CN212752310U

CN212752310U - Electronic equipment, display module and cover plate assembly thereof

Info

Publication number: CN212752310U
Application number: CN202021439976.6U
Authority: CN
Inventors: 郭天福
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2020-07-17
Filing date: 2020-07-17
Publication date: 2021-03-19
Anticipated expiration: 2030-07-17

Abstract

The utility model relates to an electronic equipment, display module assembly and apron subassembly thereof, the apron subassembly includes transparent cover plate, semi-absorbing layer and first dielectric layer, semi-absorbing layer forms on transparent cover plate, first dielectric layer forms on semi-absorbing layer, semi-absorbing layer absorbs the ambient light that passes transparent cover plate, the reflected light that the ambient light produced on semi-absorbing layer towards the interface of transparent cover plate one side and the reflected light that the ambient light produced on semi-absorbing layer towards the interface of first dielectric layer one side further takes place destructive interference. The application provides a when apron subassembly is applied to display module assembly, not only can protect display module assembly, still can eliminate display module assembly to the reflection of ambient light because of be formed with semi-absorption layer and first dielectric layer on transparent cover plate, and then realize "one dual-purpose". Moreover, the geometric thicknesses of the semi-absorption layer and the first dielectric layer can be far smaller than that of the circular polarizer, so that the thickness of the display module can be greatly reduced when the cover plate assembly is applied to the display module.

Description

Electronic equipment, display module and cover plate assembly thereof

Technical Field

The application relates to the technical field of electronic equipment, in particular to electronic equipment, a display module and a cover plate assembly of the display module.

Background

With the increasing popularity of electronic devices, electronic devices have become indispensable social and entertainment tools in people's daily life, and users have higher and higher requirements for electronic devices. For an electronic device, the contrast of the display screen is one of the factors that determine the display quality of the electronic device. However, when the user is in a strong environment light, especially when the user uses the electronic device outdoors, if the environment light is reflected by the display screen in a large amount, the contrast of the display screen is significantly reduced, and even the normal use of the user is affected.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a be applied to apron subassembly of display module assembly, this apron subassembly includes transparent cover plate, semi-absorbing layer and first dielectric layer, semi-absorbing layer forms on transparent cover plate, first dielectric layer forms on semi-absorbing layer, semi-absorbing layer absorbs the ambient light that passes transparent cover plate, the reflected light that the ambient light produced on semi-absorbing layer towards the interface of transparent cover plate one side and the reflected light that the ambient light produced on semi-absorbing layer towards the interface of first dielectric layer one side further takes place destructive interference.

The embodiment of the application also provides a display module, which comprises a light-emitting component and the cover plate component, wherein the cover plate component is assembled with the light-emitting component; the transparent cover plate is farther away from the light-emitting component compared with the first medium layer.

The embodiment of the application also provides electronic equipment which comprises a middle frame, a rear cover plate and the display module, wherein the display module and the rear cover plate are respectively positioned on two opposite sides of the middle frame and fixedly connected with the middle frame; wherein, the cover plate component is far away from the middle frame compared with the light-emitting component.

The beneficial effect of this application is: the application provides a when apron subassembly is applied to display module assembly, not only can protect display module assembly, still can eliminate display module assembly to the reflection of ambient light because of be formed with semi-absorption layer and first dielectric layer on transparent cover plate, and then realize "one dual-purpose". Moreover, the geometric thicknesses of the semi-absorption layer and the first dielectric layer can be far smaller than that of the circular polarizer, so that the thickness of the display module can be greatly reduced when the cover plate assembly is applied to the display module.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic disassembled structural diagram of an embodiment of an electronic device provided in the present application;

FIG. 2 is a schematic diagram of a stacked structure of one embodiment of the display module shown in FIG. 1;

FIG. 3 is a schematic view of a stacked configuration of one embodiment of the cover plate assembly of FIG. 2;

FIG. 4 is a schematic diagram of a stacked structure of one embodiment of the first dielectric layer of FIG. 3;

FIG. 5 is a schematic illustration of a stacked configuration of another embodiment of the cover plate assembly of FIG. 2;

fig. 6 is a schematic diagram of a stacked structure of an embodiment of the second dielectric layer of fig. 5.

