CN211455687U

CN211455687U - Chip frame, packaged chip, driving system and lighting device

Info

Publication number: CN211455687U
Application number: CN202020007577.6U
Authority: CN
Inventors: 邵蕴奇; 崔莹; 李闯; 袁振杰
Original assignee: Shanghai Looall Electronics Co ltd
Current assignee: Shanghai Looall Electronics Co ltd
Priority date: 2019-11-13
Filing date: 2020-01-02
Publication date: 2020-09-08
Anticipated expiration: 2030-01-02
Also published as: CN113597057A

Abstract

The utility model discloses a chip frame, encapsulation chip, actuating system and lighting device belongs to chip design field. Current single base island that exists among the prior art can't encapsulate rectifier and chip simultaneously, two base island poor stability and the too long and narrow problem of shape, the utility model provides a chip frame, the encapsulation chip, actuating system and lighting device, this scheme passes through the chip frame that two base islands set up, the stability of chip can be guaranteed to muscle claw through integrated into one piece, through the different parts that set up the rectifier bridge on the base island of difference, integrate rectifier and chip simultaneously to the chip encapsulation, can guarantee that holistic application circuit size reduces greatly, and the setting up of two base islands can guarantee that the performance of rectifier bridge is not influenced, the line mode is simple, through carrying out different connections to the load, drive to the load form under the different conditions, realize the control to load power.

Description

Chip frame, packaged chip, driving system and lighting device

The present application claims priority from chinese patent application CN201911107801.7 filed on 2019, 11/13/h.

The present application refers to the above-mentioned chinese patent application in its entirety.

Technical Field

The utility model relates to a chip design field, more specifically say, relate to a chip frame, encapsulation chip, actuating system and lighting device.

Background

The current LED illumination uses the linear constant current drive circuit to provide stable supply current for the LED device, and the working principle is as follows: when the power supply voltage changes, the voltage output by the linear constant current driving circuit is correspondingly changed, and the conduction voltage drop on the LED device is kept unchanged, so that the effect of current stabilization is achieved.

As shown in fig. 1, an alternating current voltage AC is outputted to rectify a voltage through a rectifier to supply power to an LED unit and a chip, the LED unit and the chip are connected in series and then connected in parallel to two output ends of the rectifier, a circuit inside the chip is a linear constant current driving circuit, when the alternating current voltage AC fluctuates and rises, the voltage at two ends of the chip rises, the power consumption of the chip rises and generates a large amount of heat, therefore, the chip generally adopts a packaging form with a heat sink, such as ESOP-8, and the chip has a metal base island, and a metal part exposed at the bottom of the chip can transfer the heat of the chip to a circuit board; the rectifier is typically a full bridge rectifier of four diodes with four pins. As LED devices become more and more miniaturized, it is generally necessary to assemble the rectifier, the chip and the LED unit on a compact circuit board, and it is necessary to try to reduce the volume of the rectifier and the chip as much as possible. The traditional ESOP-8 frame has a base island, and the rectifier and the chip at different potentials cannot be integrally packaged together.

The prior art also has a frame structure using two base islands, such as chinese patent application, application No. 201920418685.X, published 2019, 10, 25, discloses an ESOP8 dual-base-island packaging frame, which can meet the requirements of the combined action of multiple chips or chips with different polarities, can improve the flexibility of use, reduce the cost, and avoid the problems of complex structure and poor overall performance of the integrated circuit board, and the frame structure comprises base islands and pins, wherein the pins are connected with the chips on the base islands, and are packaged by a molding compound, and the pins comprise eight pins: eight pins divide into two sets and distribute in the upside of frame, downside, its characterized in that, the base island includes two: the first base island and the second base island are symmetrically arranged by taking the transverse center line of the frame as an axis, and the pins on the upper side and the pins on the lower side are respectively connected with the chips on the adjacent base islands. At that time, only one base island is split into two base islands, and because the original base island is fixed and ensured to be stable through the rib claws at two ends, when the base island is split into two base islands, the stability of the base island is reduced, the manufacturing difficulty is increased, the instability is increased, the shape of the base island is too long and narrow, and the limitation on the shape of a chip placed on the base island is too severe.

