CN212694301U

CN212694301U - Chip thermostat of Internet of things

Info

Publication number: CN212694301U
Application number: CN202021330541.8U
Authority: CN
Inventors: 徐斌
Original assignee: Nanjing Institute of Railway Technology
Current assignee: Nanjing Institute of Railway Technology
Priority date: 2020-07-09
Filing date: 2020-07-09
Publication date: 2021-03-12
Anticipated expiration: 2030-07-09

Abstract

Thing networking chip constant temperature equipment, including mainboard, heating plate, heating wire, first thermistor, first microampere table, chip, temperature sensor, controller, semiconductor refrigeration piece, second thermistor, second microampere table, heat pipe, fin, fan and heat dissipation motor, install the heating plate on the mainboard, the heating plate is embedded to have the heating wire, and it has first thermistor to establish ties on the heating wire, and it has first microampere table to go up the parallel connection on the first thermistor, installs the chip on the heating wire, installs the fan in the fin, and the heat dissipation motor is installed to the fan end. The utility model has the advantages that: the characteristics of the chip of the Internet of things are combined, according to the temperature of the chip, the semiconductor refrigeration piece works to reduce the ambient temperature of the chip when the temperature is high, and the heating wire works to heat when the temperature is low, so that the ambient temperature of the chip is increased, the method is simple and effective, and the chip is kept constant in an interval range all the time; the temperature of the chip is monitored in real time through the temperature sensor, and early warning is provided.

Description

Chip thermostat of Internet of things

Technical Field

The utility model relates to a thing networking chip constant temperature equipment belongs to integrated circuit technical field.

Background

With the development of society, the internet of things is generally regarded as the third wave of development of the information industry, and will drive the change of the whole world. In the era of the internet of things, the internet of things chip has huge demand scale, and the internet of things chip has a wider market. Compared with the traditional chip, the chip of the internet of things is more flexible and subdivided, and needs to have more efficient and simplified instruction sets and low power consumption. The temperature has certain influence to the throughput of thing networking chip, and too high or low ambient temperature all can lead to thing networking chip processing speed to reduce, the consumption increase, consequently, guarantees that thing networking chip is in the ambient temperature of certain interval scope all the time in the work, can effectual improvement chip's performance.

Disclosure of Invention

The utility model aims at providing a thing networking chip constant temperature equipment.

The to-be-solved problem of the utility model is that the phenomenon too high or low excessively of temperature appears easily in work in current thing networking chip, influences the defect of the throughput of thing networking chip.

For realizing the purpose of the utility model, the utility model adopts the technical proposal that:

an Internet of things chip thermostat comprises a mainboard, a heating plate, a heating wire, a first thermistor, a first microampere meter, a chip, a temperature sensor, a controller, a semiconductor refrigerating plate, a second thermistor, a second microampere meter, a heat pipe, a heat radiating fin, a fan and a heat radiating motor, install the heating plate on the mainboard, the heating plate is embedded to have the heating wire, it has first thermistor to establish ties on the heating wire, it has first microampere table to connect in parallel on the first thermistor, install the chip on the heating wire, install temperature sensor on the chip, temperature sensor wire connection director, install the semiconductor refrigeration piece on the chip, semiconductor refrigeration piece wire is established ties there is the second thermistor, the second thermistor connects in parallel has the second microampere table, the chip left side is connected and is installed the heat pipe, the fin is installed in the connection of heat pipe left end, install the fan in the fin, the radiating motor is installed to the fan end.

Furthermore, the radiating fins are evenly and circumferentially distributed on the fan, a certain gap is formed between every two radiating fins, the radiating fins are arc-shaped and made of aluminum alloy.

Furthermore, the hot end of the semiconductor refrigerating sheet is arranged on the chip, and the semiconductor refrigerating sheet has no sliding part, high reliability and no refrigerant pollution; the heating electric wire is embedded in the groove of the heating plate, and the heating electric wire is made of iron-chromium-aluminum molybdenum-containing materials, so that the cost is low, and the heating wire is high-temperature resistant, and the service life of the heating wire is prolonged.

Further, the temperature sensor, the first thermistor and the second thermistor can sense the interval temperature, and the interval temperature is 20-25 ℃.

The utility model has the advantages that: the characteristics of the chip of the Internet of things are combined, the circuit is controlled through the resistance value change of the thermistor in the circuit according to the temperature of the chip, so that when the temperature is high, the semiconductor refrigerating sheet works to reduce the ambient temperature of the chip, and when the temperature is low, the heating wire works to heat, so that the ambient temperature of the chip is increased, the method is simple and effective, and the chip is kept constant in the interval range all the time; the temperature of the chip is monitored in real time through the temperature sensor, and early warning is provided.

Drawings

FIG. 1 is a schematic structural diagram of an Internet of things chip thermostat;

in the figure: 1. the device comprises a mainboard 2, a heating plate 3, a heating electric wire 4, a first thermistor 5, a first microammeter 6, a chip 7, a temperature sensor 8, a controller 9, a semiconductor refrigeration plate 10, a second thermistor 11, a second microammeter 12, a heat pipe 13, a heat radiating fin 14, a fan 15 and a heat radiating motor.

Detailed Description

The present invention will be further described with reference to the accompanying drawings and examples.

