CN116679190A - Aging testing device for QFN (quad Flat No-lead) packaged chip - Google Patents

Abstract

The invention is suitable for the technical field of chip testing, and provides an aging testing device for QFN packaging chips, which comprises a fixed base and a mounting plate, wherein chip placing grooves are formed in the surface of the mounting plate, and heat dissipation grooves are formed in two sides of the mounting plate. This power chip aging testing device with good heat dispersion, through seting up the heat sink, after the test chip main part is ending the test, outside air current accessible heat sink gets into in the chip standing groove and dispels the heat to the mounting panel, and through last intake pipe and lower intake pipe's setting, the gaseous accessible in the entering chip standing groove goes up intake pipe and is discharged with lower intake pipe, thereby the inside heat-conducting plate of lower intake pipe can continue to adsorb the temperature around the test chip main part when increasing the fluidness of the air current in the chip standing groove, and contact with the air, increase the radiating area of test chip main part, make the radiating efficiency of test chip main part promote, and a structure is simple, labour saving and time saving.

Description

Aging testing device for QFN (quad Flat No-lead) packaged chip

Technical Field

The invention belongs to the technical field of chip testing, and particularly relates to an aging testing device for a QFN (quad Flat No-lead) packaged chip.

Background

QFN is one of quad flat no-lead packages, and surface mount packages, and it is noted that QFN packages are completely different from LCC packages, and LCC still has epitaxial leads, but the leads are bent to the bottom, while QFN packages do not have any epitaxial leads at all, and in order to ensure the reliability of a chip, after the chip is manufactured, it is often necessary to complete a burn-in test process in a burn-in test device, i.e. at a high temperature, generally 85 ℃ or above, to apply a high voltage higher than an operation power voltage to a signal lead of the chip for a long time, so that each unit inside the chip is subjected to an excessive load, and defects in the chip are exposed as early as possible, thereby detecting a defective chip.

When the existing high-precision and high-precision electronic devices are subjected to burn-in test, because the electronic devices are sensitive to temperature changes and changes of a test environment, before a test object is replaced, the temperature stability of a test seat and the test environment can be ensured through proper cooling and balancing, and the temperature level is the same as that of the previous test object, so that a new chip can be tested in the same test environment, the thermal inertia and temperature difference among the test objects can be reduced to the greatest extent, and the test precision and reliability can be improved.

The existing aging testing device for chips heats the aging testing process for chips, because the temperature is too high, heat dissipation is slow, the chips are required to be placed for a long time for heat dissipation, so that a plurality of test seats are required to be used for saving time, the current test seats are required to be detached after the test is finished, new test seats are required to be replaced for continuing testing of subsequent chips, when the tested chips are more, workers need to repeatedly detach and replace the test seats, and the operation strength is more troublesome.

Disclosure of Invention

The invention provides a burn-in testing device for QFN packaged chips, which aims to solve the problems that when more chips need to be tested, workers need to repeatedly detach and replace test seats, the disassembly and replacement are troublesome, and the working strength is high.

The invention is realized in such a way that the aging testing device for the QFN packaged chip comprises a fixed base and a mounting plate, wherein the chip placing groove is arranged on the surface of the mounting plate, heat dissipation grooves are formed in two sides of the mounting plate, and a testing chip main body is arranged in the chip placing groove; an upper air inlet pipe used for ventilation is arranged in the mounting plate and positioned at one side of the chip placing groove, and a lower air inlet pipe used for ventilation is arranged in the mounting plate and positioned at two sides of the bottom of the chip placing groove, and both the upper air inlet pipe and the lower air inlet pipe extend to the outside of the mounting plate; the temperature measuring assembly is arranged on the top cover, the conductive plate is arranged in the fixed base and used for conducting electricity, the pin base electrically connected with the conductive plate is arranged at the bottom of the fixed base, and the connecting seat is arranged at the bottom of the fixed base; a heat dissipation cavity is formed in the mounting plate and located on the other side of the chip placing groove, a heat dissipation plate is transversely and fixedly arranged at the top of the heat dissipation cavity, a vent hole is formed in the heat dissipation plate, spoilers matched with the heat dissipation groove are detachably arranged on two sides of the surface of the top cover, and a heat conduction plate is transversely and fixedly arranged at the bottom in the lower air inlet pipe; locate in the mounting panel and be located chip standing groove one side is used for the centre gripping clamping assembly, the clamping assembly is including locating the rotation chamber in the unable adjustment base, the inside in rotation chamber is equipped with and is used for pivoted dwang, the surface of dwang is equipped with the release board.

