CN212725255U

CN212725255U - Novel leadless surface-mounted device packaging structure

Info

Publication number: CN212725255U
Application number: CN202022237699.7U
Authority: CN
Inventors: 张敏
Original assignee: Wuhan Anzhengxin Optoelectronics Co ltd
Current assignee: Wuhan Anzhengxin Optoelectronics Co ltd
Priority date: 2020-10-10
Filing date: 2020-10-10
Publication date: 2021-03-16
Anticipated expiration: 2030-10-10

Abstract

A novel leadless chip packaging structure relates to the technical field of chip packaging, comprising a packaging platform, a guide mechanism, a positioning mechanism, a traction mechanism and a chip mounting mechanism, wherein the packaging platform comprises a bedplate and a vertical rod, the guide mechanism comprises slide columns and slide rods, the lower surfaces of the four slide columns are all connected with the upper surface of the bedplate, the positioning mechanism comprises a positioning plate, the upper surfaces of the four slide rods are all connected with the lower surface of the positioning plate, the traction mechanism comprises a mounting plate, magnetic chucks, a connecting ring and support rods, one end of each support rod is respectively connected with the peripheral side surfaces of the four vertical rods, the other end of each support rod is respectively connected with the peripheral side surfaces of the connecting ring, the upper surfaces of the six magnetic chucks are all connected with the lower surface of the mounting plate, the chip mounting mechanism comprises a positioning rod, and the two surfaces of the positioning rod are respectively connected with the, and the positioning and packaging of the positioning plate are completed under the guiding of the guiding mechanism.

Description

Novel leadless surface-mounted device packaging structure

Technical Field

The utility model relates to a paster packaging technology field, in particular to novel leadless paster packaging structure.

Background

The technology of the device is continuously developed, the general development trend is towards the development of higher power density, higher reliability and more excellent parameters, and the device is suitable for electronic products such as computers, instruments, automotive electronics, power supplies, communication and switching power supplies, however, the packaging needs to connect the chip and the pins through the lead wires, the lead wires have large thermal expansion coefficient difference with the chip and the frame interface, fatigue is easy to occur, the heat dissipation is poor, the reliability is not high, and the parasitic parameters brought are also large, therefore, in order to solve the defects of the lead wire packaging, a novel patch packaging structure without the lead wires is designed.

The novel leadless chip packaging structure which is put into use currently has the problems that a traction mechanism is simple, a corresponding quick chip packaging mechanism is lacked, and the like, and therefore a novel leadless chip packaging structure is provided.

SUMMERY OF THE UTILITY MODEL

A primary object of the present invention is to provide a novel leadless chip mounting structure, which can effectively solve the problems of simple traction mechanism, lack of corresponding quick chip mounting mechanism and the like in the background art.

In order to achieve the above purpose, the utility model adopts the following technical scheme: the utility model provides a novel leadless paster packaging structure, includes encapsulation platform, guiding mechanism, positioning mechanism, drive mechanism, paster mechanism, the encapsulation platform includes platen and montant, guiding mechanism includes traveller and slide bar, four traveller lower surfaces all with platen upper surface connection, positioning mechanism includes the locating plate, four slide bar upper surfaces all are connected with the locating plate lower surface, drive mechanism includes mounting panel, magnetic chuck, go-between and branch, four branch one end respectively with four montant week side connections, four branch other ends all are connected with connecting ring week side, six magnetic chuck upper surfaces all are connected with the mounting panel lower surface, paster mechanism includes the locating lever, locating lever two surfaces respectively with montant two surface connection.

Preferably, the packaging table further comprises table columns, the four table columns are mounted on the lower surface of the table plate, the lower surfaces of the four vertical rods are connected with the upper surface of the table plate, and the table columns play a role in supporting the whole structure.

Preferably, the guide mechanism further comprises springs, first through holes are formed in the four sliding columns, the four sliding rods are in sliding fit with the four first through holes respectively, the four springs are arranged between the bedplate and the positioning plate, and the springs play a role in elastic guide.

Preferably, positioning mechanism still includes magnetism and inhales post and holding ring, six magnetism are inhaled the post and are all installed in the locating plate lower surface, six holding ring one surface all with locating plate upper surface connection, magnetism inhale the post and accomplish the butt joint with the magnetism dish of inhaling through magnetism attraction.

