CN212846683U - Computer constant temperature subassembly - Google Patents
Computer constant temperature subassembly Download PDFInfo
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- CN212846683U CN212846683U CN202021756703.4U CN202021756703U CN212846683U CN 212846683 U CN212846683 U CN 212846683U CN 202021756703 U CN202021756703 U CN 202021756703U CN 212846683 U CN212846683 U CN 212846683U
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Abstract
The utility model discloses a computer constant temperature subassembly, including semiconductor refrigerator, mainboard and driving motor, the top fixedly connected with mount pad of mainboard, and the inboard of mount pad installs CPU, the inboard fixedly connected with constant temperature equipment of the CPU outside mount pad, constant temperature equipment's inboard fixedly connected with runs through a section of thick bamboo, the filter screen is all installed to the both sides that run through a section of thick bamboo inner wall, the conducting strip is evenly installed to the outer wall that runs through a section of thick bamboo, the both sides inner wall that runs through a section of thick bamboo top all evenly is provided with the exhaust vent, and the equal movable hinge of inner wall of exhaust vent has dust blocking mechanism. The utility model discloses a moving plate is removed simultaneously to the outside, and first reset spring and second reset spring are simultaneously by extrusion deformation, and the fixture block removes the inside that breaks away from the draw-in groove simultaneously to be convenient for open thermostatic device fast and overhaul CPU.
Description
Technical Field
The utility model relates to a computer constant temperature technical field specifically is a computer constant temperature subassembly.
Background
The application of computers is more and more common in China, after the innovation is opened, the number of computer users in China is continuously increased, the application level is continuously improved, chips in the computers are made of semiconductor materials, the computers need to be kept at constant temperature, the electronic performance stability of the semiconductors can be influenced due to the fact that the semiconductor materials of the chips are low in purity and slightly change in temperature, the temperature needs to be kept constant, dust in the computers is reduced, the precise contact and corrosion resistance of the whole machine and a circuit are mainly protected, any electronic product is expected to be used in a dust-free environment, and the computer is not only a computer and is beneficial to the working stability and the service life of the computer.
With the continuous installation and use of the computer constant temperature component, the following problems are found in the use process:
1. some current computer constant temperature subassemblies do not have the structure of dismantling the constant temperature subassembly fast at the in-process of daily use to be inconvenient for overhaul CPU.
2. And the computer constant temperature component does not have a dust removal structure in the use process, thereby causing dust deposition inside the computer and influencing the internal work.
3. And the computer constant temperature subassembly is in the use, and inside temperature is not convenient for adjust, can not reach the homothermal effect.
There is a need to design a computer thermostat assembly that addresses the above-mentioned problems.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a computer constant temperature subassembly to it does not have the problem of being convenient for adjust to dismantle fast, remove dust and temperature to constant temperature subassembly to propose a current computer constant temperature subassembly among the solution above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a computer constant temperature subassembly, includes semiconductor cooler, mainboard and driving motor, the top fixedly connected with mount pad of mainboard, and the inboard of mount pad installs CPU, the inboard fixedly connected with constant temperature equipment of the CPU outside mount pad, the inside top fixedly connected with singlechip of constant temperature equipment, constant temperature equipment's inboard fixedly connected with runs through a section of thick bamboo, the outer wall that runs through a section of thick bamboo both sides constant temperature equipment all welds the fixed plate, the filter screen is all installed to the both sides that run through a section of thick bamboo inner wall, the conducting strip is evenly installed to the outer wall that runs through a section of thick bamboo, the both sides inner wall that runs through a section of thick bamboo top all evenly is provided with the exhaust vent, and the equal movable hinge of inner.
Preferably, the middle position department that runs through a section of thick bamboo top is connected with first air-out pipe, and the top of first air-out pipe is connected with first air-out cover, the heater strip is evenly installed to the inner wall of first air-out cover.
Preferably, the middle position of penetrating through the bobbin bottom is connected with a second air outlet pipe, the bottom end of the second air outlet pipe is connected with a second air outlet cover, and a semiconductor refrigerator is installed on the inner wall of the second air outlet cover.
Preferably, driving motor is all installed to the one end outer wall of fixed plate, and driving motor's output all has the carousel through drive shaft connection, the cylinder has all been welded to the outer wall of carousel one end, and the equal movable hinge of outer wall of cylinder has the hinge bar, the equal movable hinge in inboard that a section of thick bamboo was run through to hinge bar one side has the piston.
Preferably, the second reset spring is all installed to the both sides inner wall of mount pad, and the fixture block is all installed to one side of second reset spring, constant temperature equipment's both sides outer wall all be provided with fixture block assorted draw-in groove, the movable plate has all been welded on the top of fixture block, and first reset spring is all installed to one side outer wall of movable plate.
