CN212683575U - Manual edging vacuum chuck tool of one inch substrate wafer - Google Patents
Manual edging vacuum chuck tool of one inch substrate wafer Download PDFInfo
- Publication number
- CN212683575U CN212683575U CN202021070069.9U CN202021070069U CN212683575U CN 212683575 U CN212683575 U CN 212683575U CN 202021070069 U CN202021070069 U CN 202021070069U CN 212683575 U CN212683575 U CN 212683575U
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- CN
- China
- Prior art keywords
- bottom support
- sucking disc
- sucker
- collet
- epirelief
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Mechanical Treatment Of Semiconductor (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides a manual edging vacuum chuck tool of one inch substrate wafer, its mode that adopts the dislocation step changes the sucking disc for a short time, solves equipment and emery wheel interference problem, and through rational design water conservancy diversion air guide groove and trench position, reaches the effect of adsorbing the wafer. It includes the sucking disc body, the sucking disc body includes the sucking disc collet, adsorbs the epirelief, the epirelief is formed to the upper surface center epirelief of sucking disc collet and adsorbs the epirelief, the upper surface central zone who adsorbs the epirelief is provided with the guiding gutter, the central point of guiding gutter puts and is provided with the centre bore, the centre bore runs through adsorb the thickness direction of epirelief, sucking disc collet, the lower surface central point of sucking disc collet puts and is provided with indent cylinder groove, the outer loop face ring cloth of sucking disc collet has the connecting hole that a plurality of thickness direction runs through, and it is still including the workstation collet, and fastening bolt runs through connect behind the connecting hole the corresponding locating hole of workstation collet, the upper surface center epirelief of workstation collet.
Description
Technical Field
The utility model relates to a technical field of the special sucking disc tool of liquid specifically is a manual edging vacuum chuck tool of an inch substrate wafer.
Background
At present, sell on the market and practical GaAs substrate wafer specification is 2 ~ 6 cun specifications, because the one inch substrate wafer of small dimension is too little in tiny, does not appear this specification product in the past, but recent market gradually has this specification order, because the wafer undersize, receives the influence of equipment and frock, and its collet diameter ratio product diameter still needs big, because receive the collet to interfere, meets the technical problem that the limit type can't be processed, so need design corresponding vacuum chuck tool promptly.
Disclosure of Invention
To the above problem, the utility model provides a manual edging vacuum chuck tool of one inch substrate wafer, its mode that adopts the dislocation step changes the sucking disc for a short time, and solution equipment and emery wheel interfere the problem, and through rational design water conservancy diversion air channel and trench position, reach the effect of adsorbing the wafer.
The utility model provides a manual edging vacuum chuck tool of an inch substrate wafer which characterized in that: the sucker comprises a sucker body, wherein the sucker body comprises a sucker bottom support and an adsorption upper bulge, the upper surface center of the sucker bottom support is convexly bulged to form the adsorption upper bulge, the upper surface center region of the adsorption upper bulge is provided with a flow guide groove, the center position of the flow guide groove is provided with a center hole, the center hole penetrates through the adsorption upper bulge and the thickness direction of the sucker bottom support, the lower surface center position of the sucker bottom support is provided with an inner concave cylindrical groove, the outer annular surface of the sucker bottom support is annularly provided with a plurality of connecting holes which are penetrated in the thickness direction, the sucker also comprises a workbench bottom support, fastening bolts penetrate through the connecting holes and are connected with corresponding positioning holes of the workbench bottom support, the upper surface center of the workbench bottom support is convexly bulged, the upper bulge is embedded in the inner concave cylindrical groove for positioning, the bottom of the workbench bottom support is supported on a mounting seat, and the thickness, the vacuum air guide hole is communicated with the bottom of the central hole, and the lower surface of the corresponding one-inch wafer is attached to the upper surface of the adsorption upper boss.
