CN212625546U - Board-level fan-out type heat radiation structure and electronic component - Google Patents
Board-level fan-out type heat radiation structure and electronic component Download PDFInfo
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- CN212625546U CN212625546U CN202021054246.4U CN202021054246U CN212625546U CN 212625546 U CN212625546 U CN 212625546U CN 202021054246 U CN202021054246 U CN 202021054246U CN 212625546 U CN212625546 U CN 212625546U
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Abstract
The utility model discloses a board level fan-out type heat radiation structure and electronic components, including the first heat radiation module who connects gradually, second heat radiation module and third heat radiation module, first heat radiation module includes first metal sheet and locates the miniflow way export that first metal sheet is close to second heat radiation module one side, second heat radiation module includes the second metal sheet and locates a plurality of miniflow ways on the second metal sheet, the miniflow way is located miniflow way export below and runs through the second metal sheet, third heat radiation module includes that third metal sheet and third metal sheet are close to the miniflow way storage area that second metal sheet one side was seted up and the miniflow way storage area entry that communicates with the miniflow way storage area, the miniflow way storage area is just to the miniflow way, the miniflow way storage area is through miniflow way and miniflow way export intercommunication, miniflow way storage area entry one end extends to third metal sheet lateral wall. The utility model discloses in, cooling fluid can be in the runner automatic cycle, carries out the initiative heat dissipation to the chip, combines together with the passive heat dissipation of metal sheet, can effectively improve the chip radiating effect.
Description
Technical Field
The utility model relates to an integrated circuit encapsulates technical field, concretely relates to board level fan-out type heat radiation structure and contains electronic components of this board level fan-out type heat radiation structure.
Background
With the development of chip functionalization, systematization and miniaturization, higher challenges are provided for the heat dissipation of the chip. Particularly in the stacked package structure, the problem of thermal management of the chip is not negligible. Generally, the failure rate of the electronic component increases exponentially with the temperature, and the reliability of the electronic component decreases by 5% for every 1 ℃ increase between 70 ℃ and 80 ℃.
In the existing manufacturing process of the heat dissipation structure, the efficiency is low, the cost is high, and in order to meet the requirements of high-efficiency heat dissipation effect and large-batch preparation of the heat dissipation structure, a new high-efficiency preparation process needs to be provided urgently.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a board level fan-out type heat radiation structure that radiating effect is good, production efficiency is high and contain the electronic components of this board level fan-out type heat radiation structure.
To achieve the purpose, the utility model adopts the following technical proposal:
on the one hand, the utility model provides a board-level fan-out type heat radiation structure, including the first heat radiation module, second heat radiation module and the third heat radiation module that connect gradually from top to bottom, first heat radiation module includes first metal sheet and sets up in the microchannel export that is the cell type structure of first metal sheet near second heat radiation module one side, the microchannel export extends to a lateral wall of first metal sheet, second heat radiation module includes the second metal sheet and sets up a plurality of microchannels on the second metal sheet, the microchannel is located the below of microchannel export and runs through the second metal sheet along the thickness direction of second metal sheet, the third heat radiation module includes the third metal sheet and the microchannel that the third metal sheet is close to the microchannel memory area that one side of second metal sheet was seted up and with the microchannel memory area entry that the microchannel memory area communicates, the micro-channel storage area is right opposite to the micro-channel, the micro-channel storage area is communicated with the micro-channel outlet through the micro-channel, and one end, far away from the micro-channel storage area, of the inlet of the micro-channel storage area extends to one side wall of the third metal plate.
As a preferred scheme of the board-level fan-out type heat dissipation structure, in the first heat dissipation module, the second heat dissipation module and the third heat dissipation module, metal plates of two adjacent heat dissipation modules are attached and connected through electrostatic adsorption.
As a preferred scheme of the board-level fan-out type heat dissipation structure, in the first heat dissipation module, the second heat dissipation module and the third heat dissipation module, metal plates of two adjacent heat dissipation modules are bonded and connected through bonding glue.
