CN212071562U

CN212071562U - Semiconductor wafer surface polishing device

Info

Publication number: CN212071562U
Application number: CN202020264432.4U
Authority: CN
Inventors: 毕泽
Original assignee: Jiangsu Guangkun Aluminum Co ltd
Current assignee: Jiangsu Guangkun Aluminum Co ltd
Priority date: 2020-03-06
Filing date: 2020-03-06
Publication date: 2020-12-04
Anticipated expiration: 2030-03-06

Abstract

The utility model relates to a semiconductor wafer production process equipment technical field just discloses a semiconductor wafer surface finish device, which comprises an outer shell, the top fixedly connected with base plate of facade before the shell, the top fixed mounting of base plate has branch, the top fixed mounting of branch has the connecting rod, the one end fixed mounting that branch was kept away from to the bottom of connecting rod has pneumatic cylinder one. This kind of semiconductor wafer surface finish device, the one side at semiconductor wafer is polished and is accomplished the back, cylinder one stretches out with output stopper one and stopper two of cylinder two, with the round crystal joint between stopper one and stopper two, pneumatic cylinder one drive rubbing head goes upward, at this moment, the rotatory one hundred eighty degrees of motor one start drive mounting base, make the round crystal bottom that does not polish become the top, pneumatic cylinder one drive rubbing head is down to the position of offsetting with the round crystal surface, accomplish the polishing to the round crystal two sides promptly, avoid the round crystal secondary clamping, lead to the semiconductor wafer surface to take place to collide with the damage problem.

Description

Semiconductor wafer surface polishing device

Technical Field

The utility model relates to a semiconductor wafer production process equipment technical field specifically is a semiconductor wafer surface finish device.

Background

Abrasive treatment such as grinding and lapping is indispensable in the production of semiconductor wafers, but the surface integrity of single crystal silicon wafers is deteriorated after grinding and lapping. It is therefore important for the polishing and planarization of the wafer surface in the production of microelectronic components.

In the process of polishing the surface of a semiconductor wafer, only one surface of the semiconductor wafer can be polished, after the polishing is finished, the semiconductor wafer is taken out, turned over and then clamped for the second time, the surface of the semiconductor wafer is easy to collide and damage in the process of repeated assembly and disassembly, the yield of products is reduced, in addition, the polishing is usually carried out by using a chemical mechanical method during the polishing, during the mechanical polishing, the polishing position of the wafer is rubbed and heated, an oxide film is easy to produce on the surface of monocrystalline silicon, and the electrical property of the monocrystalline silicon is influenced.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

The utility model provides a to prior art not enough, the utility model provides a semiconductor wafer surface finish device possesses a clamping and can generate heat when polishing, using low temperature polishing solution to avoid polishing to wafer two sides advantage such as, has solved the problem that the background art provided.

(II) technical scheme

Can be to the polishing of wafer two sides, the purpose that generates heat when using low temperature polishing solution to avoid the polishing for realizing above-mentioned clamping, the utility model provides a following technical scheme: a semiconductor wafer surface polishing device comprises a shell, wherein a base plate is fixedly connected to the top of a front vertical face of the shell, a support rod is fixedly mounted at the top of the base plate, a connecting rod is fixedly mounted at the top of the support rod, a first hydraulic cylinder is fixedly mounted at one end, far away from the support rod, of the bottom of the connecting rod, a mounting flat plate is fixedly connected to the tail end of the output end of the first hydraulic cylinder, a fixing plate is fixedly welded at the rear vertical face of the mounting flat plate, a second motor is fixedly mounted at the bottom of the mounting flat plate, a polishing head is fixedly connected to the tail end of the output shaft of the second motor, a first motor is fixedly mounted at the middle position of the top of a right vertical face of the shell, a mounting base is fixedly connected to the tail end of the output shaft of the, the novel round crystal clamping device is characterized in that a first through groove is formed in the upper portion of the clamping plate, a second through groove is formed in the lower portion of the clamping plate, a first air cylinder is fixedly mounted on the upper portion of the right vertical face of the clamping plate, a second air cylinder is fixedly mounted on the lower portion of the right vertical face of the clamping plate, a first limiting block is fixedly connected to the left vertical face of the first air cylinder, a second limiting block is fixedly connected to the left vertical face of the second air cylinder, and a round crystal is fixedly.