Detailed Description

The present application will be described in further detail with reference to the following drawings and examples. It is to be noted that the following examples are only illustrative of the present application, and do not limit the scope of the present application. Likewise, the following examples are only some examples and not all examples of the present application, and all other examples obtained by a person of ordinary skill in the art without any inventive work are within the scope of the present application.

Reference in the specification to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the specification. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

The inventors of the present application found in long-term studies that: for the display screens such as OLED (Organic Light-Emitting Diode), in the related art, a circular polarizer is generally disposed on a Light Emitting surface of the display screen to reduce transmittance of ambient Light (mainly considering visible Light), and further reduce transmittance of reflected Light generated by the ambient Light on the display screen (specifically, a metal electrode layer thereof), so as to improve influence of the ambient Light on display quality of the display screen. However, the circular polarizer used in the related art is generally a composite structure of a linear polarizer and an 1/4 λ phase film, and the geometric thickness thereof is generally greater than 124 μm; the circular polarizer is also adhered and fixed on a transparent cover plate and other structures, and the geometric thickness of the colloid is generally more than 25 μm. At this time, the thickness of the display screen may be large, which may cause two problems: firstly, when the display screen is applied to electronic equipment, the electronic equipment is not light and thin; when the display screen further caters to the designs of curved screens, flexible screens and the like which are popular at present, the performances of the display screen such as fitting, bending and the like are not facilitated. To this end, the present application proposes the following examples.

Referring to fig. 1, fig. 1 is a schematic view of a disassembled structure of an embodiment of an electronic device provided in the present application.

In the present application, the electronic device 10 may be a portable device such as a mobile phone, a tablet computer, a notebook computer, and a wearable device. In this embodiment, the electronic device 10 is taken as a mobile phone for exemplary explanation.

As shown in fig. 1, the electronic device 10 may include a display module 11, a middle frame 12, and a rear cover 13. The display module 11 and the rear cover plate 13 are respectively located on two opposite sides of the middle frame 12, and can be fixedly connected with the middle frame 12 through one or a combination of assembling modes such as gluing, clamping, welding and the like, so that a basic structure that the display module 11 and the rear cover plate 13 clamp the middle frame 12 together is formed after the three are assembled. Further, a cavity with a certain volume may be formed between the display module 11 and the rear cover 13, and the cavity may be used to dispose the battery 14, the main board 15, the camera module 16, and other structural members (not shown in fig. 1), such as a fingerprint module, an antenna module, and the like, so that the electronic device 10 can implement corresponding functions. For example: the structural members are fixed to the middle frame 12 to remain relatively fixed, thereby assembling the complete electronic device 10. The display module 11, the camera module 16 and other components may be electrically connected to the battery 14, the main board 15 and the like through a Flexible Printed Circuit (FPC), so that they can be supplied with electric power from the battery 14 and can execute corresponding instructions under the control of the main board 15.

Generally, the display module 11 may be a display screen such as an lcd (liquid Crystal display), an OLED (Organic Light-Emitting Diode), a Mini-LED, or a Micro-LED. In the present embodiment, the display module 11 is exemplified by a display screen such as an OLED.

Further, the edge of the display module 11 may be bent toward the middle frame 12, so that the image displayed on the display module 11 may extend from the front surface of the display module 11 to the side surface thereof in a form similar to a "waterfall". So set up, not only can reduce or even hide the black edge of display module assembly 11 to make electronic equipment 10 can provide bigger demonstration field of vision for the user, can also make display module assembly 11 build a visual effect around the demonstration, thereby make electronic equipment 10 bring one kind and be different from bang screen, water droplet screen, dig the visual experience of flat full-face screen such as hole screen, over-and-under type camera, sliding closure type camera for the user, and then increase electronic equipment 10's competitiveness. Accordingly, the edge of the rear cover 13 may also be bent toward the middle frame 12, so as to improve the grip feeling and aesthetic appearance of the electronic device 10.