As a preferred scheme of the board-level fan-out type heat dissipation structure, in the first heat dissipation module, the second heat dissipation module and the third heat dissipation module, metal plates of two adjacent heat dissipation modules are attached and connected through a heat dissipation adhesive.
On the other hand, the electronic component comprises a chip and the board-level fan-out type heat dissipation structure, wherein the chip is installed on one side, far away from the second heat dissipation module, of the third heat dissipation module.
The utility model has the advantages that: the utility model discloses in, cooling fluid passes through the automatic miniflow of getting into of capillary action principle and stores in the miniflow storage area, the cooling fluid storage in the miniflow storage area is full later in through the automatic miniflow of capillary action principle again, and export through the miniflow and flow out automatically, wherein, the miniflow is said and is put the entry and can be passed through other connecting pipes and miniflow and say the export intercommunication, realize cooling fluid's automatic cycle (whole circulation process need not to set up power devices such as micropump), initiatively dispel the heat to the chip that sets up in third heat-radiating module below, combine together with the passive radiating effect of metal sheet to the chip, can effectively improve the radiating effect of chip.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the embodiments of the present invention will be briefly described below. It is obvious that the drawings described below are only some embodiments of the invention, and that for a person skilled in the art, other drawings can be obtained from these drawings without inventive effort.
Fig. 1 is a flowchart of a first method for manufacturing a heat dissipation module according to a first embodiment of the present invention.
Fig. 1-1 is a schematic cross-sectional view of a first carrier plate coated with bonding glue according to a first embodiment of the present invention.
Fig. 1-2 are schematic cross-sectional views illustrating a first metal plate attached to a first carrier according to a first embodiment of the present invention.
Fig. 1-3 are schematic cross-sectional views illustrating a first photosensitive dry film attached to a first metal plate according to a first embodiment of the present invention.
Fig. 1-4 are schematic cross-sectional views of a first photosensitive dry film after exposure and development according to a first embodiment of the present invention.
Fig. 1-5 are schematic cross-sectional views of an exposed first metal plate after etching according to a first embodiment of the present invention.
Fig. 2 is a schematic top view of a part of a first heat dissipation module according to a first embodiment of the present invention.
Fig. 3 is a flowchart of a manufacturing method of a second heat dissipation module according to a first embodiment of the present invention.
Fig. 3-1 is a schematic cross-sectional view of a second carrier plate coated with bonding glue according to a first embodiment of the present invention.
Fig. 3-2 is a schematic cross-sectional view illustrating a second metal plate attached to a second carrier according to a first embodiment of the present invention.
Fig. 3-3 are schematic cross-sectional views illustrating a second photosensitive dry film attached to a second metal plate according to a first embodiment of the present invention.
Fig. 3-4 are schematic cross-sectional views of the second photosensitive dry film after exposure and development according to the first embodiment of the present invention.
Fig. 3-5 are schematic cross-sectional views of the second metal plate after etching according to the first embodiment of the present invention.
Fig. 4 is a schematic top view of a part of a second heat dissipation module according to a first embodiment of the present invention.
Fig. 5 is a flowchart of a manufacturing method of a third heat dissipation module according to a first embodiment of the present invention.
Fig. 5-1 is a schematic cross-sectional view of a third carrier plate coated with bonding glue according to a first embodiment of the present invention.
Fig. 5-2 is a schematic cross-sectional view of a third metal plate attached to a third carrier plate according to a first embodiment of the present invention.
Fig. 5-3 are schematic cross-sectional views illustrating a third photosensitive dry film attached to a third metal plate according to a first embodiment of the present invention.
Fig. 5-4 are schematic cross-sectional views of a third photosensitive dry film after exposure and development according to a first embodiment of the present invention.
Fig. 5-5 are schematic cross-sectional views illustrating a third metal plate exposed on a third photosensitive dry film after etching according to a first embodiment of the present invention.