Preferably, connecting rod top middle part fixed mounting has the condenser, preceding facade fixedly connected with input pipeline, the one end fixedly connected with polishing solution bin of condenser is kept away from to the input pipeline, the back facade fixedly connected with connecting tube of condenser, the one end fixedly connected with water pump of condenser is kept away from to the connecting tube, one side fixedly connected with output pipeline of connecting tube is kept away from to the water pump, the automatic take-up of one end fixedly connected with of water pump is kept away from to the output pipeline, output pipeline's bottom fixedly connected with shower nozzle.

Preferably, bearings are fixedly mounted on the left vertical surface and the right vertical surface of the shell corresponding to the output shaft of the first motor, and the output shaft of the first motor is matched with the inner ring of the bearing.

Preferably, the first limiting block and the second limiting block are output ends of a first air cylinder and a second air cylinder respectively, and the size and the shape of the first limiting block and the size and the shape of the second limiting block are matched with those of the first through groove and the second through groove.

Preferably, the distance between the bottom of the first limiting block and the top of the second limiting block is equal to the thickness of the wafer, and the second hydraulic cylinders move synchronously.

Preferably, the length of the polishing head is equal to the diameter of the round crystal, the length of the polishing head is smaller than the diameter of the through hole, and the rotation center of the polishing head coincides with the rotation center of the round crystal.

Preferably, the left side of the spray nozzle is fixedly connected with a transverse pipe, the spray nozzles are uniformly distributed on the lower side of the transverse pipe, and the lowest end of the spray nozzle is positioned above the polishing head.

(III) advantageous effects

Compared with the prior art, the utility model discloses possess following beneficial effect:

1. this kind of semiconductor wafer surface finish device, through pneumatic cylinder one, pneumatic cylinder two, motor one, and mounting base isotructure use of mutually supporting, finish the back in the one side of semiconductor wafer is polished, cylinder one stretches out with output stopper one and stopper two of cylinder two, with the round brilliant joint between stopper one and stopper two, pneumatic cylinder one drive rubbing head goes upward, this moment, the rotatory one hundred eighty degrees of motor one start-up drive mounting base, make the round brilliant bottom of not polishing become the top, pneumatic cylinder one drive rubbing head is down to the position of offseting with the round brilliant surface, accomplish the polishing to the round brilliant two sides promptly, avoid the round brilliant secondary clamping, lead to the semiconductor wafer surface to take place to collide with the damage problem.

2. This kind of semiconductor wafer surface finish device, through input pipeline, the condenser, the connecting tube, a water pump, output pipeline, violently manage and shower nozzle isotructure mutually support and use, when polishing to the round brilliant, polishing solution is through condenser cooling back, water on the round brilliant surface from the shower nozzle through each pipeline, even coating is on the round brilliant surface under the effect of rubbing head, microthermal polishing solution is favorable to maintaining the stability of wafer surface temperature when polishing, thereby avoid the polishing position friction of wafer to generate heat, lead to the problem at round brilliant surface production oxide film.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a partial enlarged view of a second structure of the hydraulic cylinder of the present invention;

FIG. 3 is a schematic view of the structure of the clamping plate of the present invention;

FIG. 4 is a schematic structural view of a first cylinder and a second cylinder of the present invention;

fig. 5 is a partial enlarged view of the second structure of the motor of the present invention.