It is further characterized in that: the flow guide groove specifically comprises an outer ring groove and a plurality of radial communicating grooves, and the top of the central hole is connected with the corresponding position of the outer ring groove through the radial communicating grooves;
the outer ring grooves are arranged by taking the center of the central hole as a circle center;
the number of the radial communicating grooves is four, and the adjacent radial communicating grooves are vertically arranged, so that the adsorption force of the outer ring groove is uniform and reliable;
the roughness of the upper surface of the diversion trench is less than or equal to 0.2Ra, and the diversion trench is flat and free of defects, so that the adsorption of the wafer is ensured.
After adopting above-mentioned technical scheme, the sucking disc body in the structure includes the sucking disc collet, adsorb the epirelief, the epirelief is adsorbed in the formation of the upper surface center epirelief of sucking disc collet, the upper surface central zone who adsorbs the epirelief is provided with the guiding gutter, the central point of guiding gutter puts and is provided with the centre bore, the centre bore runs through the thickness direction who adsorbs the epirelief, the sucking disc collet, its mode that adopts the dislocation step changes the sucking disc for a short time, solve equipment and emery wheel interference problem, and through rational design guiding gutter and trench position, reach the effect of adsorbing the wafer.
Drawings
FIG. 1 is a schematic view of the assembly structure of the present invention and a grinding wheel;
fig. 2 is a schematic top view of the sucker body of the present invention;
fig. 3 is a schematic sectional view of the front view of the sucker body of the present invention;
fig. 4 is a schematic view of the bottom view of the suction cup body of the present invention;
the names corresponding to the sequence numbers in the figure are as follows:
the vacuum sucking disc comprises a sucking disc body 1, a sucking disc bottom support 11, an adsorption upper convex 12, a flow guide groove 2, an outer ring groove 21, a radial communicating groove 22, a central hole 3, an inner concave cylindrical groove 4, a connecting hole 5, a workbench bottom support 6, an upper convex 61, a mounting seat 7, a vacuum air guide hole 8, a one-inch wafer 9, a driving motor 13 and a grinding wheel 14.
Detailed Description
A manual edging vacuum chuck tool of one inch substrate wafer, see figure 1-4: the sucker comprises a sucker body 1, wherein the sucker body 1 comprises a sucker bottom support 11 and an adsorption upper bulge 12, the upper surface center of the sucker bottom support 11 is convexly provided with the adsorption upper bulge 12, the upper surface center region of the adsorption upper bulge 12 is provided with a flow guide groove 2, the center position of the flow guide groove 2 is provided with a center hole 3, the center hole 3 penetrates through the adsorption upper bulge 12 and the thickness direction of the sucker bottom support 11, the lower surface center position of the sucker bottom support 11 is provided with an inner concave cylindrical groove 4, the outer annular surface of the sucker bottom support 11 is annularly provided with a plurality of connecting holes 5 which are penetrated in the thickness direction, the sucker also comprises a workbench bottom support 6, fastening bolts penetrate through the connecting holes 5 and are connected with corresponding positioning holes of the workbench bottom support 6, the upper surface center of the workbench bottom support 6 is convexly provided with an upper bulge 61, the upper bulge 61 is embedded in the inner concave cylindrical groove 4 for positioning, the bottom of, the vacuum air vents 8 are communicated with the bottom of the central hole 3, and the lower surface of the corresponding one-inch wafer 9 is attached to the upper surface of the adsorption upper boss 12.
The diversion trench 2 specifically comprises an outer annular trench 21 and a plurality of radial communicating trenches 22, and the top of the central hole 3 is connected with the corresponding position of the outer annular trench 21 through the radial communicating trenches 22;
the outer ring groove 21 is arranged with the center of the center hole 3 as the center of the circle;
the number of the radial communicating grooves 22 is four, and the adjacent radial communicating grooves 22 are vertically arranged, so that the adsorption force of the outer ring groove 21 is uniform and reliable;
the roughness of the upper surface of the diversion trench 2 is less than or equal to 0.2Ra, and the diversion trench is flat and has no defect, so that the adsorption of the wafer is ensured.
