CN212777242U

CN212777242U - LED circuit board

Info

Publication number: CN212777242U
Application number: CN202022045216.3U
Authority: CN
Inventors: 程爱平; 许志军; 曾祥全; 徐国芳; 刘伟
Original assignee: Quzhou Tianying Electronics Co ltd
Current assignee: Quzhou Tianying Electronics Co ltd
Priority date: 2020-09-17
Filing date: 2020-09-17
Publication date: 2021-03-23
Anticipated expiration: 2030-09-17

Abstract

The utility model provides a LED circuit board, include: the LED lamp comprises an LED circuit board body, an LED drive circuit, LED lamp beads, radiating fins and a radiating bracket; the LED driving circuit is arranged at the center of the LED circuit board body; the radiating fins are arranged at the lower end of the LED circuit board body, and the radiating support is arranged at the lower end of the radiating fins; the LED circuit board body is also provided with an LED groove, a groove, an annular groove, an inner cavity, a first heat exchange shell, a second heat exchange shell and a third heat exchange shell, the LED lamp beads are arranged on the LED groove, the first heat exchange shell is arranged in the groove, the second heat exchange shell is arranged in the annular groove, and the third heat exchange shell is arranged in the inner cavity; the first heat exchange shell, the second heat exchange shell and the third heat exchange shell are all provided with heat exchange liquid, the heat exchanger has the advantages of simple structure, convenient use, good heat dissipation effect, stable and efficient heat dissipation efficiency and prolonged service life; the utility model discloses combine together radiating groove, fin and liquid heat dissipation, improved the radiating effect of LED circuit board.

Description

LED circuit board

Technical Field

The utility model relates to a circuit board technical field, concretely relates to LED circuit board.

Background

An LED board is an important electronic component, is a support for electronic components, and is a provider of electrical connection of electronic components. LEDs are typically mounted on a circuit board and controlled by the circuit board to emit light. When the LED works, a large amount of heat is generated, so that the LED generates light attenuation due to overhigh temperature, color difference occurs, the service life of an LED product is shortened, and the like. The temperature of the LED needs to be controlled to ensure the stability of its operating state. In the prior art, a plurality of modes are adopted for carrying out work heat dissipation on a circuit board, for example: coating a heat dissipation material, arranging a heat dissipation sheet and the like; these methods have poor heat dissipation effect, and therefore, a new technical solution needs to be provided.

SUMMERY OF THE UTILITY MODEL

In order to overcome the not enough of prior art, the utility model provides a LED circuit board, this LED circuit board radiating effect is good, and the heat dissipation is stable.

The technical scheme of the utility model as follows:

an LED wiring board comprising: the LED lamp comprises an LED circuit board body, an LED drive circuit, LED lamp beads, radiating fins and a radiating bracket; the LED driving circuit is arranged at the center of the LED circuit board body; the radiating fin is arranged at the lower end of the LED circuit board body, and the radiating bracket is arranged at the lower end of the radiating fin; the LED circuit board body is also provided with an LED groove, a groove, an annular groove, an inner cavity, a first heat exchange shell, a second heat exchange shell and a third heat exchange shell, the LED lamp bead is installed on the LED groove, the first heat exchange shell is installed in the groove, the second heat exchange shell is installed in the annular groove, and the third heat exchange shell is installed in the inner cavity; and the first heat exchange shell, the second heat exchange shell and the third heat exchange shell are all provided with heat exchange liquid.

Preferably, the LED circuit board body is a high-thermal-conductivity PCB.

Further, the LED circuit board body is also provided with a heat dissipation groove; the radiating grooves are at least provided with 2 radiating grooves.

Further, an insulating layer is arranged on the outer layer of the LED circuit board body; the insulating layer is an aluminum oxide layer.

Preferably, the first heat exchange shell and the third heat exchange shell are cylindrical; the second heat exchange shell is annular.

