CN212845492U - Composite high-frequency electromagnetic wave fine-tuning test rack - Google Patents
Composite high-frequency electromagnetic wave fine-tuning test rack Download PDFInfo
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- CN212845492U CN212845492U CN202021401545.0U CN202021401545U CN212845492U CN 212845492 U CN212845492 U CN 212845492U CN 202021401545 U CN202021401545 U CN 202021401545U CN 212845492 U CN212845492 U CN 212845492U
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Abstract
The utility model relates to a circuit board test technical field, in particular to combined type high frequency electromagnetic wave fine setting test jig, it is provided with the electromagnetic wave transmission point to go up the mould, the lower mould is provided with down the probe bed, lower probe bed is provided with down the probe, the electromagnetic wave transmission point position is corresponding with lower probe position respectively, it still is provided with a plurality of electromagnetic wave output ends to go up the mould periphery, electromagnetic wave transmission point electricity is connected in the electromagnetic wave output, the electromagnetic wave output is connected with the amplification switch card, the amplification switch card is connected in electromagnetic wave generator. Compared with the prior art, the utility model discloses a combined type high frequency electromagnetic wave fine setting test jig during operation sends the electromagnetic wave through each electromagnetic wave launch site, and the electromagnetic wave can pass the signal point circuit on the insulating layer and realize switching on with the lower probe of lower mould, has solved because of having the insulating layer on the circuit board and can't switch on the problem of test, improves test suitability and convenience.
Description
[ technical field ] A method for producing a semiconductor device
The utility model relates to a circuit board test technical field, in particular to combined type high frequency electromagnetic wave fine setting test jig.
[ background of the invention ]
In the circuit board industry, the test of circuit board conductivity and insulation is a very important process flow. After the circuit board is produced, the signal antenna on the circuit board needs to be protected by covering an insulating layer in some cases, so that the conduction test cannot be realized through the probe in the subsequent circuit board test, and the test is inconvenient.
[ Utility model ] content
In order to overcome the above problems, the utility model provides a combined type high frequency electromagnetic wave fine setting test jig that can effectively solve above-mentioned problem.
The utility model provides a technical scheme who above-mentioned technical problem provided is: the composite high-frequency electromagnetic wave fine-tuning test frame is used for testing a circuit board by a testing machine and comprises an upper die and a lower die, wherein the upper die and the lower die are respectively arranged on the testing machine in an up-down corresponding manner, the upper die and the lower die are respectively connected to a testing system of the testing machine, and the circuit board is positioned between the upper die and the lower die; the upper die is provided with an electromagnetic wave emission point, the lower die is provided with a lower probe bed, the lower probe bed is provided with a lower probe, and the positions of the electromagnetic wave emission points correspond to the positions of the lower probes respectively; the periphery of the upper die is also provided with a plurality of electromagnetic wave output ends, and the electromagnetic wave emission points are electrically connected with the electromagnetic wave output ends; the electromagnetic wave output end is connected with an amplification switch card, and the amplification switch card is connected with an electromagnetic wave generator.
Preferably, the fixed lower probe bed further comprises a first layer plate, the lower probe is arranged on the upper surface of the first layer plate, a second layer plate is arranged below the first layer plate, two fine tuning platforms are symmetrically arranged on two sides of the second layer plate, the second layer plate is supported and fixed on the two fine tuning platforms, and the fine tuning platforms can adjust the second layer plate to move back and forth and left and right in the horizontal plane.
Preferably, the bilateral symmetry of second plywood is provided with two and supports the fixed plate, two support fixed plates are fixed in respectively on two fine setting platforms.
Preferably, a plurality of positioning columns are arranged on the second layer plate, a plurality of positioning holes are formed in the first layer plate, the positioning columns penetrate out of the positioning holes from bottom to top respectively, and the circuit board is placed on the positioning columns in a positioning mode.
Preferably, the lower die comprises a lower die base plate, and the platform supporting block is fixed on the surface of the lower die base plate.
Preferably, the lower die further comprises a lower row of insertion plates, a plurality of lower row of insertion plates are arranged on the lower row of insertion plates, the lower probe is electrically connected with the lower row of insertion plates through a lead, and the lower row of insertion plates are electrically connected with the tester.
Preferably, the upper die comprises an upper socket, the upper probe is electrically connected to the upper socket through a wire, and the upper socket is electrically connected to the tester.
Preferably, needle bed support columns are arranged at four corners below the lower probing needle bed, the upper ends of the needle bed support columns are fixed at the bottom of the lower probing needle bed, and the upper ends of the needle bed support columns are fixed on the surface of the lower die base plate.
Preferably, the bottom of the lower-row inserting plate is provided with a row-inserting supporting column, the upper end of the row-inserting supporting column is fixed at the bottom of the lower-row inserting plate, and the upper end of the row-inserting supporting column is fixed on the surface of the lower die bottom plate.
