CN212623969U

CN212623969U - Electronic device heat radiation structure and radiator

Info

Publication number: CN212623969U
Application number: CN202021846766.9U
Authority: CN
Inventors: 李贵钟
Original assignee: Dongguan Ming Wang Electronics Co ltd
Current assignee: Dongguan Ming Wang Electronics Co ltd
Priority date: 2020-08-31
Filing date: 2020-08-31
Publication date: 2021-02-26
Anticipated expiration: 2030-08-31

Abstract

The utility model discloses an electron device heat radiation structure and radiator, air cooling device includes the heat-conducting plate that binds with the heating element, it has fin to run through about the inside of heat-conducting plate, the right side fixedly connected with mount of fin, the right-hand member of mount is provided with the fan, heat radiation device includes the casing, the first heat radiation fin of the outer fixed surface of casing is connected with, and the cylinder hole has been seted up to the inside of casing, the inner wall fixedly connected with heat absorption copper sheet in cylinder hole, the utility model relates to a heat dissipation technical field. This electron device heat radiation structure and radiator, the heat energy on fin surface is taken away to cold wind, then gets into the inside cylinder hole of casing through the ventilation hole, is rotatory through the cylinder hole after being absorbed the heat copper sheet vortex, and rotatory hot-blast heat has increased the heat transfer, and heat energy is absorbed the back and is gone out through the electromagnetic wave radiation by first heat radiation fin, and prior art compares, and heat energy can not pile up at quick-witted case inner chamber or around.

Description

Electronic device heat radiation structure and radiator

Technical Field

The utility model relates to a heat dissipation technical field specifically is an electron device heat radiation structure and radiator.

Background

With the rapid development of the electronic industry, the functions of the computer are increasingly strengthened, and thus the computing capabilities of the microprocessor chips such as the cpu, the north bridge chip, the south bridge chip, and the image processing chip disposed on the motherboard of the computer are becoming stronger. Therefore, a large amount of heat energy is generated during the operation of the microprocessor chip, and if the generated heat energy is not removed in time, the damage of the microprocessor chip may be caused, or the operation performance of the microprocessor chip may be directly affected. Therefore, a heat sink is usually required on the microprocessor chip on the computer motherboard to dissipate heat of the operating microprocessor chip

In the narrow and small space of current computer, heating element is very concentrated, and current computer generally can install radiator fan additional to CPU, however radiator fan continuous operation after a period, the heat energy that radiator fan effluvium generally can accumulate around quick-witted incasement chamber and the quick-witted case of computer, is accumulated to a certain extent, and radiator fan is because there is not cold air to get into radiating effect just the slump, and under the environment of high temperature, some parts will descend including radiator fan's life.

SUMMERY OF THE UTILITY MODEL

Not enough to prior art, the utility model provides an electron device heat radiation structure and radiator has solved radiator fan and has only had the circulation of air in the part, the not good problem of radiating effect after the continuous use.

In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: the utility model provides an electron device heat radiation structure and radiator, includes quick-witted case, the inside fixedly connected with mainboard of machine case, the fixed surface of mainboard is connected with heating element, heating element's fixed surface is connected with wind cold charge and puts, the left of machine case is provided with heat radiation device.

The air cooling device comprises a heat conducting plate bonded with a heating element, fins penetrate through the heat conducting plate from left to right, a fixing frame is fixedly connected to the right side of each fin, a fan is arranged at the right end of the fixing frame, the heat radiating device comprises a shell, a first heat radiating fin is fixedly connected to the outer surface of the shell, a cylinder hole is formed in the shell, and a heat absorbing copper sheet is fixedly connected to the inner wall of the cylinder hole.

Preferably, the left end of the case is provided with a vent hole.

Preferably, a second heat radiation fin is fixedly connected to one side of the surface of the chassis, which is close to the vent hole.

Preferably, the four equal fixedly connected with block structures in angle of casing right-hand member, the block structure includes the dead lever with casing fixed connection, the right-hand member of dead lever runs through the ventilation hole and extends to the inside of quick-witted case, the right-hand member of dead lever just is located the inside fixedly connected with triangle block of quick-witted case, the upper and lower both sides on triangle block right side all rotate and are connected with the card wing, the upper and lower two sides of triangle block are all seted up flutedly, the inside of recess just is located fixedly connected with spring between triangle block and the card wing.

Preferably, the right end of the fixing frame is provided with a clamping groove, the upper end and the lower end of the fan are fixedly connected with clamping strips, and the fixing frame and the fan support can be connected through the clamping groove and the clamping strips in a clamping mode.