Preferably, drive mechanism still includes motor, pivot, flexible post, hydraulic stem, pivot one end and motor normal running fit, the pivot other end and flexible post upper surface connection, flexible post lower surface is equipped with the second through-hole, hydraulic stem and second through-hole sliding fit, the mounting panel is installed in the hydraulic stem lower surface, the connecting ring all sides and motor week side are connected, and sliding fit adjusts the height of mounting panel between flexible post and the hydraulic stem, and cooperation paster mechanism carries out the paster encapsulation at the locating plate.

Preferably, the chip mounting mechanism further comprises a sliding plate and chip mounting discs, two sliding grooves are formed in the positioning rod, one end of the sliding plate is in sliding fit with the two sliding grooves respectively, the other end of the sliding plate is connected with one surface of each of the four chip mounting discs respectively, and the sliding plate is in sliding fit with the positioning rod to adjust the position of the whole chip mounting mechanism.

Compared with the prior art, the utility model discloses following beneficial effect has:

1. in the utility model, the motor works to drive the telescopic column and the hydraulic rod to be in sliding fit, so as to drive the mounting plate to move up and down, and the positioning and packaging of the positioning plate are completed under the guiding of the guiding mechanism;

2. the utility model discloses in, set up a swift paster mechanism between two montants, after the location of accomplishing the encapsulation hole on the locating plate, drive mechanism withdraws from, and the paster dish carries out the paster to the locating plate under the slide slides and handles.

Drawings

Fig. 1 is a schematic view of the overall structure of a novel leadless chip package structure of the present invention;

fig. 2 is a schematic front view of a novel leadless chip package structure according to the present invention;

fig. 3 is a schematic side view of a novel leadless chip package structure according to the present invention;

fig. 4 is a schematic diagram of a partial enlarged structure at a in fig. 2 according to the present invention.

In the figure: 100. a packaging stage; 110. a platen; 120. a pillar; 130. a vertical rod; 200. a guide mechanism; 210. a traveler; 220. a slide bar; 230. a spring; 300. a positioning mechanism; 310. positioning a plate; 320. a magnetic attraction column; 330. a positioning ring; 400. a traction mechanism; 410. a motor; 420. a rotating shaft; 430. a telescopic column; 440. a hydraulic lever; 450. mounting a plate; 460. a magnetic chuck; 470. a connecting ring; 480. a strut; 500. a patch mechanism; 510. positioning a rod; 520. a slide plate; 530. a film sticking disc.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The first embodiment is as follows:

referring to fig. 1-4, the present invention is a novel leadless chip packaging structure, which comprises a packaging table 100, a guiding mechanism 200, a positioning mechanism 300, and a drawing mechanism 400, chip mechanism 500, encapsulation platform 100 includes platen 110 and montant 130, guiding mechanism 200 includes traveller 210 and slide bar 220, four traveller 210 lower surfaces all with platen 110 upper surface connection, positioning mechanism 300 includes locating plate 310, four slide bar 220 upper surfaces all with locating plate 310 lower surface connection, drive mechanism 400 includes mounting panel 450, magnetic chuck 460, go-between 470 and branch 480, four branch 480 one end are connected with four montant 130 week side respectively, four branch 480 other ends all with go-between 470 week side connection, six magnetic chuck 460 upper surfaces all with mounting panel 450 lower surface connection, chip mechanism 500 includes locating lever 510, locating lever 510 two surfaces respectively with montant 130 two surface connection.

Further, the packaging table 100 further includes table pillars 120, four table pillars 120 are all installed on the lower surface of the table plate 110, the lower surfaces of four vertical bars 130 are all connected with the upper surface of the table plate 110, and the table pillars 120 play a role in supporting the whole structure.

Further, the guiding mechanism 200 further includes springs 230, the four sliding posts 210 are all provided with first through holes therein, the four sliding rods 220 are respectively in sliding fit with the four first through holes, the four springs 230 are all disposed between the platen 110 and the positioning plate 310, and the springs 230 play a role of elastic guiding.

Further, the positioning mechanism 300 further includes magnetic poles 320 and positioning rings 330, wherein the six magnetic poles 320 are all mounted on the lower surface of the positioning plate 310, one surface of the six positioning rings 330 is connected to the upper surface of the positioning plate 310, and the magnetic poles 320 and the magnetic attraction disc 460 are magnetically attracted to complete the butt joint.

