CN212851581U - Combined heat dissipation structure - Google Patents
Combined heat dissipation structure Download PDFInfo
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- CN212851581U CN212851581U CN202022018155.1U CN202022018155U CN212851581U CN 212851581 U CN212851581 U CN 212851581U CN 202022018155 U CN202022018155 U CN 202022018155U CN 212851581 U CN212851581 U CN 212851581U
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- heat dissipation
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- heat conduction
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Abstract
The utility model discloses a combined heat dissipation structure, which is used for supporting a circuit board and dissipating heat for a first heating device and a second heating device, and comprises a first heat dissipation assembly, a second heat dissipation assembly and a liquid cooling radiator, wherein the first heat dissipation assembly comprises an insulating cover plate, an insulating heat conduction supporting piece and a heat conductor with a cavity; the second heat dissipation assembly comprises a heat conduction block and a fastener, and the second heating device is fixedly connected to the outer side face of the heat conduction block through the fastener; the top of the heat conductor and the heat conducting block are respectively provided with a connecting column for connecting the circuit board, and the bottom of the heat conductor and the bottom of the heat conducting block are respectively connected with the liquid cooling radiator. The structure is novel and simple, the processing and the manufacturing are convenient, and the heat dissipation effect is good; the installation is convenient, the batch production is easy, and the production cost is reduced.
Description
Technical Field
The utility model relates to a switching power supply technical field especially relates to a combination heat radiation structure.
Background
With the progress of science and technology and the development of electronic equipment, the demand on the power of the switching power supply is greater and greater, however, the large amount of heat generated during the working of the high-power switching power supply is an important link in the power supply design, and how to effectively and quickly dissipate the heat. At present, most of heat dissipation modes of high-power switching power supplies in the market use fans to directly blow heating devices for heat dissipation, and as is known, the fans directly blow the heating devices, so that the devices in electronic equipment are easily corroded, particularly in severe environments, and the failure rate caused by corrosion of the devices due to dust and salt mist is high.
Some liquid-cooled or indirect air-cooled switching power supplies are available in the market, but have the following disadvantages: 1. the switching power supply of the liquid cooling scheme has high cost, the cost is mainly reflected in the material cost of the radiator and the processing cost of the whole machine assembly, and the high processing cost is mainly caused by low degree of mass production of machines, manual welding and the like. 2. The heat dissipation effect is not good, which is mainly reflected in that the heat source is too concentrated, the heat source is not dispersed and spread on the heat sink substrate, the requirement on the local heat conduction capability of the heat sink substrate is high, and a plurality of super conductors are needed to diffuse heat to the periphery, so that the cost is high.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the technical problem that will solve is: the low-cost combined heat dissipation structure with good heat dissipation effect is provided.
In order to solve the technical problem, the utility model discloses a technical scheme be: a combined heat dissipation structure is used for supporting a circuit board and dissipating heat for a first heating device and a second heating device and comprises a first heat dissipation assembly, a second heat dissipation assembly and a liquid cooling radiator, wherein the first heat dissipation assembly comprises an insulating cover plate, an insulating heat conduction supporting piece and a heat conductor with a cavity, the first heating device and the insulating heat conduction supporting piece are respectively placed in the cavity, the insulating heat conduction supporting piece isolates the inner wall surface of the cavity from the first heating device, the insulating cover plate is arranged at the top of the heat conductor to seal the cavity, and insulating heat conduction filler is filled in the cavity; the second heat dissipation assembly comprises a heat conduction block and a fastener, and the second heating device is fixedly connected to the outer side face of the heat conduction block through the fastener; the top of heat conductor and heat conduction piece is equipped with the spliced pole of connecting the circuit board respectively, the bottom of heat conductor and heat conduction piece is connected respectively the liquid cooling radiator.
Furthermore, the heat dissipation device also comprises a heat conduction support, and the first heat dissipation assembly and the second heat dissipation assembly are respectively connected onto the heat conduction support.
Furthermore, the fastener is a first screw, a first screw hole matched with the first screw is formed in the heat conduction block, an accommodating groove is formed in the heat conduction block, the accommodating groove is communicated with the first screw hole and is located at one end, close to the second heating device, of the first screw hole, and an insulator is contained in the accommodating groove.
Further, the first screw penetrates the insulator.
Furthermore, an insulating heat conducting sheet is arranged between the second heating device and the heat conducting block.
Further, the number of the first heat dissipation assembly and/or the second heat dissipation assembly is multiple.
