CN212723902U - Embedded detector CPU heat abstractor - Google Patents
Embedded detector CPU heat abstractor Download PDFInfo
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- CN212723902U CN212723902U CN202021505402.4U CN202021505402U CN212723902U CN 212723902 U CN212723902 U CN 212723902U CN 202021505402 U CN202021505402 U CN 202021505402U CN 212723902 U CN212723902 U CN 212723902U
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- heat
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- cpu
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- conducting plate
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Abstract
The utility model discloses an embedded detector CPU heat dissipation device, which comprises a heat dissipation sheet and a heat transfer plate; the radiating fins are a horizontal radiating plate and a vertical heat conducting plate which are of an integrated structure; the heat transfer plates are a vertical heat transfer plate and a horizontal heat transfer plate which are of an integrated structure; the device to be radiated comprises a case body and a CPU (central processing unit) supported in the case body through a support; the horizontal heat-conducting plate of the heat-radiating fin is covered at the upper end of the CPU, the horizontal heat-conducting plate of the heat-conducting plate is fixed with a bottom box plate screw of the case body, and the vertical heat-conducting plate of the heat-conducting plate is fixed with the vertical heat-conducting plate screw of the heat-radiating fin; the horizontal radiating plate of the radiating fin is used for radiating the CPU in a first stage, and the vertical heat conducting plate of the radiating fin, the heat conducting plate and the bottom box plate of the case body radiate the CPU in a step-by-step mode in the heat conducting process. The utility model discloses a heat abstractor more is favorable to the detector of long-time work, avoids CPU long-term work high temperature to lead to the problem of halting.
Description
Technical Field
The utility model relates to an embedded detector CPU heat abstractor belongs to detector technical field.
Background
The embedded detector CPU heat abstractor is a necessary device in the detector, the traditional heat abstractor can only conduct heat to the heat dissipation frame, the heat dissipation frame transfers the heat to the air in the detector, the detector working for a long time can not effectively dissipate heat, a closed environment is required, fan type heat dissipation can not be adopted, and a novel detector CPU heat abstractor is needed.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a solve embedded detector and at long-time during operation, easily generate heat and lead to the problem of crashing, and provide an embedded detector CPU heat abstractor.
The utility model aims at realizing through the following technical scheme:
the utility model discloses an embedded detector CPU heat abstractor, which comprises a heat radiating fin and a heat transfer plate;
the radiating fins are a horizontal radiating plate and a vertical heat conducting plate which are of an integrated structure;
the heat transfer plates are a vertical heat transfer plate and a horizontal heat transfer plate which are of an integrated structure;
the device to be radiated comprises a case body and a CPU (central processing unit) supported in the case body through a support;
the horizontal heat-conducting plate of the heat-radiating fin is covered at the upper end of the CPU, the horizontal heat-conducting plate of the heat-conducting plate is fixed with a bottom box plate screw of the case body, and the vertical heat-conducting plate of the heat-conducting plate is fixed with the vertical heat-conducting plate screw of the heat-radiating fin; the horizontal radiating plate of the radiating fin is used for radiating the CPU in a first stage, and the vertical heat conducting plate of the radiating fin, the heat conducting plate and the bottom box plate of the case body radiate the CPU in a step-by-step mode in the heat conducting process.
In order to improve the heat dissipation effect, the contact surface between the horizontal heat dissipation plate of the heat dissipation plate and the CPU is coated with heat dissipation silica gel.
The upper plate surface of the horizontal radiating plate of the radiating fin is provided with a radiating structure with a large surface area.
The heat dissipation structure of the upper plate surface of the horizontal heat dissipation plate of the heat dissipation plate is provided with a plurality of heat dissipation strips which are upwards raised and arranged in parallel.
The radiating fins and the heat transfer plates are made of aluminum materials.
The horizontal heat conducting plates of the heat conducting plates are in surface-to-surface butt joint with the bottom box plate of the case body, and the vertical heat conducting plates of the heat conducting plates are in surface-to-surface butt joint with the vertical heat conducting plates of the radiating fins.
The joint of the horizontal heat conducting plate of the heat conducting plate and the bottom box plate of the case body and the joint of the vertical heat conducting plate of the heat conducting plate and the vertical heat conducting plate of the radiating fin are fixed through long hole screws, and the fixed positions of the radiating fin and the heat conducting plate are matched with the installation position of the CPU in the case body through the long holes.
Advantageous effects
The utility model discloses a heat abstractor, through fin and heat transfer plate with heat conduction to quick-witted box on, dispel the heat to CPU step by step at the heat transfer in-process, the utility model discloses a heat abstractor more is favorable to the detector of long-time work, avoids CPU long-term work high temperature to lead to the problem of halting.
Drawings
Fig. 1 is an installation schematic view of the heat dissipation device of the present invention;
wherein: 1-a heat sink; 2-heat transfer plates; 3-heat dissipation silica gel; 4-a machine box body; 5-CPU.
