CN212588515U - Microphone shell, packaging structure for microphone and microphone - Google Patents
Microphone shell, packaging structure for microphone and microphone Download PDFInfo
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- CN212588515U CN212588515U CN202021717877.XU CN202021717877U CN212588515U CN 212588515 U CN212588515 U CN 212588515U CN 202021717877 U CN202021717877 U CN 202021717877U CN 212588515 U CN212588515 U CN 212588515U
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Abstract
The utility model discloses a microphone shell, be used for packaging structure and microphone of microphone. The microphone shell comprises a shell main body and a sound cavity, wherein the shell main body is used for forming the sound cavity; the connecting part is connected with the shell main body and used for connecting the microphone shell; and a sound hole provided on the case main body, wherein at least a part of the connecting portion is located in the sound cavity. According to the utility model discloses microphone shell, be used for packaging structure and the microphone of microphone, when reinforcing microphone shell combining ability, guaranteed that the sound chamber has great volume.
Description
Technical Field
The utility model relates to a microphone encapsulation technical field, in particular to microphone shell, be used for packaging structure and microphone of microphone.
Background
Conventional MEMS (Micro-Electro-Mechanical System) microphones on the market have four major components: a PCB (Printed Circuit Board), an ASIC (Application Specific Integrated Circuit) chip, a MEMS chip, and a housing.
The casing of the microphone not only plays a role in protecting the chip and shielding radio frequency signals, but also affects the acoustic performance of the product due to the cavity structure formed by the casing and other elements. In the prior art, the microphone case is usually Mounted on the PCB by Surface Mount Technology (SMT). In order to ensure the bonding between the microphone housing and the PCB, the microphone housing is often added with an outer skirt design, which results in a greatly reduced volume of the acoustic cavity, and affects the SNR (SIGNAL to NOISE RATIO) and frequency response of the MEMS microphone.
Therefore, a new microphone housing, a packaging structure for a microphone, and a microphone, which can overcome the above problems, are desired.
SUMMERY OF THE UTILITY MODEL
In view of the above problems, an object of the present invention is to provide a novel microphone case, a packaging structure for a microphone, and a microphone, so as to take into account the bondability of the microphone case and the performance of the microphone.
According to an aspect of the present invention, there is provided a microphone case, comprising a case main body for forming an acoustic cavity; the connecting part is connected with the shell main body and used for connecting the microphone shell; and a sound hole provided on the case main body, wherein at least a part of the connecting portion is located in the sound cavity.
Preferably, the housing body is a semi-closed structure.
Preferably, the housing main body is integrally formed with the connecting portion.
Preferably, the inner wall of the housing body is used to form the acoustic cavity; the connecting part is connected with the inner wall.
Preferably, the connecting portion is located at a bottom of the housing main body, and at least a portion of the connecting portion is used to form the acoustic cavity.
Preferably, the sound hole includes at least one selected from a sound inlet hole and a sound outlet hole for introduction and/or discharge of sound.
According to another aspect of the present invention, there is provided a packaging structure for a microphone, including the microphone housing as described above.
Preferably, the package structure further includes: a printed circuit board for forming the acoustic chamber, wherein at least a portion of the housing body is connected to the printed circuit board; at least a portion of the connecting portion is connected with the printed circuit board.
Preferably, the package structure further includes: a printed circuit board for forming the acoustic cavity; a MEMS chip disposed on the printed circuit board; the microphone shell is connected with the printed circuit board and forms the sound cavity together with the printed circuit board; the MEMS chip is positioned in the acoustic cavity; the ASIC chip is located in the acoustic cavity.
According to a further aspect of the present invention, there is provided a microphone comprising a microphone housing as described above.
According to the utility model discloses microphone shell, be used for the packaging structure and the microphone of microphone, the setting of connecting portion has strengthened the associativity between microphone shell and all the other parts.