Furthermore, the heat conduction block is in a convex shape.
Furthermore, the insulating cover plate is detachably connected with the heat conductor.
Furthermore, the heat dissipation device also comprises an upper shell, wherein the first heat dissipation assembly, the second heat dissipation assembly and the circuit board are all located in the cage area of the upper shell.
Further, still include insulating heat conduction bullet pad, insulating heat conduction bullet pad is contradicted respectively the epitheca reaches the circuit board.
The beneficial effects of the utility model reside in that: the structure is novel and simple, and the processing and the manufacturing are convenient; the heat dissipation components on the circuit board are distributed in a dispersed manner, the overall heat dissipation effect of the combined heat dissipation structure is good, the heat dissipation performance of each of the first heat dissipation component and the second heat dissipation component is good, and the local heat dissipation effect of the combined heat dissipation structure is good; the installation is convenient, the batch production is easy to realize, and the production cost is reduced.
Drawings
Fig. 1 is a simplified schematic view of a combined heat dissipation structure according to a first embodiment of the present invention;
fig. 2 is a top view of a cavity in a liquid-cooled heat sink of a combined heat dissipation structure according to a first embodiment of the present invention;
fig. 3 is a side view of a liquid cooling radiator in a combined heat dissipation structure according to a first embodiment of the present invention.
Description of reference numerals:
1. a circuit board;
2. a first heat generating device;
3. a second heat generating device;
4. a liquid-cooled radiator; 41. a cavity; 42. a cover plate; 43. a flow channel; 44. a heat sink; 45. a boss; 46. a metal adapter;
5. a first heat dissipation assembly; 51. an insulating cover plate; 511. a first fastener; 52. an insulating thermally conductive support; 53. a heat conductor; 54. a chamber; 55. a second screw;
6. a second heat dissipation assembly; 61. a heat conducting block; 62. a fastener; 63. an insulator; 64. an insulating heat-conducting sheet; 65. a third screw;
7. connecting columns;
8. a thermally conductive support;
9. an upper shell;
10. insulating heat conduction bullet pad.
Detailed Description
In order to explain the technical content, the objects and the effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.
Referring to fig. 1 to 3, a combined heat dissipation structure for supporting a circuit board 1 and dissipating heat from a first heat generating device 2 and a second heat generating device 3 includes a first heat dissipation assembly 5, a second heat dissipation assembly 6 and a liquid-cooled heat sink 4, where the first heat dissipation assembly 5 includes an insulating cover plate 51, an insulating heat conduction support 52 and a heat conductor 53 having a cavity 54, the first heat generating device 2 and the insulating heat conduction support 52 are respectively disposed in the cavity 54, the insulating heat conduction support 52 isolates an inner wall surface of the cavity 54 from the first heat generating device 2, the insulating cover plate 51 is disposed on a top of the heat conductor 53 to seal the cavity 54, and the cavity 54 is filled with an insulating heat conduction filler; the second heat dissipation assembly 6 comprises a heat conduction block 61 and a fastener 62, and the second heating device 3 is fixedly connected to the outer side surface of the heat conduction block 61 through the fastener 62; the top of heat conductor 53 and heat conduction piece 61 is equipped with the connection of connection post 7 of circuit board 1 respectively, the bottom of heat conductor 53 and heat conduction piece 61 is connected respectively liquid cooling radiator 4.
From the above description, the beneficial effects of the present invention are: the structure is novel and simple, and the processing and the manufacturing are convenient; the heat dissipation components on the circuit board 1 are distributed in a dispersed manner, the overall heat dissipation effect of the combined heat dissipation structure is good, the heat dissipation performance of the first heat dissipation component and the heat dissipation performance of the second heat dissipation component are good, and the local heat dissipation effect of the combined heat dissipation structure is good; the installation is convenient, the batch production is easy to realize, and the production cost is reduced.
Further, the heat dissipation device further comprises a heat conduction support 8, and the first heat dissipation assembly 5 and the second heat dissipation assembly 6 are respectively connected to the heat conduction support 8.
From the above description, the heat conducting support 8 can connect the first and second heat dissipating assemblies into a whole, so that the combined heat dissipating structure is compact in overall structure, firm and reliable.
Further, the fastening member 62 is a first screw, the heat conducting block 61 is provided with a first screw hole matched with the first screw, the heat conducting block 61 is provided with an accommodating groove, the accommodating groove is communicated with the first screw hole and is located at one end of the first screw hole close to the second heating device 3, and an insulator 63 is arranged in the accommodating groove.
