CN212782514U - Display substrate and display device - Google Patents
Display substrate and display device Download PDFInfo
- Publication number
- CN212782514U CN212782514U CN202022004659.8U CN202022004659U CN212782514U CN 212782514 U CN212782514 U CN 212782514U CN 202022004659 U CN202022004659 U CN 202022004659U CN 212782514 U CN212782514 U CN 212782514U
- Authority
- CN
- China
- Prior art keywords
- substrate
- display
- groove
- base plate
- display substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The application provides a display substrate and display device, display substrate include by the display area who buckles the initiating line and divide and buckle the region, buckle regional display substrate and include: the substrate comprises a wiring area and a non-wiring area; the bonding pads are arranged on the first surface of the substrate base plate at intervals, and the orthographic projection of each bonding pad on the substrate base plate is positioned in the wiring area; the first side surface of the substrate base plate is provided with a groove, the groove is located in the non-wiring area, the extending direction of the groove is perpendicular to the first surface, and the first side surface is a surface which is adjacent to the first surface and close to one side of each bonding pad. This application technical scheme sets up the recess through the non-wiring region at the substrate base plate, will buckle the region and divide into a plurality of sub bending regions, because sub bending region's horizontal size is less, consequently carrying out the in-process of buckling to sub bending region, can reduce stress concentration, solve the problem of buckling not in place.
Description
Technical Field
The utility model relates to a show technical field, especially relate to a display substrate and display device.
Background
At present, cop (chip on panel) Pad bonding technology is one of the key technologies for realizing the narrow frame of the flexible OLED display panel. The technology is that a driving chip is bound to a terminal (Pad) of a flexible panel, and then the terminal is bent (bonding) to the back of a display panel, so that a narrow frame is realized.
In a medium-sized module and a large-sized module, a plurality of driver chips are generally bonded to terminals in a bending region of a flexible panel in parallel, and for example, 14.0 "UHD, 6 driver chips need to be bonded in parallel. For a bending area with a large transverse (X-direction) size, the problem of stress concentration is easy to occur in the process of bending the whole of a plurality of driving chips to the back surface, so that the bending is not in place.
SUMMERY OF THE UTILITY MODEL
The utility model provides a display substrate and display device to reduce the stress concentration of buckling.
In order to solve the above problem, the utility model discloses a display substrate, display substrate includes the display area territory of dividing by the initiating line of buckling and buckles the region, the regional display substrate of buckling includes:
the substrate comprises a wiring area and a non-wiring area;
the bonding pads are arranged on the first surface of the substrate base plate at intervals, and the orthographic projection of each bonding pad on the substrate base plate is positioned in the wiring area;
the substrate comprises a substrate base plate and a non-wiring area, wherein a groove is arranged on a first side surface of the substrate base plate, the groove is positioned in the non-wiring area, the extending direction of the groove is perpendicular to the first surface, and the first side surface is a surface which is adjacent to the first surface and is close to one side of each bonding pad.
In an optional implementation manner, the groove divides the plurality of pads into a plurality of pad groups, and the number of pads in each pad group is greater than or equal to 1.
In an alternative implementation manner, the recess depth of the groove is greater than or equal to the distance between the bending starting line and the first side surface.
In an alternative implementation, the opening of the groove close to the first side surface is greater than or equal to the opening far from the first side surface.
In an alternative implementation, the cross-sectional shape of the groove along the extension direction is rectangular, triangular or trapezoidal.
In an alternative implementation, the substrate base plate has a plurality of interface surfaces interfacing with the groove, and two adjacent interface surfaces form a chamfer at the intersection.
In an alternative implementation, the chamfer is a round chamfer.
In an alternative implementation, the grooves are laser cut.
In order to solve the problem, the utility model also discloses a display device, including a plurality of driver chip and arbitrary embodiment display substrate, each driver chip binds on the pad of difference.
In an optional implementation manner, the driving chip is located on the back of the light emitting surface of the display device.