Fig. 5-6 are schematic cross-sectional views illustrating a fourth photosensitive dry film attached to a third metal plate after exposure and development according to a first embodiment of the present invention.
Fig. 5-7 are schematic cross-sectional views illustrating a third metal plate exposed on a fourth photosensitive dry film after etching according to a first embodiment of the present invention.
Fig. 6 is a schematic top view of a part of a third heat dissipation module according to a first embodiment of the present invention.
Fig. 7-1 is a schematic diagram of alignment cross-sectional view of the first heat dissipation module, the second heat dissipation module, and the third heat dissipation module according to the first embodiment of the present invention.
Fig. 7-2 is a schematic cross-sectional view of the first heat dissipation module, the second heat dissipation module, and the third heat dissipation module after being attached according to the first embodiment of the present invention.
Fig. 7-3 are schematic sectional views of the first heat dissipation module, the second heat dissipation module and the third heat dissipation module after being attached and cut according to the first embodiment of the present invention.
Fig. 8 is a schematic top view of the first heat dissipation module, the second heat dissipation module, and the third heat dissipation module according to the first embodiment of the present invention.
Fig. 9 is a schematic top view of the first heat dissipation module, the second heat dissipation module, and the third heat dissipation module after being attached and cut according to the first embodiment of the present invention.
In the figure:
11. a first carrier plate; 12. a first metal plate; 121. a micro flow channel outlet; 13. a first photosensitive dry film;
21. a second carrier plate; 22. a second metal plate; 221. a micro flow channel; 23. a second photosensitive dry film;
31. a third carrier plate; 32. a third metal plate; 321. an inlet of a micro-channel storage area; 322. a micro flow channel storage region; 33. a third photosensitive dry film; 34. and a fourth photosensitive dry film.
Detailed Description
The technical solution of the present invention is further explained by the following embodiments with reference to the accompanying drawings.
Wherein the showings are for the purpose of illustration only and are shown by way of illustration only and not in actual form, and are not to be construed as limiting the present patent; for a better understanding of the embodiments of the present invention, some parts of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted.
The same or similar reference numerals in the drawings of the embodiments of the present invention correspond to the same or similar parts; in the description of the present invention, it should be understood that if the terms "upper", "lower", "left", "right", "inner", "outer", etc. are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of description, but it is not indicated or implied that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore, the terms describing the positional relationship in the drawings are used only for illustrative purposes and are not to be construed as limiting the present patent, and the specific meaning of the terms will be understood by those skilled in the art according to the specific circumstances.
In the description of the present invention, unless otherwise explicitly specified or limited, the term "connected" or the like, if appearing to indicate a connection relationship between the components, is to be understood broadly, for example, as being either a fixed connection, a detachable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or may be connected through one or more other components or may be in an interactive relationship with one another. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The utility model provides a preparation method of board-level fan-out type heat radiation structure, provide first metal sheet, second metal sheet and third metal sheet, in one side preparation microchannel export of third metal sheet, form first heat dissipation module, make a plurality of edges on the second metal sheet the microchannel that the thickness direction of second metal sheet runs through the second metal sheet, form second heat dissipation module, make microchannel memory area entry and the microchannel memory area that communicates with the microchannel memory area entry in one side of third metal sheet, form third heat dissipation module; and respectively connecting the first heat dissipation module, the third heat dissipation module and the second heat dissipation module in a surface mounting manner, so that the micro-channel storage area is communicated with the micro-channel outlet through the micro-channel, and then cutting to obtain the board-level fan-out type heat dissipation structure.