Referring to fig. 2, fig. 2 is a schematic diagram of a stacked structure of an embodiment of the display module shown in fig. 1. It should be noted that: the direction indicated by the arrow L1 in fig. 2 can be simply regarded as the light emitting direction of the display module, and the direction indicated by the arrow L2 in fig. 2 can be simply regarded as the incident direction of the ambient light on the display module. Further, the light emitting direction of the display module and the incident direction of the ambient light can be simply regarded as two opposite directions.

As shown in fig. 2, the display module 11 may include a light emitting device 111 and a cover plate device 112, and the cover plate device 112 may be assembled with the light emitting device 111 by using a glue 113 such as Optical Clear Adhesive (OCA) and Pressure Sensitive Adhesive (PSA). After the display module 11 is assembled with the middle frame 12, the cover assembly 112 is farther away from the middle frame 12 than the light emitting assembly 111. Further, the cover assembly 112 may be used to protect the light emitting assembly 111 and may be an outer surface of the electronic device 10, so as to facilitate a user to perform a touch operation such as clicking, sliding, pressing, etc. The light emitting element 111 is mainly used for enabling the display module 11 to display a picture, and can be used as an interactive interface to instruct a user to perform the touch operation on the cover plate element 112.

Further, the light emitting assembly 111 may include an array substrate 1111, a first electrode layer 1112, an organic electroluminescent layer 1113, a second electrode layer 1114, and an encapsulation layer 1115 sequentially stacked. After the cover plate assembly 112 and the light emitting assembly 111 are assembled, the package layer 1115 is closer to the cover plate assembly 112 than the array substrate 1111. The array substrate 111 generally includes a plurality of Thin Film Transistors (TFTs) arranged in an array, and generally corresponds to the RGB sub-pixels arranged in an array in the organic electroluminescent layer 1113 one to one. The first electrode layer 1112 is typically a transparent anode (ITO) and is typically disposed in a grid. The second electrode layer 1114 is typically a semi-transparent cathode (Mg/Ag) and is typically disposed over the entire surface. It should be noted that: the translucent cathode is more reflective to light than the transparent anode. The encapsulation layer 1115 is mainly used for achieving the isolation requirement between the organic electroluminescent layer 1113 and water and oxygen, so as to ensure the reliability of the organic electroluminescent layer 1113 and further prolong the service life of the display module 11. Further, the array substrate 1111 is mainly electrically connected to the first electrode layer 1112 and the second electrode layer 1114, so that the RGB sub-pixels arranged in the organic electroluminescent layer 1113 in an array can obtain different current inputs, and further emit light of different colors, so that the display module 11 can display images.

Based on the basic structure of the display screen such as OLED, after the display module 11 is assembled with the middle frame 12, in order to facilitate a user to view a picture displayed on the electronic device 10, the display module 11 has a light emitting direction (as shown by an arrow L1 in fig. 2). In the light emitting direction of the display module 11, the second electrode layer 1114 is closer to the external environment than the first electrode layer 1112. At this time, when the environment where the user is located has strong ambient light, especially when the user uses the electronic device outdoors, the ambient light is reflected by the second electrode layer 1114 after being irradiated on the display module 11, and the reflected light is substantially in the same direction as the light emitting direction of the display module 11, so that the contrast of the display module 11 is significantly reduced, and even the normal use of the user is affected. To this end, one inventive concept of the present application may be: on the one hand, some metal or semiconductor single bodies have a relatively balanced combination of absorption, transmission and reflection properties to absorb a part of the ambient light before reaching the light-emitting component 111 (commonly referred to as "extinction"); on the other hand, based on the principle of light interference, an optical film is disposed on the side of the light emitting element 111 facing away from the middle frame 12, so that ambient light can be reflected and destructively interfered (commonly referred to as "anti-reflection") at least before reaching the light emitting element 111.