Disclosure of Invention

1. Technical problem to be solved

Current single base island that exists can't encapsulate rectifier and chip simultaneously to among the prior art, two base island poor stability and the too long and narrow problem of shape, the utility model provides a chip frame, encapsulation chip, actuating system and lighting device, it can realize making rectifier and chip integrated package in a chip, and stability is good, and the performance is good.

2. Technical scheme

The purpose of the utility model is realized through the following technical scheme.

A chip frame comprises a first base island A and a second base island B which are adjacently arranged, wherein each base island comprises at least four edges, a gap is formed between the two base islands, the two adjacent edges of the two base islands are adjacent edges, and the edges which are deviated from each other are deviated edges; the other sides of the base islands are pin sides, at least one rib claw is arranged on each pin side opposite to each base island, and the rib claws are configured to be pins of the chip.

Furthermore, the deviating edge is also provided with at least one rib claw.

Furthermore, the rib claws are arranged at an included angle with the edge where the rib claws are located.

Further, the included angle is 90 degrees.

Furthermore, the device also comprises a plurality of separation pins, wherein the separation pins are arranged at the periphery of the first base island A and the second base island B and are electrically connected with the devices on the first base island A and the second base island B.

Furthermore, the number of the separation pins is four, and the four separation pins are respectively arranged at four corners of the chip frame.

A packaged chip adopts any one of the chip frames.

Furthermore, the packaged chip comprises at least one chip and a rectifier, partial devices of the rectifier are arranged on the first base island A, and the other devices of the chip and the rectifier are arranged on the second base island B.

Furthermore, the chip comprises a chip ground and a driving end;

the cathodes of the diode DN3 and the diode DN4 are in common potential with the first base island A, and the cathodes of the diode DN3 and the diode DN4 are connected and used as an output end of the rectifier, and are used as the rectifying anode of the packaged chip and connected with a rectifying anode pin V +;

the anodes of the diode DP1 and the diode DP2, the chip ground and the second base island B are in common potential and are used as the common ground for packaging the chip, and the anodes of the diode DN1 and the diode DN2 are connected and are used as the other output end of the rectifier and are connected with a rectification negative electrode pin V-;

the end where the anode of the diode DN4 is connected with the cathode of the diode DP2 is used as one input end of the rectifier and is connected with the input pin L;

the end where the anode of the diode DN3 is connected with the cathode of the diode DP1 serves as the other input end of the rectifier and is connected with the input pin N;

the power pin OUT of the packaged chip is connected.

Furthermore, the packaged chip further includes a setting terminal, the setting terminal is used for setting power or current of the driving terminal of the chip, and the setting terminal is connected to the setting pin CS.

Furthermore, the setting end directly or indirectly detects the signal and generates voltage or current in a monotonous change relation with the detection signal at the driving end.

A driving system comprising any one of the above packaged chips, comprising a load structure, the load structure comprising a load device, with or without an energy storage device;

when the energy storage device is not included, the load device is connected between the rectifying anode pin V + and the power pin OUT in parallel;

when the energy storage device is included, the energy storage device is connected between the rectifying anode pin V + and the power pin OUT in parallel, and the load device is connected at two ends of the energy storage device in parallel or connected between the rectifying anode pin V + and the rectifying cathode pin V-in parallel.

A lighting device comprises the chip frame, the packaged chip or the driving system.

