CN212588560U - A chip frame, packaged chip, driving system and lighting device - Google Patents

Abstract

The utility model discloses a chip frame, a packaged chip, a driving system and a lighting device, which belong to the field of chip design. Aiming at the problems in the prior art that the existing single-base island cannot encapsulate the rectifier and the chip at the same time, the double-base island has poor stability and the shape is too narrow, the utility model provides a chip frame, a packaged chip, a driving system and a lighting device, In this solution, the chip frame set on the double base islands and the integrated claws can ensure the stability of the chip. By setting different parts of the rectifier bridge on different base islands, the rectifier and the chip are integrated into the chip package at the same time. It ensures that the overall application circuit size is greatly reduced, and the setting of the double-base island can ensure that the performance of the rectifier bridge is not affected, and the connection method is simple. Control of load power.

Description

A chip frame, packaged chip, driving system and lighting device

This application claims the priority of Chinese patent application CN201911107801.7 with an application date of November 13, 2019.

This application claims the priority of Chinese patent application CN202010002650.5 with an application date of January 2, 2020.

This application cites the full text of the above Chinese patent application.

technical field

The utility model relates to the field of chip design, in particular to a chip frame, a packaged chip, a driving system and a lighting device.

Background technique

The current LED lighting uses a linear constant current drive circuit to provide a stable supply current for the LED device. Its working principle is: when the power supply voltage changes, the output voltage of the linear constant current drive circuit is correspondingly changed, and the conduction voltage drop on the LED device is maintained. change, so as to achieve the effect of current stability.

As shown in Figure 1, the alternating voltage AC is outputted by the rectifier to supply power to the LED unit and the chip. The LED unit and the chip are connected in series and then connected in parallel to the output ends of the rectifier. The circuit inside the chip is a linear constant current drive circuit. When the AC voltage fluctuates, the voltage across the chip increases, and the power consumption of the chip itself also increases, which generates a large amount of heat. Therefore, the chip is usually packaged with a heat sink, such as ESOP- 8. The chip has a metal base island, and the exposed metal part at the bottom can transfer the heat of the chip to the circuit board; the rectifier is usually a full-bridge rectifier composed of four diodes, with four pins. With the increasingly miniaturization of LED devices, it is usually necessary to assemble the rectifier, the chip and the LED unit on a compact circuit board, so it is necessary to try to reduce the size of the rectifier and the chip as much as possible. The traditional ESOP-8 framework has a base island and cannot integrate rectifiers and chips at different potentials together.

There are also frame structures using two base islands in the prior art, such as Chinese patent application, application number 201920418685.X, published on October 25, 2019, which discloses an ESOP8 dual-base island packaging frame, which can satisfy multiple chips Or the requirements of the joint action of chips of different polarities can improve the flexibility of use, reduce costs, and avoid the problems of complex structure of the integrated circuit board and poor overall product performance, including the base island, the pins, the pins and the base. The chips on the island are connected, and the pins are encapsulated by plastic encapsulation materials, and the pins include eight: the eight pins are divided into two groups and are distributed on the upper side and the lower side of the frame. It is characterized in that, the base island includes Two: the first base island and the second base island, the first base island and the second base island are arranged symmetrically with the transverse centerline of the frame as the axis, and the pins on the upper side and the pins on the lower side are The chips on adjacent base islands are connected. At that time, it only split one base island into two base islands. Since the original base island was fixed and guaranteed by the claws at both ends, when it is split into two, its stability will decrease and the manufacturing difficulty will increase. , the instability increases, and the shape of the base island is too narrow and long, and the restrictions on the shape of the chip placed on it are too strict.

SUMMARY OF THE INVENTION

1. Technical problems to be solved

Aiming at the problems in the prior art that the existing single-base island cannot encapsulate the rectifier and the chip at the same time, the double-base island has poor stability and the shape is too narrow and long, the utility model provides a chip frame, a packaged chip, a driving system and a lighting device, It can realize the integrated package of the rectifier and the chip in one chip, with good stability and good performance.

