CN212750853U

CN212750853U - Carrier for wafer processing

Info

Publication number: CN212750853U
Application number: CN202021986497.6U
Authority: CN
Inventors: 程进
Original assignee: Suzhou Xinhai Semiconductor Technology Co ltd
Current assignee: Suzhou Xinhai Semiconductor Technology Co ltd
Priority date: 2020-09-11
Filing date: 2020-09-11
Publication date: 2021-03-19
Anticipated expiration: 2030-09-11

Abstract

The utility model discloses a wafer processing carrier, which comprises a workbench, a fixing mechanism and a supporting mechanism, wherein the supporting mechanism is arranged at the center of the top of the workbench and comprises a supporting plate and a rotating rod, the center of the bottom of the supporting plate is connected with the rotating rod, a jack is arranged at the center of the top of the workbench, the rotating rod is movably inserted in the jack, and a first bearing is arranged at the joint of the rotating rod and the workbench; the novel hydraulic press is characterized in that an L-shaped connecting plate is connected to one side of the workbench through a bolt, a fixing mechanism is installed at the other end of the L-shaped connecting plate and comprises a hydraulic cylinder and a fixing frame, a pressing plate is connected to the bottom of a piston rod of the hydraulic cylinder, and a silica gel pad is bonded to the bottom of the pressing plate. The carrier for processing the wafer keeps the wafer stressed uniformly in the process of fixing the wafer so as to avoid the wafer from being broken and can conveniently rotate the fixed wafer.

Description

Carrier for wafer processing

Technical Field

The utility model belongs to the technical field of wafer processing, concretely relates to carrier is used in wafer processing.

Background

In the semiconductor industry, particularly in the field of integrated circuits, the shadow of a wafer is visible everywhere, and the wafer is a thin and round high-purity silicon wafer, and various circuit element structures can be processed and manufactured on the high-purity silicon wafer to form an IC product with a specific electrical function, so that the processing of the wafer is important, and one device necessary for the processing of the wafer is a carrier for the processing of the wafer.

Since the wafer is fragile, the wafer needs to be uniformly stressed in the process of fixing the wafer to avoid the wafer from being broken, and the fixed wafer needs to be conveniently rotated in order to conveniently polish the edge of the wafer.

Therefore, in view of the current situation, it is urgently needed to design and produce a carrier for wafer processing so as to meet the actual use requirement.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a carrier is used in wafer processing to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a carrier for wafer processing comprises a workbench, a fixing mechanism and a supporting mechanism, wherein the supporting mechanism is arranged at the center of the top of the workbench and comprises a supporting plate and a rotating rod, the rotating rod is connected to the center of the bottom of the supporting plate, an insertion hole is formed in the center of the top of the workbench, the rotating rod is movably inserted into the insertion hole, and a first bearing is arranged at the connecting position of the rotating rod and the workbench;

the utility model discloses a fixed frame of hydraulic press, including workstation, fixed frame lateral wall, silica gel pad, fixed frame lateral wall, the other end of workstation is installed fixed frame and is connected with L shape connecting plate through bolted connection, fixed mechanism is installed to the other end of L shape connecting plate, fixed mechanism includes pneumatic cylinder and fixed frame, the bottom of pneumatic cylinder piston rod is connected with the clamp plate, the bottom of clamp plate bonds there is the silica gel pad, fixed frame has been cup jointed in the outside activity of pneumatic.

Preferably, a second bearing is installed at the joint of the piston rod of the hydraulic cylinder and the fixed frame.

Preferably, the side wall of the transparent baffle is carved with anti-skid lines.

Preferably, the side wall of the workbench is welded with four groups of fixing pieces in a rectangular manner, and a fixing screw hole is formed in the body of each fixing piece.

Preferably, a rubber pad is bonded to the top plate of the support plate.