The working principle is as follows: the vacuum chuck jig comprises a chuck body 1 at the top of the vacuum chuck jig, wherein the chuck body 1 adsorbs an inch wafer 9, a driving motor 13 drives a grinding wheel 14 to manually edge the periphery of the inch wafer 9, the chuck body 1 in the structure comprises a chuck bottom support 11 and an adsorption upper convex 12, the upper surface of the chuck bottom support 11 is convexly protruded to form an adsorption upper convex 12, a diversion trench 2 is arranged in the central area of the upper surface of the adsorption upper convex 12, a central hole 3 is formed in the central position of the diversion trench 2, the central hole 3 penetrates through the thickness direction of the adsorption upper convex 12 and the chuck bottom support 11, the chuck is reduced in a staggered step mode, the problem of interference between equipment and the grinding wheel 14 is solved, the diversion trench 2 specifically comprises an outer annular groove 21 and a plurality of radial communicating grooves 22, and the top of the central hole 3 is connected; the outer ring groove 21 is arranged with the center of the center hole 3 as the center of the circle; the number of the radial communicating grooves 22 is four, and the adjacent radial communicating grooves 22 are vertically arranged, so that the adsorption force of the outer ring groove 21 is uniform and reliable; the roughness of the upper surface of the diversion trench 2 is less than or equal to 0.2Ra, and the diversion trench is flat and free of defects, so that the adsorption of the wafer is ensured, and the effect of adsorbing the wafer is achieved by reasonably designing the diversion gas trench and the trench position.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (5)
1. The utility model provides a manual edging vacuum chuck tool of an inch substrate wafer which characterized in that: the sucker comprises a sucker body, wherein the sucker body comprises a sucker bottom support and an adsorption upper bulge, the upper surface center of the sucker bottom support is convexly bulged to form the adsorption upper bulge, the upper surface center region of the adsorption upper bulge is provided with a flow guide groove, the center position of the flow guide groove is provided with a center hole, the center hole penetrates through the adsorption upper bulge and the thickness direction of the sucker bottom support, the lower surface center position of the sucker bottom support is provided with an inner concave cylindrical groove, the outer annular surface of the sucker bottom support is annularly provided with a plurality of connecting holes which are penetrated in the thickness direction, the sucker also comprises a workbench bottom support, fastening bolts penetrate through the connecting holes and are connected with corresponding positioning holes of the workbench bottom support, the upper surface center of the workbench bottom support is convexly bulged, the upper bulge is embedded in the inner concave cylindrical groove for positioning, the bottom of the workbench bottom support is supported on a mounting seat, and the thickness, the vacuum air guide hole is communicated with the bottom of the central hole, and the lower surface of the corresponding one-inch wafer is attached to the upper surface of the adsorption upper boss.
2. The one inch substrate wafer manual edge grinding vacuum chuck jig of claim 1, wherein: the flow guide groove specifically comprises an outer ring groove and a plurality of radial communicating grooves, and the top of the central hole is connected with the corresponding position of the outer ring groove through the radial communicating grooves.
3. A one inch substrate wafer manual edging vacuum chuck tool as claimed in claim 2, characterized in that: the outer ring groove is arranged by taking the center of the central hole as a circle center.
4. A one inch substrate wafer manual edging vacuum chuck tool as claimed in claim 3, characterized in that: the number of the radial communicating grooves is four, and the adjacent radial communicating grooves are mutually and vertically arranged.
5. The one inch substrate wafer manual edge grinding vacuum chuck jig of claim 1, wherein: the roughness of the upper surface of the diversion trench is less than or equal to 0.2Ra, and the diversion trench is flat and has no defect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021070069.9U CN212683575U (en) | 2020-06-11 | 2020-06-11 | Manual edging vacuum chuck tool of one inch substrate wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021070069.9U CN212683575U (en) | 2020-06-11 | 2020-06-11 | Manual edging vacuum chuck tool of one inch substrate wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212683575U true CN212683575U (en) | 2021-03-12 |
Family
ID=74890094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021070069.9U Expired - Fee Related CN212683575U (en) | 2020-06-11 | 2020-06-11 | Manual edging vacuum chuck tool of one inch substrate wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212683575U (en) |
-
2020
- 2020-06-11 CN CN202021070069.9U patent/CN212683575U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210312 Termination date: 20210611 |
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| CF01 | Termination of patent right due to non-payment of annual fee |