Preferably, the cross section of the push-out plate is concave, sliding cavities positioned at two sides of the rotating cavity are formed in the mounting plate, and rotating gears positioned in the rotating cavity and positioned at two ends of the rotating rod are arranged in the mounting plate.

Preferably, the clamping rod is arranged in the sliding cavity and used for sliding, a tooth slot matched with the rotating gear is formed in the lower surface of the clamping rod, and a supporting spring is directly and telescopically arranged on one side of the clamping rod and the inner wall of the sliding cavity in a transverse mode.

Preferably, the upper surface fixed mounting of clamping lever has the connecting rod, the top of connecting rod extends to the mounting panel is outside, the surface of mounting panel seted up with the spout of connecting rod looks adaptation, the top of connecting rod transversely fixed mounting has the push pedal, the upper surface of push pedal is the arc setting.

Preferably, one end of the top cover is fixedly provided with a rotating seat, a supporting rod which is rotationally connected with the mounting plate is arranged in the rotating seat, and the temperature measuring assembly comprises a mounting groove which is arranged on the top cover.

Preferably, the inside of the mounting groove is vertically communicated with an upper communication hole, a supporting seat is fixedly arranged on one side of the top cover, which is close to the mounting plate, a protruding block is arranged in the supporting seat, and a lower communication hole communicated with the upper communication hole is formed in the protruding block.

Preferably, the connecting holes communicated with the upper air inlet pipe and the lower air inlet pipe are formed in two sides of the mounting plate, and threads for mounting are formed in the inner wall of the connecting holes.

Preferably, a clamping block for installation is arranged on the spoiler, and a clamping groove matched with the clamping block for use is formed in the surface of the top cover.

Preferably, a supporting protection pad is fixedly arranged on one side, far away from the clamping rod, of the inner wall of the chip placing groove.

Preferably, two ends of the rotating rod are rotatably connected with the inner wall of the rotating cavity through bearings.

Advantageous effects

Compared with the prior art, the invention has the beneficial effects that:

according to the aging testing device for the QFN packaging chip, the heat dissipation groove is formed, when the tested chip main body is fewer, the tested chip main body is fixed in the chip placement groove, then the temperature measuring assembly is used for enabling the external temperature measuring device to penetrate through the top cover and directly detect the tested chip main body in the chip placement groove, after the tested chip main body is installed in the chip placement groove, the pin base is inserted into the testing base, when the tested chip main body is subjected to power-on testing, the temperature measuring device detects the temperature of the tested chip main body, when the tested chip is fewer, through the arrangement of the heat dissipation groove, the external air flow can enter the chip placement groove through the heat dissipation groove to dissipate heat of the mounting plate after the test chip main body finishes testing, and through the arrangement of the upper air inlet pipe and the lower air inlet pipe, the air entering the chip placement groove can be discharged through the upper air inlet pipe and the lower air inlet pipe, so that the heat conducting plate in the lower air inlet pipe can continuously adsorb the temperature around the tested chip main body and contact air at the same time, the labor area of the testing seat is increased, the heat dissipation efficiency of the device main body is improved, the heat dissipation efficiency of the device main body is maintained, and the heat dissipation intensity of test data of test main body is not required to be stably replaced, and test data is not required to be repeatedly replaced, and test data is reduced.