The utility model discloses a preparation method of board level fan-out type heat radiation structure adopts the form of board level permutation to make through the size advantage of combining the encapsulation of board level fan-out, and modularization board level fan-out type heat radiation structure can make each heat dissipation module of board level fan-out type heat radiation structure simultaneously, makes the production efficiency of heat radiation structure promote at double, has realized high efficiency, mass production, has promoted the cost advantage; the utility model discloses in, cooling fluid passes through the automatic miniflow of getting into of capillary action principle and stores in miniflow storage area, the cooling fluid storage in the miniflow storage area is full later in through the automatic miniflow of capillary action principle once more and says, and export through the miniflow and flow out automatically, wherein, miniflow storage area entry can be through other connecting pipes and miniflow way export intercommunication, realize cooling fluid's automatic cycle (whole circulation process need not to set up power devices such as micropump), initiatively dispel the heat to the chip that sets up in third metal sheet below, combine together with the passive radiating effect of metal sheet to the chip, can effectively improve the radiating effect of chip.
The following specific examples are provided to explain the method for manufacturing a board-level fan-out heat dissipation structure according to the present invention in detail.
Example one
In the embodiment, each heat dissipation module is prepared by pasting a photosensitive dry film, exposing, developing and etching.
A first heat dissipation module is prepared with reference to fig. 1:
s10a, as shown in fig. 1-1 and fig. 1-2, providing a first carrier 11 and a first metal plate 12, and attaching the first metal plate 12 to the first carrier 11 by a bonding adhesive;
s10b, as shown in fig. 1-3, attaching a first photosensitive dry film 13 on the first carrier 11;
s10c, as shown in fig. 1 to 4, performing exposure and development processing on the first photosensitive dry film 13 to expose an outlet region of the micro flow channel to be etched;
s10d, as shown in the figure 1-5, etching the exposed outlet area of the micro-channel to obtain a micro-channel outlet 121;
s10e, removing the residual first photosensitive dry film 13, and obtaining the first heat dissipation module shown in fig. 2.
Preparing a second heat dissipation module with reference to fig. 3:
s20a, as shown in fig. 3-1 and fig. 3-2, providing a second carrier 21 and a second metal plate 22, and attaching the second metal plate 22 to one side of the second carrier 21 by a bonding adhesive;
s20b, as shown in fig. 3-3, attaching a second photosensitive dry film 23 to a side of the second metal plate 22 away from the second carrier 21;
s20c, as shown in fig. 3-4, performing exposure and development processing on the second photosensitive dry film 23 to expose a micro flow channel region to be etched;
s20d, as shown in fig. 3-5, etching the exposed micro flow channel region to form a micro flow channel 221;
s20e, removing the residual second photosensitive dry film 23, and obtaining the second heat dissipation module shown in fig. 4.
A third heat dissipation module is prepared with reference to fig. 5:
s30a, as shown in fig. 5-1 and 5-2, providing a third carrier plate 31 and a third metal plate 32, and adhering the third metal plate 32 to one side of the third carrier plate 31 by bonding;
s30b, as shown in fig. 5-3, attaching a third photosensitive dry film 33 on a side of the third metal plate 32 away from the third carrier 31;
s30c, as shown in fig. 5-4, performing exposure and development processing on the third photosensitive dry film 33 to expose an inlet region of the micro flow channel storage region to be etched;
s30d, as shown in fig. 5-5, the exposed micro flow channel storage area inlet region is etched to form a micro flow channel storage area inlet 321.
S30e, removing the residual third photosensitive dry film 33, and attaching a fourth photosensitive dry film 34 on the third metal plate 32;
s30f, as shown in fig. 5 to 6, exposing and developing the fourth photosensitive dry film 34 to expose a region of the microchannel storage region adjacent to the microchannel storage region inlet 321;
s30g, as shown in fig. 5-7, etching the exposed region of the microchannel storage region to form a microchannel storage region 322 in communication with the microchannel storage region inlet 321;
s30h, removing the residual fourth photosensitive dry film 34, and obtaining the second heat dissipation module shown in fig. 6.
The first heat dissipation module, the second heat dissipation module and the third heat dissipation module can be prepared synchronously, so that the efficiency is improved, and the production cost is reduced.
