CN212569044U - Testing device for multi-chip assembly - Google Patents
Testing device for multi-chip assembly Download PDFInfo
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- CN212569044U CN212569044U CN202021260128.9U CN202021260128U CN212569044U CN 212569044 U CN212569044 U CN 212569044U CN 202021260128 U CN202021260128 U CN 202021260128U CN 212569044 U CN212569044 U CN 212569044U
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Abstract
The utility model provides a testing arrangement of multi-chip component belongs to mechanical technical field. The chip testing device solves the technical problems that an existing chip testing device is poor in adaptability and cannot be accurately adjusted. This testing arrangement of multi-chip module, including the test box, test box one side has the opening, its characterized in that, the box on be provided with the chamber door through the hinge, the chamber door can with the opening seal, the box internal fixation has a plurality of placing mechanism that are used for placing multi-chip module, still is fixed with the test structure who is used for testing multi-chip module on the box, placing mechanism include mounting panel, left side regulation structure, right side regulation structure, level measurement structure and a plurality of cards that are used for the card to establish multi-chip module establish the seat. The utility model has the advantage of good use effect.
Description
Technical Field
The utility model belongs to the technical field of machinery, a testing arrangement is related to, especially a multi-chip module's testing arrangement.
Background
A multi-chip module is a module in which a plurality of integrated circuit chips are electrically connected to a common circuit board and are used to interconnect the chips. It is a typical advanced hybrid integrated component. These components are typically assembled on a multilayer interconnected substrate by wire bonding, tape bonding or flip chip without encapsulation, and then plastic molded and mounted on a printed circuit board in the same manner as the QFP or BGA package components are mounted.
After retrieval, as disclosed in chinese patent literature, a chip testing apparatus [ application No.: 201920567540.6, respectively; publication No.: CN209821251U ]. The chip testing device is characterized by comprising a motherboard, an adapter plate and an expansion plate from bottom to top in sequence; the motherboard has at least one test bit; the test position is detachably and fixedly connected with the adapter plate through a pin header and a female header, the test position is at least provided with a power supply interface and a fixing hole, the power supply interface is used for accessing a power supply of an aging test device, and the female header is used for being fixed with an external high-temperature box through the fixing hole; the adapter plate and the expansion plate are detachably and fixedly connected in a pin and nut arrangement mode; the expansion board is provided with an aging test socket, the aging test socket is used for being fixedly connected with a chip to be tested through a pin interface, and the pin interface is in one-to-one correspondence with pins of the chip to be tested.
Although the chip testing device disclosed in this patent is low in testing cost, the chip testing device is not well adapted and cannot be precisely adjusted, and therefore, it is necessary to design a testing device for a multi-chip module.
SUMMERY OF THE UTILITY MODEL
The utility model aims at having the above-mentioned problem to current technique, provided a multi-chip module's testing arrangement, it is relatively poor to have solved current chip testing arrangement adaptability, can not carry out the problem of accurate adjustment.
The purpose of the utility model can be realized by the following technical proposal: the utility model provides a multi-chip module's testing arrangement, includes the test box, test box one side has the opening, its characterized in that, the box on be provided with the chamber door through the hinge, the chamber door can with the opening seal, the box internal fixation has a plurality of placing mechanism that are used for placing multi-chip module, still is fixed with the test structure who is used for testing multi-chip module on the box, placing mechanism include mounting panel, left side regulation structure, right side regulation structure, level measurement structure and a plurality of cards that are used for the card to establish multi-chip module establish the seat, left side regulation structure and right side regulation structure set up respectively on the test box, the one end of mounting panel is adjusted structurally on a left side through a plurality of springs one, the other end of mounting panel sets up on the right side regulation structure through a plurality of springs two, the seat is established to the card and is fixed on.
Structure more than adopting, be provided with the chamber door through the hinge, the chamber door can with the opening seal, can prevent that the dust from getting into the test box, be provided with left regulation structure and right regulation structure simultaneously, can carry out the accuracy to the mounting panel and adjust, have better adaptability, the levelness of mounting panel can be measured to the level measurement structure, conveniently adjusts the levelness of mounting panel, has excellent in use effect's advantage.
The left adjusting structure comprises a left screw rod, a left adjusting piece and a left base, the left screw rod is fixedly connected to the testing box body, a threaded hole is formed in the left adjusting piece, the left adjusting piece is connected with the left screw rod in a matched mode, the left base is rotatably arranged on the left adjusting piece, and the left base is connected with the first spring.
Structure more than adopting, rotatory left regulating part, under the cooperation of left screw rod, the height of adjustable left side base to adjust the left height of mounting panel.
The right adjusting structure comprises a right screw rod, a right adjusting piece and a right base, the right screw rod is fixedly connected to the test box body, the right adjusting piece is provided with a threaded hole and is connected with the right screw rod in a matched mode, the right base is rotatably arranged on the right adjusting piece, and the right base is connected with the spring two phase.