Detailed Description
The invention will be further explained with reference to the drawings and examples
Examples
As shown in fig. 1, the CPU heat sink for an embedded detector of the present invention comprises a heat sink 1 and a heat transfer plate 2;
the radiating fin 1 is a horizontal radiating plate and a vertical heat conducting plate which are of an integrated structure;
the heat transfer plate 2 is a vertical heat conduction plate and a horizontal heat conduction plate which are of an integrated structure;
the device to be radiated comprises a machine box body 4 and a CPU5 supported in the machine box body 4 through a bracket;
the horizontal radiating plate of the radiating fin 1 is covered at the upper end of the CPU5, the horizontal heat conducting plate of the heat conducting plate 2 is fixed with the bottom box plate screw of the machine box body 4, and the vertical heat conducting plate of the heat conducting plate 2 is fixed with the vertical heat conducting plate screw of the radiating fin 1; the horizontal radiating plate of the radiating fin 1 is used for primary radiating to the CPU5, and the vertical heat conducting plate of the radiating fin 1, the heat conducting plate 2 and the bottom box plate of the case body 4 gradually radiate the CPU5 in the heat conducting process.
In order to improve the heat dissipation effect, the contact surface between the horizontal heat dissipation plate of the heat dissipation plate 1 and the CPU5 is coated with heat dissipation silica gel 3.
The radiating fin 1 and the heat transfer plate 2 are both made of aluminum materials.
The upper plate surface of the horizontal radiating plate of the radiating fin 1 is provided with a radiating structure with a large surface area.
The heat dissipation structure of the upper plate surface of the horizontal heat dissipation plate of the heat dissipation plate 1 is a plurality of heat dissipation strips which are upwards protruded and arranged in parallel.
The horizontal heat conducting plates of the heat conducting plates 2 are in surface-to-surface butt joint with the bottom box plate of the case body 4, and the vertical heat conducting plates of the heat conducting plates 2 are in surface-to-surface butt joint with the vertical heat conducting plates of the radiating fins 1.
The joint of the horizontal heat conducting plate of the heat conducting plate 2 and the bottom box plate of the case body 4 and the joint of the vertical heat conducting plate of the heat conducting plate 2 and the vertical heat conducting plate of the radiating fin 1 are fixed by long hole screws, and the fixed positions of the radiating fin 1 and the heat conducting plate 2 are matched with the installation position of the CPU5 in the case body 4 through the long holes.
Claims (7)
1. An embedded detector CPU heat abstractor, characterized by: comprises a heat sink and a heat transfer plate;
the radiating fins are a horizontal radiating plate and a vertical heat conducting plate which are of an integrated structure;
the heat transfer plates are a vertical heat transfer plate and a horizontal heat transfer plate which are of an integrated structure;
the device to be radiated comprises a case body and a CPU (central processing unit) supported in the case body through a support;
the horizontal heat-conducting plate of the heat-radiating fin is covered at the upper end of the CPU, the horizontal heat-conducting plate of the heat-conducting plate is fixed with a bottom box plate screw of the case body, and the vertical heat-conducting plate of the heat-conducting plate is fixed with the vertical heat-conducting plate screw of the heat-radiating fin; the horizontal radiating plate of the radiating fin is used for radiating the CPU in a first stage, and the vertical heat conducting plate of the radiating fin, the heat conducting plate and the bottom box plate of the case body radiate the CPU in a step-by-step mode in the heat conducting process.
2. The embedded CPU heat sink for testing instrument of claim 1, wherein: and the contact surface between the horizontal radiating plate of the radiating fin and the CPU is coated with radiating silica gel.
3. The embedded CPU heat sink for testing instrument of claim 1, wherein: the upper plate surface of the horizontal radiating plate of the radiating fin is provided with a radiating structure with a large surface area.
4. The embedded CPU heat dissipation device of claim 3, wherein: the heat dissipation structure of the upper plate surface of the horizontal heat dissipation plate of the heat dissipation plate is provided with a plurality of heat dissipation strips which are upwards raised and arranged in parallel.
5. The heat dissipation device of the CPU of the embedded detector as claimed in any one of claims 1-3, wherein: the radiating fins and the heat transfer plates are made of aluminum materials.
6. The heat dissipation device of the CPU of the embedded detector as claimed in any one of claims 1-3, wherein: the horizontal heat conducting plates of the heat conducting plates are in surface-to-surface butt joint with the bottom box plate of the case body, and the vertical heat conducting plates of the heat conducting plates are in surface-to-surface butt joint with the vertical heat conducting plates of the radiating fins.
7. The heat dissipation device of the CPU of the embedded detector as claimed in any one of claims 1-3, wherein: the joint of the horizontal heat conducting plate of the heat conducting plate and the bottom box plate of the case body and the joint of the vertical heat conducting plate of the heat conducting plate and the vertical heat conducting plate of the radiating fin are fixed through long hole screws, and the fixed positions of the radiating fin and the heat conducting plate are matched with the installation position of the CPU in the case body through the long holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021505402.4U CN212723902U (en) | 2020-07-27 | 2020-07-27 | Embedded detector CPU heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021505402.4U CN212723902U (en) | 2020-07-27 | 2020-07-27 | Embedded detector CPU heat abstractor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212723902U true CN212723902U (en) | 2021-03-16 |
Family
ID=74909107
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021505402.4U Active CN212723902U (en) | 2020-07-27 | 2020-07-27 | Embedded detector CPU heat abstractor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212723902U (en) |
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2020
- 2020-07-27 CN CN202021505402.4U patent/CN212723902U/en active Active
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