Preferably, the size of the positioning hole is larger than that of the positioning column.
Compared with the prior art, the utility model discloses a combined type high frequency electromagnetic wave fine setting test jig during operation, electromagnetic wave generator send the electromagnetic wave, export the electromagnetic wave output after the signal amplification effect of amplification switch card, electromagnetic wave output rethread each electromagnetic wave launch site sends the electromagnetic wave, and the electromagnetic wave can pass the lower probe realization of the signal point circuit on the insulating layer and lower mould and switch on, has solved the problem that has the insulating layer and can't switch on the test because of having on the circuit board, improves test suitability and convenience.
[ description of the drawings ]
FIG. 1 is a three-dimensional structure diagram of a lower mold of the composite high-frequency electromagnetic wave fine tuning test jig of the present invention;
FIG. 2 is a top view of the lower mold of the composite high-frequency electromagnetic wave fine tuning test rack of the present invention;
FIG. 3 is a diagram of a first layer board structure of the composite high-frequency electromagnetic fine tuning test rack of the present invention;
FIG. 4 is a diagram of a second layer board structure of the composite high frequency electromagnetic wave fine tuning test rack of the present invention;
FIG. 5 is a schematic diagram of the fine-tuning platform of the composite high-frequency electromagnetic wave fine-tuning test jig of the present invention;
FIG. 6 is a top mold structure view of the composite high frequency electromagnetic wave fine tuning test jig of the present invention;
fig. 7 is a side view of the upper mold of the composite high-frequency electromagnetic wave fine tuning test jig of the present invention.
[ detailed description ] embodiments
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail with reference to the accompanying drawings and the following embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.
It should be noted that all directional indications (such as up, down, left, right, front, and back … …) in the embodiments of the present invention are limited to relative positions on a given view, not absolute positions.
In addition, descriptions in the present application as to "first", "second", and the like are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
Please refer to fig. 1 to 7, the utility model discloses a combined type high frequency electromagnetic wave fine tuning test jig for the circuit board is tested to the test machine, including last mould 900 and lower mould 100, it sets up on the test machine to go up mould 900 and lower mould 100 correspondence about respectively, goes up mould 900 and lower mould 100 and connects respectively in the test system of test machine, and the circuit board is located between last mould 900 and lower mould 100. The upper die 900 is provided with electromagnetic wave emitting points 910, the lower die 100 is provided with a lower probe bed 20, the lower probe bed 20 is provided with a lower probe 23, and the positions of the electromagnetic wave emitting points 910 correspond to the positions of the lower probes 23 respectively. The periphery of the upper die 900 is further provided with a plurality of electromagnetic wave output ends 920, and the electromagnetic wave emitting points 910 are electrically connected to the electromagnetic wave output ends 920. The electromagnetic wave output end 920 is connected with an amplification switch card, and the amplification switch card is connected with an electromagnetic wave generator. When the test device works, the electromagnetic wave generator emits electromagnetic waves, the electromagnetic waves are output to the electromagnetic wave output end 920 after the signal amplification effect of the amplification switch card, the electromagnetic wave output end 920 emits electromagnetic waves through the electromagnetic wave emitting points 910, the electromagnetic waves can penetrate through a signal point circuit on the insulating layer to be conducted with the lower probe 23 of the lower die 100, and the problem that the test cannot be conducted due to the fact that the insulating layer exists on a circuit board is solved.
The upper die 900 further comprises an bakelite plate 930 and a glass fiber plate 950, the bakelite plate 930 and the glass fiber plate 950 are arranged in parallel, the bakelite plate 930 and the glass fiber plate 950 are connected through a plurality of parallel iron columns 940, and the bakelite plate 930, the glass fiber plate 950 and the iron columns 940 form a support for bearing acting force of up-down pressing during testing. A test PCB board 960 is arranged below the glass fiber board 950, the electromagnetic wave emitting point 910 is arranged on the lower surface of the test PCB board 960, and the electromagnetic wave output end 920 is arranged on the side edge of the test PCB board 960.
The lower probe bed 20 further comprises a first layer plate 21, and the lower probe 23 is arranged on the upper surface of the first layer plate 21. The second layer plate 22 is arranged below the first layer plate 21, two fine tuning platforms 50 are symmetrically arranged on two sides of the second layer plate 22, the second layer plate 22 is supported and fixed on the two fine tuning platforms 50, and the fine tuning platforms 50 can adjust the second layer plate 22 to move back and forth and left and right in the horizontal plane.