According to the aging testing device for the QFN packaged chips, when the number of the tested chip main bodies to be tested is large, the external blowing device is connected through the connecting holes, then the spoiler is installed on the top cover, after the testing of the tested chip main bodies is finished, the blowing device is started, so that cold air enters the chip placing groove through the upper air inlet pipe and the lower air inlet pipe to dissipate heat, then the air flow in the heat dissipating groove is blocked by the spoiler, the air flow enters the heat dissipating cavity through the heat dissipating plate, heat absorbed by the heat conducting plate is dissipated, the device can ensure the working efficiency of different working environments, meanwhile, the heat dissipating efficiency of the tested chip main bodies is increased, the problem that workers need to wait for a long time due to low traditional heat dissipating efficiency is solved, after a plurality of chips are tested, the chips are not cooled completely due to carelessness, and the chips are scalded when taken out is solved.

According to the aging testing device for the QFN packaged chips, when the testing chip main body is placed on the chip placing groove through the clamping component, the supporting spring can support the clamping rod, so that the clamping rod extrudes one side of the testing chip main body, auxiliary positioning is carried out, the supporting protection pad is matched, the testing chip main body is fixed in the chip placing groove, then the top cover and the mounting plate are closed, the convex block is abutted to the testing chip main body, pins at the bottom of the testing chip main body can be tightly attached to the conductive plates, so that the pins are electrically connected with the pin bases, when the testing chip main body is taken out, the clamping rod moves inwards, the clamping rod releases the clamping of the testing chip main body, the supporting spring contracts and generates elastic force, then the tooth grooves at the bottom of the clamping rod are meshed with the surface of the rotating gear, the pushing plate is driven to rotate reversely, one end of the pushing plate pushes one side of the testing chip main body upwards, the fixing of the testing chip main body can be relieved, then the testing chip main body is taken out by a tool, the testing chip main body is simple in structure, time and labor are saved, and repeated adjustment by a worker is not needed.

Drawings

FIG. 1 is a schematic top view of a structure of the present invention;

FIG. 2 is an enlarged schematic view of the structure of FIG. 1A according to the present invention;

FIG. 3 is a schematic cross-sectional side view of a structural representation of a mounting plate and a stationary base of the present invention;

FIG. 4 is a schematic side view of the structure of the stationary base and the heat-conducting plate of the present invention;

FIG. 5 is a schematic top view showing the structure of the top cover and the upper communication hole of the present invention;

fig. 6 is a schematic bottom view showing the structure of the fixing base and the pin base of the present invention.

In the figure: 1. a fixed base; 2. a mounting plate; 3. a conductive plate; 4. a connecting seat; 5. a pin base; 6. testing the chip main body; 7. a chip placement groove; 8. supporting the protective pad; 9. a rotating chamber; 10. a rotating lever; 11. rotating the gear; 12. a push-out plate; 13. a clamping rod; 14. a sliding chamber; 15. a support spring; 16. a connecting rod; 17. a push plate; 18. a top cover; 19. an upper communication hole; 20. a mounting groove; 21. a support base; 22. a lower communication hole; 23. a bump; 24. a spoiler; 25. a connection hole; 26. an upper air inlet pipe; 27. a heat sink; 28. a heat dissipation plate; 29. a lower air inlet pipe; 30. a heat conductive plate; 31. a rotating seat; 32. a support rod; 33. a heat dissipation cavity.

Description of the embodiments

The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.

Referring to fig. 1-6, the present invention provides a technical solution of an burn-in test device for QFN package chips: the aging testing device for the QFN packaged chips comprises a fixed base 1 and a mounting plate 2, wherein chip placing grooves 7 are formed in the surface of the mounting plate 2, radiating grooves 27 are formed in two sides of the mounting plate 2, and a testing chip main body 6 is arranged in the chip placing grooves 7; an upper air inlet pipe 26 for ventilation is arranged in the mounting plate 2 and positioned on one side of the chip placing groove 7, a lower air inlet pipe 29 for ventilation is arranged in the mounting plate 2 and positioned on two sides of the bottom of the chip placing groove 7, and the upper air inlet pipe 26 and the lower air inlet pipe 29 extend to the outside of the mounting plate 2.