Compared with the prior art, the utility model discloses a following advantage:
this application technical scheme provides a display substrates and display device, and display substrates includes the display area who is divided by the initiating line of buckling and buckles the region, and the regional display substrates of buckling includes: the substrate comprises a wiring area and a non-wiring area; the bonding pads are arranged on the first surface of the substrate base plate at intervals, and the orthographic projection of each bonding pad on the substrate base plate is positioned in the wiring area; the first side surface of the substrate base plate is provided with a groove, the groove is located in the non-wiring area, the extending direction of the groove is perpendicular to the first surface, and the first side surface is a surface which is adjacent to the first surface and close to one side of each bonding pad. This application technical scheme sets up the recess through the line region of walking in the non-of substrate base plate, will buckle the region and divide into a plurality of son and buckle the region, because the horizontal size that the son buckles the region is less, consequently carrying out the in-process of buckling to the son area of buckling, can reduce stress concentration, solve and buckle the problem that does not put in place, can also reduce the precision and the size specification demand to equipment of buckling simultaneously.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the description of the embodiments of the present invention will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive labor.
Fig. 1 is a schematic diagram illustrating a bending region structure of a mobile phone module in the related art;
FIG. 2 is a schematic diagram illustrating a bending region structure of a medium-sized and large-sized die set in the related art;
fig. 3 is a schematic plan view illustrating a first display substrate according to an embodiment of the present disclosure;
fig. 4 is a schematic plan view illustrating a second display substrate provided in an embodiment of the present application;
fig. 5 is a schematic plan view illustrating a third display substrate provided in an embodiment of the present application;
FIG. 6 is a schematic diagram showing three groove anti-tearing structures provided by the embodiment of the application;
fig. 7 is a schematic structural diagram illustrating a display device according to an embodiment of the present application before bending;
fig. 8 is a schematic structural diagram of a display device provided in an embodiment of the present application after being bent.
Detailed Description
In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention is described in detail with reference to the accompanying drawings and the detailed description.
Referring to fig. 1, a schematic diagram of a structure of a mobile phone module using COP pad bonding in the related art is shown, in the mobile phone module, because a transverse (X direction in fig. 1) dimension is small, only one driver chip (D-IC) is generally required to be bonded to a terminal in a bending region of a flexible panel, and a problem of stress concentration is not obvious in a process of bending the driver chip to a back surface.
However, in a medium-large size module, referring to fig. 2, which shows a structural schematic diagram of a 14.0 ″ UHD product, due to the large lateral (X direction in fig. 2) size, it is generally required that a plurality of driver chips are bonded to the terminals in the bending region of the flexible panel in parallel, such as 14.0 ″ UHD in fig. 2, and 6 driver chips are bonded. In order to reduce the lower frame of the module, the driving chip needs to be bent to the back, and because the transverse size of the bending area is large and generally larger than 300mm, the bending area is easy to have stress concentration and other phenomena in the whole bending process, so that the bending is not in place, and meanwhile, higher requirements are provided for the precision and the size of the bending equipment.
In order to solve the above problem, an embodiment of the present invention provides a display substrate, which may include a display area and a bending area divided by a bending start line, and the display substrate of the bending area includes:
the substrate 31, the substrate 31 includes a routing area and a non-routing area;
a plurality of pads 32 disposed at intervals on the first surface of the substrate 31, wherein an orthographic projection of each pad 32 on the substrate 31 is located in the routing area;
a groove 33 is disposed on the first side surface of the substrate base plate 31, the groove 33 is located in the non-routing area, the extending direction of the groove 33 is perpendicular to the first surface, and the first side surface is a surface adjacent to the first surface and close to one side of each pad 32.
The bonding pads 32 are gold fingers for binding a driver chip (driver chip), and each bonding pad 32 corresponds to the driver chip one to one.
The extending direction of the groove 33, i.e., the penetrating direction of the groove 33, is a direction perpendicular to the paper surface (first surface) in fig. 3 to 5. The grooves 33 may be formed by laser cutting.
According to the display substrate provided by the embodiment, the groove 33 is arranged in the non-wiring area of the substrate 31, the bending area can be divided into the plurality of sub-bending areas by the groove 33, and the transverse size (in the X direction in fig. 3 to 5) of each sub-bending area is smaller than that of the bending area, so that stress concentration can be reduced in the process of bending each sub-bending area, the problem of bending failure can be solved, and the requirements on the precision and the size of bending equipment can be reduced.
In this embodiment, the groove 33 divides the plurality of pads 32 into a plurality of pad groups, and the number of pads 32 in each pad group is greater than or equal to 1. The number of pads 32 in each pad group may be the same or different.
