CN212542663U - AIP packaging antenna structure and system-in-package structure - Google Patents
AIP packaging antenna structure and system-in-package structure Download PDFInfo
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- CN212542663U CN212542663U CN202021538094.5U CN202021538094U CN212542663U CN 212542663 U CN212542663 U CN 212542663U CN 202021538094 U CN202021538094 U CN 202021538094U CN 212542663 U CN212542663 U CN 212542663U
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- antenna
- aip
- semiconductor chip
- package
- antenna structure
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- 238000004806 packaging method and process Methods 0.000 title abstract description 16
- 239000004065 semiconductor Substances 0.000 claims abstract description 42
- 238000003466 welding Methods 0.000 claims abstract description 20
- 239000005022 packaging material Substances 0.000 claims abstract description 5
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 239000002390 adhesive tape Substances 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 abstract description 7
- 238000010586 diagram Methods 0.000 description 8
- 238000012858 packaging process Methods 0.000 description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 6
- 238000004891 communication Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Variable-Direction Aerials And Aerial Arrays (AREA)
Abstract
The utility model discloses an AIP encapsulation antenna structure and system level packaging structure, include: the antenna comprises a carrier plate and a semiconductor chip, wherein one side of the semiconductor chip is connected with the carrier plate, the other side of the semiconductor chip is provided with a welding pad, the welding pad is connected with an antenna, the semiconductor chip and the antenna are plastically packaged by plastic packaging materials, and a receiving surface of the antenna is exposed. The antenna and the semiconductor chip are integrated and packaged in an independent packaging body, the size of the packaging structure is reduced, and the semiconductor chip and the carrier plate form line connection, so that the antenna and the semiconductor chip can be applied to millimeter wave radar and automobile radar systems.
Description
Technical Field
The utility model relates to an AIP encapsulation antenna technical field especially relates to an AIP encapsulation antenna structure and system level packaging structure.
Background
The statements in this section merely provide background information related to the present disclosure and may not necessarily constitute prior art.
The AIP packaging antenna technology conforms to the trend of improving the integration level of a silicon-based semiconductor process, and provides a good antenna and packaging solution for a system-level wireless chip. At present, a plurality of manufacturers adopt AIP technology to realize communication and millimeter wave radar systems, and in the field of millimeter wave communication and automobile radar chips, AIP packaged antenna technology is taken as an alternative.
The AIP packaging antenna technology comprises an antenna, an intermediate medium layer (with a cavity inside) and a system PCB; the integration of the antenna on the top surface of the chip with an internal cavity in the middle layer of the package, i.e. below the antenna, for the placement of other RF modules has the advantages of simplified system design, miniaturization, low cost and low power consumption.
The traditional packaging method is that a chip, an antenna and a transceiver are mounted on a PCB (printed circuit board), the antenna occupies a larger space, the future trend of miniaturization of system packaging is hindered, and the problems that an external antenna is large in size, complex in structure and incapable of being effectively matched with a receiver exist.
Disclosure of Invention
In order to solve the problem, the utility model provides an AIP encapsulation antenna structure and system level packaging structure, with antenna and semiconductor chip integrated package in independent packaging body, reduce packaging structure's volume to form line connection between semiconductor chip and support plate, can be applied to in millimeter wave radar and the car radar system.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
in a first aspect, the present invention provides an AIP package antenna structure, including: the antenna comprises a carrier plate and a semiconductor chip, wherein one side of the semiconductor chip is connected with the carrier plate, the other side of the semiconductor chip is provided with a welding pad, the welding pad is connected with an antenna, the semiconductor chip and the antenna are plastically packaged by plastic packaging materials, and a receiving surface of the antenna is exposed.
In a second aspect, the present invention provides a system in package structure, including: the AIP package antenna structure of the first aspect.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model discloses an AIP encapsulates antenna structure, with antenna connection on the semiconductor chip, encapsulates antenna and semiconductor wholly, forms independent AIP encapsulation antenna structure, reduces packaging structure's volume.