3. Advantageous effects

Compared with the prior art, the utility model has the advantages of:

this scheme is through the chip frame that two basements set up, through the different parts that set up the rectifier bridge on the basements of difference, integrate rectifier and chip on the chip frame simultaneously, can guarantee that holistic application circuit size reduces greatly, and the setting of two basements can guarantee that the performance of rectifier bridge is not influenced, the line mode is simple, through carrying out different forms's connection to the load, realizes the control to load power, has reduced the size of rectifier, and has improved power factor.

Drawings

FIG. 1 is a schematic diagram of a linear constant current driving circuit;

FIG. 2 is a schematic diagram of a chip frame structure according to the present embodiment;

fig. 3 is a schematic circuit diagram of a packaged chip according to the present embodiment;

FIG. 4 is a schematic diagram of a lead connection of a packaged chip according to the present embodiment;

FIG. 5 is a schematic diagram of a driving system using the present chip frame;

FIG. 6 is a schematic diagram of another driving system using the present chip frame;

FIG. 7 is a schematic diagram of another driving system using the present chip frame.

Detailed Description

The invention is described in detail below with reference to the drawings and specific examples.

Examples

As shown in fig. 2, the chip frame is designed according to the scheme, and comprises two base islands, wherein the base islands can be made of metal, the commonly used metal is copper or iron, the two base islands are arranged in the frame at intervals, the smaller the interval distance is, the smaller the chip size can be, the isolation between the two base islands is required to be ensured, the performance of the chip cannot be influenced due to the close range, and at least one rib claw is arranged on each pin edge of the two base islands to form a pair of rib claws. Under general conditions, the muscle claw sets up in relative both sides, and these both sides generally are the frame both sides that the pin set up, and muscle claw and base island are integrated into one piece, and the muscle claw extends to the frame outside as the pin of product, and the effect of muscle claw has guaranteed that corresponding base island can be firm, and every muscle claw and the limit of corresponding base island form the contained angle, and the preferred 90 that is of the angle of contained angle.

To illustrate a practical embodiment, as shown in fig. 2, a chip frame of this structure is shown, which includes two sets of leads on two sides of the frame: the first group of pins and the second group of pins further comprise a first base island A and a second base island B, each base island comprises four edges, one edge of each of the two base islands is arranged opposite to the other edge of each of the two base islands, and the other three base islands are respectively provided with a rib claw; two adjacent edges of the two base islands are respectively adjacent edges of each base island, and the edges deviating from each other are deviating edges; the other two side edges of the base island are pin edges, specifically as shown in the figure, the four edges are a first edge, a second edge, a third edge and a fourth edge in sequence, the first edge and the second edge are pin edges, the third edge is a deviating edge, the fourth edge is an adjacent edge, an area defined by the four edges is a corresponding base island and used for placing a chip, the first edge, the second edge and the third edge are respectively and integrally connected with three rib claws, namely a first rib claw C, a second rib claw D and a third rib claw E, so that the stability of the base island is enhanced, the fourth edges of the two base islands are oppositely arranged, and a gap is reserved between the fourth edges; the third rib claw E plays a role in additionally increasing the stability of the base island, certainly, the third rib claw E can be not arranged, only one base island is needed to be provided with a pair of oppositely arranged rib claws, the first rib claw C and the second rib claw D are respectively stretched towards two sides, and the balance stability of the base island can be guaranteed. Certainly, two pairs or more than two pairs of rib claws can be arranged on each base island, because of the requirement of functional pins, more rib claws can be arranged as pins, and corresponding pins can also be arranged by arranging a plurality of side edges, which all accord with the design scheme and thought of people.

In the prior art, the single-base island is generally in a single-base island form, a single-base island is fixed through a pair of rib claws arranged at two ends, the position of the rib claws at the two ends is equivalent to that of a third rib claw E in fig. 2, the rib claws at the two ends are stressed towards the ends respectively, and after the fixed sealing, the function of stabilizing the base island is achieved.

Specifically, in the using process, the first claws C of the two base islands are respectively configured as the 2 nd pin and the 3 rd pin in the first group of pins; the second claws D of the two base islands are respectively configured as the 7 th pin and the 6 th pin in the second group of pins; each rib claw and the corresponding edge form an included angle of 90 degrees.