As apparent from the above description, the provision of the insulator 63 can increase the creepage distance of the second heat generating device 3, thereby improving the safety of use of the combined heat dissipating structure.
Further, the first screw penetrates the insulator 63.
As can be seen from the above description, the insulator 63 is annular, so that the assembly is convenient, the assembly efficiency is improved, and the assembly cost is reduced.
Further, an insulating heat conduction sheet 64 is disposed between the second heat generating device 3 and the heat conduction block 61.
As is apparent from the above description, the insulating heat conductive sheet 64 can more quickly transfer the heat generated by the second heat generating component 3 to the heat conductive block 61, thereby improving the heat dissipation performance.
Further, the number of the first heat dissipation assembly 5 and/or the second heat dissipation assembly 6 is plural.
From the above description, the specific number of the first and second heat dissipation assemblies can be set as required, and the practicability and diversity of the combined heat dissipation structure are improved.
Further, the heat conduction block 61 is in a convex shape.
As can be seen from the above description, the heat conduction block 61 in the shape of a Chinese character 'tu' has a large surface area, and can further improve the heat dissipation effect of the second heat dissipation assembly 6.
Further, the insulating cover plate 51 is detachably connected to the heat conductor 53.
As can be seen from the above description, the insulating cover plate 51 and the heat conducting block 61 are convenient to disassemble and assemble, which is beneficial to improving the heat dissipation effect and facilitating the later maintenance.
Further, the heat dissipation device further comprises an upper shell 9, and the first heat dissipation assembly 5, the second heat dissipation assembly 6 and the circuit board 1 are all located in a cage area of the upper shell 9.
As can be seen from the above description, the upper case 9 can protect the first heat sink 5, the second heat sink 6 and the circuit board 1, which is beneficial to prolonging the service life of the combined heat sink structure. As will be readily appreciated, the upper housing 9 may be an outer housing of a switching power supply.
Further, the heat-insulation circuit board further comprises an insulating heat-conduction elastic pad 10, and the insulating heat-conduction elastic pad 10 abuts against the upper shell 9 and the circuit board 1 respectively.
As is apparent from the above description, the upper case 9 can function to conduct heat away from the circuit board 1, further improving heat dissipation performance.
Example one
Referring to fig. 1 to fig. 3, a first embodiment of the present invention is: as shown in fig. 1, a combined heat dissipation structure for supporting a circuit board 1 and dissipating heat from a first heat generating device 2 and a second heat generating device 3 includes a liquid-cooled heat sink 4, one or more first heat dissipation assemblies 5 and one or more second heat dissipation assemblies 6, wherein the first heat dissipation assembly 5 includes an insulating cover plate 51, an insulating heat-conducting support member 52 and a heat conductor 53 having a cavity 54, the first heat generating device 2 and the insulating heat-conducting support member 52 are respectively disposed in the cavity 54, the insulating heat-conducting support member 52 isolates an inner wall surface of the cavity 54 from the first heat generating device 2, the insulating cover plate 51 is disposed on a top of the heat conductor 53 to seal the cavity 54, and the cavity 54 is filled with an insulating heat-conducting filler (not shown); the second heat dissipation assembly 6 comprises a heat conduction block 61 and a fastener 62, and the second heating device 3 is fixedly connected to the outer side surface of the heat conduction block 61 through the fastener 62; the tops of the heat conductor 53 and the heat conducting block 61 are respectively provided with a connecting column 7 connected with the circuit board 1, and the bottoms of the heat conductor 53 and the heat conducting block 61 are respectively connected with the liquid cooling radiator 4; still include heat conduction support 8, first radiator unit 5 and second radiator unit 6 are connected respectively on heat conduction support 8, so can strengthen combination heat radiation structure's bulk strength, make circuit board 1 non-deformable lead to damaging. Optionally, the connecting column 7 on the heat conductor 53 is a screw column for mounting a screw, and the connecting column 7 on the heat conducting block 61 is a positioning column.
Optionally, the heat conductor 53 is a die casting, and the material of the heat conductor 53 is an aluminum alloy, such as an aluminum alloy under the trade name 6063; the insulating cover plate 51 and the insulating heat-conducting supporting piece 52 are respectively made of high-temperature-resistant plastic; the insulating heat-conducting filler is 1: 1 bi-component addition type liquid electronic encapsulation silica gel; the heat conducting block 61 is made of aluminum alloy, such as aluminum alloy with the trade mark 6063; the heat-conducting bracket 8 is a heat-conducting metal bracket, such as an aluminum alloy bracket; the first heat generating device 2 is a magnetic element such as a transformer, an inductor, etc., and the second heat generating device 3 is a power tube such as a diode, etc.
