CN212713823U - 水平式高纵横比电路板微孔镀铜镀锡的设备 - Google Patents
水平式高纵横比电路板微孔镀铜镀锡的设备 Download PDFInfo
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- CN212713823U CN212713823U CN202021077366.6U CN202021077366U CN212713823U CN 212713823 U CN212713823 U CN 212713823U CN 202021077366 U CN202021077366 U CN 202021077366U CN 212713823 U CN212713823 U CN 212713823U
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- circuit board
- conveying
- clamp
- aspect ratio
- high aspect
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- 238000007747 plating Methods 0.000 title claims abstract description 46
- 230000007246 mechanism Effects 0.000 claims abstract description 48
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 40
- 229910052802 copper Inorganic materials 0.000 claims abstract description 40
- 239000010949 copper Substances 0.000 claims abstract description 40
- 238000005406 washing Methods 0.000 claims abstract description 30
- 238000007599 discharging Methods 0.000 claims abstract description 14
- 238000001035 drying Methods 0.000 claims abstract description 9
- 230000005611 electricity Effects 0.000 claims abstract description 7
- 239000002253 acid Substances 0.000 claims abstract description 5
- 235000021110 pickles Nutrition 0.000 claims abstract description 3
- 230000008093 supporting effect Effects 0.000 claims description 16
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 14
- 239000007787 solid Substances 0.000 claims description 13
- 238000003825 pressing Methods 0.000 claims description 6
- 230000005012 migration Effects 0.000 claims description 2
- 238000013508 migration Methods 0.000 claims description 2
- 238000009713 electroplating Methods 0.000 abstract description 22
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 238000005554 pickling Methods 0.000 abstract description 6
- 235000008331 Pinus X rigitaeda Nutrition 0.000 abstract description 3
- 235000011613 Pinus brutia Nutrition 0.000 abstract description 3
- 241000018646 Pinus brutia Species 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 18
- 238000000034 method Methods 0.000 description 12
- 230000009471 action Effects 0.000 description 11
- 239000007788 liquid Substances 0.000 description 10
- 230000008569 process Effects 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 239000003814 drug Substances 0.000 description 6
- 238000003780 insertion Methods 0.000 description 6
- 230000037431 insertion Effects 0.000 description 6
- 230000005484 gravity Effects 0.000 description 5
- 239000007921 spray Substances 0.000 description 5
- 241000196324 Embryophyta Species 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 4
- 238000005507 spraying Methods 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
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Abstract
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Application Number | Priority Date | Filing Date | Title |
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CN202021077366.6U CN212713823U (zh) | 2020-06-11 | 2020-06-11 | 水平式高纵横比电路板微孔镀铜镀锡的设备 |
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CN202021077366.6U CN212713823U (zh) | 2020-06-11 | 2020-06-11 | 水平式高纵横比电路板微孔镀铜镀锡的设备 |
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CN212713823U true CN212713823U (zh) | 2021-03-16 |
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CN202021077366.6U Active CN212713823U (zh) | 2020-06-11 | 2020-06-11 | 水平式高纵横比电路板微孔镀铜镀锡的设备 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112144099A (zh) * | 2020-09-17 | 2020-12-29 | 珠海松柏科技有限公司 | 一种水平电镀生产线及其传输机构 |
CN113954168A (zh) * | 2021-09-08 | 2022-01-21 | 张清涛 | 一种用于线路板通孔镀锡的一体化加工设备 |
-
2020
- 2020-06-11 CN CN202021077366.6U patent/CN212713823U/zh active Active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112144099A (zh) * | 2020-09-17 | 2020-12-29 | 珠海松柏科技有限公司 | 一种水平电镀生产线及其传输机构 |
CN112144099B (zh) * | 2020-09-17 | 2021-12-21 | 珠海松柏科技有限公司 | 一种水平电镀生产线及其传输机构 |
CN113954168A (zh) * | 2021-09-08 | 2022-01-21 | 张清涛 | 一种用于线路板通孔镀锡的一体化加工设备 |
CN113954168B (zh) * | 2021-09-08 | 2023-11-03 | 深圳市赛孚科技有限公司 | 一种用于线路板通孔镀锡的一体化加工设备 |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Horizontal High Aspect Ratio Circuit Board Microporous Copper and Tin Plating Equipment Effective date of registration: 20230517 Granted publication date: 20210316 Pledgee: Shenzhen small and medium sized small loan Co.,Ltd. Pledgor: SHENZHEN CYPRESS INDUSTRIAL DEVELOPMENT Co.,Ltd. Registration number: Y2023980040889 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
CP03 | Change of name, title or address |
Address after: 518104 Building 8, 2nd Floor, 1st Floor, and Building 12, 1st Floor, Blue Sky Science and Technology Park, Di Tang Road, Shasi Community, Shajing Street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Songbai Science and Technology Co.,Ltd. Country or region after: Zhong Guo Address before: 518000 2 / F, 1 / F, 12 / F, 1 / F, building 8, Lantian Science Park, Ditang Road, Shasi community, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN CYPRESS INDUSTRIAL DEVELOPMENT Co.,Ltd. Country or region before: Zhong Guo |
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