CN212812183U - Based on HDI high density circuit board laser beam machining device - Google Patents
Based on HDI high density circuit board laser beam machining device Download PDFInfo
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- CN212812183U CN212812183U CN202021991429.9U CN202021991429U CN212812183U CN 212812183 U CN212812183 U CN 212812183U CN 202021991429 U CN202021991429 U CN 202021991429U CN 212812183 U CN212812183 U CN 212812183U
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- hdi
- density circuit
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- 238000003754 machining Methods 0.000 title claims abstract description 10
- 239000011148 porous material Substances 0.000 claims description 8
- 230000005540 biological transmission Effects 0.000 claims description 6
- 238000003466 welding Methods 0.000 claims description 4
- 238000010276 construction Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 8
- 238000012423 maintenance Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000003028 elevating effect Effects 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The utility model discloses a based on HDI high density circuit board laser beam machining device, including supporting seat and bolt, the upper end middle part of supporting seat is provided with the workstation, and both ends downside is provided with the fixed plate around the workstation, the upper end left and right sides of fixed plate is provided with the bolt, the upper end middle part of workstation is provided with the movable plate, and is provided with the slider in the middle part of the lower extreme of movable plate, the outside of slider is provided with the spout, the upper end of movable plate is provided with the limiting plate, the upper end right side of workstation is provided with the support column, and the inside upside of support column is provided with the disc, the front end upper side of disc is provided with the handle, and the rear end middle. This high density circuit board laser beam machining device based on HDI is provided with the slider, and the workstation passes through the slider and constitutes sliding construction with the movable plate, and the movable plate slides about the upper end of workstation under gliding effect, and the user of being convenient for adjusts the position of movable plate.
Description
Technical Field
The utility model relates to a HDI high density circuit board processing technology field specifically is a based on HDI high density circuit board laser beam machining device.
Background
The laser processing technology is a one-step processing technology for cutting, welding, surface processing, punching, micro-processing and the like of materials by utilizing the interaction characteristic of a laser beam and a substance, and comprises the step of processing an HDI high-density circuit board.
Laser beam machining device in the market is at the in-process that uses, and inconvenient user dismantles the device to detect the maintenance to the part of inside, simultaneously because HDI high density circuit board is less, also be inconvenient for processing it, for this reason, we propose one kind based on HDI high density circuit board laser beam machining device.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a based on HDI high density circuit board laser beam machining device to the in-process that proposes laser beam machining device on the market in solving above-mentioned background art and using, inconvenient user dismantles the device, thereby carries out the check and maintenance to the part of inside, simultaneously because HDI high density circuit board is less, is also not convenient for carry out the problem of processing to it.
In order to achieve the above object, the utility model provides a following technical scheme: a high-density circuit board laser processing device based on HDI comprises a supporting seat and bolts, wherein a workbench is arranged in the middle of the upper end of the supporting seat, fixed plates are arranged on the lower sides of the front end and the rear end of the workbench, bolts are arranged on the left side and the right side of the upper end of each fixed plate, a movable plate is arranged in the middle of the upper end of the workbench, a slide block is arranged in the middle of the lower end of the movable plate, a slide groove is formed in the outer portion of the slide block, a limiting plate is arranged on the upper end of the movable plate, a supporting column is arranged on the right side of the upper end of the workbench, a disc is arranged on the upper side of the inner portion of the supporting column, a handle is arranged on the upper side of the front end of the disc, a rotating shaft is arranged in the, the lower extreme of support column is provided with the slurcam, and the lower extreme middle part of slurcam is provided with the hydraulic stem, the lower extreme of hydraulic stem is provided with the pneumatic cylinder, and the pneumatic cylinder lower extreme is provided with the base, the outside of connecting plate is provided with the pore, the outside of support column is provided with the recess.
Preferably, the supporting seat and the workbench form a detachable structure through bolts, and the workbench and the fixed plate are fixedly connected.
Preferably, the workbench and the moving plate form a sliding structure through a sliding block, and the sliding block is wrapped in the sliding groove.
Preferably, the sliding block is fixedly connected with the moving plate, and two limiting plates are arranged at the upper end of the moving plate.
Preferably, the laser cover is fixedly connected with the connecting plate, and the connecting plate is wrapped in the middle of the pore channel.