2. Technical solutions

The purpose of the present utility model is achieved through the following technical solutions.

A chip frame, comprising a first base island A and a second base island B arranged adjacently, each base island respectively including no less than four sides, and there is a space between the two base islands, and the two base islands are adjacent to each other. The two sides are adjacent sides, and the side facing away from each other is the side away from each other; the other sides of the base island are pin sides, and at least one claws are arranged on the opposite pin sides of each base island, and the claws are configured as follows: chip pins.

Furthermore, at least one tendon is provided on the side facing away from the side.

Further, the claws are arranged at an included angle with the side where they are located.

Further, the included angle is 90°.

Further, it also includes a plurality of separation pins, the separation pins are arranged on the periphery of the first base island A and the second base island B, and the separation pins are electrically connected to the devices on the first base island A and the second base island B.

Further, the number of said separation pins is four, which are respectively arranged at the four corners of the chip frame.

A packaged chip adopts any one of the above-mentioned chip frames.

Further, the packaged chip includes at least one chip and a rectifier. The first base island A is provided with some components of the rectifier, and the second base island B is provided with the chip and other components of the rectifier.

Further, the chip includes a chip ground and a drive terminal;

The cathodes of the diode DN3 and the diode DN4 share the potential with the first base island A, and the cathodes of the diode DN3 and the diode DN4 are connected as an output end of the rectifier, and as the rectifier anode of the packaged chip, connected to the rectifier anode pin V+;

The anodes of the diodes DP1 and DP2, the chip ground and the second base island B have a common potential, which is used as the common ground of the packaged chip. The anodes of the diodes DN1 and DN2 are connected, and as another output terminal of the rectifier, connected to the rectifier negative pin V -;

The terminal where the anode of the diode DN4 is connected to the cathode of the diode DP2 is used as an input terminal of the rectifier, and is connected to the input pin L;

The terminal where the anode of the diode DN3 is connected to the cathode of the diode DP1 is used as another input terminal of the rectifier, and is connected to the input pin N;

Connect to the power pin OUT of the packaged chip.

Further, the packaged chip further includes a setting terminal, the setting terminal is used to set the power or current of the chip driving terminal, and the setting terminal is connected to the setting pin CS.

Furthermore, the setting terminal directly or indirectly detects the signal, and the driving terminal generates a voltage or current in a monotonically varying relationship with the detection signal.

A drive system comprising any one of the above-mentioned packaged chips, comprising a load structure, the load structure comprising a load device, including or not including an energy storage device;

When the energy storage device is not included, the load device is connected in parallel between the positive rectifier pin V+ and the power pin OUT;

When an energy storage device is included, the energy storage device is connected in parallel between the rectifier positive pin V+ and the power pin OUT, and the load device is connected in parallel between both ends of the energy storage device or between the rectifier positive pin V+ and the rectifier negative pin V-. between.

A lighting device includes the above-mentioned chip frame, packaged chip or driving system.

3. Beneficial effects

Compared with the prior art, the advantages of the present utility model are:

In this scheme, the chip frame set with double base islands is used, and different parts of the rectifier bridge are set on different base islands, and the rectifier and the chip are integrated into the chip frame at the same time, which can ensure that the overall application circuit size is greatly reduced, and the double base island can be greatly reduced. The setting of the island can ensure that the performance of the rectifier bridge is not affected, and the connection method is simple. By connecting the load in different forms, the control of the load power is realized, the size of the rectifier is reduced, and the power factor is improved.

Description of drawings

Figure 1 is a schematic diagram of a linear constant current drive circuit;

FIG. 2 is a schematic diagram of the chip frame structure of the scheme;

FIG. 3 is a schematic diagram of a circuit structure of the packaged chip of the scheme;

FIG. 4 is a schematic diagram of the lead connection of the packaged chip of the scheme;

5 is a schematic diagram of a driving system using the chip frame;

6 is a schematic diagram of another driving system using the chip frame;

FIG. 7 is a schematic diagram of still another driving system using the chip frame.

