CN212750835U - Mould pressing device for processing diode - Google Patents
Mould pressing device for processing diode Download PDFInfo
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- CN212750835U CN212750835U CN202021787480.8U CN202021787480U CN212750835U CN 212750835 U CN212750835 U CN 212750835U CN 202021787480 U CN202021787480 U CN 202021787480U CN 212750835 U CN212750835 U CN 212750835U
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Abstract
The utility model discloses a molding device for diode processing, including last mould device and the lower mould device that is used for the diode shaping, it is provided with rack device to go up the mould device outside. A molding device for diode processing, through continuous feeding setting, guaranteed diode processing's continuity, improved production speed, through rack device's setting, guaranteed that the cope and drag template presss from both sides tightly, through the setting of the cope and drag mould device of length difference, the automatic finished product diode that opens and shuts to discharge.
Description
Technical Field
The utility model belongs to diode processing field especially relates to a molding device for diode processing.
Background
A diode is an electronic device made of semiconductor material (silicon, selenium, germanium, etc.). It has one-way conducting performance, that is, when positive voltage is applied to the anode and cathode of the diode, the diode is conducted. When a reverse voltage is applied to the anode and the cathode, the diode is turned off. However, in the prior art, the diode die pressing processing is generally finished and then taken out to process the next diode, the processing is carried out intermittently, the time interval is long, and the production speed is reduced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a molding device for diode processing to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
a mould pressing device for diode processing, including last mould device and the lower mould device that is used for the diode shaping, it is provided with rack device to go up the mould device outside.
Further: the rack device comprises a rack body, wherein a glue injection pipe is arranged in front of the rack body, 2 fixed plates are symmetrically arranged on the front and back of the inner wall of the rack body, a movable plate is arranged above the fixed plates, an air cylinder is arranged on the outer side of the movable plate, the glue injection pipe and the air cylinder are respectively connected with the rack body through bolts, the fixed plates and the rack body are riveted together, the movable plate is connected with the rack body in a sliding mode, and the air cylinder is connected with the movable plate through bolts.
The frame body fixes the glue injection pipe to convey glue, and the air cylinder pushes the movable plate to lift up and down to be matched with the fixed plate to clamp the upper template and the lower template tightly.
Further: the rack device comprises a rack body, wherein a glue injection pipe is arranged in front of the rack body, 8 rolling wheels are symmetrically arranged on the front and the back of the inner wall of the rack body, a third motor is arranged on the outer side of each rolling wheel, the glue injection pipe and the third motor are respectively connected with the rack body through bolts, and the third motor is connected with the rolling wheels through flat keys.
The rack body fixes the glue injection pipe to convey glue, and the third motor drives the rolling wheel to be matched and clamped in a rotating mode to clamp the upper template and the lower template.
Further: go up the mould device including 2 first rollers that the symmetry set up, first roller is provided with first motor at the back, install first conveyer belt between the first roller, evenly distributed has a plurality of cope match-plates above the first conveyer belt, first roller with rack device bearing is connected, first motor with rack device bolted connection, the cope match-plate pattern with first conveyer belt bolted connection, the cope match-plate pattern with lower mould device plug is connected.
The first motor drives the first shaft roller to rotate so as to drive the first conveying belt and the upper template to move.
Further: the lower die device comprises a support frame, wherein 2 second shaft rollers are symmetrically arranged on the support frame, a second motor is arranged behind the second shaft rollers, a second conveying belt is installed between the second shaft rollers, a plurality of lower die plates are uniformly distributed on the second conveying belt, the second shaft rollers are connected with a support frame bearing, the second motor is connected with the support frame through bolts, and the lower die plates are connected with the second conveying belt through bolts.
The support frame supports a second motor to drive the second shaft roller to rotate so as to drive the second conveying belt and the lower template to move.
Compared with the prior art, the beneficial effects of the utility model are that:
1. through the continuous feeding arrangement, the continuity of diode processing is ensured, and the production speed is improved;
2. the clamping of the upper template and the lower template is ensured through the arrangement of the frame device;
3. and the finished diodes are automatically opened, closed and discharged through the arrangement of the upper die device and the lower die device with different lengths.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
Fig. 1 is a schematic structural diagram of a molding device for diode processing according to the present invention;
fig. 2 is a schematic view of a lower die device of the molding device for diode processing according to the present invention;
fig. 3 is a schematic view of an upper die device of the molding device for diode processing according to the present invention;
fig. 4 is a rear view of a frame device according to embodiment 1 of the molding device for diode processing of the present invention;
fig. 5 is a rear view of a frame device according to embodiment 2 of the molding device for diode processing of the present invention.
In the reference symbols: 1. a lower die device; 101. a support frame; 102. a second shaft roller; 103. a second motor; 104. a second conveyor belt; 105. a lower template; 2. an upper die device; 201. a first beam barrel; 202. a first motor; 203. a first conveyor belt; 204. mounting a template; 3. a rack device; 301. a frame body; 302. a glue injection pipe; 303. a fixing plate; 304. moving the plate; 305. a cylinder; 306. rolling wheels; 307. a third motor.
Detailed Description
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
The present invention will be further explained with reference to the accompanying drawings:
example 1
As shown in fig. 1-4, the molding device for diode processing comprises an upper mold device 2 and a lower mold device 1 for diode molding, and a frame device 3 is arranged outside the upper mold device 2.