Preferably, the connecting plate forms a transmission structure through the rack and the gear, and the outer wall of the rack is tightly attached to the gear.
Preferably, the support column and the disc form a rotating structure through a handle, and the disc is connected with the rotating shaft in a welding mode.
Preferably, the supporting column forms a lifting structure with the hydraulic cylinder through the pushing plate, and the supporting column and the groove are attached to each other.
Compared with the prior art, the beneficial effects of the utility model are that: the HDI-based high-density circuit board laser processing device is provided with a sliding block, a workbench and a movable plate form a sliding structure, the movable plate slides left and right at the upper end of the workbench under the action of sliding, a user can conveniently adjust the position of the movable plate, and meanwhile the sliding block is wrapped in a sliding groove, so that the sliding block can stably slide in the sliding groove, and the stability of the movable plate in the sliding process is ensured;
the connecting plate forms a transmission structure through the rack and the gear, the rack starts to transmit left and right under the rotation of the gear, so that the connecting plate at the upper end of the rack is controlled to move, a user can conveniently adjust the position of the laser cover at the left end of the connecting plate, the outer wall of the rack is tightly attached to the gear, and the rack can synchronously move along with the gear;
the support column passes through catch plate and pneumatic cylinder constitution elevation structure, and the pneumatic cylinder goes up and down through the hydraulic stem that drives the upper end, and then drives the catch plate and move to carry out elevating movement to the support column of catch plate upper end, because of laminating each other between support column and the recess again, make the support column go up and down at the in-process of going up and down stably in the recess.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic view of the front view of the internal structure of the present invention;
fig. 3 is a schematic view of a part of an enlarged structure at a in fig. 1 according to the present invention.
In the figure: 1. a supporting seat; 2. a fixing plate; 3. a bolt; 4. a work table; 5. a chute; 6. a slider; 7. moving the plate; 8. a limiting plate; 9. a laser mask; 10. a connecting plate; 11. a duct; 12. a support pillar; 13. a groove; 14. a rack; 15. a gear; 16. a push plate; 17. a hydraulic lever; 18. a hydraulic cylinder; 19. a base; 20. a rotating shaft; 21. a disc; 22. a handle.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution: a high-density circuit board laser processing device based on HDI comprises a supporting seat 1, a fixed plate 2, bolts 3, a workbench 4, a sliding groove 5, a sliding block 6, a movable plate 7, a limiting plate 8, a laser cover 9, a connecting plate 10, a pore passage 11, supporting columns 12, a groove 13, a rack 14, a gear 15, a pushing plate 16, a hydraulic rod 17, a hydraulic cylinder 18, a base 19, a rotating shaft 20, a disc 21 and a handle 22, wherein the workbench 4 is arranged in the middle of the upper end of the supporting seat 1, the fixed plate 2 is arranged on the lower sides of the front end and the rear end of the workbench 4, the bolts 3 are arranged on the left side and the right side of the upper end of the fixed plate 2, the movable plate 7 is arranged in the middle of the upper end of the workbench 4, the slider 6 is arranged in the middle of the lower end of the movable plate 7, the sliding groove 5 is arranged outside the, a handle 22 is arranged on the upper side of the front end of the disc 21, a rotating shaft 20 is arranged in the middle of the rear end of the disc 21, a gear 15 is arranged outside the rear end of the rotating shaft 20, a rack 14 is arranged at the upper end of the gear 15, a connecting plate 10 is arranged at the upper end of the rack 14, a laser cover 9 is arranged at the left end of the connecting plate 10, a pushing plate 16 is arranged at the lower end of the supporting column 12, a hydraulic rod 17 is arranged in the middle of the lower end of the pushing plate 16, a hydraulic cylinder 18 is arranged at the lower end of the hydraulic rod 17, a base 19 is arranged at the lower end of the hydraulic cylinder 18, a pore passage;
the supporting seat 1 and the workbench 4 form a detachable structure through the bolt 3, the workbench 4 is fixedly connected with the fixed plate 2, a user can manually rotate the bolt 3, and then the bolt 3 rotates to penetrate through the fixed plate 2 to enter the supporting seat 1, so that the fixed plate 2 is fixed on the supporting seat 1, and the workbench 4 is fixed on the supporting seat 1 due to the fact that the workbench 4 is fixedly connected with the fixed plate 2, meanwhile, the workbench 4 can be conveniently detached by the user in the later period, and time is saved;
the workbench 4 and the moving plate 7 form a sliding structure through the sliding block 6, the sliding block 6 is wrapped in the sliding groove 5, the moving plate 7 slides left and right at the upper end of the workbench 4 under the action of the sliding block 6, a user can conveniently adjust the position of the moving plate 7, and meanwhile the sliding block 6 is wrapped in the sliding groove 5, so that the sliding block 6 stably slides in the sliding groove 5, and the stability of the moving plate 7 in the sliding process is ensured;