The first metal plate 12, the second metal plate 22 and the third metal plate 32 are made of copper metal, and have a good heat conduction effect. The pressing mode of the copper plate can be realized by adopting a copper-clad plate or a copper-plated mode, and is not limited herein. Of course, the materials of the first metal plate 12, the second metal plate 22 and the third metal plate 32 in this embodiment are not limited to copper metal, and may be other metals with thermal conductivity.
In this embodiment, the materials of the first carrier 11, the second carrier 21, and the third carrier 31 may be glass, SUS, Prepreg (BT), FR4, FR5, p.p, EMC, PI, and the like.
In this embodiment, the chip is designed in advance at the position of the micro flow channel outlet 121 on the first metal plate 12, the position of the micro flow channel 221 on the second metal plate 22, and the positions of the micro flow channel storage region inlet 321 and the micro flow channel storage region 322 on the third metal plate 32, and then holes are formed by attaching photosensitive dry film, exposing, developing and etching. The hole opening by the method of pasting a photosensitive dry film, exposing, developing and etching is a conventional technique in the field, and details are not described.
In other embodiments, the micro flow channel outlet 121 may be formed on the first metal plate 12, the micro flow channel 221 may be formed on the second metal plate 22, and the micro flow channel storage region inlet 321 and the micro flow channel storage region 322 may be formed on the third metal plate 32 by using a laser. The laser removal of the material on the metal plate is a conventional technique in the art, and is not described in detail.
Further, in the first heat dissipation module, the second heat dissipation module, and the third heat dissipation module in this embodiment, two adjacent heat dissipation modules are mounted in the following manner:
firstly, cleaning three radiating modules through plasma to remove impurities such as oxides on the surface of a metal plate and metal scraps generated in the process of opening a hole, and then respectively attaching and connecting the metal plates of two adjacent radiating modules through electrostatic adsorption; by adopting the method, the adjacent metal plates can be quickly attached and connected through electrostatic adsorption, and the mounting efficiency of the first metal plate 12, the second metal plate 22 and the third metal plate 32 is improved.
In the actual operation process, as shown in fig. 7-1 to 7-3, the mounting specifically comprises the following steps:
(1) cleaning the first heat dissipation module, the second heat dissipation module and the third heat dissipation module through plasma;
(2) aligning and attaching the first metal plate 12 of the first heat dissipation module to the outlet side of the micro channel 221 of the second metal plate 22 of the second heat dissipation module, and then removing the second carrier plate 21;
(3) the third metal plate 32 of the third heat dissipation module is attached to the inlet side of the micro channel 221 of the second metal plate 22 of the second heat dissipation module in an aligned manner, and the attached first heat dissipation module, second heat dissipation module and third heat dissipation module are shown in fig. 8;
(4) and as shown in fig. 7-3, cutting the whole of the three mounted heat dissipation modules to complete the manufacture of the board-level fan-out type heat dissipation structure, thereby obtaining the board-level fan-out type heat dissipation structure as shown in fig. 9.
Example two
The present embodiment is substantially the same as the first embodiment (the same component names are used with the reference numbers in the first embodiment), and the difference is the mounting manner of the first heat dissipation module, the second heat dissipation module and the third heat dissipation module, where the mounting specifically includes the following steps:
the method comprises the steps of firstly cleaning three radiating modules through plasma to remove oxides on the surfaces of metal plates and impurities such as metal scraps generated in the process of opening positions, then respectively connecting the metal plates of two adjacent radiating modules through electrostatic adsorption, and carrying out hot pressing treatment after aligning and attaching three metal plates through electrostatic adsorption. Taking a metal plate made of a copper material as an example, copper atoms on the surface of the metal plate are activated in the hot pressing process and invade into another metal plate which is jointed and connected with the metal plate, compared with the embodiment, the jointing stability between the metal plates can be further improved, so that the structural stability of the plate-level fan-out type heat dissipation structure is improved, and the chip has a stable heat dissipation effect.