Detailed ways

The present utility model will be described in detail below with reference to the accompanying drawings and specific embodiments.

Example

As shown in Figure 2, a chip frame is designed in this scheme, which includes two base islands. The base islands can be made of metal, and the commonly used metal is copper or iron. The two base islands are arranged in the frame at intervals, and the smaller the distance The smaller the chip size can be, of course, it is necessary to ensure that the two base islands are isolated, and the performance of the chip will not be affected by being too close. A pair of claws. In general, the claws are set on opposite sides, and these two sides are generally both sides of the frame where the pins are set. The claws and the base island are integrally formed, and the claws extend to the outside of the frame as the pins of the product. The action of the claws ensures that the corresponding base island can be firm, and each claws forms an included angle with the side of the corresponding base island, and the angle of the included angle is preferably 90°.

To illustrate with an actual embodiment, as shown in Figure 2, a chip frame with the structure of this scheme is illustrated, including two groups of pins on both sides of the frame: a first group of pins and a second group of pins, and also includes The first base island A and the second base island B, each base island includes four sides, one side of the two base islands is oppositely arranged, and the other three are respectively arranged with a tendon claw; the two adjacent sides of the two base islands are respectively is the adjacent side of each base island, and the side facing away from each other is the side away from each other; the other two sides of the base island are the pin sides. Specifically, as shown in the figure, the four sides are the first side, the second side, the The third side and the fourth side, the first side and the second side are the pin sides, the third side is the away side, the fourth side is the adjacent side, and the area enclosed by the four sides is the corresponding base island, which is used for placing Chip, the first side, the second side and the third side are integrally formed and connected with three claws, respectively the first claws C, the second claws D and the third claws E, to enhance the stability of the base island The fourth sides of the two base islands are set opposite each other, leaving a gap in the middle; the function of the third claws E is to additionally increase the stability of the base islands. Of course, the third claws E may not be set, and only one base A pair of oppositely arranged tendon claws can be arranged on the island. The first tendon claws C and the second tendon claws D are stretched to both sides respectively, so as to ensure the balance and stability of the base island. Of course, two or more pairs of claws can be set on each base island. Due to the requirements of functional pins, more claws can be set as pins, and corresponding pins can also be set by setting multiple sides. , all in line with our design scheme and ideas.

In the prior art, it is generally in the form of a single base island, which fixes the single base island by a pair of claws arranged at both ends, which is equivalent to the position of the third claws E in FIG. There is a force to the end respectively. After solid sealing, it plays the role of stabilizing the base island. However, since the base island is now a double base island, each base island will be pulled in its own direction by the corresponding third claws E. Stretching force and instability will increase, so this scheme sets up a pair of claws integrally formed with the base island, which can ensure that the frame structure of the double base island is still stable.

Specifically, during use, the first claws C of the two base islands are respectively configured as the second pin and the third pin in the first group of pins; the second claws D of the two base islands are respectively configured It is the 7th pin and the 6th pin in the second group of pins; the included angle formed by each claws and the corresponding edge is 90 degrees.

Preferably, corresponding separation pins may also be provided, and the number of separation pins is not limited. In this embodiment, the frame further includes a The 1st pin, the 8th pin located between the second claws D and the third claws E of the first base island A, the first claws C and the third claws E of the second base island B The 4th pin between the second frame B and the 5th pin between the second claws D and the third claws E of the second frame B. The 1st pin, 4th pin, 5th pin and 8th pin are not directly connected to the base island. The direct connection here refers to integral molding connection or other mechanical connection methods, which can be connected by wire bonding during packaging. way to make the electrical connection between the pins and the chip. Of course, if there is a need or a process requirement, the corresponding 1st pin, 4th pin, 5th pin and 8th pin can be selectively connected to the base island. The corresponding claws are integrally formed as pins, and the number of separated pins can also be increased as required.