the slider 6 and the moving plate 7 are fixedly connected, the upper end of the moving plate 7 is provided with two limiting plates 8, in the sliding process of the slider 6, an interaction force is generated between the slider 6 and the moving plate 7, the slider 6 and the moving plate 7 are easily separated, the slider 6 and the moving plate 7 are fixedly connected, the fixed connection of the device is enhanced, and meanwhile, the upper end of the moving plate 7 is provided with the two limiting plates 8, so that the HDI high-density circuit board to be processed is limited;
the laser cover 9 is fixedly connected with the connecting plate 10, the connecting plate 10 is wrapped in the middle of the pore canal 11, the laser cover 9 is fixedly connected to the left end of the connecting plate 10 and synchronously moves along with the connecting plate 10, a user can conveniently adjust and control the position of the laser cover 9 through the connecting plate 10, and the connecting plate 10 is wrapped in the middle of the pore canal 11, so that the connecting plate 10 can stably move in the pore canal 11, and the stability of the device in the moving process is enhanced;
the connecting plate 10 forms a transmission structure through the rack 14 and the gear 15, the outer wall of the rack 14 is tightly attached to the gear 15, the rack 14 starts to perform left-right transmission under the rotation of the gear 15, so that the connecting plate 10 at the upper end of the rack 14 is controlled to move, a user can conveniently adjust the position of the laser cover 9 at the left end of the connecting plate 10, and the outer wall of the rack 14 is tightly attached to the gear 15, so that the rack 14 can synchronously move along with the gear 15;
the support column 12 and the disc 21 form a rotating structure through the handle 22, the disc 21 is in welded connection with the rotating shaft 20, a user manually rotates the handle 22 to drive the disc 21 to rotate, and the disc 21 is in welded connection with the rotating shaft 20 to drive the rotating shaft 20 to rotate, so that the gear 15 outside the rear end of the rotating shaft 20 is rotated, and the operation of the user is facilitated;
The working principle is as follows: for the laser processing device based on the HDI high-density circuit board, a user firstly puts the HDI high-density circuit board to be processed into the middle of the movable plate 7, the HDI high-density circuit board is limited under the action of the limiting plate 8 at the upper end of the movable plate 7, then the user manually rotates the handle 22 to drive the disc 21 to rotate, the disc 21 is connected with the rotating shaft 20 in a welding manner, the rotating shaft 20 is driven to rotate, the gear 15 outside the rear end of the rotating shaft 20 is rotated, the rack 14 starts to perform left-right transmission under the rotation of the gear 15, so that the connecting plate 10 at the upper end of the rack 14 is controlled to move, the user can conveniently adjust the position of the laser cover 9 at the left end of the connecting plate 10, the laser cover 9 is adjusted to a proper position, and the whole device is convenient for the user to detect and maintain the device, can adjust the height of support column 12 through pneumatic cylinder 18, convenience of customers carries out regular detection and maintenance to laser cover 9 and rack 14 on the support column 12, can take off workstation 4 from supporting seat 1 through manual rotatory bolt 3, and convenience of customers dismantles it, from detecting the maintenance to it.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. The utility model provides a based on HDI high density circuit board laser beam machining device, includes supporting seat (1) and bolt (3), its characterized in that: the upper end middle part of supporting seat (1) is provided with workstation (4), and both ends downside is provided with fixed plate (2) around workstation (4), the upper end left and right sides of fixed plate (2) is provided with bolt (3), the upper end middle part of workstation (4) is provided with movable plate (7), and the lower extreme middle part of movable plate (7) is provided with slider (6), the outside of slider (6) is provided with spout (5), the upper end of movable plate (7) is provided with limiting plate (8), the upper end right side of workstation (4) is provided with support column (12), and the inside upside of support column (12) is provided with disc (21), the front end upper side of disc (21) is provided with handle (22), and the rear end middle part of disc (21) is provided with axis of rotation (20), the rear end outside of axis of rotation (20) is provided with gear (15), and the upper end of gear (15) is provided with rack (14), the upper end of rack (14) is provided with connecting plate (10), and the left end of connecting plate (10) is provided with laser cover (9), the lower extreme of support column (12) is provided with catch plate (16), and the lower extreme middle part of catch plate (16) is provided with hydraulic stem (17), the lower extreme of hydraulic stem (17) is provided with pneumatic cylinder (18), and pneumatic cylinder (18) lower extreme is provided with base (19), the outside of connecting plate (10) is provided with pore (11), the outside of support column (12) is provided with recess (13).