After the test chip main body 6 is tested in the chip placing groove 7, external air flow can enter the chip placing groove 7 through the heat dissipation groove 27 to dissipate heat of the mounting plate 2, so that the test seat main body dissipates heat rapidly, air in the chip placing groove 7 can be discharged through the upper air inlet pipe 26 and the lower air inlet pipe 29, the circulation of the air flow in the chip placing groove 7 is improved, the heat dissipation efficiency of the mounting plate 2 is improved, and the waiting time of workers is reduced.

The top cover 18 is arranged on the mounting plate 2 and used for closing, the top cover 18 is provided with a temperature measuring component, the conducting plate 3 is arranged in the fixed base 1 and used for conducting electricity, the bottom of the fixed base 1 is provided with a pin base 5 electrically connected with the conducting plate 3, and the bottom of the fixed base 1 is provided with a connecting seat 4.

Before testing, the test chip main body 6 is contacted with the external temperature measuring device through the temperature measuring assembly and the test chip main body 6 in the chip placing groove 7, and then the test is started.

The aging test device has various size models, the structural principle is the same, so that QFN packaging chips with different sizes are tested, the aging test device has various PIN number settings with the same size model, the PIN number range is 16-32, and a user can freely select a test seat which accords with the PIN number of the chip according to the requirement.

A heat dissipation cavity 33 is arranged in the mounting plate 2 and positioned on the other side of the chip placing groove 7, a heat dissipation plate 28 is transversely and fixedly arranged at the top of the heat dissipation cavity 33, a vent hole is arranged in the heat dissipation plate 28, spoilers 24 matched with the heat dissipation grooves 27 are detachably arranged on two sides of the surface of the top cover 18, and a heat conduction plate 30 is transversely and fixedly arranged at the bottom of the heat dissipation cavity 33.

Through setting up the inside heat conduction board 30 of heat dissipation chamber 33, when test chip main part 6 after the test, mounting panel 2 produced the high temperature, the inside heat conduction board 30 of heat dissipation chamber 33 absorbed the heat, and when gas was through the heat dissipation intracavity 33, the air current can blow away the heat on heat conduction board 30 surface to equal to increase radiating area, consequently radiating efficiency has obtained the promotion.

The clamping assembly is arranged in the mounting plate 2 and positioned on one side of the chip placing groove 7 and used for clamping, the clamping assembly comprises a rotating cavity 9 arranged in the fixed base 1, a rotating rod 10 used for rotating is arranged in the rotating cavity 9, and a push-out plate 12 is arranged on the surface of the rotating rod 10.

In the present embodiment, after the test chip body 6 is placed on the chip placement groove 7, the clamping assembly in the mounting board 2 can clamp the test chip body 6.

Further, the cross section of the push-out plate 12 is concave, sliding cavities 14 located at two sides of the rotating cavity 9 are formed in the mounting plate 2, rotating gears 11 located in the rotating cavity 9 and located at two ends of the rotating rod 10 are arranged in the sliding cavities 14, clamping rods 13 used for sliding are arranged in the sliding cavities 14, tooth grooves matched with the rotating gears 11 are formed in the lower surfaces of the clamping rods 13, and supporting springs 15 are directly and telescopically arranged on one sides of the clamping rods 13 and the inner walls of the sliding cavities 14 in the transverse direction.