Preferably, the dust blocking mechanism comprises a third return spring and a baffle, the baffle is movably hinged to the inner wall of the air outlet, and the outer wall of the baffle is connected with the inner wall of the air outlet through the third return spring.
Compared with the prior art, the beneficial effects of the utility model are that: this computer constant temperature subassembly is rational in infrastructure, adopts neotype structural design for this device can be dismantled, remove dust and the temperature is convenient for adjust to constant temperature subassembly fast:
(1) the driving motor drives the turntable to rotate and drive the cylinder to simultaneously draw a circle, so that the hinge rod drives the piston to reciprocate leftwards and rightwards in the through cylinder, the piston extrudes gas when moving inwards, formed wind filters dust particles through the filter screen, enters the constant temperature device through the first air outlet cover and the second air outlet cover, hot wind is formed through the work of the heating wire, cold wind formed through the work of the semiconductor refrigerator enters the constant temperature device, the control is convenient, and the constant temperature in the constant temperature device is ensured;
(2) the movable plate is moved outwards simultaneously, the first return spring and the second return spring are extruded and deformed simultaneously, and the clamping blocks are moved away from the inside of the clamping grooves simultaneously, so that the constant temperature device can be opened quickly to overhaul the CPU;
(3) the utility model discloses a temperature control device, including a piston, a baffle, a thermostatic device, third reset spring, the exhaust vent, second play wind cover and first play wind cover, do reciprocating motion through the piston, the wind of formation goes out the wind cover through first play wind cover and second and enters into in the thermostatic device, realize the inside heat dissipation to the thermostatic device, in the time of the air inlet, dust passes through the exhaust vent and discharges in the gaseous drive thermostatic device, gaseous pressure promotes the baffle and removes to the exhaust vent inner wall, third reset spring is by extrusion deformation, be convenient for in the thermostatic device gaseous and dust discharge, when the piston outwards removes in the extraction thermostatic device, adsorption affinity makes between the baffle closed, avoid the entering of dust, realize the inside dustproof of thermostatic device.
Drawings
FIG. 1 is a schematic cross-sectional view of the device of the present invention;
FIG. 2 is a schematic view of the front view structure of the device of the present invention;
FIG. 3 is a schematic side view of the device of the present invention;
FIG. 4 is a schematic view of the structure of the mounting base of the present invention;
fig. 5 is an enlarged schematic view of a portion a of fig. 1 according to the present invention.
In the figure: 1. a cylinder; 2. a hinged lever; 3. a piston; 4. a single chip microcomputer; 5. a filter screen; 6. a first air outlet cover; 7. heating wires; 8. a first air outlet pipe; 9. a thermostatic device; 10. a heat conductive sheet; 11. a through barrel; 12. a fixing plate; 13. a turntable; 14. a mounting seat; 15. a CPU; 16. a second air outlet pipe; 17. a semiconductor refrigerator; 18. a main board; 19. a second air outlet cover; 20. a drive motor; 21. a card slot; 22. a clamping block; 23. moving the plate; 24. a first return spring; 25. a second return spring; 26. an air outlet; 27. a dust blocking mechanism; 2701. a third return spring; 2702. and a baffle plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-5, the present invention provides a technical solution: a computer constant temperature assembly comprises a semiconductor refrigerator 17, a main board 18 and a driving motor 20, wherein the top end of the main board 18 is fixedly connected with a mounting seat 14, a CPU15 is installed on the inner side of the mounting seat 14, and a constant temperature device 9 is fixedly connected on the inner side of the mounting seat 14 on the outer side of a CPU 15;
the inner walls of two sides of the mounting seat 14 are respectively provided with a second return spring 25, one side of each second return spring 25 is provided with a fixture block 22, the outer walls of two sides of the constant temperature device 9 are respectively provided with a clamping groove 21 matched with the fixture block 22, the top end of each fixture block 22 is welded with a movable plate 23, and the outer wall of one side of each movable plate 23 is provided with a first return spring 24;
