CN212797938U

CN212797938U - Encapsulating jig for rectifying electronic product

Info

Publication number: CN212797938U
Application number: CN202021649821.5U
Authority: CN
Inventors: 陈杨; 钟雁峰
Original assignee: Yangzhou Hy Technology Development Co Ltd
Current assignee: Yangzhou Hy Technology Development Co Ltd
Priority date: 2020-08-10
Filing date: 2020-08-10
Publication date: 2021-03-26
Anticipated expiration: 2030-08-10

Abstract

The utility model discloses a rectification electronic product's encapsulating encapsulation tool, include: the bottom plate is provided with a plurality of fixing columns at intervals; the frame is provided with a plurality of placing holes, the bottom of the frame is connected with the bottom plate, and the placing holes correspond to the fixing columns one by one; the erection column, the erection column setting is on the fixed column, the utility model provides an among the prior art electronic device packaging process can appear the gas tightness poor with overflow gluey technical problem.

Description

Encapsulating jig for rectifying electronic product

Technical Field

The utility model relates to a encapsulating production tool technical field especially relates to an encapsulating packaging tool of rectification electronic product.

Background

In the field of electronic product packaging, the packaging is generally divided into two types, namely plastic packaging and potting, and for a potting product, the packaging is generally divided into a common plastic shell, a zinc shell and an aluminum base rubber shell, particularly, a high-power rectifier bridge generally adopts the zinc shell and the aluminum base rubber shell, however, before potting for a three-phase rectifier bridge potting product, an aluminum substrate (a welding semi-finished product) is mostly manually assembled with a conduit and a rubber shell in the industry. Because the air tightness after glue pouring is ensured, the guide pipe is slightly tightly matched with the aluminum substrate, and the installation space is small, the assembly difficulty is high, the production efficiency is low, and the chip is easily impacted in the process of installing the guide pipe into the center hole of the aluminum substrate by using tweezers or similar jigs; in aluminium base plate cover advances the rubber casing frame, because the limitation of manual pressing of itself, can only singly press the level and smooth with the hand, this kind of mounting means can be because of four angular position atress inequality, not only has the fit clearance, leads to the gas tightness poor, and the excessive gluey phenomenon appears in the postcure, and the maloperation also can cause secondary damage to the chip moreover.

SUMMERY OF THE UTILITY MODEL

The purpose of the embodiment of the application is to provide a encapsulating and packaging jig of rectification electronic product, which solves the technical problems that in the prior art, the air tightness is poor and glue overflows in the packaging process of an electronic device.

The embodiment of the application discloses encapsulating encapsulation tool of rectification electronic product includes:

the bottom plate is provided with a plurality of fixing columns at intervals;

the frame is provided with a plurality of placing holes, the bottom of the frame is connected with the bottom plate, and the placing holes correspond to the fixing columns one by one;

and the mounting column is arranged on the fixing column.

The embodiment of the application designs a novel tool for place the part of treating the encapsulation through placing hole, fixed column and erection column and mutually support, then extrude through the cylinder, accomplish the encapsulation assembly, can reduce the damage to the chip, guarantee the gas tightness simultaneously, be difficult to take place the excessive phenomenon of gluing moreover.

On the basis of the technical scheme, the utility model discloses can also do as follows the improvement:

further, the fixed column is the square column, the erection column is the cylinder, and the cross sectional area of erection column is less than the cross sectional area of fixed column, adopts this step's beneficial effect to be used for placing the pipe through the erection column.

Furthermore, the plane of the upper surface of the mounting column is lower than the plane of the upper surface of the fixing column, and the beneficial effect of the step is that subsequent cylinder extrusion is facilitated.

Furthermore, the placing hole is a square hole, and four corners of the placing hole are provided with rounded corners.

Further, the side of placing the hole is provided with the step, adopts this step's beneficial effect to place the gluey shell through the step.

One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:

1. according to the embodiment of the application, the original packaging method is packaged, the aluminum substrate is extruded by additionally increasing external force, the impact of the external force on a chip is reduced, the material combination air tightness is ensured, and the phenomenon of glue overflow of the aluminum substrate after glue filling and post curing of a product is obviously reduced. The production cycle of the glue-pouring product is shortened, and the overall electrical yield of the product is improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural view of a glue filling and packaging jig for a rectifier electronic product according to an embodiment of the present invention;

fig. 2 is a front view of a potting jig for a rectifier electronic product according to an embodiment of the present invention;

reference numerals:

1-a bottom plate; 2-fixing the column; 3-a frame; 4-placing the holes; 5, mounting a column; 6-step.

