CN212767667U - Electronic chip protection box - Google Patents
Electronic chip protection box Download PDFInfo
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- CN212767667U CN212767667U CN202021021423.9U CN202021021423U CN212767667U CN 212767667 U CN212767667 U CN 212767667U CN 202021021423 U CN202021021423 U CN 202021021423U CN 212767667 U CN212767667 U CN 212767667U
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Abstract
The utility model discloses an electronic chip protects box relates to electronic chip technical field. The anti-vibration box comprises a top cover, the diagonal position of top cover top surface is provided with fixing nut one and fixing nut two respectively, fixing nut one with the cylinder of fixing nut two is the fixed handle that is provided with respectively outward, the bottom surface of top cover is provided with the layer of taking precautions against earthquakes, be provided with the chip in the layer of taking precautions against earthquakes, the layer overcoat of taking precautions against earthquakes is equipped with the box, the box corresponds fixing nut one with the position of fixing nut two is run through respectively and is provided with fixing stud one and fixing stud two, fixing stud one with the bottom mounting of fixing stud two is provided with fixed buckle. Has the advantages that: the chip is protected from being damaged by external force, the chip can be placed in any size, and then the chip is fixed through extrusion between the sponge layers, so that the purpose of protecting the chip is achieved.
Description
Technical Field
The utility model relates to an electronic chip technical field particularly, relates to an electronic chip protection box.
Background
A chip is also called an integrated circuit, and is a way to miniaturize a circuit (mainly including a semiconductor device and a passive component) in electronics, and is essential in daily study of electrical engineering and daily life of people.
To student and relevant engineer, the chip often independently preserves, the equipment of circuit is just taken out when needs, the chip is fragile easily impaired, but because the size of chip is various, same chip also has different sizes under different company's production, therefore do not have the containing box of special design for preserving the chip in present market, mostly be the plastics box on the market, put into a plurality of adjustable baffles in the plastics box, alright make up into the check of accomodating of different sizes, but this kind of box mostly adopts the buckle to connect the closure, can't bump, often receive the collision slightly and just can open, lead to chip striking stereoplasm box inner wall simultaneously, can cause irreversible collision injury equally.
An effective solution to the problems in the related art has not been proposed yet.
SUMMERY OF THE UTILITY MODEL
To the problem among the correlation technique, the utility model provides an electronic chip protects box to overcome the above-mentioned technical problem that current correlation technique exists.
The technical scheme of the utility model is realized like this:
an electronic chip protection case comprising: the anti-vibration device comprises a top cover, a first fixing nut and a second fixing nut are arranged at the diagonal positions of the top surface of the top cover respectively, a handle is fixedly arranged outside a cylinder of the first fixing nut and a cylinder of the second fixing nut respectively, a shockproof layer is arranged on the bottom surface of the top cover, a chip is arranged in the shockproof layer, a box body is sleeved outside the shockproof layer, the box body corresponds to the first fixing nut and the second fixing nut in position and is provided with a first fixing stud and a second fixing stud in a penetrating mode respectively, and a fixing buckle is arranged at the first fixing stud and the second fixing stud in a bottom fixing mode.
Furthermore, the first fixing stud and the second fixing stud penetrate through the box body and the top cover.
Furthermore, the first fixing stud and the second fixing stud are respectively fixed with the first fixing nut and the second fixing nut through threaded connection.
Further, the shockproof layer comprises a first sponge layer, a second sponge layer is arranged on the top surface of the first sponge layer, a chip is arranged on the top surface of the second sponge layer, and a third sponge layer is arranged on the chip.
Furthermore, a second groove is fixedly formed in the position, corresponding to the first fixing stud and the second fixing stud, of the sponge layer at the corner.
Furthermore, a first groove is fixedly formed in the position, corresponding to the first fixing stud and the second fixing stud, of the sponge layer at the corner.
Furthermore, gaps are arranged at the positions, corresponding to the first fixing stud and the second fixing stud, of the sponge layer III.
