CN212783378U - Bonding device - Google Patents
Bonding device Download PDFInfo
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- CN212783378U CN212783378U CN202021369670.8U CN202021369670U CN212783378U CN 212783378 U CN212783378 U CN 212783378U CN 202021369670 U CN202021369670 U CN 202021369670U CN 212783378 U CN212783378 U CN 212783378U
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- light source
- bonding
- substrate
- bonding apparatus
- light
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Abstract
The invention discloses a bonding device, which comprises a light source for surface activation, a vacuum cavity, a supporting mechanism and a pressurizing mechanism, wherein the vacuum cavity is provided with a vacuum cavity; the light source is used for activating the two bonding surfaces, the pressurizing mechanism can apply pressure to assist bonding after activation, and the supporting mechanism is used for conveying the sample to be bonded to a specific position and then supporting and fixing the sample to be bonded. The bonding device can avoid interface damage layers and oxidation layers brought by the traditional surface activation bonding method, and realizes that the interface has a complete lattice structure, thereby ensuring that the interface has specific performance.
Description
Technical Field
The present invention relates to a bonding apparatus, and more particularly, to a bonding apparatus with low damage to the interface and no oxide layer on the interface.
Background
The existing bonding technology, especially the low-temperature bonding technology, has some problems, and can not realize some required specific properties. For example, the surface-activated room temperature bonding technique forms an amorphous layer during activation, while the plasma-activated bonding technique forms an oxide layer at the bonded interface. The amorphous layer and the oxide layer at the interface can seriously affect the heat dissipation performance and the electric conduction performance of the interface.
In order to avoid the above problems, a novel low-temperature bonding technique and bonding apparatus for performing surface activation by light have been developed.
Disclosure of Invention
The invention aims to provide a method and an apparatus for obtaining sufficient bonding strength even at low temperature in bonding by performing surface activation by light on a substrate surface. In particular, it is an object to obtain a bonding method and device with an interface having a nearly perfect crystal lattice.
The invention relates to a low-temperature bonding device adopting optical surface activation, which applies energy to the surface by carrying out optical radiation on the surface of a material so as to realize high surface activity.
The bonding apparatus includes a vacuum chamber, an exhaust device for vacuum-exhausting the vacuum chamber, a pair of substrate holders disposed in the vacuum chamber to face each other, a pressurizing mechanism connected to the substrate holders for bonding the substrates fixed to the substrate holders to each other, and a light source for surface activation. The set of oppositely disposed substrate supports, the pressing mechanism connected to the substrate supports, and the light source for surface activation are all disposed independently within the vacuum vessel.
The group of substrate supports which are oppositely arranged in the vacuum cavity can have a heating function, and the heating temperature range is 25-800 ℃.
The number of the light sources is single or multiple, and the light wavelength emitted by the light sources is between 100 and 1500 nanometers; the light source can be moved to the middle of a set of oppositely arranged substrate supports, the plane size of light radiation emitted by the light source is larger than that of the supports, and after the surface is activated, the light source can be moved to a position where pressurization is not affected.
The direction of the light emitted by the light source is vertical to the surface of the substrate or the substrate support; the direction of the light emitted by the light source may also be at an angle in the range of 0-90 degrees with respect to the substrate or substrate support surface. The light source is a sealed tubular structure. The light source is circular or rectangular.
The light source is provided with an electric device capable of emitting light and an adjusting mechanism, the position of the electric device can be adjusted through the adjusting mechanism, and at least one part of the upper surface and the lower surface of the light source is made of transparent glass materials.
Drawings
Fig. 1 is a front cross-sectional view of a bonding apparatus of the present invention.
Fig. 2 shows an example of the outer shape of the light source.
Fig. 3 shows an example of the outer shape of the light source.
Detailed Description
Fig. 1 is a cross-sectional view of a bonding apparatus of the present invention. The vacuum container 1 is made of stainless steel and is rectangular. A vacuum extractor 2 for exhausting air is attached to one of the side surfaces of the vacuum chamber 1. The exhaust device is a combination of a molecular pump, a rotary pump, a cold pump and the like.
A movable pressure head 5 and a mechanical stage 8 are installed in a vacuum container 1, and the pressure head 5 and the mechanical stage 8 constitute a pressurizing mechanism. The center positions of the ram 5 and the machine table 8 coincide. In addition, substrate holders 3a and 3b are fixed to the machine table 8 and the indenter 5, respectively. The indenter 5 and the machine table 8 are both made of stainless steel. The substrate holders 3a and 3b are also made of stainless steel, but have an alumina coating on the surface. The substrate holders 3a and 3b are distributed with the fixed substrates 4, and the fixing method is not limited, and the substrates may be electrostatically adsorbed or simply placed.
The indenter 5 has a lower surface capable of axial movement. The arrow 9 shown in fig. 1 represents the direction of its up-and-down movement, the distance of which has the effect that its lower surface can touch the upper surface of the machine table 8, so that the pressure required for the bonding can be applied.
The light source 6 is disposed in a direction parallel to the substrate holders 3a and 3 b. The light source 6 is fixed to a side wall of the vacuum chamber 1 or a side wall of the machine table 8, and has functions of extending, retracting, tilting, and rotating. The light source 6 can be moved laterally in the direction indicated by arrow 7 and the centre of the light source 6 can be moved at least to the centre line of the indenter 5. The light emitted from the light source 6 can be radiated to the entire substrate surface. Before the pressing mechanism is operated, the light source 6 can be moved to a position where the pressing is not affected. Two profiles of the light source 6 are shown in figures 2 and 3.