Referring to fig. 3, fig. 3 is a schematic diagram illustrating a stacked structure of an embodiment of the cover plate assembly of fig. 2. It should be noted that: the arrow L2 in fig. 3 can be simply regarded as the incident light of the ambient light on the display module, the arrow L21 in fig. 3 can be simply regarded as the reflected light of the ambient light generated on the interface of the semi-absorption layer facing the transparent cover plate, and the arrow L22 in fig. 3 can be simply regarded as the reflected light of the ambient light generated on the interface of the semi-absorption layer facing the first medium layer.

As shown in fig. 3, the cover plate assembly 112 may include a transparent cover plate 1121, a semi-absorbent layer 1122, and a first dielectric layer 1123. The transparent cover 1121 may be a rigid substrate such as glass, or may be a flexible substrate such as Polyimide (PI) or Colorless Polyimide (CPI). Further, the semi-absorbing layer 1122 may be formed on the transparent cover 1121 by thermal evaporation, physical vapor deposition, atomic layer deposition, or the like; the first dielectric layer 1123 may be formed on the semi-absorbing layer 1122 by thermal evaporation, chemical vapor deposition, atomic layer deposition, or the like. It should be noted that: after the cover plate assembly 112 is assembled with the light emitting element 111, the transparent cover plate 1121 is farther away from the light emitting element 111 than the first dielectric layer 1123, i.e., the encapsulation layer 1115 is closer to the first dielectric layer 1123 than the array substrate 1111. Further, the semi-absorbing layer 1122 has a relatively well-balanced combination of absorption, transmission and reflection of light. At this time, the ambient light at least needs to pass through the transparent cover 1121, the semi-absorbing layer 1122, and the first dielectric layer 1123 in this order before reaching the light emitting assembly 111. In doing so, the semi-absorbing layer 1122 is able to absorb ambient light passing through the transparent cover 1121; the reflected light of the ambient light at the interface of the semi-absorbing layer 1122 towards the transparent cover 1121 further destructively interferes with the reflected light of the ambient light at the interface of the semi-absorbing layer 1122 towards the first dielectric layer 1123. Wherein the ambient light that destructively interferes is primarily the portion that is not absorbed by the semi-absorbing layer 1122. So set up, this application can eliminate the reflection of display module assembly 11 to ambient light effectively, and then increase display module assembly 11's contrast remarkably, improve user's daily use. At this time, the transparent cover 1121 not only protects the display module 11, but also eliminates reflection of ambient light by the display module 11 due to the formation of the semi-absorption layer 1122 and the first dielectric layer 1123, thereby achieving "dual use".

In addition, based on the principle of light interference, the optical thickness Δ of the layers of the semi-absorbing layer 1122, the first dielectric layer 1123, etc. is typically set to approximately 1/4 λ in order to achieve the destructive interference. Wherein, for visible light, the wavelength λ is generally 390-780 nm. Further, when visible light propagates through the film layer with the refractive index n, the optical thickness Δ of the film layer and the geometric thickness L satisfy the following relation: Δ ═ nxl. In addition, since the speed of visible light propagating through the film layer is generally lower than that of visible light propagating through the film layer in vacuum, the refractive index of the film layer is greater than 1. It is clear that theoretically, the geometric thickness of the semi-absorbing layer 1122 and the first dielectric layer 1123 can be less than 200 nm. In other words, the geometric thickness of each film layer for eliminating ambient light in the present embodiment may be less than 400nm, which is much less than the geometric thickness (typically greater than 200 μm) of the circular polarizer used in the related art. Therefore, the thickness of the display module 11 can be greatly reduced in the embodiment, which is favorable for the light and thin of the electronic device 10 and is also favorable for meeting the design of curved screens, flexible screens and the like.

It should be noted that: FIG. 3 is a diagram illustrating destructive interference between ambient light reflected at the interface formed by the semi-absorbent layer 1122 and the transparent cover 1121 and ambient light reflected at the interface formed by the first dielectric layer 1123 and the semi-absorbent layer 1122. Based on the above description, the optical thicknesses of the semi-absorbing layer 1122, the first dielectric layer 1123, and other layers are properly designed, so that the reflected light generated by the ambient light at the interface of the first dielectric layer 1123 away from the semi-absorbing layer 1122 can also destructively interfere with the reflected light.