Further, the traction mechanism 400 further comprises a motor 410, a rotating shaft 420, a telescopic column 430 and a hydraulic rod 440, one end of the rotating shaft 420 is in rotating fit with the motor 410, the other end of the rotating shaft 420 is connected with the upper surface of the telescopic column 430, a second through hole is formed in the lower surface of the telescopic column 430, the hydraulic rod 440 is in sliding fit with the second through hole, the mounting plate 450 is mounted on the lower surface of the hydraulic rod 440, the circumferential side surface of the connecting ring 470 is connected with the circumferential side surface of the motor 410, the height of the mounting plate 450 is adjusted by sliding fit between the telescopic column 430 and the hydraulic rod 440, and the patch mounting mechanism 500 is.

Further, the chip mounting mechanism 500 further comprises a sliding plate 520 and chip mounting discs 530, two sliding grooves are formed in the positioning rod 510, one end of the sliding plate 520 is in sliding fit with the two sliding grooves, the other end of the sliding plate 520 is connected with one surface of each of the four chip mounting discs 530, and the sliding plate 520 is in sliding fit with the positioning rod 510 to adjust the position of the whole chip mounting mechanism 500.

Example two:

referring to fig. 1-4, the present invention relates to a novel leadless chip package structure, wherein the motor 410 has a model BY24Y-2419BL, and the working principle thereof is as follows: the sliding column 210 is in sliding fit with the sliding rod 220, and simultaneously drives the spring 230 to perform elastic adjustment, so as to complete the determination of the packaging height of the positioning plate 310, then the motor 410 works to drive the telescopic column 430 and the hydraulic rod 440 to perform sliding fit to change the height of the mounting plate 450, after reaching a proper height, the magnetic attraction between the magnetic attraction column 320 and the magnetic attraction disc 460 completes the determination of the packaging position, and then the sliding plate 520 slides to drive the patch disc 530 to perform patch packaging on the positioning plate 310.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a novel leadless paster packaging structure, includes encapsulation platform (100), guiding mechanism (200), positioning mechanism (300), drive mechanism (400), paster mechanism (500), its characterized in that: the packaging table (100) comprises a bedplate (110) and a vertical rod (130), the guide mechanism (200) comprises a sliding column (210) and a sliding rod (220), the lower surfaces of the four sliding columns (210) are connected with the upper surface of the bedplate (110), the positioning mechanism (300) comprises a positioning plate (310), the upper surfaces of the four sliding rods (220) are connected with the lower surface of the positioning plate (310), the traction mechanism (400) comprises a mounting plate (450), a magnetic disc (460), a connecting ring (470) and a support rod (480), one end of each of the four supporting rods (480) is respectively connected with the peripheral side surfaces of the four vertical rods (130), the other ends of the four supporting rods (480) are connected with the peripheral side surface of the connecting ring (470), the upper surfaces of the six magnetic suction discs (460) are all connected with the lower surface of the mounting plate (450), the patch mechanism (500) comprises a positioning rod (510), and two surfaces of the positioning rod (510) are respectively connected with two surfaces of the vertical rod (130).

2. The novel leadless chip package of claim 1, wherein: the packaging table (100) further comprises table columns (120), the four table columns (120) are mounted on the lower surface of the table plate (110), and the lower surfaces of the four vertical rods (130) are connected with the upper surface of the table plate (110).

3. The novel leadless chip package of claim 1, wherein: the guide mechanism (200) further comprises springs (230), first through holes are formed in the four sliding columns (210), the four sliding rods (220) are in sliding fit with the four first through holes respectively, and the four springs (230) are arranged between the bedplate (110) and the positioning plate (310).

4. The novel leadless chip package of claim 1, wherein: positioning mechanism (300) still include magnetism and inhale post (320) and holding ring (330), six magnetism are inhaled post (320) and are all installed in holding plate (310) lower surface, a surface of six holding ring (330) all with holding plate (310) upper surface connection.

5. The novel leadless chip package of claim 1, wherein: draw mechanism (400) still includes motor (410), pivot (420), flexible post (430), hydraulic stem (440), pivot (420) one end and motor (410) normal running fit, pivot (420) other end and flexible post (430) upper surface connection, flexible post (430) lower surface is equipped with the second through-hole, hydraulic stem (440) and second through-hole sliding fit, install in hydraulic stem (440) lower surface mounting panel (450), go-between (470) week side and motor (410) week side connection.

6. The novel leadless chip package of claim 1, wherein: the paster mechanism (500) further comprises a sliding plate (520) and paster discs (530), two sliding grooves are formed in the positioning rod (510), one end of the sliding plate (520) is in sliding fit with the two sliding grooves respectively, and the other end of the sliding plate (520) is connected with one surface of each of the four paster discs (530) respectively.