specifically, as shown in fig. 1 and 4, when the structure is used, the moving plate 23 is moved outward simultaneously, the first return spring 24 and the second return spring 25 are extruded and deformed simultaneously, and the latch 22 is moved away from the inside of the latch slot 21 simultaneously, so that the thermostat 9 can be opened quickly and the CPU15 can be maintained;
the top end inside the thermostatic device 9 is fixedly connected with a single chip microcomputer 4, the type of the single chip microcomputer 4 can be AT89S51, the inner side of the thermostatic device 9 is fixedly connected with a penetrating cylinder 11, and fixing plates 12 are welded on the outer walls of the thermostatic device 9 on the two sides of the penetrating cylinder 11;
a driving motor 20 is mounted on the outer wall of one end of the fixed plate 12, the type of the driving motor 20 can be 28BYG250C-0071, the output end of the driving motor 20 is connected with a rotating disc 13 through a driving shaft, a cylinder 1 is welded on the outer wall of one end of the rotating disc 13, the outer wall of the cylinder 1 is movably hinged with a hinge rod 2, and a piston 3 is movably hinged on one side of the hinge rod 2 through the inner side of the cylinder 11;
specifically, as shown in fig. 1 and 3, when the structure is used, through the operation of the driving motor 20, the driving motor 20 rotates the rotating disc 13 to drive the cylinder 1 to simultaneously draw a circle, so that the hinge rod 2 drives the piston 3 to reciprocate left and right in the penetrating cylinder 11, and the piston 3 extrudes gas to form gas flow when moving inwards;
the two sides of the inner wall of the penetrating cylinder 11 are both provided with filter screens 5, and the outer wall of the penetrating cylinder 11 is uniformly provided with heat conducting fins 10;
a first air outlet pipe 8 is connected to the middle position of the top end of the penetrating cylinder 11, a first air outlet cover 6 is connected to the top end of the first air outlet pipe 8, and heating wires 7 are uniformly arranged on the inner wall of the first air outlet cover 6;
specifically, as shown in fig. 1, when the structure is used, air enters the thermostatic device 9 through the first air outlet cover 6, so that heat dissipation inside the thermostatic device 9 is realized, and hot air is formed through the operation of the heating wire 7;
a second air outlet pipe 16 is connected to the middle position of the bottom end of the penetrating cylinder 11, a second air outlet cover 19 is connected to the bottom end of the second air outlet pipe 16, a semiconductor refrigerator 17 is installed on the inner wall of the second air outlet cover 19, and the model of the semiconductor refrigerator 17 can be DTA-40;
specifically, as shown in fig. 1, when the structure is used, air enters the thermostatic device 9 through the second air outlet cover 19 to dissipate heat inside the thermostatic device 9, and cold air formed by the operation of the semiconductor refrigerator 17 enters the thermostatic device 9 to adjust the temperature inside the thermostatic device 9;
air outlet holes 26 are uniformly formed in the inner walls of the two sides above the penetrating cylinder 11, and dust blocking mechanisms 27 are movably hinged to the inner walls of the air outlet holes 26;
the dust blocking mechanism 27 comprises a third return spring 2701 and a baffle 2702, the baffle 2702 is movably hinged on the inner wall of the air outlet 26, and the outer wall of the baffle 2702 is connected with the inner wall of the air outlet 26 through the third return spring 2701;
specifically, as shown in fig. 1 and 5, when the structure is used, the gas drives the dust in the thermostatic device 9 to be discharged through the air outlet 26, the pressure of the gas pushes the baffle 2702 to move towards the inner wall of the air outlet 26, the third return spring 2701 is extruded and deformed, so that the gas in the thermostatic device 9 is conveniently discharged, the heat dissipation is faster, and when the piston 3 moves outwards to extract the gas in the thermostatic device 9, the adsorption force closes the baffle 2702, so as to avoid the dust from entering;
the output end of the singlechip 4 is electrically connected with the input ends of the heating wire 7, the semiconductor refrigerator 17 and the driving motor 20 through wires.