Based on the above chip frame structure, a packaged chip can be designed, as shown in Figures 3 and 4,

Using the double-base island frame, it includes at least one chip CHIP and a rectifier. The rectifier includes four diodes connected in a full-bridge rectification manner, which are diode DP1, diode DP2, diode DN3, and diode DN4. The chip CHIP includes a chip ground and drive side.

The diode DP1, the diode DP2, and the chip are placed on the second base island B, and the anodes of the diode DP1 and the diode DP2, the chip ground and the second base island B have a common potential as the common ground of the packaged chip;

The diode DN3 and the diode DN4 are placed on the first base island A, and the cathodes of the diode DN3 and the diode DN4 share the potential with the first base island A, which are used as the rectifier positive pin V+ of the packaged chip;

The terminal where the anode of the diode DN4 is connected to the cathode of the diode DP2 is used as an input terminal of the rectifier, which is connected to the input pin L; the terminal where the anode of the diode DN3 is connected to the cathode of the diode DP1 is used as another input terminal of the rectifier, which is connected to the input lead. Pin N; the cathode connection of diode DN3 and diode DN4 is used as an output terminal of the rectifier, and is connected to the rectifier anode pin V+, and the anode connection of diode DP1 and diode DP2 is the other output terminal of the rectifier, which is connected to the rectifier cathode pin V- ; The rectifier negative pin V- is used as the common ground of the packaged chip, and the driving end of the chip CHIP is connected to the power pin OUT of the packaged chip, which serves as the power end OUT of the packaged chip.

The anodes of the diode DP2 and the diode DP1 are short-circuited to the second base island B through a conductive material, and the conductive material may be conductive glue. The cathode is respectively connected to the input pin L and the input pin N of the integrated drive circuit through wire bonding; the cathodes of the diode DN4 and the diode DN3 are short-circuited to the first base island A through conductive materials; the anode is respectively connected to the integrated drive circuit through wire bonding of input pin L and input pin N.

The chip also includes a setting terminal, the setting terminal is connected to the setting pin CS of the packaged chip, the setting terminal CS is used to set the power or current of the chip driving terminal, and the setting terminal can directly or indirectly detect other signals to obtain the corresponding performance, For example, through a resistor connected to the common ground V-, a voltage or current with a monotonically varying relationship with the resistance value is generated at the power terminal OUT, and for example, other signals are directly detected or indirectly detected through a resistor, and the power terminal OUT is generated at the power terminal OUT and all other signals are detected. A voltage or current that describes other signals in a monotonically varying relationship. Of course, according to actual needs, the number of setting terminals can also be increased.

The aforementioned monotonic change relationship includes positive monotonic change and inverse monotonic change. Positive monotonic change means that when the independent variable increases, the dependent variable increases, or when the independent variable decreases, the dependent variable decreases; When it increases, the dependent variable decreases, or when the independent variable decreases, the dependent variable increases. For example, configure the dependent variable as a primary function of the independent variable.

The same is true below.

A drive system, based on the above packaged chip, can build a drive system that drives a load, and the corresponding drive system can have two load structures:

A load structure does not include an energy storage device, but only includes a load device. The load device can be an LED unit, and the LED unit includes at least one LED or a plurality of LEDs combined in series and parallel. The control circuit, for example, includes one or more current-limiting control circuits.

As shown in Figure 5, the LED unit is connected in parallel between the rectifier positive pin V+ and the power pin OUT, the anode is connected to the rectifier positive pin V+, and the cathode is connected to the power pin OUT. The LED unit includes one LED or multiple series-parallel connection Combined LED; when the AC voltage of the alternating current is greater than the conduction threshold of the LED unit, the LED unit is turned on, the current on the LED unit is controlled by the power terminal OUT of the chip CHIP, and the current of the power terminal OUT can be rectified by connecting a resistor at the CS terminal Negative pin V- gets set. By connecting an energy storage device and capacitor in parallel at both ends of the rectifier positive pin V+ and the rectifier negative pin V-, when the AC voltage of the alternating current is lower than the voltage VCAP at both ends, the current of the LED unit can be maintained unchanged, and no flicker can be obtained. The effect of this scheme is simple circuit and low cost.