In this embodiment, through the push-out plate 12, when the test chip main body 6 is installed, the clamping rod 13 slides inwards, so that the sliding cavity 14 contracts and generates elastic force, then the rotating gear 11 rotates reversely, the push-out plate 12 is driven to incline, then the test chip main body 6 is placed in the chip placing groove 7, the clamping rod 13 is released, the sliding cavity 14 drives the clamping rod 13 to reset, the clamping rod 13 is attached to the test chip main body 6 to clamp, and meanwhile, the tooth groove at the bottom of the clamping rod 13 is meshed with the rotating gear 11, so that the rotating gear 11 drives the rotating rod 10 to rotate positively, and one end of the push-out plate 12 close to the test chip main body 6 moves downwards.

When the test chip is taken out, the clamping rods 13 are pressed inwards, so that one end of the push-out plate 12, which is close to the test chip main body 6, moves upwards to push out the test chip main body 6, and the fixing can be released.

Further, the upper surface fixed mounting of clamping lever 13 has connecting rod 16, and the top of connecting rod 16 extends to the mounting panel 2 outside, and the spout with connecting rod 16 looks adaptation has been seted up on the surface of mounting panel 2, and the top of connecting rod 16 transversely fixed mounting has push pedal 17, and the upper surface of push pedal 17 is the arc setting.

In this embodiment, through the push plate 17, make the height of push plate 17 slightly higher than the surface of mounting panel 2, and set up the recess of mating push plate 17 on the top cap 18, make when top cap 18 is closed on mounting panel 2, the lug 23 closely laminates test chip main part 6 and does not extrude push plate 17, after test chip main part 6 heat dissipation is finished, open top cap 18, then slide push plate 17, make push plate 17 drive clamping lever 13 remove to the inner chamber of sliding chamber 14, make supporting spring 15 receive the extrusion while and produce elasticity, then clamping lever 13 drives dwang 10 and release plate 12 through the meshing with swivelling gear 11 and reverses, and make the one end that release plate 12 is close to test chip main part 6 upwards lift up to release test chip main part 6 can.

Further, a rotating seat 31 is fixedly installed at one end of the top cover 18, a supporting rod 32 which is rotatably connected with the mounting plate 2 is arranged in the rotating seat 31, and the temperature measuring assembly comprises a mounting groove 20 arranged on the top cover 18.

In this embodiment, the top cover 18 is rotatably connected to the mounting plate 2 through a damping bearing via a support rod 32, and when the top cover 18 needs to be opened, the top cover 18 is pushed upward away from one end of the rotating seat 31, and the top cover 18 can be opened by the rotating seat 31.

Further, an upper communication hole 19 is vertically formed in the mounting groove 20, a supporting seat 21 is fixedly mounted on one side, close to the mounting plate 2, of the top cover 18, a protruding block 23 is arranged in the supporting seat 21, and a lower communication hole 22 communicated with the upper communication hole 19 is formed in the protruding block 23.

In this embodiment, when the top cover 18 is closed on the mounting plate 2 through the lower communication hole 22, the external temperature measuring device can make contact with the upper surface of the test chip main body 6 through the upper communication hole 19 and the lower communication hole 22, and measure the temperature when the test chip main body 6 works.

Further, the two sides of the mounting plate 2 are provided with connecting holes 25 communicated with the upper air inlet pipe 26 and the lower air inlet pipe 29, and the inner wall of the connecting holes 25 is provided with threads for mounting.

In this embodiment, the external air supply device is externally connected to the testing device through the connection hole 25 by the screw threads, and the air supply device can input air into the chip placement groove 7 through the connection hole 25 to radiate heat of the testing chip main body 6.

Further, a clamping block for installation is arranged on the spoiler 24, and a clamping groove matched with the clamping block for use is formed in the surface of the top cover 18.

In this embodiment, through draw-in groove and fixture block for the device can freely assemble because of the working strength to the difference, when the chip is less, can insert the spoiler 24 in the draw-in groove and carry out the case, when the chip is more, in the spoiler 24 inserts the draw-in groove through the fixture block, the air current in the spoiler 24 to the heat dissipation groove 27 is blocked, make the air current get into in the heat dissipation chamber 33 through heating panel 28, dispel the heat to the heat-conducting plate 30 absorbing heat, make the device can be because of the radiating efficiency to the work environment of difference, increase test chip main part 6 when guaranteeing work efficiency, thereby reduce because traditional radiating efficiency is lower, lead to the staff to need wait longer problem.