The utility model has the advantages that: a first fixing stud and a second fixing stud penetrate through two small holes at the opposite corners of the bottom of the box body, the bottom of the box body is placed on a table, a first sponge layer is placed in the box body, meanwhile, a groove at the opposite corners of the first sponge layer is sleeved outside the first fixing stud and the second fixing stud, then the second sponge layer is placed, the two grooves at the opposite corners of the first sponge layer are aligned with the first fixing stud and the second fixing stud, a chip to be stored is placed, a third sponge layer is placed on the chip, notches at the opposite corners of the third sponge layer are aligned with the first fixing stud and the second fixing stud, a top cover is placed on the top surface of the third sponge layer, the two small holes at the opposite corners of the top cover respectively penetrate through the first fixing stud and the second fixing stud, and the first fixing nut and the second fixing nut are respectively sleeved on the first fixing stud and the second fixing stud, because the fixing nut one the fixing nut two respectively with the fixing nut one the fixing nut two passes through threaded connection, through rotating fixing nut one with the handle on the fixing nut two is until through fixing nut one with the fixing nut two presses the top cap to appropriate degree of depth, and at this moment, extrude each other to certain degree between sponge layer one in the layer of taking precautions against earthquakes, sponge layer two, the sponge layer three, can wrap up closely the chip that is in the in-situ portion that takes precautions against earthquakes, simultaneously, because the compliance of sponge, the layer of taking precautions against earthquakes can not lead to the fact the extrusion harm to the chip, simultaneously, utilizes threaded connection, can fix the extrusion degree on layer of taking precautions against earthquakes, and the box is fallen open when preventing carelessly to fall, causes the injury to the chip. The screw thread fixation between the fixing nut and the fixing stud can effectively prevent the scattering when falling and colliding, and the chip is effectively protected by fixing the shockproof layer. The sponge of the shockproof layer can fix the chip through extrusion, so that the chip is protected from being damaged by external force, and the chip can be protected from being damaged by extrusion through the soft characteristic of the sponge. No barrier is arranged between the third sponge layer and the second sponge layer, so that the novel chip packaging structure is suitable for placing chips of any size, and then the chips are fixed through extrusion between the sponge layers, and the purpose of protecting the chips is achieved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic perspective view of an embodiment of the present invention;
fig. 2 is a schematic diagram of an overall explosion structure according to an embodiment of the present invention.
In the figure:
1. a handle; 2. fixing a first nut; 3. a chip; 4. fixing a first stud; 5. a box body; 6. a second fixing stud; 7. a sponge layer I; 8. a first groove; 9. a sponge layer III; 10. a top cover; 11. fixing a second nut; 12. a shock-resistant layer; 13. fixing the buckle; 14. a sponge layer II; 15. and a second groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art all belong to the protection scope of the present invention.
According to the utility model discloses an embodiment provides an electronic chip protects box.
As shown in fig. 1-2, the electronic chip protection box according to the embodiment of the present invention includes: the anti-vibration device comprises a top cover 10, a first fixing nut 2 and a second fixing nut 11 are respectively arranged at the diagonal positions of the top surface of the top cover 10, a handle 1 is respectively and fixedly arranged outside a column body of the first fixing nut 2 and the second fixing nut 11, an anti-vibration layer 12 is arranged on the bottom surface of the top cover 10, a chip 3 is arranged in the anti-vibration layer 12, a box body 5 is sleeved outside the anti-vibration layer 12, a first fixing stud 4 and a second fixing stud 6 are respectively arranged at the positions, corresponding to the first fixing nut 2 and the second fixing nut 11, of the box body 5 in a penetrating mode, and a fixing buckle 13 is fixedly arranged at the bottom end of the first fixing stud 4 and the.
In one embodiment, for the fixing stud one 4, the fixing stud one 4 and the fixing stud two 6 penetrate through the box body 5 and the top cover 10.
In one embodiment, for the fixing stud 14, the fixing stud 4 and the fixing stud 6 are respectively fixed with the fixing nut 2 and the fixing nut 11 through threaded connection, so that vibration caused by falling can be effectively prevented.
In one embodiment, for the shockproof layer 12, the shockproof layer 12 includes a first sponge layer 7, a second sponge layer 14 is disposed on a top surface of the first sponge layer 7, the chip 3 is disposed on a top surface of the second sponge layer 14, and a third sponge layer 9 is disposed on the chip 3, so that the chip 3 can be completely wrapped.
In an embodiment, for the first sponge layer 7, a second groove 15 is fixedly disposed at a corner position of the first sponge layer 7 corresponding to the first fixing stud 4 and the second fixing stud 6, so that the first fixing stud 4 and the second fixing stud 6 can smoothly pass through the first sponge layer 7.
In an embodiment, for the second sponge layer 14, a first groove 8 is fixedly disposed at a corner position of the second sponge layer 14 corresponding to the first fixing stud 4 and the second fixing stud 6, so that the first fixing stud 4 and the second fixing stud 6 can smoothly pass through the second sponge layer 14.
In an embodiment, for the third sponge layer 9, notches are formed in the positions, corresponding to the first fixing studs 4 and the second fixing studs 6, of the third sponge layer 9, so that the first fixing studs 4 and the second fixing studs 6 can smoothly pass through the third sponge layer 9.
