular blade, do rotary motion through controlling this blade and carry out wafer cutting operation or the operation of whetting a knife, and wherein, the setting position of workstation 11 is close to the first face B in frame 10, the chip ejection of compact that obtains in the wafer cutting process of being convenient for.
It should be noted that, in the wafer cutting machine provided in the embodiment of the present application, the types of the blades correspond to the types of the whetstones one by one, and when the wafer cutting machine has two blades and the sharpener includes a whetstone carrying platform, the whetstone carrying platform needs to be movably connected to the fixed support, and if the types of the two blades are the same, the whetstone placed on the whetstone carrying platform does not need to be replaced during the sharpening operation, and the sharpening operation of the multiple blades is realized by changing the positions of the whetstone carrying platform on the fixed support; if these two blade models are different, at the operation in-process of whetting a knife, place the whetstone on this whetstone board microscope carrier and need change, the accessible changes the whetstone operation of the position realization a plurality of blades of whetting a knife board microscope carrier on the fixed bolster. When wafer cutting machine has two blades, and knife sharpening device includes two knife sharpening board carriers, this knife sharpening board carrier can with fixed bolster fixed connection, if these two blade models are the same, place the whetstone on every knife sharpening board carrier the same, if these two blade models are inequality, when the fixed bolster along guide rail axial displacement to blade place department, the model and the blade model of the whetstone of placing on the knife sharpening board carrier need the one-to-one.
In the wafer cutting process, when the wafer cutting operation is performed, the positions of the parts in the wafer cutting machine are as shown in fig. 12, the wafer is placed on the worktable 11, and the worktable 11 moves to the position of the blade to perform the wafer cutting operation; when the position of each part in the wafer cutting machine, which needs to grind the knife stone, is determined as shown in fig. 13, the position of the workbench 11 far away from the blade is located, and the knife grinding plate carrier 22 moves to the position of the blade through the guide rail 23 to carry out knife grinding operation; in the wafer cutting machine, the knife stone placed on the knife grinding plate loading platform does not need to be pasted with a scribing film, so that the scribing film can be saved, and the wafer processing cost is reduced.
To sum up, the wafer cutting device provided by the embodiment of the present application includes: the knife sharpening device comprises a rack, a workbench, at least one blade, a blade fixing rod, at least one connecting piece and the knife sharpening device provided by the embodiment of the application. In the wafer cutting process, the knife grinding operation is carried out on the knife grinding plate carrying platform, the time consumption of the wafer cutting operation and knife grinding operation handover process is short, and the working efficiency of the wafer cutting machine can be improved; the knife stone placed on the knife grinding plate carrying platform does not need to be pasted with a scribing film, so that the scribing film can be saved, and the wafer processing cost is reduced.
The embodiment of the application provides a wafer cutting method, which is applied to a wafer cutting machine provided by the embodiment of the application and comprises the following steps:
controlling the fixed support to move axially along the guide rail so as to enable the knife sharpening board carrying platform to move to the position where the blade is located; carrying out knife sharpening operation by utilizing a knife sharpening stone fixed on the knife sharpening plate carrying platform; after the knife sharpening operation is finished, the fixed support is controlled to move axially along the guide rail, so that the knife sharpening board carrying platform is far away from the position of the blade; controlling the workbench with the wafer to be cut to move to the position of the blade, and controlling the blade to rotate to perform cutting operation; after the circumference of the blade rotates for a preset length, the workbench is controlled to be far away from the position of the blade; repeating the above operations until the wafer is cut. The blade is a circular blade, and the preset length can be determined based on actual needs, which is not limited in the embodiment of the application.
In summary, the wafer cutting method provided by the embodiment of the present application can control the fixed support to move axially along the guide rail, so that the knife sharpening board loading platform moves to the position of the blade; carrying out knife sharpening operation through a knife sharpening stone; after the knife sharpening operation is finished, the fixed support is controlled to move axially along the guide rail, so that the knife sharpening board carrying platform is far away from the position of the blade; controlling the workbench with the wafer to be cut to move to the position of the blade, and cutting the wafer to be cut; after the circumference of the blade rotates for a preset length, the workbench is controlled to be far away from the position of the blade; the above operations are repeated until the wafer cutting is finished, the knife grinding operation is carried out on the knife grinding plate carrying platform in the wafer cutting process, the time consumed in the handover process of the wafer cutting operation and the knife grinding operation is short, and the working efficiency of the wafer cutting machine can be improved.