Further, the material of the semi-absorbing layer 1122 may be any one of In, Nb, Cr, Ti, Mo, Ni, W, Al, Ag, Au, Fe, Mg, Pt, etc., or an alloy thereof. Preferably, the material of the semi-absorbing layer 1122 is In, Nb, or the like. The material of the first dielectric layer 1123 may be any one or combination of NbOx, TiOx, SiOx, SiNx, etc.; wherein x is more than or equal to 1. At this time, the first dielectric layer 1123, in cooperation with the transparent cover 1121, can also be used as an encapsulation layer of the semi-absorbent layer 1122 to prevent water and oxygen from corroding the semi-absorbent layer 1122, thereby ensuring the optical performance of the semi-absorbent layer 1122. Compared with the related art in which the semi-absorbing layer 1122 and the encapsulating layer (different from the encapsulating layer 1115) thereof are formed on the light emitting element 111, the present embodiment forms the semi-absorbing layer 1122 and the first dielectric layer 1123 on the transparent cover plate 1121, so that the processing time of the light emitting element 111 can be shortened, especially the time of the light emitting element 111 exposed to the processes of thermal evaporation, vapor deposition, atomic layer deposition, and the like, thereby facilitating to ensure the yield of the light emitting element 111.

Illustratively, the refractive index of the semi-absorbing layer 1122 may be greater than the refractive index of the transparent cover 1121 and the refractive index of the first dielectric layer 1123. With this arrangement, the ambient light may sequentially pass through the optically thinner medium, the optically denser medium and the optically thinner medium during the propagation process of the cover plate assembly 112. Based on the principle of light interference, a half-wave loss of the reflected light generated by the ambient light at the interface of the semi-absorbing layer 1122 toward the transparent cover 1121 is beneficial to further reduce the geometric thickness of the semi-absorbing layer 1122. Further, for rigid substrates such as glass, the refractive index of the transparent cover 1121 is generally 1.5; for flexible substrates such as polyimide, the refractive index of the transparent cover 1121 is typically 1.7. Root of herbaceous plantAccording to the Fresnel formula: when light enters from one medium (its refractive index is denoted as n1) to another medium (its refractive index is denoted as n2) at an incident angle (proximity) of 90 °, the reflection occurs at the interface formed by the two media, and the reflectance R can be described as: r ═ [ (n1-n2)/(n1+ n2)]². Obviously, the larger the difference between the refractive indexes of two adjacent media is, the larger the reflectivity of light is, and the smaller the light transmittance is accordingly. Based on this, for ambient light, the larger the refractive index of the semi-absorbing layer 1122, the more ambient light can be reflected, which is more beneficial for destructive interference, i.e. the less ambient light reaches the light emitting element 111; however, the light emitted from the light emitting element 111 is also reflected by a large amount in the process of passing through the cover plate 112, so that the light that can pass through the cover plate 112 to reach the environment is less (i.e. the light output is less), and the visual perception is that the brightness of the display module 11 is not enough. In other words, the cover plate assembly 112 reduces the brightness of the display module 11 while allowing the ambient light to destructively interfere. Therefore, in designing the refractive index of the semi-absorbing layer 1122, the effects of both of the above aspects need to be considered together. In this embodiment, the refractive index of the semi-absorbing layer 1122 can be in the closed range [1.8,2.5]]Any value within.

