CN212625536U

CN212625536U - Bearing device

Info

Publication number: CN212625536U
Application number: CN202022102620.XU
Authority: CN
Inventors: 陈鲁; 范铎; 张鹏斌
Original assignee: Shenzhen Zhongke Feice Technology Co Ltd
Current assignee: Shenzhen Zhongke Feice Technology Co Ltd
Priority date: 2020-09-22
Filing date: 2020-09-22
Publication date: 2021-02-26
Anticipated expiration: 2030-09-22

Abstract

The utility model discloses a bearing device, which comprises at least a first joint component, a second joint component and a force application component, wherein the first joint component and the second joint component comprise joint parts for fixing the edge part of an object to be tested; the force application component is used for applying a force far away from the second joint component to the first joint component so as to drive the first joint part to be far away from the second joint component; use the utility model provides a when bearing device fixes the wafer, earlier the joint portion of each engaging means is fixed with the edge part of wafer, then start application of force part and order about first engaging means and second engaging means and keep away from relatively, and then the engaging means will give the corresponding position of power transmission rather than the wafer of fixed joint, the wafer is under the traction of first engaging means and second engaging means, the wafer surface is evened up, guarantee the roughness that the wafer detected time measuring, be favorable to satisfying the testing requirement, be particularly convenient for to the wafer back and detect.

Description

Bearing device

Technical Field

The utility model relates to a wafer clamping technical field, in particular to bear device.

Background

The wafer is a silicon wafer from which silicon semiconductor integrated circuits are fabricated. As the size of semiconductor features becomes smaller and smaller, any portion of the wafer surface has a critical effect on the quality and operational reliability of the device, and therefore the wafer quality needs to be paid more attention to during the production process.

Due to the process and use requirements, the thickness of a semiconductor wafer is generally thin, and the thickness of a wafer sheet is different from dozens of micrometers to hundreds of micrometers. When the wafer thickness is thinner, it is easy to generate larger warpage due to the manufacturing process, and its own thickness is thinner and also generates larger sagging deformation due to gravity. When quality inspection is performed on such a wafer, the wafer is usually required to be fixed to prevent the wafer from warping. The wafer includes a back side and a front side, the front side is generally the side on which the process pattern is disposed, and the back side is the side on which the process pattern is not disposed. When the front process and the detection process are carried out, the whole area of the back surface of the wafer can be fixed by a vacuum or electrostatic adsorption mode, but when the process and the detection are required to be carried out on the back surface of the slice, the existing process patterns on the front surface of the wafer can not be contacted, so that the wafer can not be positioned by a large-area vacuum and electrostatic adsorption mode.

At present, when the back surface of a wafer is detected, a clamping component is generally used for radially clamping the edge of the wafer, but the problem of wafer warping cannot be solved, and the wafer warping is easy to increase or even hidden crack due to the clamping force when the wafer is serious.

Therefore, how to provide a positioning device suitable for wafer backside detection to solve the technical problem of warpage in wafer positioning in the prior art is an urgent technical problem to be solved by those skilled in the art.

SUMMERY OF THE UTILITY MODEL

The utility model provides a positioner suitable for wafer back detects, the surface is more level and smooth during wafer location.

The utility model provides a bearing device, which comprises a first joint part and a second joint part, wherein the first joint part and the second joint part comprise joint parts for fixing the edge part of an object to be measured; the force applying component is used for applying force far away from the second joint component to the first joint component so as to drive the first joint part to be far away from the second joint component.

Use the utility model provides a when bearing device fixes the wafer, earlier the junction part of each joint part is fixed with the edge part of wafer, then start application of force part and order about first joint part and second joint part and keep away from relatively, and then joint part will give the corresponding position of power transmission rather than the wafer of fixed joint, the wafer is under the traction effect of first joint part and second joint part, the wafer surface is evened up, and then the warping problem of wafer among the prior art has been solved, guarantee the roughness that the wafer detected time measuring, be favorable to satisfying the detection requirement, especially be convenient for detect the wafer back, on the other hand, the wafer is under the traction effect of first junction part and second junction part, the position at adjustable wafer center.

Optionally, the first engaging member is the same as the second engaging member, or the first engaging member is different from the second engaging member.

Optionally, the first engaging part and the second engaging part each comprise a first clip body and a second clip body, the first clip body comprises a first clip body portion, the second clip body comprises a second clip body portion, and the first clip body portion and the second clip body portion cooperate with clamped edge portions; the first clamping part is used for providing supporting force along the normal direction of the second surface for the second surface of the object to be measured, and the second clamping part is used for providing pressure along the normal direction of the first surface for the first surface of the object to be measured.

Optionally, the first clip body and the second clip body are hinged, and the second clip portion is relatively close to or far from the first clip portion by reciprocating rotation around a hinge shaft.