In this scheme, when the alternating current rises to be greater than the voltage across the capacitor CAP, a large pulse current will flow through the alternating current AC, and the power factor is low. When the load power is large, the corresponding rectifier includes four diodes that also need to be larger. In order to resist the large pulse current, this will increase the frame size used by the integrated driver chip. Accordingly, the present invention provides another load structure solution as follows.

Another load structure includes an energy storage device and a load device. The energy storage device in this solution is a capacitor CAP, or other types of energy storage devices, which are connected in parallel between the rectifier positive pin V+ and the power pin OUT;

There are two ways to connect the load device with the energy storage device. One is directly connected to the energy storage device, that is, the two ends of the capacitor CAP, as shown in Figure 6. The capacitor CAP is used to reduce the current ripple of the LED unit and suppress flicker. When the AC voltage of the alternating current is lower than the voltage VCAP at both ends, the current of the LED unit is maintained. When the AC voltage of the alternating current is greater than the voltage VCAP at both ends of the capacitor CAP, the alternating current AC supplies power to the LED unit through the rectifier bridge, and charges the capacitor CAP at the same time. The total current of supplying power to the LED unit and charging the capacitor CAP is controlled by the current of the power terminal OUT, and the current of the power terminal OUT can be set through the CS terminal.

Another connection method of the load device is: the load device is connected in parallel between the rectifier positive pin V+ and the rectifier negative pin V-, as shown in Figure 7, the capacitor CAP is used to reduce the current ripple of the LED unit and suppress flicker. When the AC voltage of the alternating current is lower than the voltage VCAP at both ends, the positive terminal of the capacitor CAP outputs the current, and returns to the negative terminal of the capacitor CAP through the LED unit, the common ground V-, and the power terminal OUT of the chip; when the AC voltage of the alternating current is greater than the two ends of the capacitor CAP When the voltage is VCAP, the alternating current AC supplies power to the LED unit through the rectifier bridge, and at the same time charges the capacitor CAP. The total current charging the capacitor CAP is controlled by the current of the power terminal OUT. The current of the power terminal OUT can be connected to the CS terminal by connecting a resistor to V - Get settings.

In Figure 6 and Figure 7, the CS terminal is connected to the rectifier negative pin V- through a resistor, a certain voltage or current is obtained at the CS terminal, and a voltage or current with a positive monotonic relationship is generated at the power terminal OUT to realize the load. power setting;

or,

The CS terminal detects the positive or negative voltage of the capacitor CAP through a resistor or a resistor network, senses the parameters related to the AC voltage of the alternating current, and adjusts the current of the power terminal OUT so that it has an inverse monotonic relationship with the AC voltage of the alternating current. The control of the voltage at both ends of the CAP realizes the control of the load power. When the AC voltage of the alternating current increases, the charging current of the OUT terminal to the capacitor CAP decreases. On the contrary, when the AC voltage of the alternating current increases, the power terminal OUT charges the capacitor CAP. The increase of the charging current not only improves the power factor, but also obtains a better circuit conversion efficiency, which is described in the existing publication "LED drive circuit with high power factor and flicker-free", patent application number 201610160462.9, which is described in I won't go into details here.

In this embodiment, the current of the capacitor CAP is controlled by the power terminal OUT of the chip, which reduces the pulse current flowing through the alternating current AC, which not only improves the power factor, but also reduces the pulse current of the rectifier, so that a diode with a smaller volume can be used. , reducing the frame size of the integrated driving chip of the present invention.

Specifically, the above-mentioned driving chip or driving system can be applied accordingly, for example, the LED lighting device is provided with a corresponding chip or driving circuit.

