CN212695446U - Sintering clamp of semiconductor laser - Google Patents
Sintering clamp of semiconductor laser Download PDFInfo
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- CN212695446U CN212695446U CN202021903947.0U CN202021903947U CN212695446U CN 212695446 U CN212695446 U CN 212695446U CN 202021903947 U CN202021903947 U CN 202021903947U CN 212695446 U CN212695446 U CN 212695446U
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- fixing plate
- sintering
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Abstract
The utility model relates to a semiconductor laser's sintering anchor clamps. This anchor clamps include: upper and lower fixing plates and connecting columns; the pressing blocks press two sides of the COS to be sintered through the rectangular holes in the upper fixing plate and the round holes in the lower fixing plate corresponding to the COS. A positioning sheet is used for positioning the COS; and a sleeve frame for bearing the lower fixing plate is covered outside the packaging shell. The utility model discloses COS location efficiency and accuracy can be improved, and the COS that can realize having the difference in height atress evenly in the sintering process.
Description
Technical Field
The utility model relates to a sintering anchor clamps of a plurality of semiconductor laser of once sintering belongs to semiconductor laser sintering technical field.
Background
Semiconductor lasers have been widely used in military, communication, projection, medical treatment, illumination, and scientific research fields due to their advantages of wide wavelength range, small size, light weight, and long lifetime, and the demand is increasing.
Although the growth of semiconductor laser materials and the level of manufacturing processes are continuously improved, the single chip power still cannot meet the high power requirement of industrial production on semiconductor lasers, in order to obtain high power output, the high power output is generally realized by a method of increasing the number of chips, the main realization mode is two forms of bar array packaging and multi-tube-chip series packaging, the bar array packaging is that a plurality of semiconductor laser chips are connected in parallel in the slow axis direction, low voltage and high current driving is needed, and a plurality of practical problems can be caused in engineering application. Compared with the prior art, the single-chip serial package has independent electric and thermal working environments, avoids thermal crosstalk among the light-emitting units, and has great advantages in the aspects of service life and the like. And a single chip is independently packaged, so that the sintering difficulty of the chip can be reduced, the heat dissipation capacity can be improved, the packaged small units can be screened, defective products can be eliminated, and the yield of series modules can be improved.
The multi-die serial package is that a single chip is packaged on a sub-heat sink, and then the packaged unit device COS (COS refers to a chip on sub-mount, which is a laser packaged on the sub-heat sink) is packaged on a large heat sink through secondary sintering. Because the solder has certain fluidity when melting, a sintering cavity is formed between the heat sink bottom plate and the large heat sink, and the light emitting direction of the tube core is deviated. Therefore, when the secondary sintering is performed, a certain pressure is applied to COS.
CN104409964A provides a semiconductor laser sintering clamp and a sintering method thereof, the clamp comprises a base, a support plate and a pressing block, the support plate is fixed on the base, a compression bolt is arranged on the support plate, a fixing column is arranged on the base, the pressing block is positioned on the base through the fixing column, a boss is arranged on one side of the bottom of the pressing block, and vertical spring pins are fixedly arranged on the other side of the bottom of the pressing block. Firstly, a heat sink with prefabricated welding flux is placed on a base, the heat sink is positioned through fixing columns on the base, then COS is placed on the heat sink along the arc-shaped edge of the heat sink, pressing blocks are placed on the heat sink, spring pins correspond to the COS in a one-to-one mode, and the pressing bolts are rotated to press the pressing blocks tightly, so that the pressing blocks do not shift in the sintering process. The method has the disadvantages that the COS is positioned on the same plane on the large heat sink, and when the gradient is formed on the large heat sink and the COS is required to have certain height difference for arrangement, the force applied to each COS is different, so that the consistency of the height difference cannot be ensured. And need artifical COS to put under the microscope, lead to the position deviation that appears easily that inefficiency and COS discharged, and the uniformity is poor.
Disclosure of Invention
The utility model provides a to prior art not enough, the utility model provides a sintering anchor clamps of a plurality of semiconductor laser of once sintering can improve COS positioning efficiency and accuracy to can realize that the COS that has the difference in height atress is even in the sintering in the process.
A plurality of semiconductor lasers: refers to COS located in the same plane or in multiple planes with height differences.
COS: referred to as chip on submount, is a laser packaged on a submount.
Packaging the shell: the COS sintering region is arranged in the package shell of the laser, and a plurality of COS are output by optical fibers after being optically coupled.
Width and length of the packaging shell and the positioning sheet: the width refers to the length of the semiconductor laser sintering fixture in the X direction in fig. 1, and the length refers to the length of the Y direction in fig. 1.