A plurality of positioning columns 24 are arranged on the second layer plate 22, a plurality of positioning holes 211 are arranged on the first layer plate 21, the positioning columns 24 penetrate out of the positioning holes 211 from bottom to top respectively, and the circuit board is positioned on the positioning columns 24. When the same batch of circuit boards of the same type have errors of test point positions, the fine tuning platform 50 can be adjusted to enable the second layer board 22 to move in the horizontal plane, the positioning columns 24 drive the circuit boards to move in the horizontal plane in a small range until the test point positions are aligned with the upper probe and the lower probe 23, the labor consumed in the test process can be effectively reduced, the test efficiency is improved, the updating frequency of the test frame and the test machine can be reduced, the test requirements of different circuit boards can be met only by replacing the arrangement of the probes on the test frame, and the equipment cost is saved.
The size of positioning hole 211 is larger than that of positioning column 24, so as to provide a space for movement of positioning column 24, so as to satisfy that positioning column 24 moves horizontally.
The bilateral symmetry of second plywood 22 is provided with two and supports fixed plate 60, two support fixed plate 60 are fixed in respectively on two fine setting platforms 50, and fine setting platform 50 adjustment drives support fixed plate 60 and removes to it removes to drive second plywood 22.
A platform supporting block 70 is disposed below the fine adjustment platform 50, and is used for supporting the fine adjustment platform 50 so that the fine adjustment platform 50 reaches a height required for assembling with the supporting and fixing plate 60.
The lower mold 100 includes a lower mold base plate 10, and the platform support block 70 is fixed on the surface of the lower mold base plate 10.
Needle bed support columns 25 are arranged at four corners below the lower probing needle bed 20, the upper ends of the needle bed support columns 25 are fixed at the bottom of the lower probing needle bed 20, and the upper ends of the needle bed support columns 25 are fixed on the surface of the lower die base plate 10.
The lower die 100 further comprises a lower row of inserting plates 30, a plurality of lower row of inserting plates 32 are arranged on the lower row of inserting plates 30, the lower probes 23 are electrically connected with the lower row of inserting plates 32 through conducting wires, and the lower row of inserting plates 32 are electrically connected with a testing machine.
The bottom of the lower-row inserting plate 30 is provided with an inserting support column 31, the upper end of the inserting support column 31 is fixed at the bottom of the lower-row inserting plate 30, and the upper end of the inserting support column 31 is fixed on the surface of the lower die bottom plate 10.
The fine tuning platform 50 includes a first base 51, and the bottom of the first base 51 is fixed on the upper surface of the platform supporting block 70. A first slider 53 is slidably connected to the first base 51, and the first slider 53 can linearly slide on the first base 51. The first sliding block 53 is fixed with a second base 54, the second base 54 is connected with a second sliding block 56 in a sliding manner, and the second sliding block 56 can slide on the second base 54 along a straight line. The support fixing plate 60 is fixed to the second slider 56. The sliding direction of the first sliding block 53 is perpendicular to the sliding direction of the second sliding block 56, when the position needs to be adjusted, the first sliding block 53 slides to drive the second base 54 to move, the second base 54 moves to drive the second sliding block 56 to move, meanwhile, the second sliding block 56 slides on the second base 54 to drive the supporting and fixing plate 60 to move, and the supporting and fixing plate 60 moves to drive the whole second layer plate 22 to move.
A first fine adjustment screw 52 is arranged on one side of the first base 51, one end of the first fine adjustment screw 52 is connected with a first push rod, and the direction of the first push rod is consistent with the sliding direction of the first slide block 53. The first fine adjustment screw 52 is rotated to extend and retract the first push rod along the sliding direction of the first slide block 53, so as to push the first slide block 53 to slide. A return spring is arranged between the first slider 53 and the first base 51, and when the first push rod does not apply acting force on the first slider 53, the first slider 53 returns to the initial position of the first base 51 under the action of the restoring force of the return spring. The first sliding block 53 is provided with a first arc protrusion 531, the position of the first arc protrusion 531 corresponds to the position of the first ejector rod, and the first ejector rod pushes the first arc protrusion 531 to push the first sliding block 53 to slide, so that the contact sensitivity is more accurate, and more accurate and fine adjustment can be realized. Similarly, a second fine tuning screw 55 is disposed on one side of the second base 54, one end of the second fine tuning screw 55 is connected to a second push rod, and the direction of the second push rod is parallel to the sliding direction of the second slide block 56. The second fine adjustment screw 55 is rotated so that the second jack rod is extended and contracted in a direction parallel to the sliding direction of the second slider 56. A pushing plate 57 is arranged on one side of the second sliding block 56, a second arc bulge 571 is arranged on the pushing plate 57, the position of the second arc bulge 571 corresponds to the position of the second ejector rod, the second ejector rod pushes the second arc bulge 571 to push the pushing plate 57 to move, and the pushing plate 57 drives the second sliding block 56 to slide.