Further, a supporting protection pad 8 is fixedly installed on one side, far away from the clamping rod 13, of the inner wall of the chip placing groove 7.

In this embodiment, by providing the support protection pad 8, the clamping rod 13 can be matched, so that the support protection pad 8 supports the other side of the test chip body 6 when the clamping rod 13 fixes the test chip body 6, thereby fixing the test chip body 6.

Further, both ends of the rotating rod 10 are rotatably connected with the inner wall of the rotating cavity 9 through bearings.

In the present embodiment, the rotation lever 10 is rotatable in the inner cavity of the rotation chamber 9 by the arrangement of the bearings.

The working principle and the using flow of the invention are as follows: after the invention is installed, when the test chip main body 6 is placed on the chip placing groove 7, the supporting spring 15 can support the clamping rod 13, so that the clamping rod 13 extrudes one side of the test chip main body 6 to perform auxiliary positioning, the test chip main body 6 is fixed in the chip placing groove 7 by matching with the arrangement of the supporting protection pad 8, then the top cover 18 and the mounting plate 2 are closed, the convex block 23 is abutted on the test chip main body 6, the pins at the bottom of the test chip main body 6 are tightly attached to the conductive plate 3, the pin bases 5 are electrically connected with the pin bases, then the pin bases 5 are installed on the test bases, the test chip main body 6 is subjected to power-on test, and after the test is finished, the top cover 18 is opened, the push plate 17 is pushed inwards.

When the test chip main body 6 to be tested is less, after the test chip main body 6 is fixed in the chip placing groove 7, the temperature measuring assembly is used later, the external temperature measuring device passes through the top cover 18 and can directly detect the test chip main body 6 inside the chip placing groove 7, after the test chip main body 6 is installed in the chip placing groove 7, the pin base 5 is inserted into the test base, when the test chip main body 6 is electrified and tested, the temperature measuring device detects the temperature of the test chip main body 6, when the tested chip is less, the temperature measuring device is arranged through the heat dissipation groove 27, so that after the test chip main body 6 is tested, external air flow can enter the chip placing groove 7 through the heat dissipation groove 27 to dissipate heat of the mounting plate 2.

When the number of the test chip main bodies 6 to be tested is large, the external blowing device is connected through the connecting hole 25, then the spoiler 24 is installed on the top cover 18, after the test of the test chip main bodies 6 is finished, the blowing device is started, so that after cold air enters the chip placing groove 7 through the upper air inlet pipe 26 and the lower air inlet pipe 29 to dissipate heat, the air flow reaches the heat dissipation groove 27, then the spoiler 24 blocks the air flow in the heat dissipation groove 27, so that the air flow enters the heat dissipation cavity 33 through the heat dissipation plate 28, and the heat absorbed by the heat conduction plate 30 is dissipated.

The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the invention.

Claims (10)

1. A QFN package chip burn-in test device is characterized in that: the test device comprises a fixed base (1) and a mounting plate (2), wherein a chip placing groove (7) is formed in the surface of the mounting plate (2), radiating grooves (27) are formed in two sides of the mounting plate (2), and a test chip main body (6) is arranged in the chip placing groove (7);

an upper air inlet pipe (26) for ventilation is arranged in the mounting plate (2) and positioned at one side of the chip placing groove (7), and a lower air inlet pipe (29) for ventilation is arranged in the mounting plate (2) and positioned at two sides of the bottom of the chip placing groove (7), wherein the upper air inlet pipe (26) and the lower air inlet pipe (29) extend to the outside of the mounting plate (2);

