CN212587463U

CN212587463U - Telescopic silicon chip conversion subassembly

Info

Publication number: CN212587463U
Application number: CN202021997640.1U
Authority: CN
Inventors: 欧阳小泉
Original assignee: Wuxi Quanyi Technology Co ltd
Current assignee: Wuxi Quanyi Technology Co ltd
Priority date: 2020-09-13
Filing date: 2020-09-13
Publication date: 2021-02-23
Anticipated expiration: 2030-09-13

Abstract

The utility model discloses a telescopic silicon chip conversion subassembly is applicable to the automatic adjustment to the silicon chip interval in semiconductor device's the actual production, and it includes base, drive arrangement, guide bar and a plurality of adjusting substrate, and the guide bar is arranged along the length direction of base, and a plurality of adjusting substrate can be followed the guide bar and worn to locate movably on the guide bar, be provided with between two adjacent adjusting substrate and be used for spacing coupling assembling to both intervals, and drive arrangement's drive end is connected on being located the adjusting substrate in the outside, all is provided with the silicon chip draw-in groove on every adjusting substrate's the medial surface. The telescopic silicon chip conversion assembly is compact in structure and ingenious in design; and can realize the adjustment of silicon chip interval automatically, work efficiency is high, uses manpower sparingly, and whole conversion process is safe and reliable.

Description

Telescopic silicon chip conversion subassembly

Technical Field

The utility model belongs to the technical field of the semiconductor manufacturing, especially, relate to a telescopic silicon chip conversion components.

Background

In the actual production of semiconductor devices, according to different process flows, the conversion of the distance between two adjacent silicon wafers in a silicon wafer box is sometimes required, that is, the original silicon wafer distance is changed. At present, the commonly used operation mode mostly adopts manual work to take the silicon wafer out of the original silicon wafer box and place the silicon wafer in another silicon wafer box with different slot pitches. Obviously, the method has the defects of low working efficiency, high strength, high labor cost and easy occurrence of silicon wafer damage.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to above-mentioned problem, provide a telescopic silicon chip conversion subassembly to adopt the manual work to adjust the silicon chip interval among the solution prior art and have work efficiency low, intensity is big, the human cost is high and easily take place the impaired problem of silicon chip.

The utility model aims at realizing through the following technical scheme:

the utility model provides a telescopic silicon chip conversion subassembly, its includes base, drive arrangement, guide bar and a plurality of adjusting base plate, wherein, the guide bar is arranged along the length direction of base, a plurality of adjusting base plate can wear to locate along the guide bar activity on the guide bar, be provided with between two adjacent adjusting base plate and be used for spacing coupling assembling to both intervals, drive arrangement's drive end is connected on being located the adjusting base plate in the outside, all is provided with the silicon chip draw-in groove on every adjusting base plate's the medial surface.

As a preferred scheme of the utility model, spacing coupling assembling includes the linkage piece, on the linkage piece was fixed in every adjusting substrate's lateral surface, just linkage piece one side inwards extends to have a spacing piece, and the spacing groove has been seted up in one side of every adjusting substrate to the cooperation stopper, and all adjusting substrate's spacing groove orientation is unanimous, the spacing inslot on the stopper of linkage piece inserted adjacent adjusting substrate.

As a preferred scheme of the utility model, the base includes the bottom plate, vertical interval is fixed with two mounting panels, two on the bottom plate the parallel interval of guide bar is installed on two mounting panels, and two guiding holes have been seted up to the cooperation guide bar on every adjusting substrate.

As a preferred scheme of the utility model, the lightening hole has been seted up at the middle part of adjusting the base plate, two guiding holes set up respectively in the both ends of lightening hole.

As an optimized scheme of the utility model, it is right trapezoid structure to adjust the base plate cross-section, and its lateral surface is planar structure, and the medial surface is the inclined plane structure.

As an optimized scheme of the utility model, the middle part of linkage piece is provided with the bellying, one side of bellying inwards extends to have the stopper.

As a preferred scheme of the utility model, the mounting hole has all been seted up at the both ends of linkage piece, corresponding to set up threaded hole on the lateral surface of adjusting the base plate, fixing bolt passes through the mounting hole and fixes linkage piece locking in threaded hole.

As an optimal scheme of the utility model, be located and be fixed with the connecting plate on the regulation base plate in the outside, drive arrangement's actuating lever passes a mounting panel wherein and fixed connection in on the connecting plate.

The utility model has the advantages that the telescopic silicon wafer conversion component not only has compact structure, but also has ingenious design; and can realize the adjustment of silicon chip interval automatically, work efficiency is high, uses manpower sparingly, and whole conversion process is safe and reliable.

Drawings

Fig. 1 is a schematic structural diagram of a telescopic silicon wafer conversion assembly according to an embodiment of the present invention;

fig. 2 is an assembly schematic diagram of all the adjusting substrates of the telescopic silicon wafer conversion assembly provided in the embodiment of the present invention;

fig. 3 is another schematic assembly diagram of all the adjusting substrates of the retractable silicon wafer conversion assembly according to the embodiment of the present invention;

fig. 4 is a schematic perspective view of a linkage plate of the retractable silicon wafer conversion assembly according to an embodiment of the present invention;

fig. 5 is a cross-sectional view of a single adjusting substrate of the retractable silicon wafer conversion module according to an embodiment of the present invention.

Detailed Description

The technical solution of the present invention is further explained by the following embodiments with reference to the accompanying drawings.

