CN212610902U - Engineering plastic piece plated with metal film layer - Google Patents
Engineering plastic piece plated with metal film layer Download PDFInfo
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- CN212610902U CN212610902U CN202022326524.3U CN202022326524U CN212610902U CN 212610902 U CN212610902 U CN 212610902U CN 202022326524 U CN202022326524 U CN 202022326524U CN 212610902 U CN212610902 U CN 212610902U
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Abstract
An engineering plastic part plated with a metal film layer relates to the technical field of electrical elements and solves the technical problem that the metal film layer on the existing engineering plastic part is easy to peel off. The engineering plastic part comprises an engineering plastic substrate part, wherein a metal composite film layer is plated on the engineering plastic substrate part; the metal composite film layer is formed by alternately laminating at least one alloy film layer and at least one copper film layer from bottom to top, the first layer from bottom to top is the alloy film layer, and the first layer from top to bottom is the copper film layer; the density of the alloy film layer is smaller than that of the copper film layer and larger than that of the engineering plastic substrate, and the thermal expansion coefficient of the alloy film layer is smaller than that of the copper film layer and larger than that of the engineering plastic substrate. The utility model provides an engineering working of plastics is particularly suitable for making lightweight electrical component.
Description
Technical Field
The utility model relates to an electrical component technique especially relates to a technique of the engineering working of plastics who plates metal film layer.
Background
Engineering plastics such as PPS (polyphenylene sulfide), PA (polyamide), PBT (polybutylene terephthalate), LCP (liquid crystal polymer), PEEK (polyether ether ketone) and the like have the advantages of less electromagnetic shielding and good plasticity, and a metal film layer with a certain thickness and shape is plated on the engineering plastic part, so that the light-weight wireless signal booster can be manufactured.
At present, the method for plating the metal film on the engineering plastic mainly comprises water electroplating, vacuum evaporation plating, sputtering and the like, the metal film plated on the engineering plastic is usually a copper film, and the copper film plated on the engineering plastic is easy to peel off after reaching a certain thickness due to the relatively large density difference and thermal expansion coefficient difference between copper and the engineering plastic and the low affinity between the copper and the engineering plastic, so that the thickness of the copper film plated on the engineering plastic is limited to a certain extent.
SUMMERY OF THE UTILITY MODEL
To the defect that exists among the above-mentioned prior art, the utility model aims to solve the technical problem that an engineering working of plastics that plates with metal film layer that metal film layer is difficult for peeling off is provided.
In order to solve the technical problem, the utility model provides a plated engineering plastics spare of metal film layer, including engineering plastics primary member, its characterized in that: the engineering plastic substrate component is plated with a metal composite film layer;
the metal composite film layer is formed by alternately laminating at least one alloy film layer and at least one copper film layer from bottom to top, the first layer from bottom to top is the alloy film layer, and the first layer from top to bottom is the copper film layer;
the density of the alloy film layer is smaller than that of the copper film layer and larger than that of the engineering plastic substrate, and the thermal expansion coefficient of the alloy film layer is smaller than that of the copper film layer and larger than that of the engineering plastic substrate.
Furthermore, the single-layer thickness of the alloy film layer and the copper film layer is less than or equal to 2 microns.
Furthermore, in the metal composite film layer, a thickened copper film layer is plated on the upper surface of the copper film layer on the upper first layer, and the density of the thickened copper film layer is smaller than that of the copper film layer in the metal composite film layer.
Further, the thickness of the thickened film layer is less than or equal to 3 microns.