Further, after the cover plate assembly 112 and the light emitting assembly 111 are assembled, although the reflection of the display module 11 to the ambient light can be effectively eliminated by the above-mentioned manner, a small amount of ambient light may pass through the cover plate assembly 112 to reach the light emitting assembly 111, and then is reflected by the second electrode layer 1114. For this reason, the optical thicknesses of the film layers such as the semi-absorbing layer 1122, the first dielectric layer 1123, and the later-mentioned second dielectric layer 1124 may be designed such that the reflected light of the ambient light generated at the interface between the second electrode layer 1114 and the encapsulation layer 1115 can further destructively interfere with the reflected light of the ambient light generated at the interface between the semi-absorbing layer 1122 and the transparent cover plate 1121, or the reflected light of the ambient light generated at the interface between the second electrode layer 1114 and the encapsulation layer 1115 can further destructively interfere with the reflected light of the ambient light generated at the interface between the semi-absorbing layer 1122 and the first dielectric layer 1123, thereby increasing the destructive interference effect.

Referring to fig. 4, fig. 4 is a schematic diagram of a stacked structure of an embodiment of the first dielectric layer in fig. 3.

Based on the above description, the light emitted from the light emitting element 111 will also be reflected to some extent while passing through the cover plate 112, resulting in insufficient brightness of the display module 11. For this reason, one inventive concept of the present embodiment may be: based on the fresnel formula, the first dielectric layer 1123 is divided into a plurality of layers having different refractive indexes to reduce the reflection of the light emitted from the light emitting element 111 during the process of passing through the cover plate element 112, thereby increasing the transmittance of the light.

As shown in fig. 4, the first dielectric layer 1123 may include a first inorganic layer 11231 and a second inorganic layer 11232. Wherein a first inorganic layer 11231 is formed on the semi-absorbent layer 1122 and a second inorganic layer 11232 is formed on the first inorganic layer 11231. Further, the refractive index of the first inorganic layer 11231 may be between the refractive index of the semi-absorbing layer 1122 and the refractive index of the second inorganic layer 11232. Illustratively, the refractive index of the first inorganic layer 11231 may take any value within the closed interval [1.6,2.0], and the refractive index of the second inorganic layer 11232 may take any value within the closed interval [1.8,2.5 ].

Illustratively, the material of the first inorganic layer 11231 may be any one or a combination of NbOx, TiOx, etc., and the material of the second inorganic layer 11232 may be any one or a combination of SiOx, SiNx, etc.; wherein x is more than or equal to 1.

Referring to fig. 5, fig. 5 is a schematic view illustrating a stacked structure of another embodiment of the cover plate assembly of fig. 2. It should be noted that: arrow L2 in fig. 5 can be simply regarded as incident light of ambient light on the display module, arrow L23 in fig. 5 can be simply regarded as reflected light of ambient light generated on the interface formed by the second dielectric layer and the transparent cover plate, arrow L24 in fig. 5 can be simply regarded as reflected light of ambient light generated on the interface formed by the semi-absorbing layer and the second dielectric layer, and arrow L25 in fig. 5 can be simply regarded as reflected light of ambient light generated on the interface formed by the first dielectric layer and the semi-absorbing layer.

The main differences from the above described embodiment are: in this embodiment, as shown in fig. 5, the cover plate assembly 112 may further include a second dielectric layer 1124. Wherein the second dielectric layer 1124 is formed on the transparent cover 1121, and the semi-absorbing layer 1122 is formed on the second dielectric layer 1124. At this time, the ambient light at least needs to pass through the transparent cover 1121, the second medium layer 1124, the semi-absorbing layer 1122, and the first medium layer 1123 in sequence before reaching the light emitting assembly 111. In doing so, the semi-absorbing layer 1122 is able to absorb ambient light passing through the transparent cover 1121; any two of the reflected light of the ambient light at the interface formed by the second dielectric layer 1124 and the transparent cover 1121, the reflected light of the ambient light at the interface formed by the semi-absorbing layer 1122 and the second dielectric layer 1124, and the reflected light of the ambient light at the interface formed by the first dielectric layer 1123 and the semi-absorbing layer 1122 further interfere destructively. The material of the second dielectric layer 1124 may be any one or a combination of NbOx, TiOx, SiOx, SiNx, etc.; wherein x is more than or equal to 1.