Furthermore, at least 4 first heat exchange shells are arranged; the number of the second heat exchange shells is consistent with that of the LED lamp beads.

Furthermore, the outer layers of the first heat exchange shell, the second heat exchange shell and the third heat exchange shell are all provided with elasticity increasing films.

Further, the heat exchange liquid is water or alcohol.

Preferably, the heat sink and the heat sink support are made of aluminum, copper, aluminum nitride or other high thermal conductivity base materials.

Compared with the prior art, the utility model discloses following beneficial effect has:

the structure is simple, the use is convenient, the heat dissipation effect is good, the heat dissipation efficiency is stable and efficient, and the service life is prolonged; the utility model discloses combine together radiating groove, fin and liquid heat dissipation, improved the radiating effect of LED circuit board.

Drawings

Fig. 1 is a schematic structural diagram of an LED circuit board of the present invention;

fig. 2 is a schematic cross-sectional view of an LED circuit board according to the present invention;

reference numerals: 1. LED circuit board body, 2, LED drive circuit, 3, LED groove, 4, first heat transfer casing, 5, recess, 6, LED lamp pearl, 7, fin, 8, heat dissipation support, 9, radiating groove, 10, second heat transfer casing, 11, ring channel, 12, inner chamber, 13, third heat transfer casing.

Detailed Description

In order to make the technical problems, technical solutions and advantages to be solved by the present invention clearer, the following detailed description will be given with reference to the accompanying drawings and specific embodiments. In the following description, feature details such as specific configurations and components are provided only to help a full understanding of the embodiments of the present invention. Thus, it will be apparent to those skilled in the art that various changes and modifications may be made to the embodiments described herein without departing from the scope and spirit of the invention. In addition, descriptions of well-known functions and constructions are omitted for clarity and conciseness.

It should be appreciated that reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

In various embodiments of the present invention, it should be understood that the sequence numbers of the following processes do not mean the execution sequence, and the execution sequence of the processes should be determined by the functions and the internal logic, and should not constitute any limitation to the implementation process of the embodiments of the present invention.

It should be understood that the term "and/or" herein is merely one type of association relationship that describes an associated object, meaning that three relationships may exist, e.g., a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.

In the embodiments provided herein, it should be understood that "B corresponding to a" means that B is associated with a from which B can be determined. It should also be understood that determining B from a does not mean determining B from a alone, but may be determined from a and/or other information.

With reference to fig. 1-2, the utility model provides a LED circuit board, include: LED circuit board body 1, LED drive circuit 2, LED lamp pearl 6, fin 7, heat dissipation support 8, LED drive circuit 2 sets up in LED circuit board body 1 center department as driven core, and fin 7 sets up at LED circuit board body 1 lower extreme, and heat dissipation support 8 sets up at fin 7 lower extreme, and fin 7, heat dissipation support 8 adopt aluminium, copper, aluminium nitride or other high heat conduction substrate to make and dispel the heat to LED circuit board 1. The LED circuit board body 1 is further provided with an LED groove 3, a groove 5, an annular groove 11, an inner cavity 12, a first heat exchange shell 4, a second heat exchange shell 10 and a third heat exchange shell 13, wherein the annular groove 11 is arranged on the outer side of the LED groove 3; the LED lamp beads 6 are fixedly arranged on the LED grooves 3, the first heat exchange shell 4 is fixedly arranged in the groove 5, the second heat exchange shell 10 is fixedly arranged in the annular groove 11, and the third heat exchange shell 13 is fixedly arranged in the inner cavity 12; the first heat exchange shell 4, the second heat exchange shell 10 and the third heat exchange shell 13 are all provided with heat exchange liquid, and the heat exchange liquid is made of materials with good heat absorption effect, such as water or alcohol.

In one embodiment, the LED circuit board body 1 is a high thermal conductivity PCB, and a circuit board with high thermal conductivity is adopted, so that the heat dissipation problem of the LED is better solved, and the light emitting efficiency of the LED can be improved.