The utility model provides an engineering plastic piece plated with a metal film layer, which is characterized in that an alloy film layer with better affinity with engineering plastic is plated on an engineering plastic base component, then a copper film layer is plated on the alloy film layer, because the difference between the alloy film layer and the engineering plastic in density and thermal expansion coefficient is relatively small, the adhesive force of the alloy film layer plated on the engineering plastic is high, the alloy film layer is not easy to peel off from the engineering plastic, the difference between the density and the thermal expansion coefficient of the copper film layer and the alloy film layer is relatively small, common electrons between the copper film layer and the alloy film layer exist, consequently the adhesive force of copper rete on the alloy rete is also higher, also is difficult for peeling off from the alloy rete, and the mode of plating the copper rete on engineering plastics is directly plated to current relatively, the utility model discloses a metal film layer has that adhesive force is good, the characteristics of difficult peeling off, and the rete also can be plated relatively thickly.
Drawings
Fig. 1 is a schematic view of a film structure of an engineering plastic member plated with a metal film according to an embodiment of the present invention.
Detailed Description
The following description is provided for further details of the embodiments of the present invention with reference to the accompanying drawings, but this embodiment is not intended to limit the present invention, and all similar structures and similar variations thereof adopted by the present invention should be included in the protection scope of the present invention.
As shown in fig. 1, an embodiment of the present invention provides an engineering plastic part plated with a metal film layer, including an engineering plastic base part 1, which is characterized in that: the engineering plastic base component 1 is plated with a metal composite film layer;
the metal composite film layer is formed by alternately laminating at least one alloy film layer 2 and at least one copper film layer 3 from bottom to top (the side close to the plated surface is the lower side), the first layer from bottom to top is the alloy film layer 2, and the first layer from top to bottom is the copper film layer 3;
the density of the alloy film layer 2 is smaller than that of the copper film layer 3 and larger than that of the engineering plastic substrate 1, and the thermal expansion coefficient of the alloy film layer 2 is smaller than that of the copper film layer 3 and larger than that of the engineering plastic substrate 1.
In the embodiment of the utility model, the alloy film layer 2 and the copper film layer 3 in the metal composite film layer are both manufactured by adopting a vacuum plating method, and the single-layer thickness of the alloy film layer and the copper film layer is less than or equal to 2 microns; the vacuum plating method can adopt one or more of evaporation plating, sputtering plating and ion plating.
In the embodiment of the utility model, in the metal composite film layer, copper thickening rete 4 has been plated to the copper rete 3 upper surface of the first layer of having gone up, and the density of thickening rete 4 is less than the density of the copper rete 3 in the metal composite film layer, the thickening rete adopts the chemical plating method preparation, the thickness of thickening rete is less than or equal to 3 microns, the film density of vacuum plating method preparation is higher, therefore there is the restriction to film thickness, the rete is too thick to peel off easily, and the coating film time of vacuum plating method will be longer than the coating film time of chemical plating method, therefore the unsuitable thicker thickening rete of plating of vacuum plating method, and the film density of chemical plating method preparation is lower, the rete of vacuum plating method preparation will be superior to in the aspect of limiting film thickness, be fit for plating thicker rete; in other embodiments of the utility model, the thickened film layer is not needed to be plated according to actual needs.
The embodiment of the utility model provides an in, the alloy rete adopts the iron chromium nickel alloy to make, and engineering plastic's density is 1.4 ~ 1.6 (unit g/cm) for the density of iron chromium nickel alloy is 7.4 ~ 7.9 (unit g/cm) for the density of iron chromium nickel alloy, and vacuum copper plating's density is 8.9 (unit g/cm) for the thin blooms, and electroless copper plating's density is 8.7 ~ 8.8 (unit g/cm) for the thin blooms), and engineering plastic's coefficient of thermal expansion in the 20 ℃ environment is 8 ~ 12 (unit 1E-6/K), and iron chromium nickel alloy is 14.5 ~ 16 (unit 1E-6/K) for the coefficient of thermal expansion in the 20 ℃ environment, and copper is 17.5 (unit 1E-6/K) in the 20 ℃ environment, in other embodiments of the utility model, the alloy rete also can adopt the chromium nickel alloy preparation.