In summary, with the above technical solution of the present invention, the first fixing stud 4 and the second fixing stud 6 are inserted through the two small holes at the bottom corner of the box 5, the bottom of the box 5 is laid on the desktop, the first sponge layer 7 is placed in the box 5, the second groove 15 at the diagonal corner of the first sponge layer 7 is sleeved outside the first fixing stud 4 and the second fixing stud 6, the second sponge layer 14 is then placed, the first two grooves 8 at the diagonal corner of the second sponge layer 14 are aligned with the first fixing stud 4 and the second fixing stud 6, the chip 3 to be stored is placed, the third sponge layer 9 is placed on the chip 3, the gap at the diagonal corner of the third sponge layer 9 is aligned with the first fixing stud 4 and the second fixing stud 6, the top cover 10 is placed on the top surface of the third sponge layer 9, and the two small holes at the diagonal corner of the top cover 10 are respectively inserted through the first fixing stud 4 and the second fixing stud 6, a first fixing nut 2 and a second fixing nut 11 are respectively sleeved on the first fixing stud 4 and the second fixing stud 6, the first fixing nut 2 and the second fixing nut 11 are respectively in threaded connection with the first fixing stud 4 and the second fixing stud 6, and the first fixing nut 2 and the handle 1 on the second fixing nut 11 are rotated until the top cover 10 is pressed to a proper depth through the first fixing nut 2 and the second fixing nut 11, at the moment, the first sponge layer 7, the second sponge layer 14 and the third sponge layer 9 in the shockproof layer 12 are mutually extruded to a certain degree, so that the chip 3 in the shockproof layer can be tightly wrapped, meanwhile, due to the flexibility of the sponge, the shockproof layer 12 cannot cause extrusion damage to the chip 3, meanwhile, the extrusion degree of the shockproof layer 12 can be fixed by utilizing threaded connection, and the box is prevented from being opened when the shockproof layer 12 falls down carelessly, causing damage to the chip 3.
Has the advantages that: 1. the screw thread fixation between the fixing nut and the fixing stud can effectively prevent the scattering when falling and colliding, and the chip is effectively protected by fixing the shockproof layer.
2. The sponge of the shockproof layer can fix the chip through extrusion, so that the chip is protected from being damaged by external force, and the chip can be protected from being damaged by extrusion through the soft characteristic of the sponge.
3. No barrier is arranged between the third sponge layer and the second sponge layer, so that the novel chip packaging structure is suitable for placing chips of any size, and then the chips are fixed through extrusion between the sponge layers, and the purpose of protecting the chips is achieved.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. An electronic chip protection case comprising: the top cover (10) is characterized in that a first fixing nut (2) and a second fixing nut (11) are arranged at the diagonal positions of the top surface of the top cover (10) respectively, the first fixing nut (2) and the second fixing nut (11) are fixedly provided with a handle (1) outside a cylinder respectively, the bottom surface of the top cover (10) is provided with a shockproof layer (12), a chip (3) is arranged in the shockproof layer (12), a box body (5) is sleeved outside the shockproof layer (12), the box body (5) corresponds to the first fixing nut (2) and the second fixing nut (11) respectively and is provided with a first fixing stud (4) and a second fixing stud (6) in a penetrating mode, and the first fixing stud (4) and the second fixing stud (6) are fixedly provided with a fixing buckle (13) at the bottom end.
2. The electronic chip protection box according to claim 1, wherein the first fixing stud (4) and the second fixing stud (6) penetrate through the box body (5) and the top cover (10).
3. The electronic chip protection box according to claim 1, wherein the first fixing stud (4) and the second fixing stud (6) are fixed to the first fixing nut (2) and the second fixing nut (11) by screw threads.
4. The electronic chip protection box according to claim 1, wherein the shockproof layer (12) comprises a first sponge layer (7), a second sponge layer (14) is arranged on the top surface of the first sponge layer (7), the chip (3) is arranged on the top surface of the second sponge layer (14), and a third sponge layer (9) is arranged on the chip (3).
5. The electronic chip protection box according to claim 4, wherein a second groove (15) is fixedly arranged at a corner position of the first sponge layer (7) corresponding to the first fixing stud (4) and the second fixing stud (6).
6. The electronic chip protection box according to claim 4, wherein a first groove (8) is fixedly formed in the second sponge layer (14) corresponding to the corner positions of the first fixing stud (4) and the second fixing stud (6).
7. The electronic chip protection box according to claim 4, wherein a gap is formed in the sponge layer III (9) at a corner position corresponding to the first fixing stud (4) and the second fixing stud (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021021423.9U CN212767667U (en) | 2020-06-06 | 2020-06-06 | Electronic chip protection box |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021021423.9U CN212767667U (en) | 2020-06-06 | 2020-06-06 | Electronic chip protection box |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212767667U true CN212767667U (en) | 2021-03-23 |
Family
ID=75069896
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021021423.9U Active CN212767667U (en) | 2020-06-06 | 2020-06-06 | Electronic chip protection box |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212767667U (en) |
-
2020
- 2020-06-06 CN CN202021021423.9U patent/CN212767667U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210817 Address after: Second floor, building 1, phase 1, Xicheng Industrial Zone, Shiyong village, Hengli Town, Dongguan City, Guangdong Province 523000 Patentee after: Dongguan Xiaomai Electronic Technology Co.,Ltd. Address before: 313200 room 365, building 4, No. 11, Keyuan Road, Wuyang street, Deqing County, Huzhou City, Zhejiang Province (Moganshan national high tech Zone) Patentee before: Huzhou Shenmo Machinery Technology Co.,Ltd. |
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| TR01 | Transfer of patent right |