Illustratively, the optical thickness Δ of the second dielectric layer 1124 may also be set to approximately 1/4 λ based on the principle of interference of light. At this time, the reflected light of the ambient light generated at the interface formed by the second dielectric layer 1124 and the transparent cover 1121 and the reflected light of the ambient light generated at the interface formed by the semi-absorbing layer 1122 and the second dielectric layer 1124 may further destructively interfere (which may be referred to as first destructive interference), and the reflected light of the ambient light generated at the interface formed by the semi-absorbing layer 1122 and the second dielectric layer 1124 and the reflected light of the ambient light generated at the interface formed by the first dielectric layer 1123 and the semi-absorbing layer 1122 may further destructively interfere (which may be referred to as second destructive interference). In some embodiments, the optical film thickness of the second dielectric layer 1124 may not be equal to the optical film thickness of the semi-absorbing layer 1122, so that the first destructive interference and the second destructive interference can respectively aim at different wavelength ranges in visible light, thereby increasing the applicable range of destructive interference. In other embodiments, the optical film thickness of the second dielectric layer 1124 can be the same as the optical film thickness of the semi-absorbing layer 1122 so that the first destructive interference and the second destructive interference can be applied to a certain wavelength range of visible light to increase the effect of destructive interference.

Illustratively, the refractive index of the semi-absorbing layer 1124 may be greater than the refractive index of the transparent cover 1121, the refractive index of the first dielectric layer 1123, and the refractive index of the second dielectric layer 1124. So configured, based on the above description, there is a half-wave loss in the reflected light generated by the ambient light at the interface of the semi-absorbing layer 1122 towards the transparent cover 1121, which is beneficial to further reduce the geometric thickness of the semi-absorbing layer 1122. Further, based on the above description, if the difference between the refractive index of the semi-absorbing layer 1122 and the refractive index of the transparent cover 1121 is large, the light emitted from the light emitting element 111 will be reflected seriously when passing through the interface formed by the two, and the brightness of the display module 11 will be affected. Therefore, in the present embodiment, the refractive index of the second medium layer 1124 can be further designed to match with the transparent cover 1121 and the semi-absorption layer 1122 to generate the first destructive interference, and simultaneously, the brightness requirement of the display module 11 can be considered, that is, the transmittance of the light emitted from the light emitting element 111 is increased. Preferably, the refractive index of the second medium layer 1124 may be between the refractive index of the semi-absorbing layer 1122 and the refractive index of the transparent cover 1121.

Further, other structures of the present embodiment are the same as or similar to those of the above embodiments, please refer to the detailed description of the above embodiments, and are not repeated herein.

Referring to fig. 6, fig. 6 is a schematic diagram of a stacked structure of an embodiment of the second dielectric layer in fig. 5.

Similar to the embodiment described in fig. 4, in this embodiment, as shown in fig. 6, the second dielectric layer 1124 may include a third inorganic layer 11241 and a fourth inorganic layer 11242. Wherein a fourth inorganic layer 11242 is formed on the transparent cover 1121, a third inorganic layer 11241 is formed on the fourth inorganic layer 11242, and a semi-absorbent layer 1122 is formed on the third inorganic layer 11241. Further, the refractive index of the third inorganic layer 11241 may be between the refractive index of the fourth inorganic layer 11242 and the refractive index of the semi-absorbing layer 1122. Illustratively, the refractive index of the third inorganic layer 11241 may take any value within the closed interval [1.6,2.0], and the refractive index of the fourth inorganic layer 11242 may take any value within the closed interval [1.8,2.5 ].

Illustratively, the material of the third inorganic layer 11241 may be any one or a combination of NbOx, TiOx, etc., and the material of the fourth inorganic layer 11242 may be any one or a combination of SiOx, SiNx, etc.; wherein x is more than or equal to 1.

Based on the above detailed description, in one embodiment, the geometrical thickness of the semi-absorbing layer 1122 is not more than 100nm, the geometrical thicknesses of the first inorganic layer 11231 and the third inorganic layer 11241 are not more than 50nm, and the geometrical thicknesses of the second inorganic layer 11232 and the fourth inorganic layer 11242 are not more than 100 nm.