The utility model discloses an AIP encapsulation antenna structure uses the welding wire bonding between semiconductor chip and the support plate, forms the line connection with the support plate, accomplishes semiconductor chip and the whole plastic envelope of antenna, forms low-power consumption, high accuracy AIP encapsulation antenna, has solved external antenna bulky, the problem that the structure is complicated to can be better match with the receiver, but the integration is applied to in millimeter wave radar and the car radar system.
Drawings
The accompanying drawings, which form a part of the specification, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention without unduly limiting the scope of the invention.
Fig. 1 is a schematic diagram of an AIP packaged antenna structure provided in embodiment 1 of the present invention;
fig. 2 is a schematic diagram of the step (1) of the AIP packaged antenna packaging process provided in embodiment 1 of the present invention;
fig. 3 is a schematic diagram of step (2) of the AIP packaged antenna packaging process provided in embodiment 1 of the present invention;
fig. 4 is a schematic diagram of step (3) of the AIP packaged antenna packaging process provided in embodiment 1 of the present invention;
fig. 5 is a schematic diagram of the step (4) of the AIP packaged antenna packaging process provided in embodiment 1 of the present invention;
fig. 6 is a schematic diagram of the step (5) of the AIP packaged antenna packaging process provided in embodiment 1 of the present invention;
fig. 7 is a top view of the step (5) of the AIP packaged antenna packaging process provided in embodiment 1 of the present invention;
fig. 8 is a schematic diagram of the step (6) of the AIP packaged antenna packaging process provided in embodiment 1 of the present invention;
fig. 9 is a schematic diagram of a system in package structure provided in embodiment 2 of the present invention;
wherein, 1, a carrier plate; 2. a semiconductor chip; 3. a pad; 4. an antenna; 5. plastic packaging material; 6. a binder; 7. tin balls; 8. welding wires; 9. a golden finger.
The specific implementation mode is as follows:
the present invention will be further explained with reference to the accompanying drawings and examples.
It should be noted that the following detailed description is exemplary and is intended to provide further explanation of the invention. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments in accordance with the invention. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.
In the present invention, the terms such as "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "side", "bottom", and the like indicate the position or positional relationship based on the position or positional relationship shown in the drawings, and are only the terms determined for convenience of describing the structural relationship of each component or element of the present invention, and are not specific to any component or element of the present invention, and are not to be construed as limiting the present invention.
In the present invention, terms such as "fixedly connected", "connected", and the like are to be understood in a broad sense, and may be a fixed connection, or an integral connection or a detachable connection; may be directly connected or indirectly connected through an intermediate. The meaning of the above terms in the present invention can be determined according to specific situations by persons skilled in the art, and should not be construed as limiting the present invention.
Example 1
As shown in fig. 1, the present embodiment provides an AIP package antenna structure, which includes: the antenna comprises a carrier plate 1 and a semiconductor chip 2, wherein one side of the semiconductor chip 2 is connected with the carrier plate 1, the other side of the semiconductor chip is provided with a welding pad 3, the welding pad 3 is connected with an antenna 4, the semiconductor chip 2 and the antenna 4 are plastically packaged by a plastic packaging material 5, and a receiving surface of the antenna 4 is exposed.
In the present embodiment, the semiconductor chip 2 and the carrier board 1 are connected by an adhesive 6, as shown in fig. 2;
preferably, the adhesive 6 is a piece of glue or an adhesive Tape.
It can be understood that a plurality of semiconductor chips 2 can be sequentially adhered to the carrier board 1, and the semiconductor chips 2 do not interfere with each other and form independent chip units respectively.
As shown in fig. 3, bumps are provided at the pads 3 where the semiconductor chip 2 receives or transmits signals;
the welding pad 3 is used for transmitting signals; in the embodiment, the bonding pads 3 are located on the other side of the semiconductor chip 2 connected to the carrier board 1, and the number of the bonding pads 3 is not limited herein and is determined according to the actual semiconductor chip transmit-receive signal;
connecting an antenna 4 on the salient point;
it can be understood that the antennas 4 may be disposed in pairs, and the receiving antenna and the transmitting antenna are disposed on the receiving signal pad and the transmitting signal pad, respectively, to complete the transceiving of signals.