In this embodiment, the frame further includes a 1 st pin located between the first claw C and the third claw E of the first base island a, an 8 th pin located between the second claw D and the third claw E of the first base island a, a 4 th pin located between the first claw C and the third claw E of the second base island B, and a 5 th pin located between the second claw D and the third claw E of the second frame B. No 1 st pin, no 4 th pin, no 5 th pin and no 8 th pin are directly connected with the base island, the direct connection refers to integral connection or other mechanical and other communication modes, and the pins and the chip can be electrically connected in a routing mode during packaging. Of course, the corresponding pin 1, pin 4, pin 5 and pin 8 can be selectively connected to the base island if necessary or required by the process. The corresponding rib claw of integrated into one piece is as the pin, and the quantity that separates the pin also can increase as required.

Based on the above chip frame structure, a packaged chip can be designed, as shown in fig. 3 and 4,

the double-base island frame is utilized and comprises at least one CHIP and a rectifier, wherein the rectifier comprises four diodes which are connected in a full-bridge rectification mode and respectively comprise a diode DP1, a diode DP2, a diode DN3 and a diode DN4, and the CHIP comprises a CHIP ground and a driving end.

The diode DP1 and the diode DP2 are placed on the second base island B, and anodes of the diode DP1 and the diode DP2, the chip ground and the second base island B are in common potential and are used as a common ground of the packaged chip;

the diode DN3 and the diode DN4 are arranged on the first base island A, and the cathodes of the diode DN3 and the diode DN4 are in common potential with the first base island A and serve as a rectification anode pin V + of the packaged chip;

the end where the anode of the diode DN4 is connected with the cathode of the diode DP2 is used as one input end of the rectifier and is connected with the input pin L; the end where the anode of the diode DN3 is connected with the cathode of the diode DP1 serves as the other input end of the rectifier and is connected with the input pin N; the cathodes of the diode DN3 and the diode DN4 are connected and used as one output end of the rectifier, and are connected with a rectification anode pin V +, and the anodes of the diode DP1 and the diode DP2 are connected and used as the other output end of the rectifier, and are connected with a rectification cathode pin V-; the rectifying negative electrode pin V-is used as a common ground of the packaged CHIP, and the driving end of the CHIP is connected with a power pin OUT of the packaged CHIP, which is used as the power end OUT of the packaged CHIP.

The anodes of the diodes DP2 and DP1 are short-circuited to the second base island B by a conductive material, which may be a conductive adhesive. The cathode is respectively connected with an input pin L and an input pin N of the integrated drive circuit through routing; the cathodes of the diode DN4 and the diode DN3 are in short-circuit connection with the first base island A through a conductive material; the anode is respectively connected with an input pin L and an input pin N of the integrated drive circuit through routing.

The chip also comprises a setting end which is connected to a setting pin CS of the packaged chip, the setting end CS is used for setting power or current of the driving end of the chip, the setting end can directly or indirectly detect other signals to obtain corresponding performance, for example, the setting end is connected with a common ground V through a resistor, voltage or current which is in a monotone change relation with the resistance value is generated at a power end OUT, for example, other signals are directly detected or other signals are indirectly detected through the resistor, and voltage or current which is in a monotone change relation with the other signals is generated at the power end OUT. Of course, the number of the setting ends can be increased according to actual needs.

The monotonic variation relationship includes positive monotonic variation and negative monotonic variation, wherein positive monotonic variation means that the dependent variable increases when the independent variable increases, or the dependent variable decreases when the independent variable decreases; an inverse monotonic change means that the dependent variable decreases as the independent variable increases or increases as the independent variable decreases. For example, the dependent variable is configured as a linear function of the independent variable.

The same is true below.