2. The HDI-based high-density circuit board laser processing device according to claim 1, wherein: the supporting seat (1) and the workbench (4) form a detachable structure through the bolt (3), and the workbench (4) and the fixing plate (2) are fixedly connected.
3. The HDI-based high-density circuit board laser processing device according to claim 1, wherein: the workbench (4) and the moving plate (7) form a sliding structure through the sliding block (6), and the sliding block (6) is wrapped in the sliding groove (5).
4. The HDI-based high-density circuit board laser processing device according to claim 1, wherein: the sliding block (6) is fixedly connected with the moving plate (7), and two limiting plates (8) are arranged at the upper end of the moving plate (7).
5. The HDI-based high-density circuit board laser processing device according to claim 1, wherein: the laser cover (9) is fixedly connected with the connecting plate (10), and the connecting plate (10) is wrapped in the middle of the duct (11).
6. The HDI-based high-density circuit board laser processing device according to claim 1, wherein: the connecting plate (10) forms a transmission structure through the rack (14) and the gear (15), and the outer wall of the rack (14) is tightly attached to the gear (15).
7. The HDI-based high-density circuit board laser processing device according to claim 1, wherein: the support column (12) forms a rotating structure with the disc (21) through the handle (22), and the disc (21) is connected with the rotating shaft (20) in a welding mode.
8. The HDI-based high-density circuit board laser processing device according to claim 1, wherein: the supporting column (12) and the hydraulic cylinder (18) form a lifting structure through the pushing plate (16), and the supporting column (12) and the groove (13) are attached to each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021991429.9U CN212812183U (en) | 2020-09-11 | 2020-09-11 | Based on HDI high density circuit board laser beam machining device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021991429.9U CN212812183U (en) | 2020-09-11 | 2020-09-11 | Based on HDI high density circuit board laser beam machining device |
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| Publication Number | Publication Date |
|---|---|
| CN212812183U true CN212812183U (en) | 2021-03-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202021991429.9U Active CN212812183U (en) | 2020-09-11 | 2020-09-11 | Based on HDI high density circuit board laser beam machining device |
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| CN (1) | CN212812183U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114136220A (en) * | 2021-11-26 | 2022-03-04 | 深圳元道兴智能科技有限公司 | Full-automatic 3D solder paste precision detection equipment |
-
2020
- 2020-09-11 CN CN202021991429.9U patent/CN212812183U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114136220A (en) * | 2021-11-26 | 2022-03-04 | 深圳元道兴智能科技有限公司 | Full-automatic 3D solder paste precision detection equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information |
Inventor after: Qian Congbin Inventor before: Qian Congbin Inventor before: Chen Song Inventor before: Zhang Liwei |
|
| CB03 | Change of inventor or designer information | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240312 Address after: Room 704, No. 19-1 Beiyi West Road, Tiexi District, Shenyang City, Liaoning Province, 110000 Patentee after: Shenyang Zhongcheng Botong Technology Co.,Ltd. Country or region after: China Address before: 215000 1st floor, building 3, 1988 Diamond Road, Weitang Town, Xiangcheng District, Suzhou City, Jiangsu Province Patentee before: Jiahong Electronic Technology (Suzhou) Co.,Ltd. Country or region before: China |
|
| TR01 | Transfer of patent right |