By adopting the structure, the right adjusting piece is rotated, and the height of the right base can be adjusted under the matching of the right screw rod, so that the height of the right side of the mounting plate is adjusted.
The horizontal measurement structure include scale, connecting wire and balancing weight, the scale is installed on the mounting panel through two connecting rods, the one end of connecting wire is fixed on the mounting panel, the other end of connecting wire is connected with the balancing weight.
Structure more than adopting through setting up the balancing weight for the mounting panel is more firm, sets up the scale simultaneously, when carrying out the levelness adjustment to the mounting panel, conveniently calibrates, has convenient to use's advantage.
The testing box body is provided with a fan which is communicated with the testing box body, and the testing box body is also provided with a plurality of air outlets.
By adopting the structure, the fan is arranged, the air outlet is formed, the test box is conveniently cooled, and the effect of testing caused by the fact that the multi-chip assembly is too high in temperature is prevented.
The door is also fixed with a handle which is convenient for opening the door.
By adopting the structure, the door of the box can be opened and closed conveniently by arranging the handle.
Compared with the prior art, the utility model has the advantages of it is following:
1. be provided with the chamber door through the hinge, the chamber door can with the opening seal, can prevent that the dust from getting into the test box, be provided with simultaneously that left side adjusts the structure and right side adjusts the structure, can carry out the accuracy to the mounting panel and adjust, have better adaptability, the level measurement structure can be measured the levelness of mounting panel, conveniently adjusts the levelness of mounting panel, has excellent in use effect's advantage.
2. Through setting up the balancing weight for the mounting panel is more firm, sets up the scale simultaneously, when carrying out the levelness adjustment to the mounting panel, conveniently calibrates, has convenient to use's advantage.
Drawings
Fig. 1 is a schematic plan view of the present invention.
Fig. 2 is a schematic sectional structure of the present invention.
In the figure, 1, a test box body; 1a, an air outlet; 2. a hinge; 3. a box door; 4. testing the structure; 5. mounting a plate; 6. a clamping seat; 7. a first spring; 8. a second spring; 9. a left screw; 10. a left adjustment member; 11. a left base; 13. a right screw; 14. a right adjustment member; 15. a right base; 17. a graduated scale; 18. a connecting wire; 19. a balancing weight; 20. a connecting rod; 21. a fan; 22. a handle.
Detailed Description
The following are specific embodiments of the present invention and the accompanying drawings are used to further describe the technical solution of the present invention, but the present invention is not limited to these embodiments.
As shown in fig. 1-2, the testing apparatus for multi-chip module comprises a testing box 1, an opening is provided on one side of the testing box 1, in this embodiment, a box door 3 is provided on the testing box through a hinge 2, the box door 3 can seal the opening, a plurality of placing mechanisms for placing the multi-chip module are fixed in the box, in this embodiment, the number of the placing mechanisms is three, a testing structure 4 for testing the multi-chip module is further fixed on the box, the placing mechanisms include a mounting plate 5, a left adjusting structure, a right adjusting structure, a horizontal measuring structure and a plurality of clamping seats 6 for clamping the multi-chip module, in this embodiment, the number of the clamping seats 6 is two, the left adjusting structure and the right adjusting structure are respectively provided on the testing box 1, one end of the mounting plate 5 is provided on the left adjusting structure through a plurality of springs 7, in this embodiment, the quantity of spring 7 is two, and the other end of mounting panel 5 sets up on the structure is adjusted on the right through a plurality of springs two 8, and in this embodiment, the quantity of spring two 8 is two, and the card is established seat 6 and is fixed on mounting panel 5, and the level measurement structure sets up on mounting panel 5.
Structure more than adopting, be provided with chamber door 3 through hinge 2, chamber door 3 can seal the opening, can prevent that the dust from getting into test box 1, is provided with left regulation structure and right regulation structure simultaneously, can carry out the accuracy adjustment to mounting panel 5, has better adaptability, and the levelness measurement structure can be measured mounting panel 5's levelness, conveniently adjusts mounting panel 5's levelness, has excellent in use effect's advantage.
The left adjusting structure comprises a left screw rod 9, a left adjusting piece 10 and a left base 11, the left screw rod 9 is fixedly connected to the test box body 1, the left adjusting piece 10 is provided with a threaded hole, the left adjusting piece 10 is connected with the left screw rod 9 in a matched mode, the left base 11 is rotatably arranged on the left adjusting piece 10, and the left base 11 is connected with a spring I7.
With the above structure, the left adjusting piece 10 is rotated, and the height of the left base can be adjusted by matching with the left screw 9, so that the height of the left side of the mounting plate 5 can be adjusted.