In this embodiment, the fastening member 62 is a first screw, the heat conducting block 61 is provided with a first screw hole matched with the first screw, in order to improve the use safety, the heat conducting block 61 is provided with a containing groove, the containing groove is communicated with the first screw hole and is located at one end of the first screw hole close to the second heating device 3, an insulator 63 is contained in the containing groove, optionally, the insulator 63 is an insulating ring, the first screw penetrates through the insulator 63, and the insulator 63 is a high temperature resistant plastic member. In other embodiments, the fastener 62 may also be a spring plate or the like.
Preferably, an insulating heat conducting sheet 64 is disposed between the second heat generating device 3 and the heat conducting block 61, the first screw penetrates through the insulating heat conducting sheet 64, and at this time, two ends of the insulator 63 respectively abut against the insulating heat conducting sheet 64 and the heat conducting block 61. The insulating heat conducting sheet 64 may be an alumina and silica gel composite sheet (such as a K-10 heat conducting pad), a metal oxide sheet (such as an alumina ceramic substrate), or others.
In order to improve the heat conduction effect of the heat conduction block 61, in the embodiment, the heat conduction block 61 is in a convex shape.
In order to facilitate disassembly and assembly and maintenance, the insulating cover plate 51 is detachably connected with the heat conductor 53, optionally, the insulating cover plate 51 is connected with the heat conductor 53 in a fastening manner, specifically, a first fastening piece 511 is arranged on the insulating cover plate 51, and a second fastening piece matched with the first fastening piece 511 is arranged on the heat conductor 53.
The heat dissipation structure further comprises an upper shell 9, and the first heat dissipation assembly 5, the second heat dissipation assembly 6 and the circuit board 1 are located in a cage area of the upper shell 9. Preferably, the heat-insulating and heat-conducting circuit board further comprises an elastic insulating and heat-conducting pad 10, and the elastic insulating and heat-conducting pad 10 abuts against the upper shell 9 and the circuit board 1 respectively. Optionally, the insulating heat-conducting elastic pad 10 is a heat-conducting silica gel pad.
Optionally, the insulating heat-conducting supporting element 52 is a base body for supporting the first heat-generating device 2, the base body includes a frame body, a rib and a third fastener, the rib and the third fastener are respectively disposed on the frame body, the rib is located in the hollow area of the frame body, and the third fastener is used for fastening and fixing the first heat-generating device 2. The insulating heat-conducting support member 52 with such a structure not only has less production consumables and is beneficial to cost control, but also is convenient for the heat generated by the first heating member to be quickly transferred to the heat conductor 53, and the heat transfer path can not be obstructed.
As shown in fig. 1, the heat conductor 53 is fixedly connected to the liquid-cooled heat sink 4 by a second screw 55, and the heat conducting block 61 is fixedly connected to the liquid-cooled heat sink 4 by a third screw 65. Referring to fig. 2 and 3, the liquid-cooled heat sink 4 includes a cavity 41 and a cover plate 42 connected to each other, a flow channel 43 is disposed in the cavity 41, a plurality of heat dissipation areas are disposed in the flow channel 43, a plurality of heat dissipation fins 44 and a plurality of bosses 45 are disposed in the heat dissipation areas, the bosses 45 are disposed in the flow channel 43, the second screws 55 and the third screws 65 respectively penetrate through the bosses 45, the heat dissipation fins 44 can increase heat dissipation area and improve heat dissipation performance, the outer side surface of the cover plate 42 is a heat conduction surface in contact with the heat conduction block 61 and the heat conductor 53, two ends of the flow channel 43 are respectively connected to a metal adapter 46, and the metal adapter 46 is communicated with the outside. In detail, the cavity 41 and the cover plate 42 are vacuum brazed, and the heat sink 44 is welded to the cavity 41. Preferably, the heat sink 44 abuts the cover plate 42, such that the heat sink 44 also serves to reinforce the structural strength of the liquid-cooled heat sink 4. Optionally, the cover plate 42 and the cavity 41 are made of 3-series aluminum alloy, the thickness of the cover plate 42 is 4mm, and the depth of the hollow area of the cavity 41 is 2 mm.