Optionally, the clamping device further comprises a driving component, and the driving component is connected with the second clamping body and used for driving the second clamping part to rotate around the hinge shaft.

Optionally, the clamping device further comprises a tensioning member, the tensioning member is tensioned between the second clamp body and the first clamp body, or between the second clamp body and an external fixed environment, and under the action of the tensioning force of the tensioning member, the second clamping portion and the first clamping portion are in a closed state or a separated state.

Optionally, the tensioning member is a spring.

Optionally, the force application component includes at least one power portion and at least one connecting end, one power portion corresponds to at least one connecting end, and each connecting end is connected with the first clamp body so as to apply force to the first clamp body.

Optionally, the clamping device further comprises a base body, each first clamping body is slidably mounted on the base body, and the plane of the first clamping portion is higher than the upper surface of the base body or the plane of the first clamping portion is flush with the upper surface of the base body.

Optionally, the base member includes the spout along circumference equipartition, the spout is followed the base member radially distributes, first clamp is at least partly located in the spout, the application of force part is used for the drive first clamp is in remove in the spout.

Drawings

Fig. 1 is a schematic structural diagram of a carrying device according to an embodiment of the present invention;

FIG. 2 is a schematic view of the structure of the wafer assembly and the carrier of the present invention;

fig. 3 is a partially enlarged schematic view of the structure shown in fig. 2.

Wherein, the one-to-one correspondence between the names and reference numbers of the components in fig. 1 to 3 is as follows:

10-a first clip body; 101-a first clamping portion; 11-a second clamp body; 111-attachment position; 112-a second clamping portion; 12-a jointed shaft; 13-a tensioning member; 14-a substrate; 141-a chute;

20-wafer.

Detailed Description

Aiming at the technical problem that the wafer is difficult to position and easy to warp during the back detection of the wafer in the background technology, a large amount of experimental researches are carried out, and a technical scheme for solving the technical problem is proposed based on the research.

The technical solutions and the technical effects are described by taking the wafer clamped by the carrying device as an example, and it should be understood by those skilled in the art that the carrying device herein can also be applied to other objects to be tested besides wafers.

In order to make those skilled in the art better understand the technical solution of the present invention, the present invention will be further described in detail with reference to the accompanying drawings and specific embodiments.

Referring to fig. 1 to 3, fig. 1 is a schematic structural diagram of a carrying device according to an embodiment of the present invention; FIG. 2 is a schematic view of the structure of the wafer assembly and the carrier of the present invention; fig. 3 is a partially enlarged schematic view of the structure shown in fig. 2.

The utility model provides a bearing device, which comprises at least two joint parts, namely at least a first joint part and a second joint part, wherein the first joint part and the second joint part comprise joint parts for fixing the edge part of an object to be measured; taking the fixed circular wafer 20 as an example, the edge portion of the wafer 20 described herein is approximately 0-3mm away from the peripheral outer edge of the wafer 20, and generally, no process pattern is disposed on the edge portion region of the wafer, and the contact and engagement of the engagement portion with the edge portion of the front surface of the wafer does not affect the etched pattern on the front surface of the wafer. Of course, the defined size of the edge portion may vary depending on the application of the test object. The particular reasonable size of the edge portion will be known to those skilled in the art based on the particular application, and thus, the particular size and shape of the edge portion is not limited herein without impeding the understanding and implementation of the present teachings by those skilled in the art.

The utility model discloses still further include the application of force part for apply the power of keeping away from second joint part to first joint part, keep away from the second joint part in order to drive first joint part. The urging member may be one or plural, that is, one engaging portion may correspond to one urging member, or plural engaging portions may correspond to one urging member. The force applying component can simultaneously apply force to each joint component to drive each joint component to move away relatively, and of course, only partial joint components can be applied with force, and the other joint components are fixed in position to realize the relative moving away between the joint components.

Use the utility model provides a when bearing device fixes the wafer, the joint portion of each joint part is fixed with the edge part of wafer earlier, then start application of force part and order about first joint part and second joint part and keep away from relatively, and then joint part will give power transmission and give the relevant position of the wafer 20 rather than fixed joint, wafer 20 is under the traction of first joint part and second joint part, wafer 20 surface is evened up, and then the warping problem of wafer 20 among the prior art has been solved, guarantee the roughness of wafer 20 detection time measuring, be favorable to satisfying the detection requirement, especially, be convenient for detect the wafer 20 back, on the other hand, wafer 20 is under the traction of first joint part and second joint part, the position at adjustable wafer 20 center.

The first and second engagement members may be configured in a variety of ways, with the first engagement member being the same as the second engagement member or the first engagement member being different from the second engagement member. For example, each bonding member may have a suction type structure, such as a plurality of suction points, or may have an adhesive type structure, such as a bonding member that is positioned and bonded to the wafer by adhesion, as long as the wafer can be stably loaded with a force. The following provides a specific embodiment in which the first engaging member and the second engaging member have the same structure.