The right adjusting structure comprises a right screw 13, a right adjusting piece 14 and a right base 15, the right screw 13 is fixedly connected to the test box body 1, the right adjusting piece 14 is provided with a threaded hole, the right adjusting piece 14 is matched and connected with the right screw 13, the right base 15 is rotatably arranged on the right adjusting piece 14, and the right base 15 is connected with the second spring 8.
With the above structure, the right adjusting member 14 is rotated, and the height of the right base can be adjusted by the cooperation of the right screw 13, so that the height of the right side of the mounting plate 5 can be adjusted.
The level survey structure includes scale 17, connecting wire 18 and balancing weight 19, and scale 17 installs on mounting panel 5 through two connecting rods 20, and the one end of connecting wire 18 is fixed on mounting panel 5, and the other end of connecting wire 18 is connected with balancing weight 19.
Structure more than adopting through setting up balancing weight 19 for mounting panel 5 is more firm, sets up scale 17 simultaneously, when carrying out the levelness adjustment to mounting panel 5, conveniently calibrates, has convenient to use's advantage.
The testing box body 1 is provided with a fan 21, the fan 21 is communicated with the testing box body 1, the testing box body 1 is further provided with a plurality of air outlets 1a, and in the embodiment, the number of the air outlets 1a is six.
Structure more than adopting, through setting up fan 21, seting up air outlet 1a, conveniently cool down in to test box 1, prevent that the too high effect of test of multichip module temperature from influencing.
A handle 22 for facilitating the opening of the door is also fixed on the door 3.
With the above structure, the door 3 can be opened and closed conveniently by providing the handle 22.
The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications or additions may be made to the described embodiments or alternatives may be employed by those skilled in the art without departing from the spirit or scope of the invention as defined in the appended claims.
Claims (6)
1. The utility model provides a multi-chip module's testing arrangement, includes the test box, test box one side has the opening, its characterized in that, the box on be provided with the chamber door through the hinge, the chamber door can with the opening seal, the box internal fixation has a plurality of placing mechanism that are used for placing multi-chip module, still is fixed with the test structure who is used for testing multi-chip module on the box, placing mechanism include mounting panel, left side regulation structure, right side regulation structure, level measurement structure and a plurality of cards that are used for the card to establish multi-chip module establish the seat, left side regulation structure and right side regulation structure set up respectively on the test box, the one end of mounting panel is adjusted structurally on a left side through a plurality of springs one, the other end of mounting panel sets up on the right side regulation structure through a plurality of springs two, the seat is established to the card and is fixed on.
2. The device for testing the multi-chip assembly of claim 1, wherein the left adjusting structure comprises a left screw, a left adjusting member and a left base, the left screw is fixedly connected to the testing box, the left adjusting member is provided with a threaded hole, the left adjusting member is connected to the left screw in a matching manner, the left base is rotatably disposed on the left adjusting member, and the left base is connected to the first spring.
3. The device for testing the multi-chip module according to claim 1, wherein the right adjusting structure comprises a right screw, a right adjusting member and a right base, the right screw is fixedly connected to the testing box, the right adjusting member is provided with a threaded hole, the right adjusting member is connected with the right screw in a matching manner, the right base is rotatably arranged on the right adjusting member, and the right base is connected with the spring.
4. The apparatus of claim 1, wherein the leveling mechanism comprises a scale, a connecting wire and a weight block, the scale is mounted on the mounting plate via two connecting rods, one end of the connecting wire is fixed to the mounting plate, and the other end of the connecting wire is connected to the weight block.
5. The multi-chip module testing device of claim 1, wherein the testing box is provided with a fan, the fan is communicated with the testing box, and the testing box is further provided with a plurality of air outlets.
6. The apparatus of claim 1, wherein a handle is further secured to the door to facilitate opening of the door.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021260128.9U CN212569044U (en) | 2020-07-01 | 2020-07-01 | Testing device for multi-chip assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021260128.9U CN212569044U (en) | 2020-07-01 | 2020-07-01 | Testing device for multi-chip assembly |
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| Publication Number | Publication Date |
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| CN212569044U true CN212569044U (en) | 2021-02-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202021260128.9U Active CN212569044U (en) | 2020-07-01 | 2020-07-01 | Testing device for multi-chip assembly |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111816575A (en) * | 2020-06-19 | 2020-10-23 | 浙江亚芯微电子股份有限公司 | Three-chip packaging process |
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2020
- 2020-07-01 CN CN202021260128.9U patent/CN212569044U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111816575A (en) * | 2020-06-19 | 2020-10-23 | 浙江亚芯微电子股份有限公司 | Three-chip packaging process |
| CN111816575B (en) * | 2020-06-19 | 2022-01-28 | 浙江亚芯微电子股份有限公司 | Three-chip packaging process |
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