In this embodiment, the first heat dissipation assembly 5 and the second heat dissipation assembly 6 are connected to the same liquid cooling heat sink 4, so that the integrity of the combined heat dissipation structure can be improved and the assembly is convenient. In other embodiments, the first heat sink assembly 5 and the second heat sink assembly 6 may be connected to different liquid-cooled heat sinks 4.
In summary, the combined heat dissipation structure provided by the utility model has novel and simple structure and is convenient for processing and manufacturing; the heat dissipation components on the circuit board are distributed in a dispersed manner, the overall heat dissipation effect of the combined heat dissipation structure is good, the heat dissipation performance of each of the first heat dissipation component and the second heat dissipation component is good, and the local heat dissipation effect of the combined heat dissipation structure is good; the installation is convenient, the batch production is easy to realize, and the production cost is reduced.
The above mentioned is only the embodiment of the present invention, and not the limitation of the patent scope of the present invention, all the equivalent transformations made by the contents of the specification and the drawings, or the direct or indirect application in the related technical field, are included in the patent protection scope of the present invention.
Claims (10)
1. The utility model provides a combination heat radiation structure for support circuit board and for first heating device and the heat dissipation of second heating device, its characterized in that: the heat radiator comprises a first heat radiating assembly, a second heat radiating assembly and a liquid cooling radiator, wherein the first heat radiating assembly comprises an insulating cover plate, an insulating heat conduction supporting piece and a heat conductor with a cavity, a first heating device and the insulating heat conduction supporting piece are respectively placed in the cavity, the insulating heat conduction supporting piece isolates the inner wall surface of the cavity from the first heating device, the insulating cover plate is arranged at the top of the heat conductor to seal the cavity, and insulating heat conduction filler is filled in the cavity; the second heat dissipation assembly comprises a heat conduction block and a fastener, and the second heating device is fixedly connected to the outer side face of the heat conduction block through the fastener; the top of heat conductor and heat conduction piece is equipped with the spliced pole of connecting the circuit board respectively, the bottom of heat conductor and heat conduction piece is connected respectively the liquid cooling radiator.
2. The combination heat dissipation structure of claim 1, wherein: the heat dissipation structure is characterized by further comprising a heat conduction support, and the first heat dissipation assembly and the second heat dissipation assembly are connected to the heat conduction support respectively.
3. The combination heat dissipation structure of claim 1, wherein: the fastener is a first screw, a first screw hole matched with the first screw is formed in the heat conduction block, an accommodating groove is formed in the heat conduction block, the accommodating groove is communicated with the first screw hole and is located at one end, close to the second heating device, of the first screw hole, and an insulator is contained in the accommodating groove.
4. The combination heat dissipation structure of claim 3, wherein: the first screw penetrates the insulator.
5. The combination heat dissipation structure of claim 1, wherein: and an insulating heat conducting sheet is arranged between the second heating device and the heat conducting block.
6. The combination heat dissipation structure of claim 1, wherein: the number of the first heat dissipation assembly and/or the second heat dissipation assembly is multiple.
7. The combination heat dissipation structure of claim 1, wherein: the heat conduction block is in a convex shape.
8. The combination heat dissipation structure of claim 1, wherein: the insulating cover plate is detachably connected with the heat conductor.
9. The combination heat dissipation structure of claim 1, wherein: the heat dissipation structure comprises a circuit board and is characterized by further comprising an upper shell, wherein the first heat dissipation assembly, the second heat dissipation assembly and the circuit board are all located in a cage cover area of the upper shell.
10. The combination heat dissipation structure of claim 9, wherein: still include insulating heat conduction bullet pad, insulating heat conduction bullet pad is contradicted respectively the epitheca reaches the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022018155.1U CN212851581U (en) | 2020-09-15 | 2020-09-15 | Combined heat dissipation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022018155.1U CN212851581U (en) | 2020-09-15 | 2020-09-15 | Combined heat dissipation structure |
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| Publication Number | Publication Date |
|---|---|
| CN212851581U true CN212851581U (en) | 2021-03-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022018155.1U Active CN212851581U (en) | 2020-09-15 | 2020-09-15 | Combined heat dissipation structure |
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| CN (1) | CN212851581U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113825343A (en) * | 2021-11-23 | 2021-12-21 | 华海通信技术有限公司 | Be applied to high-pressure optical communication equipment's insulating heat-transfer device |
-
2020
- 2020-09-15 CN CN202022018155.1U patent/CN212851581U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113825343A (en) * | 2021-11-23 | 2021-12-21 | 华海通信技术有限公司 | Be applied to high-pressure optical communication equipment's insulating heat-transfer device |
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