In an embodiment of the present invention, the manufacturing material of the engineering plastic base member includes any one of PPS (polyphenylene sulfide), PA (polyamide), PBT (polybutylene terephthalate), LCP (liquid crystal polymer), and PEEK (polyether ether ketone), and an auxiliary additive with a mass percentage of less than 50% may be added to the selected material, and the auxiliary additive includes any one of glass fiber, carbon fiber, and metal powder.
The embodiment of the utility model provides a plated engineering working of plastics's of metal film layer coating method's that provides concrete step is as follows:
step 1, scanning the plated surface of an engineering plastic base piece by using laser with power larger than 5W to carbonize the plated surface of the engineering plastic base piece, covering the engineering plastic base piece by using a shielding jig, exposing the plated surface of the engineering plastic base piece, and putting the engineering plastic base piece covered by the shielding jig into a vacuum container;
2, bombarding the plated surface of the engineering plastic substrate by using argon plasma in a vacuum container, wherein the bombarding time is between 30 seconds and 60 seconds, and the preferred value of the bombarding time is 30 seconds;
the argon plasma bombardment can break the polymer surface of the plated surface of the engineering plastic substrate piece under vacuum by plasma energy, so that the polymer surface is activated to form free carbon chains, and the adhesive force of the alloy film layer can be increased;
step 4, plating a copper film layer on the upper surface of the alloy film layer in a vacuum container by adopting a vacuum plating mode;
step 5, if the metal composite film layer is plated, turning to step 7, otherwise, turning to step 6;
step 6, plating a layer of gold film on the upper surface of the copper film in a vacuum container by adopting a vacuum plating mode, and then transferring to the step 4;
step 7, taking out the engineering plastic substrate piece from the vacuum container, and removing the shielding jig;
and 8, plating a copper thickening film layer on the upper surface of the upper first copper film layer by adopting a chemical plating mode.
In the embodiment of the present invention, the vacuum plating mode adopted in step 3, step 4, and step 6 is one or more combinations of evaporation plating, sputtering plating, and ion plating.
In other embodiments of the present invention, step 8 can be omitted if the thickened film layer is not required to be plated.
Claims (4)
1. An engineering plastic member plated with a metal film layer comprises an engineering plastic base member, and is characterized in that: the engineering plastic substrate component is plated with a metal composite film layer;
the metal composite film layer is formed by alternately laminating at least one alloy film layer and at least one copper film layer from bottom to top, the first layer from bottom to top is the alloy film layer, and the first layer from top to bottom is the copper film layer;
the density of the alloy film layer is smaller than that of the copper film layer and larger than that of the engineering plastic substrate, and the thermal expansion coefficient of the alloy film layer is smaller than that of the copper film layer and larger than that of the engineering plastic substrate.
2. The engineering plastic part plated with the metal film layer as claimed in claim 1, wherein: the single-layer thickness of the alloy film layer and the copper film layer is less than or equal to 2 microns.
3. The engineering plastic part plated with the metal film layer as claimed in claim 1, wherein: in the metal composite film layer, the upper surface of the copper film layer on the first layer is plated with a thickened copper film layer, and the density of the thickened copper film layer is smaller than that of the copper film layer in the metal composite film layer.
4. The engineering plastic part plated with the metal film layer as claimed in claim 3, wherein: the thickness of the thickened film layer is less than or equal to 3 microns.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2020214956469 | 2020-07-27 | ||
| CN202021495646 | 2020-07-27 |
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| Publication Number | Publication Date |
|---|---|
| CN212610902U true CN212610902U (en) | 2021-02-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202022326524.3U Active CN212610902U (en) | 2020-07-27 | 2020-10-19 | Engineering plastic piece plated with metal film layer |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112095103A (en) * | 2020-07-27 | 2020-12-18 | 合肥镭士客微电路有限公司 | Engineering plastic part plated with metal film layer and film coating method thereof |
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2020
- 2020-10-19 CN CN202022326524.3U patent/CN212610902U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112095103A (en) * | 2020-07-27 | 2020-12-18 | 合肥镭士客微电路有限公司 | Engineering plastic part plated with metal film layer and film coating method thereof |
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