The technical scheme of the utility model is that:
a sintering jig that sinters a plurality of semiconductor lasers at a time, comprising:
an upper fixing plate, a lower fixing plate and a connecting column connected with the upper fixing plate and the lower fixing plate;
the upper part of each pressing block is in a rectangular column shape and is called a rectangular part, the lower part of each pressing block is in a cylindrical shape and is called a cylindrical part, and the bottom end of each pressing block is a pointed end and used for pressing COS to be sintered;
a plurality of round holes are formed in the lower fixing plate corresponding to the COS and used for the cylindrical part of the pressing block to penetrate through;
the upper fixing plate is provided with a rectangular hole which is vertically aligned with the round hole on the lower fixing plate up and down and is used for the rectangular part of the pressing block to pass through;
the positioning sheet is used for positioning the COS;
and the sleeve frame is used for bearing the lower fixing plate.
Preferably, according to the present invention, the positioning piece is located on the inner surface of the package housing. The length of the positioning piece is matched with the length in the inner surface of the packaging shell, and the width of the positioning piece is the distance from the inner wall of the upper surface of the packaging shell to the front cavity surface of the COS (chip on chip), so that the positioning piece is fixed in a mode of being clamped on the inner wall of the packaging shell.
According to the optimization of the invention, one side of the positioning sheet is flush with the edge of the COS sintering area, the edge is provided with a groove, and the light-emitting surface of the laser is aligned to the center of the groove so as to position the COS; the groove can also prevent the positioning sheet from contacting the light-emitting surface of the laser, and damage to the light-emitting surface of the laser is avoided.
Preferably, according to the invention, the pressing block tips press both sides of the heat sink on the COS to be sintered.
The number of the round holes formed in the lower fixing plate is COS 2, and the diameter of each round hole is matched with that of the cylindrical part of the pressing block. The number of the rectangular holes formed in the upper fixing plate is COS 2, and the size of each rectangular hole is matched with that of the rectangular part of the pressing block. The utility model discloses a press the tip of briquetting lower part bottom on COS both sides of heat sink and realize the fixed action, consequently the number of briquetting is the twice of treating sintering COS number.
The round holes of the upper fixing plate and the rectangular holes of the lower fixing plate are in one-to-one vertical correspondence and used for fixing the pressing blocks.
According to the invention, the rectangular part of the pressure block has a length greater than the length of the cylindrical part.
According to the invention, the contact point of the pointed end at the bottom end of the briquetting and COS is preferably in a pointed shape with a circular arc shape. A slight increase in contact area can avoid displacement well.
According to the invention, the COS is located in a COS sintering area in the packaging shell and is arranged in a step shape.
The semiconductor laser sintering furniture can be used for a plurality of COS positioned on the same plane, and can also be used for COS positioned on a plurality of planes with height difference.
According to the invention, the sleeve frame for bearing the lower fixing plate is preferably clamped at the upper part of the packaging shell or is fit and sleeved outside the packaging shell. The sleeve frame is connected with the lower fixing plate and the packaging shell, so that the assembled device is prevented from shifting in the moving process.
According to the invention, the sleeve for carrying the lower fastening plate is preferably a sleeve with a surrounding wall or a carrier without a surrounding wall. The size of the lower fixing plate is matched with that of the lower fixing plate. The lower fixing plate is stably clamped to bear the upper and lower fixing plates and the connecting column.
According to the invention, the sleeve frame is preferably divided into an upper part and a lower part by the transverse support clamp beam. The lower dimension of the sleeve frame is matched with the upper or outer dimension of the packaging shell, and the sleeve frame can be clamped on the shell wall to be fixed. The size of the upper part of the sleeve frame is matched with that of the lower fixing plate, so that the lower fixing plate is clamped on the upper part of the sleeve frame to be fixed.
The COS positioning device is simple in structure and convenient to operate, the COS is positioned through the positioning piece, the COS positioning efficiency and accuracy are greatly improved, and the problems of low efficiency and position deviation caused by manual placement of the COS under a microscope in the prior art are solved. The lower fixing plate and the shell are connected through the sleeve, so that the clamp is prevented from shifting in the moving process of the assembled device. Each COS corresponds to two pressing blocks, so that the two sides of the COS are stressed uniformly, the applied pressure is not influenced by the height of the welding surface of the COS, and the COS is suitable for the situation that the COS is arranged with a certain height difference. The clamp can be sintered under the protection of nitrogen, and the solder is prevented from being oxidized during high-temperature sintering. Meanwhile, a plurality of clamp units can be arranged for batch sintering, the sintering yield is over 95%, and the production efficiency is greatly improved.