The working principle is as follows: when the device is used, firstly, the moving plate 23 is moved outwards simultaneously, the first return spring 24 and the second return spring 25 are extruded and deformed, the fixture block 22 moves towards one side of the second return spring 25, then the constant temperature device 9 is installed in the installation seat 14, and after the moving plate 23 is loosened, the first return spring 24 and the second return spring 25 are reset to enable the fixture block 22 to be clamped into the clamping groove 21 for fixing, so that the constant temperature device 9 is installed;
then, through the work of the driving motor 20, the driving motor 20 rotates the rotary table 13, and drives the cylinder 1 to move circularly at the same time, so that the hinge rod 2 drives the piston 3 to reciprocate left and right in the penetrating cylinder 11, the piston 3 extrudes gas when moving inwards, the formed wind filters dust particles through the filter screen 5 and enters the thermostatic device 9 through the first air outlet cover 6 and the second air outlet cover 19, so as to realize the heat dissipation of the inside of the thermostatic device 9, the hot wind is formed through the work of the heating wire 7, the cold wind is formed through the work of the semiconductor refrigerator 17 and enters the thermostatic device 9, the control is convenient, the constant temperature of the inside of the thermostatic device 9 is ensured, the heat in the thermostatic device 9 is absorbed through the heat conducting sheet 10, and the heat dissipation is realized through the reciprocating motion of the piston 3;
finally, in the time of the air inlet, dust passes through exhaust vent 26 and discharges in the gaseous constant temperature equipment 9 that drives, gaseous pressure promotes baffle 2702 and removes to exhaust vent 26 inner wall, third reset spring 2701 is by extrusion deformation, be convenient for gaseous discharge in the constant temperature equipment 9, it is faster to make the heat dissipation, when gaseous in the constant temperature equipment 9 of outside removal extraction through piston 3, the adsorption affinity makes between the baffle 2702 closed, avoid the entering of dust, through the outside movable plate 23 that removes simultaneously, first reset spring 24 and second reset spring 25 are by extrusion deformation simultaneously, fixture block 22 removes the inside that breaks away from draw-in groove 21 simultaneously, thereby be convenient for open constant temperature equipment 9 fast and overhaul CPU 15.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A computer thermostatic assembly comprising a semiconductor refrigerator (17), a main board (18) and a drive motor (20), characterized in that: the utility model discloses a heat preservation device, including mainboard (18), inboard fixedly connected with mount pad (14), and the inboard of mount pad (14) installs CPU (15), the inboard fixedly connected with constant temperature equipment (9) of CPU (15) outside mount pad (14), the inside top fixedly connected with singlechip (4) of constant temperature equipment (9), the inboard fixedly connected with of constant temperature equipment (9) runs through a section of thick bamboo (11), the outer wall that runs through a section of thick bamboo (11) both sides constant temperature equipment (9) all welds fixed plate (12), filter screen (5) are all installed to the both sides that run through a section of thick bamboo (11) inner wall, heat-conducting strip (10) are evenly installed to the outer wall that runs through a section of thick bamboo (11), the both sides inner wall that runs through a section of thick bamboo (11) top all evenly is provided with exhaust vent (26), and the equal movable hinge.
2. A computer thermostat assembly as claimed in claim 1, wherein: run through a section of thick bamboo (11) intermediate position department on top and be connected with first play tuber pipe (8), and the top of first play tuber pipe (8) is connected with first play wind cover (6), heater strip (7) are evenly installed to the inner wall of first play wind cover (6).
3. A computer thermostat assembly as claimed in claim 1, wherein: run through a section of thick bamboo (11) intermediate position department of bottom and be connected with second air-out pipe (16), and the bottom that the second air-out pipe (16) is connected with second air-out cover (19), semiconductor cooler (17) are installed to the inner wall that the second air-out cover (19).
4. A computer thermostat assembly as claimed in claim 1, wherein: driving motor (20) are all installed to the one end outer wall of fixed plate (12), and driving motor's (20) output all has carousel (13) through the drive shaft connection, cylinder (1) have all been welded to the outer wall of carousel (13) one end, and the equal movable hinge of outer wall of cylinder (1) has hinge bar (2), the equal movable hinge in inboard that hinge bar (2) one side run through a section of thick bamboo (11) has piston (3).
5. A computer thermostat assembly as claimed in claim 1, wherein: second reset spring (25) are all installed to the both sides inner wall of mount pad (14), and fixture block (22) are all installed to one side of second reset spring (25), the both sides outer wall of constant temperature equipment (9) all be provided with fixture block (22) assorted draw-in groove (21), movable plate (23) have all been welded on the top of fixture block (22), and first reset spring (24) are all installed to one side outer wall of movable plate (23).
6. A computer thermostat assembly as claimed in claim 1, wherein: the dust blocking mechanism (27) comprises a third return spring (2701) and a baffle (2702), the baffle (2702) is movably hinged to the inner wall of the air outlet (26), and the outer wall of the baffle (2702) is connected with the inner wall of the air outlet (26) through the third return spring (2701).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202021756703.4U CN212846683U (en) | 2020-08-20 | 2020-08-20 | Computer constant temperature subassembly |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202021756703.4U CN212846683U (en) | 2020-08-20 | 2020-08-20 | Computer constant temperature subassembly |
Publications (1)
Publication Number | Publication Date |
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CN212846683U true CN212846683U (en) | 2021-03-30 |
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Application Number | Title | Priority Date | Filing Date |
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CN202021756703.4U Expired - Fee Related CN212846683U (en) | 2020-08-20 | 2020-08-20 | Computer constant temperature subassembly |
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CN (1) | CN212846683U (en) |
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2020
- 2020-08-20 CN CN202021756703.4U patent/CN212846683U/en not_active Expired - Fee Related
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210330 Termination date: 20210820 |
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CF01 | Termination of patent right due to non-payment of annual fee |