Referring to fig. 3, the number of the pads 32 in each pad group is 1, that is, the groove 33 is disposed between any two adjacent pads 32, so that each sub-bending region only includes one pad 32, only one driver chip needs to be bound, when bending is performed, each sub-bending region can be bent one by one, only one driver chip needs to be processed in each bending process, and the problems of stress concentration, bending failure and the like are solved.
Referring to fig. 4, the number of the pads 32 in each pad group is 2, that is, each sub-bending region includes two pads 32, two driver chips are bound, and when bending is performed, each sub-bending region can be bent one by one, only two driver chips need to be processed in the process of bending each time, so that the problems of stress concentration, improper bending and the like can be greatly reduced.
Referring to fig. 5, the number of the bonding pads 32 in each bonding pad group is 3, that is, each sub-bending region includes three bonding pads 32, three driver chips are bound, and when bending is performed, each sub-bending region can be bent one by one, only three driver chips need to be processed in each bending process, so that the problems of stress concentration, improper bending and the like can be greatly reduced.
In order to prevent tearing from occurring at the grooves during bending of each sub-bending region, the recess depth of the groove 33 may be greater than or equal to the distance between the bending start line and the first side surface, i.e., the distance between the groove bottom of the groove 33 and the first side surface is greater than or equal to the distance between the bending start line and the first side surface.
Since the pads 32 are connected to the signal lines in the display area by fan-shaped traces, the opening of the groove 33 close to the first side may be greater than or equal to the opening far from the first side in order to avoid the influence on the traces during the groove cutting process.
In a specific implementation, the cross-sectional shape of the groove 33 along the extending direction may be rectangular (as shown in fig. 6a and 6 c), triangular (as shown in fig. 6 b), or trapezoidal, and the specific shape of the groove 33 is not limited in this embodiment.
The substrate base plate 31 has a plurality of interfaces interfacing with the grooves 33, and in order to prevent tearing at the grooves when bent, adjacent interfaces may be chamfered at the intersection. Referring to fig. 6, the chamfer may be a round chamfer.
Another embodiment of the present application further provides a display device, and fig. 7 is a schematic diagram of a display device before bending, where the display device includes a plurality of driver chips 71 and the display substrate according to any embodiment, and each driver chip 71 is bonded to a different pad 32.
Referring to fig. 8, which shows a schematic diagram of the display device after bending, the driving chip 71 is located on the back of the light-emitting surface of the display device.
The display device in this embodiment may be: any product or component with a 2D or 3D display function, such as a display panel, electronic paper, a mobile phone, a tablet computer, a television, a notebook computer, a digital photo frame, a navigator and the like.
The embodiment of the application provides a display substrate and display device, display substrate includes the display area who is divided by the initiating line of buckling and the region of buckling, and the regional display substrate of buckling includes: the substrate comprises a wiring area and a non-wiring area; the bonding pads are arranged on the first surface of the substrate base plate at intervals, and the orthographic projection of each bonding pad on the substrate base plate is positioned in the wiring area; the first side surface of the substrate base plate is provided with a groove, the groove is located in the non-wiring area, the extending direction of the groove is perpendicular to the first surface, and the first side surface is a surface which is adjacent to the first surface and close to one side of each bonding pad. This application technical scheme sets up the recess through the non-wiring region at the substrate base plate, will buckle the region and divide into a plurality of son and buckle the region, because the horizontal size that the son buckles the region is less, consequently can reduce stress concentration at the in-process of buckling, solve and buckle the problem that does not put in place, can also reduce the precision and the dimensional specification demand to equipment of buckling simultaneously.
The embodiments in the present specification are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
Finally, it should also be noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, the use of the phrase "comprising a. -. said" to define an element does not exclude the presence of other like elements in the process, method, article, or apparatus that comprises the element.
The display substrate and the display device provided by the present invention are introduced in detail, and the principle and the implementation of the present invention are explained by applying specific examples, and the descriptions of the above examples are only used to help understanding the method and the core idea of the present invention; meanwhile, for the general technical personnel in the field, according to the idea of the present invention, there are changes in the specific implementation and application scope, to sum up, the content of the present specification should not be understood as the limitation of the present invention.
Claims (10)
1. A display substrate, comprising a display region and a bending region divided by a bending start line, wherein the display substrate of the bending region comprises:
the substrate comprises a wiring area and a non-wiring area;
the bonding pads are arranged on the first surface of the substrate base plate at intervals, and the orthographic projection of each bonding pad on the substrate base plate is positioned in the wiring area;
the substrate comprises a substrate base plate and a non-wiring area, wherein a groove is arranged on a first side surface of the substrate base plate, the groove is positioned in the non-wiring area, the extending direction of the groove is perpendicular to the first surface, and the first side surface is a surface which is adjacent to the first surface and is close to one side of each bonding pad.