Drawings
Fig. 1 is a schematic structural diagram of a semiconductor laser sintering fixture of the present invention;
FIG. 2 is a schematic diagram of two sides of the heat sink on COS pressed by the tip at the lower part of the middle pressing block of the present invention;
FIG. 3 is a schematic view of a compact;
FIG. 4 is a schematic view of the lower retaining plate;
FIG. 5 is a schematic view of a nest frame;
FIG. 6 is a schematic view of the mounting position of the spacers and COS;
FIG. 7 is a schematic view of COS sintering regions in a stepped arrangement within a package housing;
in the drawing, 1, a pressing block, 2, an upper fixing plate, 3, a connecting column, 4, a lower fixing plate, 5, a sleeve frame, 6, a packaging shell, 7, a positioning sheet, 8, a cylindrical part at the lower part of the pressing block, 9, COS, 10, a pointed end at the bottom end of the pressing block, 11, a rectangular part at the upper part of the pressing block, 12, a pressing block through hole at the upper part of the lower fixing plate, 13, a COS observation window at the upper part of the lower fixing plate, 14 and a mounting hole.
Detailed Description
The present invention will be further described with reference to the following drawings and examples, but is not limited thereto.
The structure of the semiconductor laser sintering clamp of the utility model is shown in figure 1; mainly comprises an upper fixing plate 2, a lower fixing plate 4, a connecting column 3 for connecting the upper fixing plate and the lower fixing plate, a plurality of pressing blocks 1 and positioning sheets 7; the upper part of the compact is a rectangular part 11, the lower part is a cylindrical part 8, the bottom end is a pointed end 10 for pressing two sides of the COS 9 to be sintered, the contact point of the pointed end 10 at the bottom end of the compact and the COS is a pointed shape with a circular arc shape, the contact area is increased, and the displacement can be well avoided, and the structure of the compact is shown in figure 3. The length of the rectangular part 11 of the pressing block is larger than that of the cylindrical part 8.
The upper fixing plate 2 is provided with a rectangular hole for the rectangular part 11 of the pressing block to pass through, and vertically aligned with the round hole on the lower fixing plate up and down, and the lower fixing plate is provided with a plurality of round holes 12 corresponding to the COS positions for the cylindrical part 8 of the pressing block to pass through; the rectangular hole on the upper fixing plate 2 is vertically aligned with the round hole on the lower fixing plate. The lower fixing plate 4 is clamped on the cross beam of the sleeve frame 5 and is horizontally and stably fixed on the sleeve frame 5, the structure of the sleeve frame 5 is shown in figure 5, the sleeve frame 5 covers the outer part of the packaging shell, the size of the lower part of the sleeve frame 5 is matched with that of the packaging shell, and the sleeve frame 4 can be clamped on the shell wall to be fixed.
The positioning sheet 7 is used for positioning the COS; the locating plate 7 is clamped on the inner surface of the packaging shell, the length (Y-direction length) of the locating plate is matched with the length in the inner surface of the packaging shell, and the width (X-direction width) of the locating plate is the distance from the inner wall of the packaging shell to the front cavity surface of the COS (chip on chip) so that the locating plate is fixed in a mode of being clamped on the inner wall of the packaging shell; one side of the positioning sheet 7 is flush with the edge of the COS sintering area, the edge is provided with a groove, the light-emitting surface of the laser is aligned to the center of the groove, and the COS can be positioned (as shown in fig. 6); the groove can also prevent the positioning sheet from contacting the light-emitting surface of the laser, and damage to the light-emitting surface of the laser is avoided.
The number of the round holes formed in the lower fixing plate is COS 2, and the diameter of each round hole is matched with that of the cylindrical part of the pressing block. The number of the rectangular holes formed in the upper fixing plate is COS 2, and the size of each rectangular hole is matched with that of the rectangular part of the pressing block. The round holes 12 of the lower fixing plate vertically correspond to the rectangular holes of the upper fixing plate one by one and are used for fixing the pressing blocks. According to a preferred embodiment of the present invention, the COS is located in a COS sintering region within the package housing in a stepped arrangement, as shown in fig. 7.
The use method of the semiconductor laser sintering clamp of the utility model is except that all the other can be operated according to the routine in the field. As a preferable scheme, the following use method of the clamp is provided:
(1) the locating plate is placed in the packaging shell and fixed in a mode of being clamped in the inner surface of the shell. And placing the COS in a sintering area in the packaging shell, wherein the light-emitting surface is aligned to the center of the groove of the positioning sheet. One side of the positioning sheet is flush with the edge of the COS sintering area, and the COS is positioned;
(2) the sleeve frame is sleeved on the upper part of the packaging shell, the size of the lower part of the sleeve frame is matched with that of the upper part of the shell, and the sleeve frame can be clamped on the shell wall to be fixed. And placing the lower fixing plate on the upper part of the sleeve frame, and clamping the lower fixing plate on the upper part of the sleeve frame for fixing. And a connecting column is arranged on the lower fixing plate, and then an upper fixing plate is arranged.