In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. The preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete. It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1 to 5, in the present embodiment, a telescopic silicon wafer converting assembly includes a base 1, a driving device 2, two guide rods 3 and a plurality of adjusting substrates 4, the base 1 includes a bottom plate 10, two mounting plates 11 are fixed on the bottom plate 10 at vertical intervals, the two guide rods 3 are mounted on the two mounting plates 10 at parallel intervals along the length direction of the bottom plate 10, two guide holes 40 are formed on each adjusting substrate 4 in cooperation with the guide rods 3, the plurality of adjusting substrates 4 can movably penetrate the two guide rods 3 along the guide rods 3 through the guide holes 40, the cross sections of all the adjusting substrates 4 are right trapezoid structures with the same shape and size, the outer side surfaces are planar structures, the inner side surfaces are inclined surface structures, the middle portion of each adjusting substrate 4 is provided with a rectangular lightening hole 41, the two guide holes 40 are respectively disposed at two ends of the lightening hole 41, and a connecting plate 5 is fixed on one adjusting base plate 4 positioned at the outermost side, a driving rod of the driving device 2 penetrates through one mounting plate 11 and is fixedly connected to the connecting plate 5, and the driving device 2 adopts an air cylinder.

All be fixed with linkage piece 6 on every adjusting substrate 4's the lateral surface, linkage piece 6's middle part is provided with bellying 60, one side of bellying 60 inwards extends has the stopper 61 that has certain thickness, mounting hole 62 has all been seted up at linkage piece 6's both ends, set up threaded hole on the lateral surface corresponding to adjusting substrate 4, fixing bolt passes through mounting hole 62 with linkage piece 6 locking fixation in threaded hole, spacing groove 42 has been seted up in one side of every adjusting substrate 4 to cooperation stopper 61, all adjusting substrate 4's spacing groove 42 orientation is unanimous, linkage piece 6's stopper 61 inserts in the spacing groove 42 on the adjacent adjusting substrate 4, all be provided with the silicon chip draw-in groove on every adjusting substrate 4's the medial surface.

The telescopic silicon chip conversion assembly is in two states, wherein one state is the minimum distance between two adjacent adjusting substrates 4, and the other state is the maximum distance between two adjacent adjusting substrates 4. The during operation adopts two parallel interval arrangement's above-mentioned telescopic silicon chip conversion subassemblies, hold up a set of silicon chip through the silicon chip draw-in groove, then drive arrangement 2 drives an adjustment base plate 4 action in the outside, when the adjustment base plate 4 in the outside is moved to another kind of state by a state, adjustment base plate 4 in the outside can drive adjacent adjustment base plate 4's action, analogize in proper order and realize all adjustment base plate 4's linkage, finally realize two adjacent adjustment base plate 4's interval conversion, linkage piece 6 can realize the spacing of two kinds of states at the action in-process.

The above embodiments have been merely illustrative of the basic principles and features of the present invention, and the present invention is not limited by the above embodiments, and does not depart from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims.

Claims

1. The utility model provides a telescopic silicon chip conversion subassembly which characterized in that: it includes base, drive arrangement, guide bar and a plurality of regulation base plate, the guide bar is arranged along the length direction of base, a plurality of regulation base plates can wear to locate along the guide bar activity on the guide bar, be provided with between two adjacent regulation base plates and be used for spacing coupling assembling to both intervals, drive arrangement's drive end is connected on being located the regulation base plate in the outside, all is provided with the silicon chip draw-in groove on the medial surface of every regulation base plate.

2. The telescoping silicon wafer conversion assembly of claim 1, wherein: spacing coupling assembling includes the linkage piece, the linkage piece is fixed in on every adjusting substrate's the lateral surface, just linkage piece one side inwards extends to have a spacing piece, and the spacing groove has been seted up in one side of every adjusting substrate to the cooperation stopper, and all adjusting substrate's spacing groove orientation is unanimous, the spacing inslot on the adjacent adjusting substrate is inserted to the stopper of linkage piece.

3. The telescoping silicon wafer conversion assembly of claim 1, wherein: the base comprises a bottom plate, two mounting plates are fixed on the bottom plate at vertical intervals, two guide rods are arranged on the two mounting plates at parallel intervals, and two guide holes are formed in each adjusting base plate in a matched mode.

4. The telescoping silicon wafer conversion assembly of claim 3, wherein: the middle part of the adjusting base plate is provided with lightening holes, and the two guide holes are respectively arranged at two ends of the lightening holes.

5. The telescoping silicon wafer conversion assembly of claim 1, wherein: the cross section of the adjusting substrate is of a right-angle trapezoidal structure, the outer side face of the adjusting substrate is of a plane structure, and the inner side face of the adjusting substrate is of an inclined plane structure.

6. The telescoping silicon wafer conversion assembly of claim 2, wherein: the middle part of linkage piece is provided with the bellying, one side of bellying inwards extends to have a stopper.

7. The telescoping silicon wafer conversion assembly of claim 2, wherein: mounting holes are formed in the two ends of the linkage piece, threaded holes are formed in the outer side face corresponding to the adjusting base plate, and the linkage piece is locked and fixed in the threaded holes through the mounting holes by the fixing bolts.

8. The telescoping silicon wafer conversion assembly of claim 3, wherein: and a connecting plate is fixed on one adjusting base plate positioned at the outermost side, and a driving rod of the driving device penetrates through one mounting plate and is fixedly connected to the connecting plate.