Detailed Description

Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and therefore are only examples, and the protection scope of the present invention is not limited thereby.

It is to be noted that unless otherwise specified, technical or scientific terms used herein shall have the ordinary meaning as understood by those skilled in the art to which the present invention belongs.

In the description of the present application, it is to be understood that the terms "upper", "lower", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus should not be construed as limiting the present invention.

In this application, unless expressly stated or limited otherwise, the terms "wrapped," "attached," "secured," and the like are to be construed broadly and include, for example, fixed attachments, removable attachments, or integral attachments; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

The high encapsulating packaging tool of rectification electronic product that this application embodiment provided has solved among the prior art electronic product plastic envelope and has easily appeared overflowing gluey technical problem.

The general idea of the embodiment of the application is as follows: the embodiment of the application discloses dedicated tool assembles the back with the part through the tool, then utilizes other parts to press, and the impact force when having reduced the chip equipment has guaranteed the quality of product.

In order to better understand the technical solutions, the technical solutions will be described in detail below with reference to the drawings and the detailed description.

Example 1

As shown in fig. 1-2, the present embodiment provides a glue filling and packaging jig for a rectifier electronic product, including:

the device comprises a bottom plate 1, wherein a plurality of fixing columns 2 are arranged on the bottom plate 1 at intervals; in the embodiment of the application, the bottom plate can be replaced according to actual needs, namely, the bottom plates with different thicknesses are replaced so as to meet the requirements of assembling products of different models;

the frame 3 is provided with a plurality of placing holes 4, the bottom of the frame 3 is connected with the bottom plate 1, the placing holes 4 correspond to the fixing columns 2 one by one, the frame 3 and the bottom plate 1 in the embodiment of the application are matched with each other to form a mechanism with one side opened, namely, one end of each placing hole 4 is used for assembling other components; the placing holes 4 correspond to the fixing columns 2 one by one, namely each placing hole is used for assembling an electronic device;

a mounting post 5, wherein the mounting post 5 is disposed on the fixing post 2, and the mounting post 5 in the embodiment of the present application is used for mounting a conduit component in an electronic device, thereby facilitating a subsequent pressing operation.

The fixed column 2 is a square column, the mounting column 5 is a cylinder, and the cross section area of the mounting column 5 is smaller than that of the fixed column 2; the fixing column 2 is used for supporting the aluminum substrate, and subsequent installation is facilitated.

Specifically, the upper surface of the mounting post 5 is located on a lower plane than the upper surface of the fixing post 2, which facilitates the subsequent pressing operation.

Specifically, place hole 4 for the square hole, just place the four corners of hole 4 and be provided with the fillet, the fillet of this application embodiment is convenient for frame 3's shaping and processing.

Specifically, the side of placing hole 4 is provided with step 6, and step 6 of this application embodiment is used for supporting the shell of glue, the subsequent processing of being convenient for.

The embodiment of the application provides a novel jig for accomplish the processing of device, accomplish the assembly of pipe, gluey shell and aluminium base board promptly, press aluminium base board through cylinder piston rod, can effectively guarantee pipe, aluminium base board, glue the gas tightness between the shell, shorten production cycle and reduce the impact to the chip in the assembling process, and the tool degree of depth can satisfy different lead wire length demands.

In the specification of the present invention, a large number of specific details are explained. It is understood, however, that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been shown in detail in order not to obscure an understanding of this description.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the scope of the embodiments of the present invention, and are intended to be covered by the claims and the specification.

Claims

1. The utility model provides a rectification electronic product's encapsulating encapsulation tool which characterized in that includes:

the bottom plate is provided with a plurality of fixing columns at intervals;

and the mounting column is arranged on the fixing column.

2. The encapsulating and packaging jig for the rectified electronic product of claim 1, wherein the fixing column is a square column, the mounting column is a cylinder, and the cross-sectional area of the mounting column is smaller than that of the fixing column.

3. The encapsulating and packaging jig for the rectified electronic product of claim 2, wherein the plane of the upper surface of the mounting post is lower than the plane of the upper surface of the fixing post.

4. The tool of claim 3, wherein the hole is a square hole, and four corners of the hole are rounded.

5. The encapsulating and packaging jig for the rectified electronic product as claimed in claim 4, wherein the side of the placing hole is provided with a step.