The chip constant temperature device of the Internet of things comprises a mainboard 1, a heating plate 2, a heating electric wire 3, a first thermistor 4, a first microampere meter 5, a chip 6, a temperature sensor 7, a controller 8, a semiconductor refrigerating sheet 9, a second thermistor 10, a second microampere meter 11, a heat pipe 12, a radiating fin 13, a fan 14 and a radiating motor 15, wherein the heating plate 2 is installed on the mainboard 1 and used for heating, the heating electric wire 3 is embedded in the heating plate 2 and used for heating, the first thermistor 4 is connected on the heating electric wire 3 in series and used for a control circuit, the first microampere meter 5 is connected on the first thermistor 4 in parallel and used for detecting the thermistor, the chip 6 is installed on the heating electric wire 3 and used for an integrated circuit, the temperature sensor 7 is installed on the chip 6 and used for sensing temperature, the wire of the temperature sensor 7 is connected with the controller 8 and used for processing data, the semiconductor refrigerating sheet 9 is installed on the chip 6, the refrigerating chip is used for refrigerating, a second thermistor 10 is connected in series with a semiconductor refrigerating chip 9 through a wire and used for controlling a circuit, a second microampere meter 11 is connected in parallel with the second thermistor 10 and used for detecting the thermistor, a heat pipe 12 is connected and installed on the left side of the chip 6 and used for conducting heat, a radiating fin 13 is connected and installed at the left end of the heat pipe 12 and used for radiating, a fan 14 is installed in the radiating fin 13 and used for radiating, and a radiating motor 15 is installed at the tail end of the fan 14 and used for providing power.

Further, the heat dissipation fins 13 are evenly and circumferentially distributed on the fan 14, and a certain gap is formed between each heat dissipation fin 13, and the heat dissipation fins are arc-shaped and made of aluminum alloy.

Furthermore, the hot end of the semiconductor refrigerating sheet 9 is arranged on the chip 6, and the semiconductor refrigerating sheet 9 has no sliding part, so that the reliability is high, and no refrigerant pollution is caused; the heating electric wire 3 is embedded in the groove of the heating plate 2, and the heating electric wire 3 is made of iron-chromium-aluminum molybdenum-containing materials, so that the cost is low, and the heating wire is high-temperature resistant, and the service life of the heating wire is prolonged.

Further, the temperature sensor 7, the first thermistor 4 and the second thermistor 10 can sense the interval temperature, and the interval temperature is 20-25 ℃.

The using method comprises the following steps: when the power supply is switched on, the chip 6 works normally, the heat dissipation motor 15 works to drive the fan 14 to rotate, when the temperature is too high, the resistance value of the second thermistor 10 is reduced, the semiconductor refrigeration sheet 9 is electrified, and the heat generated by the chip 6 is absorbed by the hot end and then is dissipated through the cold end; when the temperature of the chip is too low, the resistance value of the first thermistor 4 is reduced, and the heating wire 3 starts to heat after being electrified to provide heat for the chip 6; the temperature sensor 7 senses the temperature of the chip 6 and transmits a data signal to the controller 8, and the controller 8 processes the data signal and outputs the processed data signal through an output end.

Claims

1. Thing networking chip constant temperature equipment, characterized by: comprises a mainboard (1), a heating plate (2), a heating wire (3), a first thermistor (4), a first microampere meter (5), a chip (6), a temperature sensor (7), a controller (8), a semiconductor refrigerating sheet (9), a second thermistor (10), a second microampere meter (11), a heat pipe (12), a radiating fin (13), a fan (14) and a radiating motor (15), wherein the heating plate (2) is installed on the mainboard (1), the heating wire (3) is embedded in the heating plate (2), the first thermistor (4) is connected in series on the heating wire (3), the first microampere meter (5) is connected in parallel on the first thermistor (4), the chip (6) is installed on the heating wire (3), the temperature sensor (7) is installed on the chip (6), a lead of the temperature sensor (7) is connected with the controller (8), and the semiconductor refrigerating sheet (9) is installed on the chip (6), the semiconductor refrigeration piece (9) is connected with a second thermistor (10) in series through a wire, the second thermistor (10) is connected with a second microammeter (11) in parallel, the left side of the chip (6) is connected with and provided with a heat pipe (12), the left end of the heat pipe (12) is connected with and provided with a radiating fin (13), a fan (14) is installed in the radiating fin (13), and a radiating motor (15) is installed at the tail end of the fan (14).

2. The Internet of things chip thermostat device of claim 1, characterized in that: the radiating fins (13) are evenly and circumferentially distributed on the fan (14), gaps are reserved among the radiating fins (13), the radiating fins are arc-shaped and made of aluminum alloy.

3. The Internet of things chip thermostat device of claim 1, characterized in that: the hot end of the semiconductor refrigerating sheet (9) is arranged on the chip (6), and the semiconductor refrigerating sheet (9) is not provided with a sliding component; the heating electric wire (3) is embedded in the groove of the heating plate (2), and the heating electric wire (3) is made of iron-chromium-aluminum molybdenum-containing materials.

4. The Internet of things chip thermostat device of claim 1, characterized in that: the temperature sensor (7), the first thermistor (4) and the second thermistor (10) can sense the interval temperature, and the interval temperature is 20-25 ℃.