In the figure: 1. a water pump; 2. a condenser; 3. an input pipe; 4. a connecting rod; 5. a strut; 6. a substrate; 7. a fixing plate; 8. an automatic take-up device; 9. connecting a pipeline; 10. a first hydraulic cylinder; 11. an output pipe; 12. carrying out wafer rounding; 13. a second hydraulic cylinder; 14. mounting a base; 15. a first motor; 16. a through hole; 17. a housing; 18. a first cylinder; 19. clamping a plate; 20. a second air cylinder; 21. a transverse tube; 22. a first through groove; 23. a second through groove; 24. a first limiting block; 25. a second limiting block; 26. installing a flat plate; 27. a second motor; 28. a polishing head; 29. and (4) a spray head.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Example one

Referring to fig. 1-5, a semiconductor wafer surface polishing device comprises a housing 17, a base plate 6 is fixedly connected to the top of the front vertical surface of the housing 17, a supporting rod 5 is fixedly installed on the top of the base plate 6, a connecting rod 4 is fixedly installed on the top of the supporting rod 5, a first hydraulic cylinder 10 is fixedly installed at one end, far away from the supporting rod 5, of the bottom of the connecting rod 4, a mounting flat plate 26 is fixedly connected to the tail end of the output end of the first hydraulic cylinder 10, a fixing plate 7 is fixedly welded to the rear vertical surface of the mounting flat plate 26, a second motor 27 is fixedly installed at the bottom of the mounting flat plate 26, a polishing head 28 is fixedly connected to the tail end of the output shaft of the second motor 27, a first motor 15 is fixedly installed at the middle position of the top of the right vertical surface of the housing 17, bearings are fixedly installed on the left, the service life of the equipment is prolonged, the tail end of the output shaft of the shell 17 is fixedly connected with a mounting base 14, the center of the mounting base 14 is provided with a through hole 16, the top of the mounting base 14 is fixedly provided with a second hydraulic cylinder 13, the tail end of the output end of the second hydraulic cylinder 13 is fixedly connected with a clamping plate 19, the upper part of the clamping plate 19 is provided with a first through groove 22, the lower part of the clamping plate 19 is provided with a second through groove 23, the upper part of the right vertical surface of the clamping plate 19 is fixedly provided with a first air cylinder 18, the lower part of the right vertical surface of the clamping plate 19 is fixedly provided with a second air cylinder 20, the left vertical surface of the first air cylinder 18 is fixedly connected with a first limiting block 24, the left vertical surface of the second air cylinder 20 is fixedly connected with a second limiting block 25, the first limiting block 24 and the second limiting block 25 are respectively the output ends of the first air, the first limiting block 24 and the second limiting block 25 are respectively sleeved in the first through groove 22 and the second through groove 23, the hydraulic cylinders 13 are equidistantly distributed at the top end of the mounting base 14, the output shafts of the hydraulic cylinders 13 are equal in height, the top of the second limiting block 25 is fixedly clamped with the round crystal 12 with the left side of the clamping plate 19, the distance between the bottom of the first limiting block 24 and the top of the second limiting block 25 is equal to the thickness of the round crystal 12, the hydraulic cylinders 13 synchronously move, the first air cylinder 18 and the second air cylinder 20 are electrically connected in the control system, when the first air cylinder 18 and the second air cylinder 20 are in a carry position, the left vertical surfaces of the second limiting block 25 and the first limiting block 24 are positioned on the left side of the left vertical surface of the clamping plate 19, when the first air cylinder 18 and the second air cylinder 20 are in a retreat position, the left vertical surfaces of the second limiting block 25 and the first limiting block 24 and the left vertical surface of the clamping plate 19 are positioned, and the rotation center of the polishing head 28 coincides with the rotation center of the round crystal 12, therefore, the polishing head 28 can completely cover the upper surface of the round crystal 12 when the surface of the round crystal 12 rotates, when in use, firstly, the first air cylinder 18 is in a retreating position, the second air cylinder 20 is in a carrying position, so that the bottom surface of the round crystal 12 is abutted against the upper surface of the second limit block 25, the second hydraulic cylinder 13 is started, at this time, the clamping plate 19 is tightly abutted against the circumferential edge of the round crystal 12, the round crystal 12 is fixed at a processing position, then, the first hydraulic cylinder 10 is started to drive the polishing head 28 to descend until the bottom surface of the polishing head 28 is tightly abutted against the upper surface of the round crystal 12, the second motor 27 is started, at this time, the second motor 27 drives the polishing head 28 to polish the round crystal 12, after polishing is finished, the polishing head 28 is retreated to the original position, at this time, the second air cylinder 20 and, and then, the first motor 15 starts to drive the mounting base 14 to rotate by one hundred eighty degrees, so that the bottom of the round crystal 12 which is not polished is changed into the top, then the second air cylinder 20 is in the retreating position, the first air cylinder 18 is in the carrying position, and the actions are repeated, so that the two surfaces of the round crystal 12 are polished, and the problem that the surface of the semiconductor wafer is damaged due to collision when the round crystal 12 is secondarily clamped is avoided.