The above description is only a part of the embodiments of the present application, and not intended to limit the scope of the present application, and all equivalent devices or equivalent processes that can be directly or indirectly applied to other related technologies, which are made by using the contents of the present specification and the accompanying drawings, are also included in the scope of the present application.

Claims

1. A cover plate assembly for a display module, the cover plate assembly comprising a transparent cover plate, a semi-absorbing layer formed on the transparent cover plate, and a first dielectric layer formed on the semi-absorbing layer, the semi-absorbing layer absorbing ambient light passing through the transparent cover plate, the ambient light further destructively interfering with reflected light generated at an interface of the semi-absorbing layer facing a side of the transparent cover plate and reflected light generated at an interface of the semi-absorbing layer facing a side of the first dielectric layer.

2. The cover plate assembly of claim 1, wherein the semi-absorbing layer has a refractive index greater than the refractive index of the transparent cover plate and the refractive index of the first dielectric layer.

3. The cover sheet assembly of claim 2, wherein the first dielectric layer includes a first inorganic layer formed on the semi-absorbent layer and a second inorganic layer formed on the first inorganic layer, the first inorganic layer having a refractive index between a refractive index of the semi-absorbent layer and a refractive index of the second inorganic layer.

4. The cover plate assembly of claim 1, further comprising a second dielectric layer formed on the transparent cover plate, the semi-absorbing layer formed on the second dielectric layer, the ambient light producing reflected light at an interface formed by the second dielectric layer and the transparent cover plate, the ambient light producing reflected light at an interface formed by the semi-absorbing layer and the second dielectric layer, the ambient light producing reflected light at an interface formed by the first dielectric layer and the semi-absorbing layer, any two of the ambient light producing reflected light at an interface formed by the first dielectric layer and the semi-absorbing layer further destructively interfere.

5. The cover plate assembly of claim 4, wherein the semi-absorbing layer has a refractive index greater than the refractive index of the transparent cover plate, the refractive index of the first dielectric layer, and the refractive index of the second dielectric layer.

6. The cover plate assembly of claim 5, wherein the refractive index of the second dielectric layer is between the refractive index of the semi-absorbing layer and the refractive index of the transparent cover plate.

7. The cover sheet assembly of claim 6, wherein the second dielectric layer comprises a third inorganic layer formed on the transparent cover sheet and a fourth inorganic layer formed on the fourth inorganic layer, the semi-absorbing layer formed on the third inorganic layer, the refractive index of the third inorganic layer being between the refractive index of the fourth inorganic layer and the refractive index of the semi-absorbing layer.

8. The cover plate assembly according to claim 2 or 5, wherein the refractive index of the semi-absorbing layer takes any value within the close interval [1.8,2.5 ].

9. A display module, wherein the display module comprises a light emitting assembly and the cover plate assembly of any one of claims 1-8, the cover plate assembly being assembled with the light emitting assembly; wherein the transparent cover plate is farther away from the light emitting component than the first medium layer.

10. The display module of claim 9, wherein the light-emitting assembly comprises an array substrate, a first electrode layer, an organic electroluminescent layer, a second electrode layer and an encapsulation layer, which are sequentially stacked; wherein the package layer is closer to the first dielectric layer than the array substrate, reflected light of the ambient light generated at an interface formed by the second electrode layer and the package layer and reflected light of the ambient light generated at an interface of the semi-absorption layer facing the transparent cover plate further destructively interfere, or reflected light of the ambient light generated at an interface formed by the second electrode layer and the package layer and reflected light of the ambient light generated at an interface of the semi-absorption layer facing the first dielectric layer further destructively interfere.

11. An electronic device, comprising a middle frame, a back cover plate and the display module set of claim 9 or 10, wherein the display module set and the back cover plate are respectively located at two opposite sides of the middle frame and are fixedly connected with the middle frame; wherein the cover plate component is farther away from the middle frame than the light-emitting component.