The above description is only a preferred embodiment of the application and is illustrative of the principles of the technology employed. It will be appreciated by a person skilled in the art that the scope of the invention as referred to in the present application is not limited to the embodiments with a specific combination of the above-mentioned features, but also covers other embodiments with any combination of the above-mentioned features or their equivalents without departing from the inventive concept. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.
Claims (10)
1. A knife sharpening device, comprising: a fixed bracket, a knife sharpening board carrying platform and a guide rail,
the fixed support is provided with at least one knife sharpening plate carrying platform, and the first surface of the knife sharpening plate carrying platform is used for fixing a knife sharpening stone;
the fixed support can move axially along the guide rail, so that the knife sharpening board carrying platform moves to the position of the blade, and the knife sharpening operation is carried out through the knife sharpening stone.
2. The sharpener of claim 1, wherein the device further comprises: a first vacuum controller and a first air pipe,
the first surface of the knife sharpening board carrying platform is provided with at least one first opening, and the second surface of the knife sharpening board carrying platform is provided with a second opening;
the second opening is connected with the first vacuum controller and the first end of the first air pipe, the second end of the first air pipe is connected with an external vacuum box, the first opening is communicated with the second opening to form a space for air circulation, compressed air is conveyed into the knife sharpening board carrying platform by controlling the on-off of the first vacuum controller, and the knife sharpening stone placed on the first surface is fixed.
3. The knife sharpening device of claim 1 or 2, wherein a first groove is arranged on a first surface of the knife sharpening plate carrying platform and used for clamping a knife sharpening stone.
4. The knife sharpening device of claim 1 or 2, wherein the knife sharpening board carrying platform is movably or fixedly connected with the fixed support.
5. The knife sharpening device according to claim 4, wherein a second groove is formed on a second surface of the knife sharpening board carrier, the knife sharpening board carrier is clamped on the fixed support through the second groove, and the knife sharpening board carrier can move along the axial direction of the fixed support.
6. The sharpener of claim 1 wherein said mounting bracket is attached to one side of said rail.
7. The knife sharpening device according to claim 1, wherein the number of the guide rails is two, third grooves are respectively arranged on opposite surfaces of the two guide rails, and two ends of the fixing bracket are clamped in the third grooves.
8. The sharpener of claim 2, wherein the device further comprises: a second air pipe and a second vacuum controller,
the guide rail is provided with a fourth opening, the fourth opening is connected with the first end of the second air pipe and the second vacuum controller, the second end of the second air pipe is connected with an external vacuum box, the guide rail is provided with an air hole, and compressed air is conveyed into the guide rail by controlling the on-off of the second vacuum controller so as to control the fixed support to move along the axial direction of the guide rail.
9. The sharpener of claim 8, wherein the device further comprises: a display device is arranged on the base plate,
the display is electrically connected with the first vacuum controller or the second vacuum controller and used for displaying the vacuum value in the knife sharpening board carrying platform or the guide rail.
10. A wafer cutting machine, characterized by comprising: a frame, a table, at least one blade, a blade retaining bar, at least one connector and a knife sharpening device as claimed in any one of claims 1 to 8,
the guide rail of the knife sharpening device is fixedly connected with the rack, the workbench is movably connected with the rack, two ends of the blade fixing rod are fixedly connected with the rack, one end of at least one connecting piece is connected with the blade fixing rod, and the other end of each connecting piece is movably connected with a through hole in the center of the blade.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020702065.1U CN212859972U (en) | 2020-04-30 | 2020-04-30 | Knife sharpening device and wafer cutting machine |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020702065.1U CN212859972U (en) | 2020-04-30 | 2020-04-30 | Knife sharpening device and wafer cutting machine |
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| CN212859972U true CN212859972U (en) | 2021-04-02 |
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| CN202020702065.1U Active CN212859972U (en) | 2020-04-30 | 2020-04-30 | Knife sharpening device and wafer cutting machine |
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