The invention and its embodiments have been described above schematically, and the description is not restrictive. The invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. What is shown in the accompanying drawings is only one of the embodiments of the present invention, and the actual structure is not limited thereto, and any reference signs in the claims shall not limit the related claims. Therefore, if those of ordinary skill in the art are inspired by it, and without departing from the purpose of the present invention, any structure and embodiment similar to this technical solution are designed without creativity, which shall belong to the protection scope of this patent. Furthermore, the word "comprising" does not exclude other elements or steps, and the word "a" preceding an element does not exclude the inclusion of "a plurality" of that element. Several elements recited in a product claim can also be implemented by one element by means of software or hardware. The terms first, second, etc. are used to denote names and do not denote any particular order.

Claims (14)

1. a chip frame, it is characterized in that: comprise the first base island A and the second base island B that are arranged adjacently, each base island comprises not less than four sides respectively, and there is interval in the middle of two base islands, two The two adjacent sides of each base island are adjacent sides, and the side facing away from each other is the away side; the other sides of the base island are the lead sides, and at least one claws are set on the opposite lead sides of each base island. The described claws are configured as the pins of the chip. 2 . The chip frame according to claim 1 , wherein at least one tendon is further provided on the side facing away from the chip. 3 . 3. A chip frame according to claim 1 or 2, wherein the claws are arranged at an included angle with the side where they are located. 4 . The chip frame according to claim 3 , wherein the included angle is 90°. 5 . 5. A chip frame according to claim 1 or 2, characterized in that: further comprising several separation pins, the separation pins are arranged on the periphery of the first base island A and the second base island B, and the separation pins are connected to the first base island A and the second base island B. Devices on a base island A and a second base island B are electrically connected. 6 . The chip frame according to claim 5 , wherein the number of said separation pins is four, which are respectively arranged at four corners of the chip frame. 7 . 7. A packaged chip, characterized in that: a chip frame according to any one of claims 1-6 is used. 8 . The packaged chip according to claim 7 , wherein the packaged chip comprises at least one chip and a rectifier, the first base island A is provided with some devices of the rectifier, and the second base island B is provided with a chip and a rectifier. 9 . the rest of the devices. 9. The packaged chip according to claim 8, wherein the rectifier comprises four diodes connected in a full-bridge rectification manner, which are diode DP1, diode DP2, diode DN3 and diode DN4, diode DN3 and diode respectively DN4 is placed on the first base island A, and diodes DP1 and DP2 are placed on the second base island B. 10. The packaged chip according to claim 8 or 9, wherein the chip comprises a chip ground and a drive terminal; The cathodes of the diode DN3 and the diode DN4 share the potential with the first base island A, and the cathodes of the diode DN3 and the diode DN4 are connected as an output end of the rectifier, and as the rectifier anode of the packaged chip, connected to the rectifier anode pin V+; The anodes of the diodes DP1 and DP2, the chip ground and the second base island B have a common potential, which is used as the common ground of the packaged chip. -; The terminal where the anode of the diode DN4 is connected to the cathode of the diode DP2 is used as an input terminal of the rectifier, and is connected to the input pin L; The terminal where the anode of the diode DN3 is connected to the cathode of the diode DP1 is used as another input terminal of the rectifier, and is connected to the input pin N; The driving end is connected to the power pin OUT of the packaged chip. 11 . The packaged chip according to claim 10 , wherein the packaged chip further comprises a setting terminal, the setting terminal is used to set the power or current of the chip driving terminal, and the setting terminal is connected to the setting pin CS. 12 . 12 . The packaged chip according to claim 11 , wherein the setting terminal directly or indirectly detects the signal, and the driving terminal generates a voltage or current in a monotonically varying relationship with the detection signal. 13 . 13. A drive system comprising the packaged chip according to any one of claims 7-12, characterized in that: comprising a load structure, the load structure comprising a load device, including or not including an energy storage device; When the energy storage device is not included, the load device is connected in parallel between the positive rectifier pin V+ and the power pin OUT; When an energy storage device is included, the energy storage device is connected in parallel between the rectifier positive pin V+ and the power pin OUT, and the load device is connected in parallel between both ends of the energy storage device or between the rectifier positive pin V+ and the rectifier negative pin V-. between. 14. A lighting device, characterized in that it comprises the chip frame, packaged chip or driving system according to any one of claims 1-13.

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