Example two

Based on the first embodiment, as shown in fig. 1 and 5, a condenser 2 is fixedly installed in the middle of the top of a connecting rod 4, an input pipeline 3 is fixedly connected to the front vertical surface of the connecting rod, one end of the input pipeline 3 away from the condenser 2 is fixedly connected to a polishing solution storage tank, a connecting pipeline 9 is fixedly connected to the rear vertical surface of the condenser 2, one end of the connecting pipeline 9 away from the condenser 2 is fixedly connected to a water pump 1, one side of the water pump 1 away from the connecting pipeline 9 is fixedly connected to an output pipeline 11, one end of the output pipeline 11 away from the water pump 1 is fixedly connected to an automatic take-up device 8, the bottom end of the output pipeline 11 is fixedly connected to a spray head 29, a horizontal pipe 21 is fixedly connected to the left side of the spray head 29, the spray heads 29 are uniformly distributed on the lower side of the horizontal pipe 21, the lowest end of the spray head 29, the polishing solution is uniformly coated on the surface of the wafer 12 under the action of the polishing head 28, and the low-temperature polishing solution is beneficial to maintaining the stability of the surface temperature of the wafer 12 during polishing, so that the problem that the polishing position of the wafer generates heat due to friction, which causes an oxide film to be produced on the surface of the wafer 12, is avoided.

The working principle is as follows: when the polishing machine is used, firstly, the first air cylinder 18 is in a retreating position, the second air cylinder 20 is in a carry position, the bottom surface of the round crystal 12 is abutted against the upper surface of the second limit block 25, the second hydraulic cylinder 13 is started, the clamping plate 19 is abutted against the circumferential edge of the round crystal 12 tightly, the round crystal 12 is fixed at a processing position, then, the first hydraulic cylinder 10 is started to drive the polishing head 28 to descend until the bottom surface of the polishing head 28 is abutted against the upper surface of the round crystal 12 tightly, the second motor 27 is started, the second motor 27 drives the polishing head 28 to polish the round crystal 12, after polishing is finished, the polishing head 28 returns to the original position, the second air cylinder 20 and the first air cylinder 18 are in a carry position simultaneously, the round crystal 12 is clamped between the first limit block 24 and the second limit block 25, then, the first motor 15 is started to drive the mounting base 14 to rotate by one hundred eighty degrees, the bottom of the round crystal, cylinder 18 is in the carry, repeat above-mentioned action, accomplish the polishing to the brilliant 12 two sides of circle promptly, avoid 12 secondary clamping to the brilliant 12 of circle, lead to the semiconductor wafer surface to take place to collide with the damage problem, secondly, when polishing the brilliant 12 of circle, polishing solution is through the cooling back of condenser 2, water on brilliant 12 of circle surface from shower nozzle 29 through each pipeline, evenly coat in brilliant 12 of circle surface under the effect of rubbing head 28, the stability of brilliant 12 surface temperature of circle when microthermal polishing solution is favorable to maintaining the polishing, thereby avoid the polishing position friction of wafer to generate heat, lead to the problem at brilliant 12 surface production oxide film of circle.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A semiconductor wafer surface polishing apparatus includes a housing (17);