Further, the LED circuit board body 1 is further provided with a heat sink 9; the radiating grooves 9 are at least provided with 2, the radiating grooves 9 are arranged in a T shape, and the LED driving circuits 2 and the LED lamp beads 6 are distributed around, so that the radiating effect is further improved.

Further, an insulating layer is arranged on the outer layer of the LED circuit board body 1; the insulating layer is an aluminum oxide layer.

In one embodiment, the first heat exchange shell 4 and the third heat exchange shell 13 are cylindrical; the second heat exchange shell 10 is annular.

Further, at least 4 first heat exchange shells 4 are arranged; the number of the second heat exchange shells 10 is consistent with that of the LED lamp beads 6.

Further, the outer layers of the first heat exchange shell 4, the second heat exchange shell 10 and the third heat exchange shell 13 are respectively provided with an elasticity increasing film, the elasticity increasing films can increase the strength of the heat exchange shell, so that the structure of the heat exchange shell is kept stable, and the influence of the excessive expansion of the heat exchange shell on the structure of the LED circuit board is avoided.

The utility model discloses a theory of operation: when the LED circuit board works, heat generated by the LED circuit board body 1, the LED driving circuit 2 and the LED lamp beads 6 is conducted out by the radiating fins 7 and the radiating support 8 on one hand, is conducted out by the radiating grooves 9 on the other hand, and is finally absorbed by liquid in the heat exchange shell on the other hand to radiate the LED circuit board; when the LED circuit board does not work, the heat absorbed by the liquid in the heat exchange shell is conducted away by the LED circuit board body 1.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.

Claims

1. An LED circuit board which characterized in that: the method comprises the following steps: the LED lamp comprises an LED circuit board body (1), an LED driving circuit (2), LED lamp beads (6), radiating fins (7) and a radiating support (8); the LED driving circuit (2) is arranged at the center of the LED circuit board body (1); the radiating fin (7) is arranged at the lower end of the LED circuit board body (1), and the radiating bracket (8) is arranged at the lower end of the radiating fin (7); the LED circuit board body (1) is further provided with an LED groove (3), a groove (5), an annular groove (11), an inner cavity (12), a first heat exchange shell (4), a second heat exchange shell (10) and a third heat exchange shell (13), the LED lamp beads (6) are installed on the LED groove (3), the first heat exchange shell (4) is installed in the groove (5), the second heat exchange shell (10) is installed in the annular groove (11), and the third heat exchange shell (13) is installed in the inner cavity (12); and the first heat exchange shell (4), the second heat exchange shell (10) and the third heat exchange shell (13) are all provided with heat exchange liquid.

2. The LED circuit board of claim 1, wherein: the LED circuit board body (1) is a high-heat-conductivity PCB.

3. The LED circuit board of claim 2, wherein: the LED circuit board body (1) is also provided with a heat dissipation groove (9); the number of the heat dissipation grooves (9) is at least 2.

4. The LED circuit board of claim 3, wherein: an insulating layer is arranged on the outer layer of the LED circuit board body (1); the insulating layer is an aluminum oxide layer.

5. The LED circuit board of claim 1, wherein: the first heat exchange shell (4) and the third heat exchange shell (13) are cylindrical; the second heat exchange shell (10) is annular.

6. The LED circuit board of claim 5, wherein: at least 4 first heat exchange shells (4) are arranged; the number of the second heat exchange shells (10) is consistent with that of the LED lamp beads (6).

7. The LED circuit board of claim 6, wherein: the outer layers of the first heat exchange shell (4), the second heat exchange shell (10) and the third heat exchange shell (13) are all provided with elasticity increasing films.

8. The LED circuit board of claim 7, wherein: the heat exchange liquid is water or alcohol.

9. The LED circuit board of claim 1, wherein: the radiating fins (7) and the radiating support (8) are made of aluminum, copper, aluminum nitride or other high-heat-conductivity base materials.