Preferably, the bottom of the inner side wall of the fixed frame is nested with the fixed ring, and the bottom of the fixed ring and the bottom of the fixed frame are located on the same horizontal plane.

The utility model discloses a technological effect and advantage: the carrier for processing the wafer is used for placing the wafer on the top of the supporting plate, then the hydraulic cylinder is started, the piston rod of the hydraulic cylinder drives the pressing plate to press downwards, meanwhile, the fixing frame is pressed downwards due to the support without the pressure plate, and the fixing frame contacts the wafer first and preliminarily determines and fixes the position of the wafer, then the pressure plate is continuously pressed down until the middle part of the top of the wafer is pressed, the wafer is stably fixed, the polishing of the edge of the wafer can be started, when the wafer needs to be rotated, the piston rod of the hydraulic cylinder drives the pressure plate to move upwards for a short distance, that is, when the pressing plate is not in contact with any object, the wafer can be driven to rotate by holding the transparent plate to rotate the fixing frame, the supporting plate can not block the rotation of the wafer due to the rotating rod, the wafer is fixed by the pressing plate again after rotating to the required position, the transparent baffle can prevent the scraps generated by polishing from entering the eyes of operators to cause danger; the carrier for processing the wafer keeps the wafer stressed uniformly in the process of fixing the wafer so as to avoid the wafer from being broken and can conveniently rotate the fixed wafer.

Drawings

Fig. 1 is a schematic structural view of the present invention;

fig. 2 is a sectional view of the fixing mechanism of the present invention;

fig. 3 is a cross-sectional view of the supporting mechanism of the present invention.

In the figure: the device comprises a workbench 1, a 2L-shaped connecting plate, a fixing mechanism 3, a hydraulic cylinder 4, a fixing frame 5, a pressing plate 6, a fixing ring 7, a silica gel pad 8, a transparent baffle 9, a supporting mechanism 10, a fixing part 11, a supporting plate 12, a rotating rod 13, a first bearing 14, a rubber pad 15 and a second bearing 16.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Unless defined otherwise, all references to up, down, left, right, front, back, inner and outer directions herein are to be interpreted as referring to up, down, left, right, front, back, inner and outer directions in the drawings to which the invention is applied, and all references are hereby incorporated herein by reference.

The utility model provides a wafer processing carrier as shown in figures 1-3, which comprises a workbench 1, a fixing mechanism 3 and a supporting mechanism 10, wherein the supporting mechanism 10 is arranged at the top center of the workbench 1, the supporting mechanism 10 comprises a supporting plate 12 and a rotating rod 13, the bottom center of the supporting plate 12 is connected with the rotating rod 13, the center of the top of the workbench 1 is provided with a jack, the rotating rod 13 is movably inserted in the jack, and a first bearing 14 is arranged at the joint of the rotating rod 13 and the workbench 1;

there is L shape connecting plate 2 one side of workstation 1 through bolted connection, fixed establishment 3 is installed to the other end of L shape connecting plate 2, fixed establishment 3 includes pneumatic cylinder 4 and fixed frame 5, the bottom of 4 piston rods of pneumatic cylinder is connected with clamp plate 6, the bottom of clamp plate 6 bonds there is silica gel pad 8, the outside activity of 4 piston rods of pneumatic cylinder has cup jointed fixed frame 5, and fixed frame 5 supports at the top of clamp plate 6, the fixed transparent baffle 9 that has cup jointed in top of fixed frame 5 lateral wall.

Specifically, the second bearing 16 is installed at the junction of the piston rod of the hydraulic cylinder 4 and the fixed frame 5, so that the smoothness of the rotation of the fixed frame 5 relative to the piston rod of the hydraulic cylinder 4 is improved.

Specifically, the side wall of the transparent baffle 9 is engraved with anti-slip lines, so that the edge of the transparent baffle 9 can be conveniently gripped for rotation, and the transparent baffle 9 is drawn to be opaque for the purpose of illustration.

