CN212810325U - LED purple light ceramic support - Google Patents
LED purple light ceramic support Download PDFInfo
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- CN212810325U CN212810325U CN202022084102.XU CN202022084102U CN212810325U CN 212810325 U CN212810325 U CN 212810325U CN 202022084102 U CN202022084102 U CN 202022084102U CN 212810325 U CN212810325 U CN 212810325U
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Abstract
The utility model relates to a LED purple light ceramic support belongs to LED support technical field, and the ceramic support is installed on the ceramic circuit board, and the ceramic support is a plurality of independently arranged support units, and each support unit comprises a ceramic substrate, a copper plating layer on the surface of the ceramic substrate and a copper foil layer on the back of the ceramic substrate, wherein the thickness of the copper plating layer is 4-5mm, the thickness of the copper foil layer is 0.02-0.05mm, and stress grooves are arranged around the surface of the ceramic circuit board; the utility model discloses a LED purple light ceramic support all has seted up the stress cell around its frame, and the stress of the different productions of both sides thickness can not cause panel deformation when the stress cell can release the copper facing, improves the product percent of pass, makes things convenient for follow-up production and processing, and simultaneously, the electroless copper plating of stress cell portion of opening has saved the copper in the plating bath, has reduced the processing cost.
Description
Technical Field
The utility model relates to a ceramic support technical field, in particular to LED purple light ceramic support.
Background
In the production process of the ceramic support, because the frame is required to be used as a process edge, when the copper plating thicknesses on the two surfaces of the ceramic plate are greatly different, internal stress is easily generated, the substrate is bent, the subsequent processing procedure is influenced, and the substrate is cracked when the thickness is serious; therefore, a need exists for a ceramic scaffold that addresses the above-mentioned deficiencies.
SUMMERY OF THE UTILITY MODEL
In order to overcome the problem, the utility model provides a LED purple light ceramic support has solved the problem that the frame is crooked, panel warp, has the characteristics of practicing thrift use cost simultaneously.
The utility model provides a technical scheme who above-mentioned technical problem provided is: the utility model provides a LED purple light ceramic support, ceramic support installs on ceramic circuit board, and wherein, ceramic support is a plurality of independent setting's support unit, and every support unit includes ceramic substrate, the copper facing on ceramic substrate surface and the copper foil layer at the ceramic substrate back, the copper facing thickness is 4-5mm, the copper foil layer thickness is 0.02-0.05mm, the stress groove has been seted up all around on ceramic circuit board surface.
Further, the width of the stress groove is 0.5-1 mm.
Further, the width of the stress groove is 0.8 mm.
Furthermore, the copper-plated layer on the surface of the ceramic substrate is of a stepped structure, and the copper foil layer on the back surface of the ceramic substrate is of a planar structure.
Furthermore, the thickness of the copper plating layer is 4mm, and the thickness of the copper foil layer is 0.03 mm.
Compared with the prior art, the utility model discloses following beneficial effect has:
1. the ceramic bracket of the utility model is provided with stress grooves around the frame, and the stress grooves can release the stress generated by different thicknesses of the two sides during copper plating, thereby preventing the deformation of the plate;
2. the part of the stress opening groove is not electroplated with copper, so that the copper in the plating solution is saved, and the processing cost is reduced.
Drawings
Fig. 1 is a front view of an LED purple ceramic support of the present invention;
fig. 2 is an enlarged schematic structural view of a single unit of an LED purple ceramic support according to the present invention;
fig. 3 is a side view of a single unit of the LED purple ceramic support of the present invention.
In the figure: 1 ceramic support, 2 ceramic circuit board, 3 ceramic substrate, 4 copper-plated layer, 5 copper foil layer, 6 stress groove.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail with reference to the accompanying drawings and the following embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.
As shown in fig. 1-3, an LED purple light ceramic bracket, a ceramic bracket 1 is mounted on a ceramic circuit board 2, the ceramic bracket 1 is a plurality of independently arranged bracket units, each bracket unit comprises a ceramic substrate 3, a copper plating layer 4 on the surface of the ceramic substrate and a copper foil layer 5 on the back of the ceramic substrate, the copper plating layer 4 is 4-5mm thick, preferably the copper plating layer is 4mm thick, the copper foil layer 5 is 0.02-0.05mm thick, preferably the copper foil layer is 0.03mm thick.
As shown in fig. 3, stress grooves 6 are formed around the surface of the ceramic substrate 1, and the width of the stress grooves 6 is 0.5-1mm, preferably 0.8 mm.
The copper plating layer on the surface of the ceramic substrate 3 is of a stepped structure, and the copper plating layer is of a multi-stage stepped structure, so that LED light rays are gathered and a lens is mounted; the copper foil layer on the back of the ceramic substrate is of a planar structure and plays a role of an electrode.
The utility model discloses a LED purple light ceramic support, make the stress groove on the pattern transfer film before the ceramic substrate is electroplated, the width is 0.8mm, the stress groove releases the base plate stress, has solved the crooked problem of panel; the part of the stress opening groove is not electroplated with copper, so that the copper in the plating solution is saved, and the processing cost is reduced. When the pattern is electroplated, because the circuits inside except the frame are all independent units and the unit area is very small (generally 3.5 × 3.5mm, 4.0 × 4.0mm and the like), the board cannot be deformed or bent due to the small area, the product percent of pass is improved, and the subsequent production and processing are convenient.
The above description is only for the preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications made within the spirit of the present invention, equivalent replacements and improvements should be included in the scope of the present invention.
Claims (5)
1. The utility model provides a purple light ceramic support of LED, ceramic support installs on ceramic circuit board, its characterized in that: the ceramic support is a plurality of independently arranged support units, each support unit comprises a ceramic substrate, a copper plating layer on the surface of the ceramic substrate and a copper foil layer on the back of the ceramic substrate, the thickness of the copper plating layer is 4-5mm, the thickness of the copper foil layer is 0.02-0.05mm, and stress grooves are formed in the periphery of the surface of the ceramic circuit board.
2. The LED purple light ceramic support of claim 1, wherein: the width of the stress groove is 0.5-1 mm.
3. The LED purple light ceramic support of claim 1, wherein: the width of the stress groove is 0.8 mm.
4. The LED purple light ceramic support of claim 1, wherein: the copper-plated layer on the surface of the ceramic substrate is of a stepped structure, and the copper foil layer on the back surface of the ceramic substrate is of a planar structure.
5. The LED purple light ceramic support of claim 1, wherein: the thickness of the copper plating layer is 4mm, and the thickness of the copper foil layer is 0.03 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022084102.XU CN212810325U (en) | 2020-09-22 | 2020-09-22 | LED purple light ceramic support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022084102.XU CN212810325U (en) | 2020-09-22 | 2020-09-22 | LED purple light ceramic support |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212810325U true CN212810325U (en) | 2021-03-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022084102.XU Active CN212810325U (en) | 2020-09-22 | 2020-09-22 | LED purple light ceramic support |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212810325U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117287453A (en) * | 2023-09-25 | 2023-12-26 | 哈尔滨工业大学 | Ceramic material bonding process with bonding stress eliminating effect |
-
2020
- 2020-09-22 CN CN202022084102.XU patent/CN212810325U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117287453A (en) * | 2023-09-25 | 2023-12-26 | 哈尔滨工业大学 | Ceramic material bonding process with bonding stress eliminating effect |
| CN117287453B (en) * | 2023-09-25 | 2024-04-30 | 哈尔滨工业大学 | Ceramic material bonding process with bonding stress eliminating effect |
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