Compared with the prior art, the utility model discloses a combined type high frequency electromagnetic wave fine setting test jig during operation, electromagnetic wave generator sends the electromagnetic wave, exports electromagnetic wave output 920 after the signal amplification effect of amplification switch card, and electromagnetic wave output 920 rethread each electromagnetic wave launch site 910 sends the electromagnetic wave, and the electromagnetic wave can pass the signal point circuit on the insulating layer and realize switching on with lower probe 23 of lower mould 100, has solved the problem that has the insulating layer and can't switch on the test because of there is the insulating layer on the circuit board, improves test suitability and convenience.
The above description is only for the preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications made within the spirit of the present invention, equivalent replacements and improvements should be included in the scope of the present invention.
Claims (10)
1. The combined high-frequency electromagnetic wave fine tuning test frame is used for a test machine to test a circuit board and is characterized by comprising an upper die and a lower die, wherein the upper die and the lower die are respectively arranged on the test machine in an up-down corresponding manner, the upper die and the lower die are respectively connected to a test system of the test machine, and the circuit board is positioned between the upper die and the lower die;
the upper die is provided with an electromagnetic wave emission point, the lower die is provided with a lower probe bed, the lower probe bed is provided with a lower probe, and the positions of the electromagnetic wave emission points correspond to the positions of the lower probes respectively;
the periphery of the upper die is also provided with a plurality of electromagnetic wave output ends, and the electromagnetic wave emission points are electrically connected with the electromagnetic wave output ends;
the electromagnetic wave output end is connected with an amplification switch card, and the amplification switch card is connected with an electromagnetic wave generator.
2. The composite high-frequency electromagnetic wave fine-adjustment test frame as claimed in claim 1, wherein the lower probe bed further comprises a first layer plate, the lower probe is disposed on an upper surface of the first layer plate, a second layer plate is disposed below the first layer plate, two fine-adjustment platforms are symmetrically disposed on two sides of the second layer plate, the second layer plate is supported and fixed on the two fine-adjustment platforms, and the fine-adjustment platforms can adjust the second layer plate to move back and forth and left and right in a horizontal plane.
3. The composite fine tuning test jig for high-frequency electromagnetic waves of claim 2, wherein two supporting and fixing plates are symmetrically disposed on two sides of the second layer plate, and the two supporting and fixing plates are respectively fixed on the two fine tuning platforms.
4. The combined type high-frequency electromagnetic wave fine adjustment test rack as claimed in claim 2, wherein a plurality of positioning posts are disposed on the second layer board, a plurality of positioning holes are disposed on the first layer board, the positioning posts respectively penetrate through the positioning holes from bottom to top, and the circuit board is positioned on the positioning posts.
5. The composite high-frequency electromagnetic wave fine-tuning test jig of claim 4, wherein the lower mold comprises a lower mold base plate, and the platform support block is fixed on the surface of the lower mold base plate.
6. The combined type high-frequency electromagnetic wave fine adjustment test rack according to claim 5, wherein the lower mold further comprises a lower row of insertion plates, a plurality of lower row of insertion plates are arranged on the lower row of insertion plates, the lower probe is electrically connected with the lower row of insertion plates through a lead, and the lower row of insertion plates are electrically connected with a test machine.
7. The composite high-frequency electromagnetic wave fine-tuning test rack of claim 1, wherein the upper mold comprises an upper socket, the upper probe is electrically connected to the upper socket through a wire, and the upper socket is electrically connected to the tester.
8. The combined type high-frequency electromagnetic wave fine-tuning test jig as claimed in claim 5, wherein needle bed supporting columns are arranged at four corners below the lower probe needle bed, the upper ends of the needle bed supporting columns are fixed at the bottom of the lower probe needle bed, and the upper ends of the needle bed supporting columns are fixed on the surface of the lower die base plate.
9. The combined type high-frequency electromagnetic wave fine adjustment test jig as claimed in claim 6, wherein the bottom of the lower row of insert plates is provided with an insert support column, the upper end of the insert support column is fixed at the bottom of the lower row of insert plates, and the upper end of the insert support column is fixed on the surface of the bottom plate of the lower die.
10. The composite high-frequency electromagnetic wave fine-tuning test jig of claim 4, wherein the size of the positioning holes is larger than the size of the positioning posts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021401545.0U CN212845492U (en) | 2020-07-15 | 2020-07-15 | Composite high-frequency electromagnetic wave fine-tuning test rack |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021401545.0U CN212845492U (en) | 2020-07-15 | 2020-07-15 | Composite high-frequency electromagnetic wave fine-tuning test rack |
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| Publication Number | Publication Date |
|---|---|
| CN212845492U true CN212845492U (en) | 2021-03-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021401545.0U Active CN212845492U (en) | 2020-07-15 | 2020-07-15 | Composite high-frequency electromagnetic wave fine-tuning test rack |
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| CN (1) | CN212845492U (en) |
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- 2020-07-15 CN CN202021401545.0U patent/CN212845492U/en active Active
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