Preferably, the housing is fixedly connected with the chassis through a clamping structure.

Advantageous effects

The utility model provides an electron device heat radiation structure and radiator. Compared with the prior art, the method has the following beneficial effects:

(1) this electron device heat radiation structure and radiator, include the heat-conducting plate that binds with heating element through at air cooling plant, it has the fin to run through about the inside of heat-conducting plate, the right side fixedly connected with mount of fin, the right-hand member of mount is provided with the fan, heat radiation plant includes the casing, the first heat radiation fin of the first heat radiation of surface fixedly connected with of casing, the cylinder hole has been seted up to the inside of casing, the inner wall fixedly connected with heat absorption copper sheet in cylinder hole, the heat energy on fin surface is taken away to cold wind, then get into the inside cylinder hole of casing through the ventilation hole, rotatory cylinder hole of passing through after being absorbed the vortex of heat absorption copper sheet, rotatory hot-blast heat transfer that has increased, heat energy is absorbed the back and is gone out through the electromagnetic wave radiation by first heat radiation.

(2) This electron device heat radiation structure and radiator, through the equal fixedly connected with block structure in four angles of casing right-hand member, the block structure includes the dead lever with casing fixed connection, the right-hand member of dead lever runs through the ventilation hole and extends to the inside of quick-witted case, the right-hand member of dead lever just is located the three hornblocks of inside fixedly connected with of quick-witted case, the upper and lower both sides on three hornblocks right side are all rotated and are connected with the card wing, the recess has all been seted up on the upper and lower two sides of three hornblocks, the inside of recess just is located the three hornblocks and blocks fixedly connected with spring between the wing, can easily install heat radiation device at machine box surface, the user can install heat radiation device additional alone, make the radiating effect of computer further strengthen.

Drawings

Fig. 1 is a front sectional view of the present invention;

fig. 2 is a side sectional view of the heat radiation device of the present invention;

FIG. 3 is an enlarged view of a portion of FIG. 1;

fig. 4 is a partially enlarged view of the point B in fig. 1 according to the present invention.

In the figure: 1. a chassis; 2. a main board; 3. a heating element; 4. an air cooling device; 5. a heat radiation means; 401. a heat conducting plate; 402. a fin; 403. a fixed mount; 404. a fan; 501. a housing; 502. a first heat radiation fin; 503. a cylindrical bore; 504. a heat absorbing copper sheet; 6. a vent hole; 7. a second heat radiation fin; 510. a snap-fit structure; 511. fixing the rod; 512. a triangular block; 513. a fin; 514. a groove; 515. a spring; 405. a card slot; 406. and (6) clamping the strip.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: the utility model provides an electron device heat radiation structure and radiator, includes quick-witted case 1, and the inside fixedly connected with mainboard 2 of quick-witted case 1, the fixed surface of mainboard 2 is connected with heating element 3, and heating element 3's fixed surface is connected with air cooling device 4, and the left of quick-witted case 1 is provided with heat radiation device 5.

The air cooling device 4 comprises a heat conducting plate 401 bonded with the heating element 3, fins 402 penetrate through the left and right sides of the interior of the heat conducting plate 401, a fixing frame 403 is fixedly connected to the right side of each fin 402, a fan 404 is arranged at the right end of the fixing frame 403, the heat radiating device 5 comprises a shell 501, a first heat radiating fin 502 is fixedly connected to the outer surface of the shell 501, a cylinder hole 503 is formed in the shell 501, a heat absorbing copper sheet 504 is fixedly connected to the inner wall of the cylinder hole 503, heat energy on the surface of each fin 402 is taken away by cold air and then enters the cylinder hole 503 in the shell 501 through a vent 6, the heat absorbing copper sheet rotates through the cylinder hole 503 after being disturbed by the heat absorbing copper sheet 504, the rotating hot air increases heat transfer, the heat energy is absorbed and then radiated out by the first heat radiating fin 502 through electromagnetic waves, compared with the prior art, the surface of the chassis 1 and one side close to the vent hole 6 are fixedly connected with a second heat radiation fin 7, four corners of the right end of the housing 501 are fixedly connected with a clamping structure 510, the clamping structure 510 comprises a fixed rod 511 fixedly connected with the housing 501, the right end of the fixed rod 511 penetrates through the vent hole 6 and extends into the chassis 1, the right end of the fixed rod 511 is fixedly connected with a triangular block 512 positioned in the chassis 1, the upper side and the lower side of the right side of the triangular block 512 are rotatably connected with clamping wings 513, the upper side and the lower side of the triangular block 512 are both provided with grooves 514, a spring 515 is fixedly connected in the grooves 514 and positioned between the triangular block 512 and the clamping wings 513, the heat radiation device 5 can be easily installed on the surface of the chassis 1, a user can independently install the heat radiation device 5, the heat radiation effect of a computer is further enhanced, the computer, the right-hand member of mount 403 has seted up draw-in groove 405, the equal fixedly connected with card strip 406 in upper and lower both ends of fan 404, mount 403 can pass through draw-in groove 405 and card strip 406 block with the fan 404 support and be connected, casing 501 passes through block structure 510 and quick-witted case 1 fixed connection, wherein heat-conducting plate 401, fin 402, casing 501 are the metal material that heat conductivility is good, second heat radiation fin 7, can go out the absorbed heat energy of quick-witted case 1 through the electromagnetic wave release, keep quick-witted case 1 inner chamber and the air temperature on every side.