According to the utility model discloses microphone shell, be used for packaging structure and the microphone of microphone, connecting portion set up in the sound intracavity portion, when reinforcing microphone shell combining ability, guaranteed that the sound chamber has great volume.
According to the utility model discloses microphone shell, be used for packaging structure and the microphone of microphone, the sound chamber has great volume, has improved the acoustic performance of microphone, has improved the SNR index of microphone.
According to the utility model discloses microphone shell, be used for packaging structure and the microphone of microphone, the sound chamber has great volume, has improved the acoustics performance of microphone, has widened the high frequency cut-off frequency of microphone.
Drawings
The above and other objects, features and advantages of the present invention will become more apparent from the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:
fig. 1 shows a cross-sectional view of a microphone housing according to a first embodiment of the invention;
fig. 2 shows a schematic structural diagram of a microphone housing according to a second embodiment of the present invention;
fig. 3 shows a schematic structural diagram of a microphone housing according to a third embodiment of the present invention;
fig. 4 shows a schematic structural diagram of a packaging structure for a microphone according to an embodiment of the present invention;
fig. 5 shows a schematic structural diagram of a microphone according to an embodiment of the present invention.
Detailed Description
Various embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Like elements in the various figures are denoted by the same or similar reference numerals. For purposes of clarity, the various features in the drawings are not necessarily drawn to scale. Moreover, certain well-known elements may not be shown in the figures.
The following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings and examples. Numerous specific details of the invention, such as structure, materials, dimensions, processing techniques and techniques of components, are set forth in the following description in order to provide a more thorough understanding of the invention. However, as will be understood by those skilled in the art, the present invention may be practiced without these specific details.
It will be understood that when a layer, region or layer is referred to as being "on" or "over" another layer, region or layer in describing the structure of the component, it can be directly on the other layer, region or layer or intervening layers or regions may also be present. Also, if the component is turned over, one layer or region may be "under" or "beneath" another layer or region.
Fig. 1 shows a cross-sectional view of a microphone housing according to a first embodiment of the invention. As shown in fig. 1, a microphone case 10 according to a first embodiment of the present invention includes a case main body 101, a connecting portion 102, and a sound hole 103.
Specifically, the housing main body 101 is used to form an acoustic chamber. The casing main body 101 is, for example, a semi-closed structure. The material of the casing main body 101 is, for example, metal, plastic, or the like.
The connection portion 102 is connected to the case main body 101 for connection of the microphone case 10. Wherein at least a portion of the connecting portion 102 is located in the acoustic cavity. The connecting portion 102 may also be referred to as an (inner) skirt.
The sound hole 103 is provided on the casing main body 101. The sound openings 103 are, for example, sound inlets and/or sound outlets for the introduction and/or removal of sound. The sound hole 103 is, for example, a through hole penetrating the casing main body 101. Optionally, the plurality of sound holes 103 are distributed in an array on the housing body 101. The sound holes 103 can be arranged according to actual requirements.
In the above embodiment, at least a part of the connecting portion 102 is disposed in the acoustic cavity 60, so as to ensure the bondability between the microphone housing and other components, increase the volume of the acoustic cavity, improve the signal-to-noise ratio (SNR) index of the microphone, and widen the high-frequency cut-off frequency of the microphone, compared with the existing outer skirt design.
Fig. 2 shows a schematic structural diagram of a microphone housing according to a second embodiment of the present invention. Fig. 2a shows a schematic top view of a microphone housing according to a second embodiment of the invention. Fig. 2b shows a front cross-sectional view of a microphone housing according to a second embodiment of the invention. As shown in fig. 2, a microphone case 10 according to a second embodiment of the present invention includes a case main body 101, a connecting portion 102, and a sound hole 103.