Specifically, the lateral wall of workstation 1 is that the rectangle welding has four sets of mounting 11, fixed screw has been seted up to the body of mounting 11, can be in fixed screw internal spiro union fixing bolt in order to increase the stability of workstation 1.

Specifically, a rubber pad 15 is bonded to the top plate of the support plate 12, so that the bottom of the wafer is prevented from being worn by the support plate 12.

Specifically, the bottom of the inside wall of the fixed frame 5 is nested with the fixed ring 7, and the bottom of the fixed ring 7 and the bottom of the fixed frame 5 are located on the same horizontal plane, so that the contact area between the fixed frame 5 and the wafer is increased, and the wafer is prevented from being cracked due to overlarge pressure at the contact part of the wafer and the fixed frame 5.

The working principle of the carrier for processing the wafer is that the wafer is placed on the top of the supporting plate 12, then the hydraulic cylinder 4 is started, the piston rod of the hydraulic cylinder 4 drives the pressing plate 6 to press downwards, meanwhile, the fixing frame 5 is pressed down without the support of the pressing plate 6, and the fixing frame 5 contacts the wafer first and preliminarily determines and fixes the position of the wafer, then the pressure plate 6 is continuously pressed down until the middle part of the top of the wafer is pressed, the wafer is stably fixed, the polishing of the edge of the wafer can be started, when the wafer needs to be rotated, the piston rod of the hydraulic cylinder 4 drives the pressure plate 6 to move upwards for a short distance, when clamp plate 6 did not contact anything promptly, thereby can rotate fixed frame 5 and drive the wafer rotation through holding transparent plate 9, backup pad 12 because the reason of bull stick 13 and first bearing 14 can not hinder the rotation of wafer, rotate to required position after again through clamp plate 6 fixed wafer polish can.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.

Claims

1. A wafer processing carrier comprises a workbench (1), a fixing mechanism (3) and a supporting mechanism (10), and is characterized in that: a supporting mechanism (10) is arranged at the center of the top of the workbench (1), the supporting mechanism (10) comprises a supporting plate (12) and a rotating rod (13), the rotating rod (13) is connected to the center of the bottom of the supporting plate (12), a jack is formed in the center of the top of the workbench (1), the rotating rod (13) is movably inserted into the jack, and a first bearing (14) is installed at the connecting position of the rotating rod (13) and the workbench (1);

one side of workstation (1) has L shape connecting plate (2) through bolted connection, fixed establishment (3) are installed to the other end of L shape connecting plate (2), fixed establishment (3) are including pneumatic cylinder (4) and fixed frame (5), the bottom of pneumatic cylinder (4) piston rod is connected with clamp plate (6), the bottom of clamp plate (6) bonds there is silica gel pad (8), fixed frame (5) have been cup jointed in the outside activity of pneumatic cylinder (4) piston rod, and fixed frame (5) support at the top of clamp plate (6), transparent baffle (9) have been cup jointed to the top of fixed frame (5) lateral wall.

2. A carrier for wafer processing as claimed in claim 1, wherein: and a second bearing (16) is arranged at the joint of the piston rod of the hydraulic cylinder (4) and the fixed frame (5).

3. A carrier for wafer processing as claimed in claim 1, wherein: the side wall of the transparent baffle (9) is carved with anti-skidding lines.

4. A carrier for wafer processing as claimed in claim 1, wherein: the side wall of the workbench (1) is rectangular and is welded with four fixing pieces (11), and a fixing screw hole is formed in the body of each fixing piece (11).

5. A carrier for wafer processing as claimed in claim 1, wherein: the top plate of the supporting plate (12) is bonded with a rubber pad (15).

6. A carrier for wafer processing as claimed in claim 1, wherein: the bottom of the inner side wall of the fixed frame (5) is nested with a fixed ring (7), and the bottom of the fixed ring (7) and the bottom of the fixed frame (5) are located on the same horizontal plane.