In the actual operation process, the mounting specifically comprises the following steps:
(1) cleaning the first heat dissipation module, the second heat dissipation module and the third heat dissipation module through plasma;
(2) aligning and attaching the first metal plate 12 of the first heat dissipation module to the outlet side of the micro channel 221 of the second metal plate 22 of the second heat dissipation module, and then removing the second carrier plate 21;
(3) the third metal plate 32 of the third heat dissipation module is attached to the inlet side of the micro channel 221 of the second metal plate 22 of the second heat dissipation module;
(4) carrying out hot-pressing treatment on the three attached heat dissipation modules;
(5) and cutting the three heat dissipation modules subjected to the hot pressing treatment to complete the manufacture of the board-level fan-out type heat dissipation structure.
EXAMPLE III
The present embodiment is substantially the same as the first embodiment (the same component names are used with the reference numbers in the first embodiment), and the difference is the mounting manner of the first heat dissipation module, the second heat dissipation module and the third heat dissipation module, where the mounting specifically includes the following steps:
the three heat dissipation modules are subjected to ultrasonic cleaning to remove impurities on the surface of the metal plate through friction, and are subjected to hot pressing treatment after being aligned and attached.
In the actual operation process, the mounting specifically comprises the following steps:
(1) carrying out ultrasonic cleaning on the first heat dissipation module, the second heat dissipation module and the third heat dissipation module;
(2) aligning and attaching the first metal plate 12 of the first heat dissipation module to the outlet side of the micro channel 221 of the second metal plate 22 of the second heat dissipation module, and then removing the second carrier plate 21;
(3) the third metal plate 32 of the third heat dissipation module is attached to the inlet side of the micro channel 221 of the second metal plate 22 of the second heat dissipation module in an opposite position;
(4) carrying out hot-pressing treatment on the three attached heat dissipation modules;
(5) and cutting the three heat dissipation modules subjected to the hot pressing treatment to complete the manufacture of the board-level fan-out type heat dissipation structure.
Example four
The present embodiment is substantially the same as the first embodiment (the same component names are used with the reference numbers in the first embodiment), and the difference is the mounting manner of the first heat dissipation module, the second heat dissipation module and the third heat dissipation module, where the mounting specifically includes the following steps:
the metal plates of two adjacent heat dissipation modules are connected in a bonding mode through bonding glue.
In the actual operation process, the mounting specifically comprises the following steps:
(1) attaching the first metal plate 12 of the first heat dissipation module to the outlet side of the micro channel 221 of the second metal plate 22 of the second heat dissipation module through bonding glue, and then removing the second carrier plate 21, wherein the shape of the bonding glue is consistent with the shape of the un-etched part of the first metal plate 12;
(3) attaching the third metal plate 32 of the third heat dissipation module to the inlet side of the micro channel 221 of the second metal plate 22 by bonding glue, wherein the shape of the bonding glue is consistent with the shape of the unetched part of the third metal plate 32;
(4) carrying out hot-pressing treatment on the three attached heat dissipation modules;
(5) and cutting the three heat dissipation modules subjected to the hot pressing treatment to complete the manufacture of the board-level fan-out type heat dissipation structure.
EXAMPLE five
The present embodiment is substantially the same as the fourth embodiment (the same component names are used for the reference numerals in the fourth embodiment), except that the bonding glue is replaced by the heat dissipation glue, that is, the heat dissipation glue is attached and connected between the metal plates of two adjacent heat dissipation modules. Compared with the fourth embodiment, the heat dissipation effect of the plate-level fan-out type heat dissipation structure can be further improved by adopting the heat dissipation glue in the fourth embodiment.
Specifically, the heat dissipation glue comprises graphene, silica gel, silicone grease, methyl vinyl polysiloxane mixture, methyl hydrogen polysiloxane mixture and aluminum oxide. The graphene can enable the heat dissipation adhesive to have a good heat dissipation effect.