Specifically, the housing main body 101 is used to form an acoustic chamber. As shown in fig. 2b, the microphone housing 10 and other components together form an acoustic cavity 60 (the area enclosed by the microphone housing 10 and the dashed line in fig. 2b is the acoustic cavity 60). The casing main body 101 is a cylinder having a hollow interior and an open lower end. The shape of the casing main body 101 is not limited to this, and may be set to different shapes according to actual needs.
In an alternative embodiment of the present invention, the inner wall of the housing body 101 is used to form the acoustic chamber 60. The connection portion 102 is connected to an inner wall of the case main body 101.
The connection portion 102 is connected to the case main body 101 for connection of the microphone case 10. The microphone case 10 is connected to other components during the manufacturing process of the microphone. A connection 102 is located in the acoustic chamber 60 for connection of the microphone housing 10 to other components. As shown in fig. 2, the broken line on the microphone case 10 divides the case main body portion and the connection portion. Alternatively, the case main body 101 and the connection portion 102 of the microphone case 10 are connected to other components. The connection portion 102 is a ring connected to an inner side wall of the casing main body 101. The connecting portion 102 is flush with the lower end of the case main body 101. Alternatively, the shape of the connection portion 102 is not limited thereto, and may be provided in different shapes according to actual requirements. Alternatively, the connection portion 102 is a separate member and is connected to the microphone case 10 by bonding or the like. Alternatively, the housing main body 101 and the connecting portion 102 are of an integral structure (integrally molded).
The sound hole 103 is provided on the casing main body 101. The sound hole 103 is provided, for example, at the center of the top of the casing main body 101.
According to another aspect of the present invention, a packaging structure for a microphone is provided. The packaging structure according to the embodiment of the present invention includes the microphone case as described above.
Fig. 3 shows a schematic structural diagram of a microphone housing according to a third embodiment of the present invention. As shown in fig. 3, a microphone case 10 according to a third embodiment of the present invention includes a case main body 101 and a connecting portion 102.
Specifically, as shown in fig. 3, a broken line on the microphone case 10 divides the case main body portion and the connection portion. The connection part 102 is located at the bottom of the housing main body 101 for connection of the microphone housing. At least a portion of the connecting portion 102 is used to form the acoustic chamber 60. Optionally, the connecting portion 102 includes opposing first (upper) and second (lower) surfaces. The first surface of the connection portion 102 is connected to the case main body 101, and the first surface is connected to other components to realize connection of the microphone case 10. The casing main body 101 is not directly connected with other components. Alternatively, the housing main body 101 and the connecting portion 102 are of an integral structure (integrally molded).
The shape of the connection part 102, the connection manner of the connection part 102 and the case main body 101, and the like according to the embodiment of the present invention are not limited to the above.
Fig. 4 shows a schematic structural diagram of a packaging structure for a microphone according to an embodiment of the present invention. As shown in fig. 4, the package structure for a microphone according to an embodiment of the present invention includes a microphone case 10, a printed circuit board 20, a MEMS chip 30, an ASIC chip 40, and a connection line 50.
In particular, a Printed Circuit Board (PCB) 20 is used to form the acoustic cavity 60. The printed circuit board 20 is also provided with circuits, electronic components, etc. for implementing the microphone function.
The microphone housing 10 is connected to the printed circuit board 20 and forms an acoustic chamber 60 together with the printed circuit board 20. The microphone housing 10 is designed for an inner skirt, i.e. the connection portion 102 is arranged inside the cavity of the microphone housing 10. When the microphone housing 10 is connected to the printed circuit board 20, the connection portion 102 is located inside the acoustic chamber 60.
The MEMS chip 30 is disposed on the printed circuit board 20. After the microphone housing 10 is connected to the printed circuit board 20, the MEMS chip 30 is located in the acoustic cavity 60 formed by the two.
The ASIC chip 40 is disposed on the printed circuit board 20. After the microphone housing 10 is connected to the printed circuit board 20, the ASIC chip 40 is located in the acoustic cavity 60 formed by the two.