(3) The pressing block sequentially penetrates through the rectangular hole in the upper fixing plate and the round hole in the lower fixing plate, and the tip of the pressing block presses the two sides of the heat sink on the COS, so that the COS is stressed uniformly, and the laser is prevented from being damaged.
(4) And sintering the whole mounted clamp in a sintering furnace.
Claims (10)
1. A sintering clamp of a semiconductor laser is characterized by comprising:
an upper fixing plate, a lower fixing plate and a connecting column connected with the upper fixing plate and the lower fixing plate;
the upper part of each pressing block is in a rectangular column shape and is called a rectangular part, the lower part of each pressing block is in a cylindrical shape and is called a cylindrical part, and the bottom end of each pressing block is a pointed end and used for pressing COS to be sintered;
a plurality of round holes are formed in the lower fixing plate corresponding to the COS and used for the cylindrical part of the pressing block to penetrate through;
the upper fixing plate is provided with a rectangular hole which is vertically aligned with the round hole on the lower fixing plate up and down and is used for the rectangular part of the pressing block to pass through;
the positioning sheet is used for positioning the COS;
and the sleeve frame is used for bearing the lower fixing plate.
2. The sintering fixture of a semiconductor laser as claimed in claim 1 wherein said spacer is located on an inner surface of the package housing; the positioning plate is fixed in a manner of being clamped on the inner wall of the packaging shell.
3. The sintering fixture of claim 1, wherein one side of the positioning piece is flush with the edge of the COS sintering region, and the side is provided with a groove for aligning the light exit surface of the laser with the center of the groove.
4. The sintering fixture of a semiconductor laser as claimed in claim 1 wherein said compact tips press against both sides of a heat sink on the COS to be sintered.
5. The sintering fixture of a semiconductor laser as claimed in claim 1, wherein the number of round holes provided on said lower fixing plate is COS number 2, and the diameter of the round holes matches the diameter of the cylindrical part of the compact; the number of the rectangular holes formed in the upper fixing plate is COS 2, and the size of each rectangular hole is matched with that of the rectangular part of the pressing block.
6. The sintering jig for a semiconductor laser as claimed in claim 1, wherein a contact point of a tip at a bottom end of said compact with COS is a tip having a circular arc shape.
7. The sintering fixture of a semiconductor laser as claimed in claim 1 wherein the COS is located in a COS sintering region in a stepped arrangement.
8. The sintering fixture of a semiconductor laser as claimed in claim 1, wherein the frame for carrying the bottom mounting plate is clamped on the top of the package or fit over the package.
9. A sintering jig for a semiconductor laser as claimed in claim 1 wherein the holder for carrying the lower fixing plate is a sleeve having a peripheral wall or a holder having no peripheral wall; the size of the sleeve frame is matched with that of the lower fixing plate.
10. The sintering fixture for semiconductor laser as claimed in claim 1, wherein said nest is divided into upper and lower portions by a cross support clamp beam; the size of the lower part of the sleeve frame is matched with the size of the upper part or the outer part of the packaging shell, and the sleeve frame is clamped on the shell wall to be fixed; the size of the upper part of the sleeve frame is matched with that of the lower fixing plate, so that the lower fixing plate is clamped on the upper part of the sleeve frame to be fixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021903947.0U CN212695446U (en) | 2020-09-03 | 2020-09-03 | Sintering clamp of semiconductor laser |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021903947.0U CN212695446U (en) | 2020-09-03 | 2020-09-03 | Sintering clamp of semiconductor laser |
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| CN212695446U true CN212695446U (en) | 2021-03-12 |
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| CN202021903947.0U Active CN212695446U (en) | 2020-09-03 | 2020-09-03 | Sintering clamp of semiconductor laser |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115476016A (en) * | 2021-05-31 | 2022-12-16 | 山东华光光电子股份有限公司 | Semiconductor laser chip reflow soldering fixture and use method thereof |
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2020
- 2020-09-03 CN CN202021903947.0U patent/CN212695446U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115476016A (en) * | 2021-05-31 | 2022-12-16 | 山东华光光电子股份有限公司 | Semiconductor laser chip reflow soldering fixture and use method thereof |
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