As shown in fig. 7-3, an embodiment of the present invention further provides a board-level fan-out heat dissipation structure, which is manufactured by the method for manufacturing the board-level fan-out heat dissipation structure in any of the above embodiments, wherein the board-level fan-out heat dissipation structure includes a first heat dissipation module, a second heat dissipation module, and a third heat dissipation module, which are sequentially connected from top to bottom, the first heat dissipation module includes a first metal plate 12 and a micro flow channel outlet 121 that is arranged on a side of the first metal plate 12 close to the second heat dissipation module and has a groove-shaped structure, the micro flow channel outlet 121 extends to a side wall of the first metal plate 12, the second heat dissipation module includes a second metal plate 22 and a plurality of micro flow channels 221 arranged on the second metal plate 22, the micro flow channels 221 are located below the micro flow channel outlet 121 and penetrate through the second metal plate 22 along a thickness direction of the second metal plate 22, the third heat dissipation module includes third metal sheet 32 with the third metal sheet 32 is close to the microchannel storage area 322 that one side of second metal sheet 22 was seted up and with the microchannel storage area entry 321 that microchannel storage area 322 communicates, microchannel storage area 322 is just right microchannel 221, microchannel storage area 322 passes through microchannel 221 with microchannel export 121 communicates, microchannel storage area entry 321 is kept away from the one end in microchannel storage area 322 extends to a lateral wall of third metal sheet 32.
The utility model discloses in, cooling fluid passes through the automatic miniflow of getting into miniflow storage area entry 321 of capillary action principle and stores in miniflow storage area 322, cooling fluid storage in miniflow storage area 322 flows into miniflow 221 through the capillary action principle again after being full, and through miniflow export 121 automatic outflow, wherein, miniflow storage area entry 321 can be through other connecting pipes and miniflow export 121 intercommunication, realize cooling fluid's automatic cycle (whole circulation process need not to set up power devices such as micropump), initiatively dispel the heat to the chip that sets up in first metal sheet 12 below, combine together with the passive radiating effect of metal sheet to the chip, can effectively improve the radiating effect of chip.
In the first heat dissipation module, the second heat dissipation module and the third heat dissipation module, metal plates of two adjacent heat dissipation modules are connected through electrostatic adsorption and fitting. After the metal plate is cleaned by plasma, impurities such as oxide on the surface can be removed, and then the metal plate can be attached and connected through electrostatic adsorption.
In other embodiments, in the first heat dissipation module, the second heat dissipation module, and the third heat dissipation module, the metal plates of two adjacent heat dissipation modules are bonded together by a bonding adhesive, and a cleaning step can be omitted.
Furthermore, in the first heat dissipation module, the second heat dissipation module and the third heat dissipation module, the metal plates of two adjacent heat dissipation modules are connected in a bonding manner through heat dissipation glue. Compared with the bonding glue, the heat dissipation glue can further improve the heat dissipation effect.
In this embodiment, the first metal plate 12, the second metal plate 22, and the third metal plate 32 are all copper plates.
Further, the number of the micro-channel storage area inlets 321 is four, the four micro-channel storage area inlets 321 extend to four sides of the third metal plate 32, the number of the micro-channel outlets 121 is four, and the four micro-channel outlets 121 extend to four sides of the first metal plate 12 and correspond to one of the micro-channel storage area inlets 321.
Wherein the depth of the microchannel storage area 322 is greater than the depth of the microchannel storage area inlet 321.
The cross section of the micro flow channel 221 may be square, circular, or triangular, and is not limited.
The embodiment of the utility model provides an electronic components is still provided, this electronic components contain chip and above-mentioned embodiment board level fan-out type heat radiation structure, the chip install in third heat radiation module keeps away from one side of second heat radiation module. The active heat dissipation and the passive heat dissipation of the board-level fan-out type heat dissipation structure are combined, so that the chip has a good heat dissipation effect.
It should be understood that the above-described embodiments are merely illustrative of the preferred embodiments of the present invention and the technical principles thereof. It will be understood by those skilled in the art that various modifications, equivalents, changes, and the like can be made to the present invention. However, these modifications are within the scope of the present invention as long as they do not depart from the spirit of the present invention. In addition, certain terms used in the specification and claims of the present application are not limiting, but are used merely for convenience of description.