A driving system for driving a load can be constructed based on the packaged chip, and the corresponding driving system can have two load structures:

a load structure does not comprise an energy storage device, only comprises a load device, the load device can be an LED unit, the LED unit comprises at least one LED or a plurality of LEDs combined in series and parallel, and optimally also comprises a control circuit for controlling the current of the LEDs, for example, the control circuit comprises one or more current limiting circuits.

As shown in fig. 5, the LED unit is connected in parallel between the rectifying anode pin V + and the power pin OUT, the anode is connected to the rectifying anode pin V +, the cathode is connected to the power pin OUT, and the LED unit includes one LED or a plurality of series-parallel combined LEDs; when the alternating current AC voltage is greater than the conduction threshold of the LED unit, the LED unit is turned on, the current of the LED unit is controlled by the power terminal OUT of the CHIP, and the current of the power terminal OUT can be set by connecting a resistor to the rectifying negative terminal pin V-at the CS terminal. Through connecting an energy storage device in parallel at rectification positive pole pin V + and rectification negative pole pin V-both ends, electric capacity can be when alternating current AC voltage is less than its both ends voltage VCAP, keeps the electric current of LED unit unchangeable, obtains not stroboscopic effect, and this kind of scheme circuit is simple, and is with low costs.

When the alternating current rises to be larger than the voltage across the capacitor CAP, a larger pulse current flows on the alternating current AC, the power factor is low, and when the load power is larger, the corresponding rectifier comprises four diodes which also need a larger volume to resist the large pulse current, which increases the frame size used by the integrated driving chip.

The other load structure comprises an energy storage device and a load device, wherein the energy storage device is a capacitor CAP or other types of energy storage devices and is connected in parallel between a rectification anode pin V + and a power pin OUT;

the load device with the energy storage device has two connection modes, one mode is directly connected in parallel to the energy storage device, namely two ends of a capacitor CAP, as shown in fig. 6, the capacitor CAP is used for reducing current ripples of an LED unit and inhibiting stroboflash, when the AC voltage is lower than the voltage VCAP at the two ends of the capacitor CAP, the current of the LED unit is maintained to be continuous, when the AC voltage is greater than the voltage VCAP at the two ends of the capacitor CAP, the AC supplies power to the LED unit through a rectifier bridge and simultaneously charges the capacitor CAP, the total current for supplying power to the LED unit and charging the capacitor CAP is controlled by the current of a power end OUT, and the current of the power end OUT can.

Another connection mode of the load device is as follows: the load device is connected in parallel between the rectifying anode pin V + and the rectifying cathode pin V-, as shown in FIG. 7, the capacitor CAP is used for reducing the current ripple of the LED unit and inhibiting the stroboscopic, when the AC voltage is lower than the voltage VCAP at the two ends, the positive end of the capacitor CAP outputs current, and the current returns to the negative end of the capacitor CAP through the LED unit, the common ground V-, and the power end OUT of the chip; when the alternating current AC voltage is greater than the voltage VCAP at two ends of the capacitor CAP, the alternating current AC supplies power to the LED unit through the rectifier bridge, the capacitor CAP is charged, the total current for charging the capacitor CAP is controlled by the current of the power end OUT, and the current of the power end OUT can be set by connecting a resistor to V-at the CS end.

In fig. 6 and 7, the CS terminal is connected to the rectified negative terminal V-through a resistor, a determined voltage or current is obtained at the CS terminal, and a voltage or current in a positive single modulation relationship with the CS terminal is generated at the power terminal OUT, so as to implement setting of the load power;

alternatively, the first and second electrodes may be,

the CS terminal detects the voltage of the positive electrode or the negative electrode of the capacitor CAP through a resistor or a resistor network, senses a parameter associated with the AC voltage, and adjusts the current of the power terminal OUT to make it in an inverse monotonic change relationship with the AC voltage, so as to obtain control over the voltage of the two ends of the capacitor CAP, thereby realizing control over the load power.