the method is characterized in that:

the top fixedly connected with base plate (6) of facade before shell (17), the top fixed mounting of base plate (6) has branch (5), the top fixed mounting of branch (5) has connecting rod (4), the one end fixed mounting that branch (5) were kept away from to the bottom of connecting rod (4) has pneumatic cylinder one (10), the terminal fixedly connected with installation flat board (26) of output of pneumatic cylinder one (10), the fixed welding of back facade of installation flat board (26) has fixed plate (7), the bottom fixed mounting of installation flat board (26) has motor two (27), the terminal fixedly connected with polishing head (28) of output shaft of motor two (27), the top intermediate position fixed mounting of shell (17) right side facade has motor one (15), the terminal fixedly connected with mounting base (14) of output shaft of shell (17), through-hole (16) have been seted up at the center of mounting base (14), the top fixed mounting of mounting base (14) has pneumatic cylinder two (13), the terminal fixedly connected with cardboard (19) of output of pneumatic cylinder two (13), logical groove one (22) have been seted up on the upper portion of cardboard (19), logical groove two (23) have been seted up to the lower part of cardboard (19), the upper portion fixed mounting of cardboard (19) right side face has cylinder one (18), the lower part fixed mounting of cardboard (19) right side face has cylinder two (20), the left side face fixedly connected with stopper one (24) of cylinder one (18), the left side face fixedly connected with stopper two (25) of cylinder two (20), stopper two (25) tops and cardboard (19) left side fixed joint have round crystal (12).

2. A semiconductor wafer surface polishing apparatus as set forth in claim 1, wherein: connecting rod (4) top middle part fixed mounting has condenser (2), preceding facade fixedly connected with input pipeline (3), the one end fixedly connected with polishing solution bin of condenser (2) is kept away from in input pipeline (3), back facade fixedly connected with connecting tube (9) of condenser (2), the one end fixedly connected with water pump (1) of condenser (2) are kept away from in connecting tube (9), one side fixedly connected with output pipeline (11) of connecting tube (9) are kept away from in water pump (1), the automatic take-up of one end fixedly connected with (8) of water pump (1) are kept away from in output pipeline (11), the bottom fixedly connected with shower nozzle (29) of output pipeline (11).

3. A semiconductor wafer surface polishing apparatus as set forth in claim 1, wherein: bearings are fixedly mounted on the left vertical surface and the right vertical surface of the shell (17) corresponding to the output shaft of the motor I (15), and the output shaft of the motor I (15) is matched with the inner ring of the bearing.

4. A semiconductor wafer surface polishing apparatus as set forth in claim 1, wherein: the first limiting block (24) and the second limiting block (25) are respectively the output ends of the first air cylinder (18) and the second air cylinder (20), and the size and the shape of the first limiting block (24) and the second limiting block (25) are matched with the size and the shape of the first through groove (22) and the second through groove (23).

5. A semiconductor wafer surface polishing apparatus as set forth in claim 1, wherein: the distance between the bottom of the first limiting block (24) and the top of the second limiting block (25) is equal to the thickness of the round crystal (12), and the second hydraulic cylinder (13) moves synchronously.

6. A semiconductor wafer surface polishing apparatus as set forth in claim 1, wherein: the length of the polishing head (28) is equal to the diameter of the round crystal (12), the length of the polishing head (28) is smaller than the diameter of the through hole (16), and the rotation center of the polishing head (28) is coincident with the rotation center of the round crystal (12).

7. A semiconductor wafer surface polishing apparatus as set forth in claim 2, wherein: the left side of the spray head (29) is fixedly connected with a transverse pipe (21), the spray heads (29) are uniformly distributed on the lower side of the transverse pipe (21), and the lowest ends of the spray heads (29) are located above the polishing head (28).