Claims (8)
1. A board-level fan-out type heat dissipation structure is characterized by comprising a first heat dissipation module, a second heat dissipation module and a third heat dissipation module which are sequentially connected from top to bottom, wherein the first heat dissipation module comprises a first metal plate and a micro-channel outlet which is arranged on one side of the first metal plate and is of a groove-shaped structure and close to one side of the second heat dissipation module, the micro-channel outlet extends to one side wall of the first metal plate, the second heat dissipation module comprises a second metal plate and a plurality of micro-channels which are arranged on the second metal plate, the micro-channels are positioned below the micro-channel outlet and penetrate through the second metal plate along the thickness direction of the second metal plate, the third heat dissipation module comprises a third metal plate and a micro-channel storage area which is arranged on one side of the third metal plate and is close to the second metal plate and a micro-channel storage area inlet which is communicated with the micro-channel storage area, the micro-channel storage area is right opposite to the micro-channel, the micro-channel storage area is communicated with the micro-channel outlet through the micro-channel, and one end, far away from the micro-channel storage area, of the inlet of the micro-channel storage area extends to one side wall of the third metal plate.
2. The board-level fan-out heat dissipation structure of claim 1, wherein metal plates of two adjacent heat dissipation modules of the first, second, and third heat dissipation modules are attached together by electrostatic attraction.
3. The board-level fan-out heat dissipation structure of claim 1, wherein metal plates of two adjacent heat dissipation modules of the first heat dissipation module, the second heat dissipation module and the third heat dissipation module are bonded together by a bonding adhesive.
4. The board-level fan-out heat dissipation structure of claim 1, wherein metal plates of two adjacent heat dissipation modules in the first heat dissipation module, the second heat dissipation module and the third heat dissipation module are bonded together by a heat dissipation adhesive.
5. The board-level fan-out heat dissipation structure of claim 1, wherein the first metal plate, the second metal plate, and the third metal plate are copper plates.
6. The board-level fan-out heat dissipation structure of claim 1, wherein the number of the micro-channel storage area inlets is four, four micro-channel storage area inlets extend to four sides of the third metal plate, respectively, the number of the micro-channel outlets is four, and four micro-channel outlets extend to four sides of the first metal plate and correspond to one of the micro-channel storage area inlets, respectively.
7. The board-level fan-out heat dissipation structure of claim 1, wherein a depth of the microchannel storage region is greater than a depth of the microchannel storage region inlet.
8. An electronic component comprising a chip and the board-level fan-out heat dissipation structure of any one of claims 1 to 7, wherein the chip is mounted on a side of the third heat dissipation module away from the second heat dissipation module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021054246.4U CN212625546U (en) | 2020-06-09 | 2020-06-09 | Board-level fan-out type heat radiation structure and electronic component |
Applications Claiming Priority (1)
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Denomination of utility model: Board level fan out heat dissipation structure and electronic components Effective date of registration: 20211229 Granted publication date: 20210226 Pledgee: Guangdong Shunde Rural Commercial Bank Co.,Ltd. science and technology innovation sub branch Pledgor: Guangdong fozhixin microelectronics technology research Co.,Ltd.|Guangdong Xinhua Microelectronics Technology Co.,Ltd. Registration number: Y2021980016930 |
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Effective date of registration: 20230904 Address after: Room A107, scientific research building, block a, neifo high tech think tank center, Nanhai Software Science Park, Shishan town, Nanhai District, Foshan City, Guangdong Province, 528225 Patentee after: Guangdong fozhixin microelectronics technology research Co.,Ltd. Address before: Room A107, scientific research building, block a, neifo high tech think tank center, Nanhai Software Science Park, Shishan town, Nanhai District, Foshan City, Guangdong Province, 528225 Patentee before: Guangdong fozhixin microelectronics technology research Co.,Ltd. Patentee before: Guangdong Xinhua Microelectronics Technology Co.,Ltd. |
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