In fig. 1, the upper and lower substrates 4 are not shown to be carried in and out, and a robot may be provided in a sample pre-storage chamber communicating with the vacuum chamber 1, the substrates 4 may be placed on the substrate holders 3a and 3b by the robot, and the substrate samples may be taken out after bonding is completed.
The sequence of bonding using the above bonding apparatus is as follows:
1. the upper and lower substrates 4 are first transferred to the substrate holders 3a and 3b by a robot and fixed;
2. after the manipulator exits from the vacuum cavity 1, vacuumizing to a proper vacuum degree;
3. moving the light source 6 to the middle of the two substrates 4;
4. starting a light source 6 to irradiate the surfaces to be bonded of the upper substrate 4 and the lower substrate 4, and performing surface activation;
5. turning off the light source 6, and then returning to the initial position to avoid the influence on the subsequent bonding;
6. the pressure head 5 is lowered to bring the activated both surfaces into contact, and then pressure heating is performed.
7. After bonding, the pressure head 5 is lifted, and a bonded sample rises along with the upper substrate support 3 b;
8. and introducing into a manipulator, and taking out the bonded sample to complete bonding.
Another sequence of bonding using the bonding apparatus described above is as follows:
1. the upper and lower substrates 4 are first transferred to the substrate holders 3a and 3b by a robot and fixed;
2. after the manipulator exits from the vacuum cavity 1, vacuumizing to a proper vacuum degree;
3. lowering the pressure head 5 to make the two surfaces to be bonded contact, releasing the upper substrate 4 and raising the pressure head 5;
4. moving the light source 6 to the middle of the pressure head 5 and the jointed substrate;
5. starting a light source 6 to irradiate the attached substrate, and activating an interface;
6. the light source 6 is turned off and then returns to the initial position, so that the influence on subsequent pressurization is avoided;
7. the activated bonded substrate is pressurized and heated by the lowering ram 5.
8. After bonding, the pressure head 5 is lifted, and a bonded sample rises along with the upper substrate support 3 b;
9. and introducing into a manipulator, and taking out the bonded sample to complete bonding.
Another sequence of bonding using the bonding apparatus described above is as follows:
1. firstly, conveying the externally attached substrate to a substrate support 3a through a manipulator;
2. after the manipulator exits from the vacuum cavity 1, vacuumizing to a proper vacuum degree;
3. moving the light source 6 to the middle of the pressure head 5 and the jointed substrate;
4. starting a light source 6 to irradiate the attached substrate, and activating an interface;
5. the light source 6 is turned off and then returns to the initial position, so that the influence on subsequent pressurization is avoided;
6. the activated bonded substrate is pressurized and heated by the lowering ram 5.
7. After bonding, the pressure head 5 is lifted, and a bonded sample rises along with the upper substrate support 3 b;
8. and introducing into a manipulator, and taking out the bonded sample to complete bonding.
Claims (8)
1. A bonding apparatus comprising a vacuum chamber, an exhaust device for vacuum-exhausting the vacuum chamber, a pair of substrate holders disposed in the vacuum chamber so as to face each other, a pressurizing mechanism connected to the substrate holders for bonding substrates fixed to the substrate holders to each other, and a light source for surface activation,
the light source for surface activation is configured within the vacuum chamber independently of the substrate support and the pressurization mechanism.
2. The bonding apparatus of claim 1,
the light source can be moved to the middle of a group of oppositely arranged substrate supports without influencing the position for implementing pressurization, and the plane size of light radiation emitted by the light source is larger than the size of the supports.
3. The bonding apparatus of claim 1,
the number of the light sources is single or multiple, and the light wavelength emitted by the light sources is between 100 and 1500 nanometers.
4. The bonding apparatus of claim 1,
the direction of the light emitted by the light source is a certain angle in the range of 0-90 degrees with the surface of the substrate or the substrate support.
5. The bonding apparatus of claim 1,
the light source is a sealed tubular structure.
6. The bonding apparatus of claim 1,
the shape of the light source is circular ring or rectangle.
7. The bonding apparatus of claim 1,
the light source is provided with an electric device which emits light and an adjusting mechanism, and the position of the electric device can be adjusted through the adjusting mechanism.
8. The bonding apparatus of claim 1,
at least one part of the upper surface and the lower surface of the light source is made of transparent materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021369670.8U CN212783378U (en) | 2020-07-13 | 2020-07-13 | Bonding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021369670.8U CN212783378U (en) | 2020-07-13 | 2020-07-13 | Bonding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212783378U true CN212783378U (en) | 2021-03-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021369670.8U Active CN212783378U (en) | 2020-07-13 | 2020-07-13 | Bonding device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212783378U (en) |
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2020
- 2020-07-13 CN CN202021369670.8U patent/CN212783378U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220720 Address after: 300451 corner C, second floor, plant 22-a, innovation and entrepreneurship Park, No. 4668, Xinbei Road, Tanggu Marine Science Park, Binhai New Area, Tianjin Patentee after: Tianjin Zhongke Jinghe Electronic Technology Co.,Ltd. Address before: 100044 room 702, 36 Jiaoda East Road, Haidian District, Beijing Patentee before: Mu Fengwen |
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| TR01 | Transfer of patent right |