The connecting wires 50 are used for electrical connection between devices such as circuits and/or electronic components. The connection line 50 connects the MEMS chip 30 and the ASIC chip 40, for example. The connection line 50 connects the printed circuit board 20 and the ASIC chip 40, for example. The connection line 50 is, for example, a gold wire or a silver wire.
In the above embodiment, at least a part of the connecting portion 102 is disposed in the acoustic cavity 60, and compared with the existing outer skirt design, the volume of the acoustic cavity is increased while the bondability between the microphone housing and the printed circuit board is ensured, so that the signal-to-noise ratio (SNR) index of the microphone is improved, and the high-frequency cut-off frequency of the microphone is widened.
According to another aspect of the present invention, a microphone is provided. The microphone according to the embodiment of the present invention includes the microphone case or the package structure as described above.
Fig. 5 shows a schematic structural diagram of a microphone according to an embodiment of the present invention. As shown in fig. 5, the microphone according to the embodiment of the present invention is, for example, a microphone that is relatively common in the market, and includes the microphone housing 10 and other components as described above.
In an alternative embodiment of the present invention, a microphone according to an embodiment of the present invention includes the package structure and other components as described above.
According to the utility model discloses microphone shell and packaging structure, can be applied to various types of microphone widely.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
In accordance with the embodiments of the present invention as set forth above, these embodiments are not exhaustive and do not limit the invention to the precise embodiments described. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical application, to thereby enable others skilled in the art to best utilize the invention and its various embodiments with various modifications as are suited to the particular use contemplated. The present invention is limited only by the claims and their full scope and equivalents.
Claims (10)
1. A microphone housing, comprising:
a housing body for forming an acoustic cavity;
the connecting part is connected with the shell main body and used for connecting the microphone shell; and
a sound hole provided on the case main body,
wherein at least a portion of the connecting portion is located within the acoustic cavity.
2. The microphone housing of claim 1, wherein the housing body is a semi-enclosed structure.
3. The microphone housing of claim 1, wherein the housing body is integrally formed with the connecting portion.
4. The microphone housing of claim 1, wherein an inner wall of the housing body is to form the acoustic cavity;
the connecting part is connected with the inner wall.
5. The microphone housing of claim 1, wherein the connecting portion is located at a bottom of the housing body, at least a portion of the connecting portion being for forming the acoustic cavity.
6. The microphone housing according to claim 1, wherein the sound hole comprises at least one selected from a sound inlet hole and a sound outlet hole for introduction and/or discharge of sound.
7. A package structure for a microphone, comprising:
a microphone housing as claimed in any one of claims 1-6.
8. The package structure of claim 7, further comprising:
a printed circuit board for forming the acoustic cavity,
wherein at least a portion of the housing body is connected with the printed circuit board;
at least a portion of the connecting portion is connected with the printed circuit board.
9. The package structure of claim 7, further comprising:
a printed circuit board for forming the acoustic cavity;
a MEMS chip disposed on the printed circuit board; and
an ASIC chip disposed on the printed circuit board,
the microphone shell is connected with the printed circuit board and forms the sound cavity together with the printed circuit board;
the MEMS chip is positioned in the acoustic cavity;
the ASIC chip is located in the acoustic cavity.
10. A microphone, comprising:
a microphone housing as claimed in any one of claims 1-7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021717877.XU CN212588515U (en) | 2020-08-17 | 2020-08-17 | Microphone shell, packaging structure for microphone and microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021717877.XU CN212588515U (en) | 2020-08-17 | 2020-08-17 | Microphone shell, packaging structure for microphone and microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212588515U true CN212588515U (en) | 2021-02-23 |
Family
ID=74652030
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021717877.XU Active CN212588515U (en) | 2020-08-17 | 2020-08-17 | Microphone shell, packaging structure for microphone and microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212588515U (en) |
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2020
- 2020-08-17 CN CN202021717877.XU patent/CN212588515U/en active Active
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