Further: the rack device 3 comprises a rack body 301, a glue injection pipe 302 is installed on the front surface of the rack body 301, 2 fixing plates 303 are symmetrically arranged on the front and back of the inner wall of the rack body 301, a moving plate 304 is arranged above the fixing plates 303, an air cylinder 305 is installed on the outer side of the moving plate 304, the glue injection pipe 302 and the air cylinder 305 are respectively in bolt connection with the rack body 301, the fixing plates 303 and the rack body 301 are riveted together, the moving plate 304 is in sliding connection with the rack body 301, and the air cylinder 305 is in bolt connection with the; the upper die device 2 comprises 2 first axial rollers 201 which are symmetrically arranged, a first motor 202 is arranged behind the first axial rollers 201, a first conveying belt 203 is arranged between the first axial rollers 201, a plurality of upper die plates 204 are uniformly distributed on the first conveying belt 203, the first axial rollers 201 are connected with a rack device 3 through bearings, the first motor 202 is connected with the rack device 3 through bolts, the upper die plates 204 are connected with the first conveying belt 203 through bolts, and the upper die plates 204 are connected with the lower die device 1 in a plugging and pulling manner; the lower die device 1 comprises a support frame 101, 2 second shaft rollers 102 are symmetrically arranged on the support frame 101, a second motor 103 is arranged behind the second shaft rollers 102, a second conveying belt 104 is arranged between the second shaft rollers 102, a plurality of lower die plates 105 are uniformly distributed on the upper surface of the second conveying belt 104, the second shaft rollers 102 are in bearing connection with the support frame 101, the second motor 103 is in bolt connection with the support frame 101, and the lower die plates 105 are in bolt connection with the second conveying belt 104.
Example 2
As shown in fig. 5, embodiment 2 differs from embodiment 1 in that: the rack device 3 comprises a rack body 301, a glue injection pipe 302 is installed in front of the rack body 301, 8 rolling wheels 306 are symmetrically arranged on the front and back of the inner wall of the rack body 301, a third motor 307 is installed on the outer side of each rolling wheel 306, the glue injection pipe 302 and the third motor 307 are respectively connected with the rack body 301 through bolts, and the third motor 307 and the rolling wheels 306 are connected through flat keys.
The utility model discloses a theory of operation and use flow: the diode is placed in the lower template 105, the support frame 101 supports the second motor 103 to drive the second shaft roller 102 to rotate so as to drive the second conveyor belt 104 and the lower template 105 to move, the first motor 202 drives the first shaft roller 201 to rotate so as to drive the first conveyor belt 203 and the upper template 204 to move, the upper template 204 and the lower template 105 are meshed to enter the frame body 301, the air cylinder 305 pushes the moving plate 304 to ascend and descend and to be matched with the fixing plate 303 to clamp the upper template 204 and the lower template 105, or the third motor 307 drives the rolling wheel 306 to rotate and to be matched to clamp the upper template 204 and the lower template 105, and the frame body 301 fixes the glue injection pipe 302 to convey glue to enter the upper template 204 and the lower template 105 to.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention.
Claims (5)
1. A molding device for diode processing, its characterized in that: the diode forming die comprises an upper die device and a lower die device for diode forming, wherein a rack device is arranged on the outer side of the upper die device.
2. Embossing apparatus for diode machining according to claim 1, characterized in that: the rack device comprises a rack body, wherein a glue injection pipe is arranged in front of the rack body, 2 fixed plates are symmetrically arranged on the front and back of the inner wall of the rack body, a movable plate is arranged above the fixed plates, an air cylinder is arranged on the outer side of the movable plate, the glue injection pipe and the air cylinder are respectively connected with the rack body through bolts, the fixed plates and the rack body are riveted together, the movable plate is connected with the rack body in a sliding mode, and the air cylinder is connected with the movable plate through bolts.
3. Embossing apparatus for diode machining according to claim 1, characterized in that: the rack device comprises a rack body, wherein a glue injection pipe is arranged in front of the rack body, 8 rolling wheels are symmetrically arranged on the front and the back of the inner wall of the rack body, a third motor is arranged on the outer side of each rolling wheel, the glue injection pipe and the third motor are respectively connected with the rack body through bolts, and the third motor is connected with the rolling wheels through flat keys.
4. Embossing apparatus for diode machining according to claim 1, characterized in that: go up the mould device including 2 first rollers that the symmetry set up, first roller is provided with first motor at the back, install first conveyer belt between the first roller, evenly distributed has a plurality of cope match-plates above the first conveyer belt, first roller with rack device bearing is connected, first motor with rack device bolted connection, the cope match-plate pattern with first conveyer belt bolted connection, the cope match-plate pattern with lower mould device plug is connected.
5. Embossing apparatus for diode machining according to claim 1, characterized in that: the lower die device comprises a support frame, wherein 2 second shaft rollers are symmetrically arranged on the support frame, a second motor is arranged behind the second shaft rollers, a second conveying belt is installed between the second shaft rollers, a plurality of lower die plates are uniformly distributed on the second conveying belt, the second shaft rollers are connected with a support frame bearing, the second motor is connected with the support frame through bolts, and the lower die plates are connected with the second conveying belt through bolts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021787480.8U CN212750835U (en) | 2020-08-25 | 2020-08-25 | Mould pressing device for processing diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021787480.8U CN212750835U (en) | 2020-08-25 | 2020-08-25 | Mould pressing device for processing diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212750835U true CN212750835U (en) | 2021-03-19 |
Family
ID=74990878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021787480.8U Active CN212750835U (en) | 2020-08-25 | 2020-08-25 | Mould pressing device for processing diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212750835U (en) |
-
2020
- 2020-08-25 CN CN202021787480.8U patent/CN212750835U/en active Active
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