2. The display substrate of claim 1, wherein the recess divides the plurality of pads into a plurality of pad groups, and the number of pads in each pad group is greater than or equal to 1.
3. The display substrate according to claim 1, wherein a recess depth of the groove is greater than or equal to a distance between the bending start line and the first side surface.
4. The display substrate of claim 1, wherein the opening of the groove near the first side is greater than or equal to the opening far from the first side.
5. The display substrate according to claim 4, wherein the cross-sectional shape of the groove along the extending direction is rectangular, triangular or trapezoidal.
6. The display substrate of claim 1, wherein the substrate base plate has a plurality of interface surfaces interfacing with the recess, and adjacent two of the interface surfaces form a chamfer at the intersection.
7. The display substrate of claim 6, wherein the chamfer is a rounded chamfer.
8. The display substrate of any one of claims 1 to 7, wherein the grooves are formed by laser cutting.
9. A display device comprising a plurality of driver chips and the display substrate according to any one of claims 1 to 8, wherein each of the driver chips is bonded to a different pad.
10. The display device according to claim 9, wherein the driving chip is located on a back surface of a light emitting surface of the display device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022004659.8U CN212782514U (en) | 2020-09-14 | 2020-09-14 | Display substrate and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022004659.8U CN212782514U (en) | 2020-09-14 | 2020-09-14 | Display substrate and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212782514U true CN212782514U (en) | 2021-03-23 |
Family
ID=75057775
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022004659.8U Active CN212782514U (en) | 2020-09-14 | 2020-09-14 | Display substrate and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212782514U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113539127A (en) * | 2021-07-09 | 2021-10-22 | 京东方科技集团股份有限公司 | Display substrate, preparation method thereof and display device |
| WO2024041320A1 (en) * | 2022-08-25 | 2024-02-29 | 京东方科技集团股份有限公司 | Display panel and display device |
-
2020
- 2020-09-14 CN CN202022004659.8U patent/CN212782514U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113539127A (en) * | 2021-07-09 | 2021-10-22 | 京东方科技集团股份有限公司 | Display substrate, preparation method thereof and display device |
| WO2024041320A1 (en) * | 2022-08-25 | 2024-02-29 | 京东方科技集团股份有限公司 | Display panel and display device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN212782514U (en) | Display substrate and display device | |
| US7432213B2 (en) | Electrical connection pattern in an electronic panel | |
| CN107749239B (en) | Display panel, display device and manufacturing method of display panel | |
| EP3767440A1 (en) | Wiring structure, fabrication method therefor, and display device | |
| US10405437B2 (en) | Display device | |
| CN110047804B (en) | Array substrate, manufacturing method, display panel and spliced screen | |
| CN110557887B (en) | Circuit alignment assembly and display device | |
| CN101517737A (en) | Flip-chip interconnection through chip vias | |
| CN205788905U (en) | A kind of abnormity display screen | |
| CN107204346B (en) | Array substrate, display panel and display device | |
| US20180108604A1 (en) | Chip on film and display device | |
| CN109560086A (en) | Display panel | |
| CN104269111A (en) | Display module manufacturing method and display module | |
| CN111554202A (en) | Display panel and display device | |
| CN110297347B (en) | Display panel, manufacturing method thereof and display device | |
| CN101478858A (en) | Circuit board construction, manufacturing method and liquid crystal display | |
| CN112135467A (en) | Welded structure and display module | |
| US10939564B2 (en) | Circuit board, display device and method for manufacturing the same | |
| CN115019677B (en) | Display panel and preparation method thereof, and preparation method of display device | |
| CN111610879A (en) | Touch panel, preparation method of touch panel, touch assembly and electronic equipment | |
| CN110133929A (en) | Array substrate and its manufacturing method, display panel and display module | |
| CN106125991A (en) | A kind of touch-control display panel and touch control display apparatus | |
| US20220093563A1 (en) | Chip-on-film structure, displaying base plate and displaying device | |
| CN109767692B (en) | Display panel | |
| CN212847477U (en) | Chip on film, display substrate and display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |