CN212683550U - Wafer surface polishing device for semiconductor field - Google Patents

Abstract

The utility model relates to the technical field of semiconductors, and a semiconductor field is with brilliant surface finish device is disclosed, the power distribution box comprises a box body, open the right side top of box has the escape orifice, the fixed mounting in the place ahead top of box has the fixing base, the top fixed mounting of fixing base has cylinder one, the top fixed mounting of cylinder one has the roof, roof and cylinder one are through two fixed connection of fixing bolt, the top below fixed mounting of roof has motor two. This kind of semiconductor field is with brilliant surface finish device of circle, motor one rotates and drives the mounting base and carry out one hundred eighty degrees rotations to make the other face of brilliant circle upwards, cylinder two presss from both sides tight the brilliant edge of circle simultaneously, then motor one descends and polishes the other face of brilliant circle, thereby does not need the manual work to take once more, avoids the brilliant secondary clamping of circle, leads to the damage problem of colliding with of semiconductor wafer surface emergence.

Description

Wafer surface polishing device for semiconductor field

Technical Field

The utility model relates to the field of semiconductor technology, specifically be a semiconductor field is with brilliant surface finish device of circle.

Background

Abrasive treatment such as grinding and lapping is indispensable in the production of semiconductor wafers, but the surface integrity of single crystal silicon wafers is deteriorated after grinding and lapping. It is therefore important for the polishing and planarization of the wafer surface in the production of microelectronic components.

After one side of a semiconductor wafer is polished, the semiconductor wafer needs to be taken out, turned over and then clamped for the second time, the surface of the semiconductor wafer is easy to collide and damage in the process of repeated assembly and disassembly, the yield of products is reduced, in addition, the polishing is usually carried out by using a chemical mechanical method during polishing, and during mechanical polishing, the polishing position of the wafer is rubbed and heated, so that an oxide film is easy to produce on the surface of monocrystalline silicon, and the electrical property of the monocrystalline silicon is influenced.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

The utility model provides a not enough to prior art, the utility model provides a semiconductor field is with brilliant surface finish device of circle possesses a clamping and can be to the polishing of wafer two sides, use the coolant liquid to avoid advantages such as friction generates heat when polishing, has solved the problem that the background art provided.

(II) technical scheme

Can be to the polishing of wafer two sides, use the coolant liquid to avoid the purpose that the friction generates heat when polishing in order to realize above-mentioned clamping, the utility model provides a following technical scheme: a wafer surface polishing device for the semiconductor field comprises a box body, wherein a drain hole is formed in the upper portion of the right side of the box body, a fixed seat is fixedly mounted at the top end of the front portion of the box body, a first air cylinder is fixedly mounted above the fixed seat, a top plate is fixedly mounted at the top end of the first air cylinder, the top plate is fixedly connected with the first air cylinder through a second fixing bolt, a second motor is fixedly mounted below the top end of the top plate, a polishing head is fixedly mounted at the bottom of the second motor, a first motor is fixedly mounted above the right side of the box body, the first motor is fixedly connected with the box body through a fixed plate, the fixed plate is fixedly connected with the box body through the first fixing bolt, a mounting base is mounted at the central position of the upper portion of the box body, the top end of the front portion of the mounting base is fixedly, the upper portion of the connecting plate is fixedly provided with a second air cylinder, the second air cylinder is fixedly connected with the connecting plate through a supporting plate, a clamping plate is fixedly arranged in front of the second air cylinder, and a round crystal is arranged on the inner side of the clamping plate.

Preferably, the top left side fixed mounting of roof has the cooler, the top central point of roof puts fixed mounting has the water pump, water pump and cooler pass through output pipeline fixed connection, output pipeline is the fixed connection in the rear side below of the place ahead top and cooler, the right side at the head of polishing is installed to output pipeline's end, output pipeline and roof pass through fixed block fixed connection, connecting block fixed connection is passed through on output pipeline's end and the right side of roof.

Preferably, the number of the second air cylinders is four, and the four second air cylinders are fixedly mounted above the connecting plate respectively.

Preferably, a protective pad is fixedly arranged in front of the clamping plate.

Preferably, a cavity is arranged below the box body, and a collecting tank is arranged at the bottom of the cavity.

Preferably, the diameter of the polishing head is equal to that of the round crystal, and the rotation center of the polishing head is coincided with that of the round crystal.

(III) advantageous effects

Compared with the prior art, the utility model discloses possess following beneficial effect:

1. this kind of semiconductor field is with brilliant surface finish device of circle, motor one rotates and drives the mounting base and carry out one hundred eighty degrees rotations to make the other face of brilliant circle upwards, cylinder two presss from both sides tight the brilliant edge of circle simultaneously, then motor one descends and polishes the other face of brilliant circle, thereby does not need the manual work to take once more, avoids the brilliant secondary clamping of circle, leads to the damage problem of colliding with of semiconductor wafer surface emergence.

2. This kind of wafer surface finish device for semiconductor field, through mutually supporting between water pump, output pipeline, the cooler, then the coolant liquid of cooler inside is discharged through the end of output pipeline, cools off the surface of wafer to avoid the polishing position friction of wafer to generate heat, lead to the problem at the wafer surface production oxide film.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of a partial structure of the present invention;

fig. 3 is a schematic view of the structure of the surface a of the present invention.

In the figure: 1. a box body; 2. a drain port; 3. a first motor; 4. fixing a first bolt; 5. a fixing plate; 6. mounting a base; 8. carrying out wafer rounding; 9. a cooler; 10. a top plate; 11. fixing a second bolt; 12. a first cylinder; 13. a fixed seat; 15. a water pump; 16. a fixed block; 17. an output pipe; 18. connecting blocks; 19. a second motor; 20. polishing head; 21. a connecting plate; 22. a support plate; 23. a second air cylinder; 24. and (5) clamping the plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Example one

Referring to fig. 1-3, a device for polishing the surface of a wafer for the semiconductor field comprises a box body 1, a drain port 2 is arranged on the upper right side of the box body 1, when the wafer 8 is polished, waste residues generated by polishing can fall into the box body 1, the waste residues can be cleaned out of the box body 1 through the drain port 2, a fixed seat 13 is fixedly arranged at the top end in front of the box body 1, a cylinder 12 is fixedly arranged above the fixed seat 13, a top plate 10 is fixedly arranged at the top end of the cylinder 12, the top plate 10 is fixedly connected with the cylinder 12 through a fixed bolt 11, a motor 19 is fixedly arranged below the top end of the top plate 10, a polishing head 20 is fixedly arranged below the motor 19, the polishing head 12 descends to drive the top plate 10 to descend, the top plate 10 descends to drive the motor 19 to descend, and the polishing head 20 contacts the surface of the wafer 8, the second motor 19 rotates to drive the polishing head 20 to rotate to polish the surface of the round crystal 8, the first motor 3 is fixedly arranged above the right side of the box body 1, the first motor 3 and the box body 1 are fixedly connected through the fixing plate 5, the fixing plate 5 and the box body 1 are fixedly connected through the first fixing bolt 4, four fixing bolts 4 are provided, the four fixing bolts 4 are respectively and fixedly arranged at four corners above the fixing plate 5, the mounting base 6 is arranged at the central position above the box body 1, the mounting base 6 is fixedly connected with the top end in front of the first motor 3, the connecting plate 21 is fixedly arranged above the mounting base 6, the second air cylinder 23 is fixedly arranged above the connecting plate 21, four air cylinders 23 are respectively and fixedly arranged above the connecting plate 21, the second air cylinder 23 is fixedly connected with the connecting plate 21 through the supporting plate 22, and two supporting plates 22 are provided, two backup pads 22 are respectively the symmetry and install the left and right sides at two 23 cylinders, the place ahead fixed mounting of two 23 cylinders has clamp plate 24, the brilliant 8 of circle is installed to clamp plate 24's inboard, after 8 one sides of brilliant circle are polished and are polished, two 19 upward movements of cylinder 12 drive motor, then 3 work rotations of motor, drive mounting base 6 and carry out one hundred eighty degrees rotations, thereby make another one side of brilliant 8 of circle upwards, cylinder two 23 presss from both sides simultaneously the brilliant 8 edge of circle tightly, then 3 descends and polish to 8 other one sides of brilliant circle to motor.