In a specific embodiment, the first engaging member and the second engaging member each comprise a first clip body 10 and a second clip body 11, the first clip body 10 comprises a first clamping portion 101, the second clip body 11 comprises a second clamping portion 112, and the first clamping portion 101 and the second clamping portion 112 cooperate to clamp edge portions; the first clamping portion 101 is used for providing a supporting force to the second surface of the object to be tested along the normal direction of the second surface, and the second clamping portion 112 is used for providing a pressure to the first surface of the object to be tested along the normal direction of the first surface.

When the wafer is clamped, the edge part of the wafer 20 is placed between the first clamping part 101 and the second clamping part 112, then the first clamping part 101 and the second clamping part 112 are controlled to be in a closed state to clamp the edge part of the wafer 20, then the force application part is controlled to pull the joint parts outwards to enable the joint parts to be separated relatively, and then the joint parts transmit the pulling force to the wafer to overcome the self gravity of the wafer and flatten the wafer.

The urging member may be connected to the first clip body 10, may be connected to the second clip body 11, or may be connected to both the first clip body 10 and the second clip body 11.

The force application member may be an electrically driven member, such as a motor, or a gas driven member, such as a pneumatic cylinder. The force application members may correspond to the engagement members one to one, but it is needless to say that one force application member may correspond to two or more engagement members. Specifically, the force application member may include at least one power portion and at least one connection end, where one power portion corresponds to at least one connection end, and each connection end is connected to the first clamp body 10 so as to apply force to the first clamp body 10. For example, in the case of a pneumatic drive, a plurality of pneumatic cylinders are connected in parallel to a high-pressure control oil circuit, and each pneumatic cylinder corresponds to one engagement member.

In the above embodiments, the first clip body 10 and the second clip body 11 are hinged, the first clip portion 101 and the second clip portion 112 are located on the same side of the hinge shaft 12, and the second clip portion 112 is relatively close to or away from the first clip portion 101 by reciprocating rotation about the hinge shaft 12.

The first clamp body 10 and the second clamp body 11 are relatively close to or far away from each other through hinging, and the structure is simple and the occupied space is small.

For automated control, a driving member is connected to the second clamp body 11 for driving the second clamping portion 112 to rotate about the hinge axis. That is, the relative approaching or separating of the first collet 10 and the second collet 11 can be controlled by a driving part, which can be a motor part or a pneumatic control part. The connection position 111 of the second collet 11 to the drive member is shown in fig. 1, and although the drive member is not shown, it does not hinder the understanding and implementation of the solution herein by the person skilled in the art.

Generally, the back surface and the front surface of the wafer are both flat surfaces, and the surfaces of the first clamping portion 101 and the second clamping portion 112 that cooperate to clamp the wafer may also be flat surfaces. Thus, the contact area between the first clamping portion 101 and the wafer 20 and the contact area between the second clamping portion 112 and the wafer 20 are relatively large, which is beneficial to the reliable contact between the joint formed by the first clamping portion 101 and the second clamping portion 112 and the wafer 20.

In the above embodiments, the load bearing device may further include a tensioning member 13, which is tensioned between the second clamp body 11 and the first clamp body 10, or between the second clamp body 11 and an external fixed environment, and under the tensioning force of the tensioning member 13, the second clamping portion 112 and the first clamping portion 101 are in a closed state or a separated state.

A specific embodiment is given in which the second clamping part 112 is in the closed position under the tensioning force of the tensioning member 13, such that in a normal state (defined herein as follows: the drive member does not apply a force to the second clamping part 112), the second clamping part 112 is in the closed position. The automatic control of the bearing device is very important, and the controller can know the states of the first clamp body 10 and the second clamp body 11 through judging the states of all the parts, so that the subsequent automatic control can be realized.

Of course, under the normal condition, under the tension of the tension member 13, the second clamping portion 112 may be in the separated state, that is, the first clamping portion 101 and the second clamping portion 112 are in the relatively opened state.

In one embodiment, the tension member 13 may be a spring. The spring can be pressed between the second clamp body 11 and the first clamp body 10, and can also be pressed between the second clamp body 11 and the external fixed environment. The external fixed environment may be the base 14 of the fixed engagement member.

The first clamps 10 in the above embodiments are arranged along the circumferential direction, and are arranged opposite to each other two by two so as to apply coaxial and opposite forces to the wafer. The figure shows an embodiment in which six engagement members are provided, two of which are arranged opposite each other, and two of which are arranged opposite each other to apply radial and opposite forces to the wafer. This is advantageous in order to make the wafer surface as flat as possible.