In this embodiment, the current of the capacitor CAP is controlled by the power terminal OUT of the chip, which reduces the pulse current flowing through the alternating current AC, not only improves the power factor, but also reduces the pulse current of the rectifier, so that a diode with a smaller volume can be used, and the frame size of the integrated driving chip of the present invention is reduced.

Specifically, the driving chip or the driving system can be applied correspondingly, for example, the LED lighting device is provided with a corresponding chip or driving circuit.

The invention and its embodiments have been described above schematically, without limitation, and the invention can be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The representation in the drawings is only one of the embodiments of the invention, the actual construction is not limited thereto, and any reference signs in the claims shall not limit the claims concerned. Therefore, if a person skilled in the art receives the teachings of the present invention, without inventive design, a similar structure and an embodiment to the above technical solution should be covered by the protection scope of the present patent. Furthermore, the word "comprising" does not exclude other elements or steps, and the word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. Several of the elements recited in the product claims may also be implemented by one element in software or hardware. The terms first, second, etc. are used to denote names, but not any particular order.

Claims

1. A chip frame, comprising: the device comprises a first base island A and a second base island B which are adjacently arranged, wherein each base island comprises at least four edges, an interval is arranged between the two base islands, the two adjacent edges of the two base islands are adjacent edges, and the edge which deviates from the adjacent edges is a deviating edge; the other sides of the base islands are pin sides, at least one rib claw is arranged on each pin side opposite to each base island, and the rib claws are configured to be pins of the chip.

2. A chip frame according to claim 1, wherein: the deviating edge is also provided with at least one rib claw.

3. A chip frame according to claim 1 or 2, characterized in that: the rib claw and the edge where the rib claw is located form an included angle.

4. A chip frame according to claim 3, wherein: the included angle is 90 degrees.

5. A chip frame according to claim 1 or 2, characterized in that: the device also comprises a plurality of separation pins, wherein the separation pins are arranged on the peripheries of the first base island A and the second base island B and are electrically connected with devices on the first base island A and the second base island B.

6. The die frame of claim 5, wherein: the four separating pins are respectively arranged at four corners of the chip frame.

7. A packaged chip, comprising: use of a chip frame according to any one of claims 1 to 6.

8. The packaged chip of claim 7, wherein: the packaged chip comprises at least one chip and a rectifier, wherein a part of devices of the rectifier are arranged on the first base island A, and the other part of devices of the chip and the rectifier are arranged on the second base island B.

9. The packaged chip of claim 8, wherein: the rectifier comprises four diodes which are connected in a full-bridge rectification mode, namely a diode DP1, a diode DP2, a diode DN3 and a diode DN4, wherein the diode DN3 and the diode DN4 are placed on a first base island A, and the diode DP1 and the diode DP2 are placed on a second base island B.

10. The packaged chip of claim 8 or 9, wherein: the chip comprises a chip ground and a driving end;

the anodes of the diode DP1 and the diode DP2, the chip ground and the second base island B are in common potential and are used as the common ground for packaging the chip, and the anodes of the diode DP1 and the diode DP2 are connected and are used as the other output end of the rectifier and are connected with a rectification negative electrode pin V-;

the driving end is connected with a power pin OUT of the packaged chip.

11. The packaged chip of claim 10, wherein: the packaged chip further comprises a setting end, the setting end is used for setting power or current of the driving end of the chip, and the setting end is connected with the setting pin CS.

12. The packaged chip of claim 11, wherein: the setting end directly or indirectly detects the signal and generates voltage or current which is in monotone change relation with the detection signal at the driving end.

13. A driving system comprising the packaged chip of any one of claims 7 to 12, wherein: comprises a load structure, wherein the load structure comprises a load device which comprises or does not comprise an energy storage device;

14. An illumination device, characterized by: comprising a chip frame, a packaged chip or a drive system according to any of claims 1-13.