And those not described in detail in this specification are well within the skill of those in the art.

When the heat-radiating type heat-radiating shell is used, the heating element 3 emits heat energy, the heat energy is transmitted into the heat-conducting plate 401, the heat energy in the heat-conducting plate 401 is transmitted into the fins 402, cold air blown by the fan 404 takes away the heat energy on the surfaces of the fins 402 to form hot air, then the hot air enters the cylindrical holes 503 in the shell 501 through the vent holes, the hot air rotates through the cylindrical holes 503 after being disturbed by the heat-absorbing copper sheets 504, the heat transfer is increased through the rotating hot air, and the heat energy is radiated out through electromagnetic waves by the first heat-radiating fins 502 after being.

When the heat radiation device 5 is separately installed, the clamping fin 513 is aligned to the vent hole 6 of the chassis 1, then the housing 501 is forcibly pressed until the clamping structure 510 penetrates through the vent hole 6, the housing 501 is pulled in the opposite direction, whether the housing will fall or not is checked, and the heat radiation device can be used after installation.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides an electron device heat radiation structure and radiator, includes quick-witted case (1), its characterized in that: a main board (2) is fixedly connected inside the case (1), a heating element (3) is fixedly connected to the surface of the main board (2), a wind cooling device (4) is fixedly connected to the surface of the heating element (3), and a heat radiation device (5) is arranged on the left side of the case (1);

the air cooling device (4) comprises a heat conduction plate (401) bonded with the heating element (3), fins (402) penetrate through the heat conduction plate (401) from left to right in the heat conduction plate (401), a right-side fixedly connected with fixing frame (403) of the fins (402), a fan (404) is arranged at the right end of the fixing frame (403), the heat radiation device (5) comprises a shell (501), a first heat radiation cooling fin (502) is fixedly connected to the outer surface of the shell (501), a cylinder hole (503) is formed in the shell (501), and a heat absorption copper sheet (504) is fixedly connected to the inner wall of the cylinder hole (503).

2. The heat radiation structure and the heat sink for electronic devices as claimed in claim 1, wherein: the left end of the case (1) is provided with a vent hole (6).

3. The heat radiation structure and the heat sink for electronic devices as claimed in claim 2, wherein: and a second heat radiation cooling fin (7) is fixedly connected to one side of the surface of the case (1) close to the ventilation hole (6).

4. The heat radiation structure and the heat sink for electronic devices as claimed in claim 1, wherein: the all fixedly connected with block structure (510) in four angles of casing (501) right-hand member, block structure (510) include with casing (501) fixed connection's dead lever (511), the right-hand member of dead lever (511) runs through ventilation hole (6) and extends to the inside of quick-witted case (1), the right-hand member of dead lever (511) just is located the inside fixedly connected with triangle block (512) of quick-witted case (1), the upper and lower both sides on triangle block (512) right side all rotate and are connected with card wing (513), the upper and lower two sides of triangle block (512) all are seted up fluted (514), the inside of recess (514) just is located fixedly connected with spring (515) between triangle block (512) and the card wing (513).

5. The heat radiation structure and the heat sink for electronic devices as claimed in claim 1, wherein: the right end of the fixing frame (403) is provided with a clamping groove (405), the upper end and the lower end of the fan (404) are fixedly connected with clamping strips (406), and the fixing frame (403) and the fan (404) support can be connected through the clamping groove (405) and the clamping strips (406) in a clamping mode.

6. The heat radiation structure and the heat sink for electronic devices as claimed in claim 4, wherein: the shell (501) is fixedly connected with the case (1) through a clamping structure (510).