the device comprises a mounting plate (2), a top cover (18) arranged on the mounting plate (2) and used for closing, a temperature measuring assembly arranged on the top cover (18), a conductive plate (3) arranged in the fixing base (1) and used for conducting electricity, a pin base (5) electrically connected with the conductive plate (3) arranged at the bottom of the fixing base (1), and a connecting seat (4) arranged at the bottom of the fixing base (1);

a heat dissipation cavity (33) is formed in the mounting plate (2) and located at the other side of the chip placement groove (7), a heat dissipation plate (28) is transversely and fixedly arranged at the top of the heat dissipation cavity (33), a vent hole is formed in the heat dissipation plate (28), spoilers (24) matched with the heat dissipation groove (27) are detachably arranged on two sides of the surface of the top cover (18), and a heat conduction plate (30) is transversely and fixedly arranged at the bottom in the lower air inlet pipe (29);

locate in mounting panel (2) and be located the centre gripping subassembly that chip standing groove (7) one side was used for the centre gripping, the centre gripping subassembly is including locating rotating cavity (9) in unable adjustment base (1), the inside in rotating cavity (9) is equipped with and is used for pivoted dwang (10), the surface of dwang (10) is equipped with release board (12).

2. The burn-in apparatus for QFN package chips of claim 1, wherein: the cross section of the push-out plate (12) is concave, sliding cavities (14) positioned at two sides of the rotating cavity (9) are formed in the mounting plate (2), and rotating gears (11) which are arranged in the rotating cavity (9) and positioned at two ends of the rotating rod (10) are arranged in the mounting plate.

3. The burn-in apparatus for QFN package chips of claim 2, wherein: the clamping rod (13) is arranged in the sliding cavity (14) and used for sliding, tooth grooves matched with the rotating gear (11) are formed in the lower surface of the clamping rod (13), and a supporting spring (15) is directly and telescopically arranged on one side of the clamping rod (13) and the inner wall of the sliding cavity (14) in the transverse direction.

4. The burn-in apparatus for QFN package chips of claim 3, wherein: the upper surface fixed mounting of clamping lever (13) has connecting rod (16), the top of connecting rod (16) extends to mounting panel (2) is outside, the spout with connecting rod (16) looks adaptation is seted up on the surface of mounting panel (2), the top of connecting rod (16) transversely fixed mounting has push pedal (17), the upper surface of push pedal (17) is the arc setting.

5. The burn-in apparatus for QFN package chips of claim 1, wherein: one end of the top cover (18) is fixedly provided with a rotating seat (31), a supporting rod (32) which is rotationally connected with the mounting plate (2) is arranged in the rotating seat (31), and the temperature measuring assembly comprises a mounting groove (20) arranged on the top cover (18).

6. The burn-in apparatus for QFN package chips of claim 5, wherein: the inside of mounting groove (20) is vertical to link up and has seted up upper communication hole (19), top cap (18) be close to one side fixed mounting of mounting panel (2) has supporting seat (21), be equipped with lug (23) in supporting seat (21), set up in lug (23) with lower communication hole (22) that upper communication hole (19) are linked together.

7. The burn-in apparatus for QFN package chips of claim 1, wherein: connecting holes (25) communicated with the upper air inlet pipe (26) and the lower air inlet pipe (29) are formed in two sides of the mounting plate (2), and threads for mounting are formed in the inner wall of the connecting holes (25).

8. The burn-in apparatus for QFN package chips of claim 1, wherein: the spoiler (24) is provided with a clamping block for installation, and the surface of the top cover (18) is provided with a clamping groove matched with the clamping block for use.

9. The burn-in apparatus for QFN package chips of claim 4, wherein: the inner wall of the chip placing groove (7) and one side far away from the clamping rod (13) are fixedly provided with a supporting protection pad (8).

10. The burn-in apparatus for QFN package chips of claim 1, wherein: the two ends of the rotating rod (10) are rotatably connected with the inner wall of the rotating cavity (9) through bearings.