Example two

Based on the first embodiment, as shown in fig. 1-2, a wafer surface polishing device for semiconductor field, a cooler 9 is fixedly installed on the left side above a top plate 10, a water pump 15 is fixedly installed on the center position above the top plate 10, the water pump 15 and the cooler 9 are fixedly connected through an output pipeline 17, the front top end of the output pipeline 17 is fixedly connected with the lower part of the rear side of the cooler 9, the end of the output pipeline 17 is installed on the right side of a polishing head 20, the output pipeline 17 is fixedly connected with the top plate 10 through a fixing block 16, the end of the output pipeline 17 is fixedly connected with the right side of the top plate 10 through a connecting block 18, so as to facilitate the fixing of the end of the output pipeline 17, when polishing and polishing the surface of a wafer 8, the water pump 15 operates to extract the cooling liquid inside the cooler 9 through the output pipeline 17, and then the cooling liquid inside the cooler 9 is discharged through the end of the output, the surface of the wafer 8 is cooled.

The working principle is as follows: after 8 one sides of round crystal are polished and are polished, cylinder 12 drives two 19 upward movements of motor, then 3 work rotations of motor, it rotates to drive mounting base 6 and carries out one hundred eighty degrees rotations, thereby make round crystal 8's other one side upwards, cylinder two 23 press from both sides tight round crystal 8 edge simultaneously, then motor 3 descends and polishes round crystal 8's other one side, thereby do not need the manual work to take once more, in addition, when polishing and polishing round crystal 8 surface, water pump 15 moves, through output pipeline 17, extract the inside coolant liquid of cooler 9, then the inside coolant liquid of cooler 9 passes through output pipeline 17's end and discharges, cool off round crystal 8's surface.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. A wafer surface polishing device for the semiconductor field comprises a box body (1);

the method is characterized in that:

the improved garbage bin is characterized in that a drain hole (2) is formed in the upper portion of the right side of the bin body (1), a fixing seat (13) is fixedly installed at the top end of the front portion of the bin body (1), a cylinder I (12) is fixedly installed at the top end of the fixing seat (13), a top plate (10) is fixedly installed at the top end of the cylinder I (12), the top plate (10) and the cylinder I (12) are fixedly connected through a fixing bolt II (11), a motor II (19) is fixedly installed below the top end of the top plate (10), a polishing head (20) is fixedly installed at the bottom of the lower portion of the motor II (19), a motor I (3) is fixedly installed above the right side of the bin body (1), the motor I (3) and the bin body (1) are fixedly connected through a fixing plate (5), the fixing plate (5) and the bin body (1) are fixedly connected through a fixing bolt I (4), and a mounting base (6, mounting base (6) and the place ahead top fixed connection of motor (3), the top fixed mounting of mounting base (6) has connecting plate (21), the top fixed mounting of connecting plate (21) has cylinder two (23), cylinder two (23) and connecting plate (21) pass through backup pad (22) fixed connection, the place ahead fixed mounting of cylinder two (23) has clamp plate (24), round brilliant (8) are installed to the inboard of clamp plate (24).

2. The apparatus of claim 1, wherein: the utility model discloses a polishing machine, including roof (10), top center position fixed mounting of roof (10) has cooler (9), the top central point of roof (10) puts fixed mounting has water pump (15), water pump (15) and cooler (9) are fixed continuous through output pipeline (17), output pipeline (17) are the fixed continuous in the rear side below of place ahead top and cooler (9), the right side at polishing head (20) is installed to the end of output pipeline (17), output pipeline (17) and roof (10) are through fixed block (16) fixed connection, connecting block (18) fixed connection is passed through on the end of output pipeline (17) and the right side of roof (10).

3. The apparatus of claim 1, wherein: the number of the second air cylinders (23) is four, and the four second air cylinders (23) are respectively and fixedly installed above the connecting plate (21).

4. The apparatus of claim 1, wherein: a protective pad is fixedly arranged in front of the clamping plate (24).

5. The apparatus of claim 1, wherein: the lower part of the box body (1) is a cavity body, and the bottom of the cavity body is provided with a collecting tank.

6. The wafer surface polishing device for semiconductor field as claimed in claim 2, wherein: the diameter of the polishing head (20) is equal to that of the round crystal (8), and the rotation center of the polishing head (20) is superposed with that of the round crystal (8).

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