In order to improve the integration of mechanical equipment, the clamping efficiency and the detection efficiency are further improved. The utility model provides a bearing device can also include base member 14, and each first clamp 10 slidable mounting is in base member 14 to first clamping part 101 place plane is higher than base member 14 upper surface, or first clamping part 101 place plane flushes with the base member upper surface. In this way, the substrate 14 can integrally mount the bonding components on the substrate 14, and when clamping the wafer, the wafer and the bonding components on the substrate 14 only need to be clamped correspondingly, and since the upper surface of the first clamping portion 101 is higher than the upper surface of the substrate 14, the crystal 20 is mounted and supported on the first clamping portions 101.

The base 14 primarily provides a mounting base for the various components of the joint, and is not limited herein with respect to the specific shape and configuration of the base 14.

Specifically, the base 14 may be provided with sliding grooves, the sliding grooves are circumferentially and uniformly distributed, the sliding grooves extend in the radial direction, the first clip body 10 is at least partially installed inside the sliding groove 141, and when the force application member pulls the first clip body 10, the first clip body 10 can relatively displace with respect to the sliding groove 141, so that the sliding groove 141 has a guiding effect on the force applied to the first clip body 10.

Although the specific structure of the force application member is not shown herein, it is not a hindrance to the understanding and implementation of the technical solutions herein by those skilled in the art through this description.

Furthermore, the utility model also provides a method for using of bearing device of above-mentioned each embodiment, specifically include:

s1, fixedly connecting the joint part of the first joint component and the joint part of the second joint component with different positions of the edge part of the object to be measured respectively;

and S2, starting the force application part to drive the first joint part and the second joint part to move away relatively to flatten at least part of the surface of the object to be tested.

Of course, the following steps may also be added before step S1 or between step S1 and step S2: the first engaging member and the urging member are connected.

The use method provided herein is based on the implementation of the carrying device, and therefore, the use method also has the technical effects of the carrying device, which are not described herein again.

It is right above that the utility model provides a bear device and introduced in detail. The principles and embodiments of the present invention have been explained herein using specific examples, and the above descriptions of the embodiments are only used to help understand the method and its core ideas of the present invention. It should be noted that, for those skilled in the art, without departing from the principle of the present invention, the present invention can be further modified and modified, and such modifications and modifications also fall within the protection scope of the appended claims.

Claims

1. A carrying device is characterized by comprising a first joint part and a second joint part, wherein the first joint part and the second joint part respectively comprise a joint part for fixing an edge part of an object to be tested; the force applying component is used for applying force far away from the second joint component to the first joint component so as to drive the first joint part to be far away from the second joint component.

2. The carrier of claim 1 wherein the first engagement member is the same as the second engagement member or the first engagement member is different from the second engagement member.

3. The carrying device according to claim 1, wherein the first engaging means and the second engaging means each comprise a first clamp body (10) and a second clamp body (11), the first clamp body (10) comprising a first clamping portion (101), the second clamp body (11) comprising a second clamping portion (112), the first clamping portion (101) and the second clamping portion (112) cooperating to clamp edge portions; the first clamping part (101) is used for providing a supporting force along the normal direction of the second surface to the second surface of the object to be measured, and the second clamping part (112) is used for providing a pressure along the normal direction of the first surface to the first surface of the object to be measured.

4. A load-carrying device according to claim 3, characterized in that said first clamp (10) and said second clamp (11) are hinged, said second clamp (112) being relatively close to or far from said first clamp (101) by reciprocating rotation about a hinge axis.

5. A load carrying device according to claim 4, further comprising a drive member connected to the second clamp body (11) for driving the second clamp portion (112) in rotation about the hinge axis.

6. The load carrying device according to claim 5, further comprising a tensioning member (13) tensioned between the second clamp body (11) and the first clamp body (10) or between the second clamp body (11) and an external fixed environment, wherein the second clamping portion (112) and the first clamping portion (101) are in a closed state or a separated state under the tensioning force of the tensioning member (13).

7. A load carrying device according to claim 6, wherein the tensioning member (13) is a spring.

8. The carrying device according to claim 3, wherein the force exerting member comprises at least one power portion and at least one connecting end, one power portion corresponding to at least one connecting end, each connecting end being connected to the first clamp body (10) for exerting a force on the first clamp body (10).

9. The carrying device according to any one of claims 3 to 8, further comprising a base body (14), wherein each of the first clamping bodies (10) is slidably mounted on the base body (14), and the plane of the first clamping portion (101) is higher than the upper surface of the base body (14) or the plane of the first clamping portion (101) is flush with the upper surface of the base body (14).

10. The carrying device according to claim 9, wherein the base body (14) comprises sliding slots (141) which are uniformly distributed along the circumferential direction, the sliding slots (141) are distributed along the radial direction of the base body (14), the first clamp body (10) is at least partially arranged in the sliding slots (141), and the force application component is used for driving the first clamp body (10) to move in the sliding slots (141).