As shown in fig. 4, the pad 3 of the semiconductor chip 2 is bonded to the carrier board 1 by a bonding wire 8, so as to electrically connect the semiconductor chip 2 to the carrier board 1;
in this embodiment, the welding wire 8 is a gold wire, which has the advantages of high conductivity, corrosion resistance and good toughness;
it is understood that the bonding wire 8 is not limited to gold wire, and in other embodiments, the bonding wire may be gold wire, copper wire or alloy wire.
As can be understood, the pad 3 is connected to the gold finger 9 on the carrier board 1 through the bonding wire 8, and the signal is transmitted through the gold finger; the golden finger consists of a plurality of golden conductive contact blades, the surface of the golden conductive contact blades is plated with gold, and the golden conductive contact blades are arranged like fingers.
As shown in fig. 5, the semiconductor chip 2 and the antenna 4 are integrally molded in a mold with a mold material 5;
after plastic package is completed, a receiving surface, namely the upper surface of the antenna is exposed;
it will be appreciated that portions of the antenna may be left exposed, so long as the receiving face of the antenna is left exposed.
As shown in fig. 6-7, after the plastic package is completed, the plastic package body is cut into individual plastic package units, so as to form an independent AIP package antenna with low power consumption and high precision.
It will be understood that a plurality of semiconductor chips are attached to the carrier board 1, and that each semiconductor chip 2 is cut into individual units during dicing.
As shown in fig. 8, a solder ball 7 is implanted under the carrier 1, and the solder ball 7 and the PCB form an interconnection;
the AIP packaging antenna structure of the embodiment is applied to the field of communication or radar systems;
in the present embodiment, the solder balls 7 are symmetrically disposed on the carrier 1.
In this embodiment, a specific packaging process of the AIP packaged antenna structure includes:
(1) fixing the semiconductor chip on the carrier plate through an adhesive;
taking the radar chip as an example, the radar chip is sequentially adhered to the carrier plate through the upper glue or the adhesive Tape.
(2) And salient points are arranged above the welding pads for receiving signals or sending signals of the radar chip, and the salient points are connected with an antenna.
(3) And bonding the welding pad for transmitting signals with the carrier plate by using a welding wire.
(4) And (3) using a plastic package material to complete the integral plastic package of the radar chip and the antenna in a plastic package mold, wherein the upper surface or part of the antenna is exposed in the air.
(5) And cutting the plastic package body after plastic package into independent plastic package units to form the independent AIP packaged antenna.
(6) And implanting solder balls below the plastic package unit carrier plate after plastic package, wherein the solder balls and the PCB form interconnection, and the method is applied to the field of communication or radar systems.
Example 2
As shown in fig. 9, the present embodiment provides a system-in-package structure, including: the AIP package antenna structure described in embodiment 1 is integrated in an SIP system-in-package, and is interconnected with other components of the SIP system-in-package by a line to implement signal reception and transmission of a system board.
The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Although the present invention has been described with reference to the accompanying drawings, it is not intended to limit the scope of the present invention, and those skilled in the art should understand that various modifications or variations that can be made by those skilled in the art without inventive work are still within the scope of the present invention.
Claims (10)
1. An AIP package antenna structure, comprising: a carrier plate and a semiconductor chip;
one side of the semiconductor chip is connected with the carrier plate, the other side of the semiconductor chip is provided with a welding pad, the welding pad is connected with the antenna, the semiconductor chip and the antenna are plastically packaged through a plastic packaging material, and the receiving surface of the antenna is exposed.
2. The AIP package antenna structure of claim 1,
the semiconductor chip is connected with the carrier plate through an adhesive.
3. The AIP package antenna structure of claim 2,
the adhesive is made of upper piece glue or adhesive tape.
4. The AIP package antenna structure of claim 1,
and arranging a salient point on the welding pad, and connecting an antenna on the salient point.
5. The AIP package antenna structure of claim 1,
the welding pad of the semiconductor chip is connected with the carrier plate through a welding wire.
6. The AIP package antenna structure of claim 5,
the welding wire is connected with the golden finger on the carrier plate.
7. The AIP package antenna structure of claim 1,
the welding pad is positioned at a signal receiving or sending position of the semiconductor chip and is used for transmitting signals.
8. The AIP package antenna structure of claim 1,
and solder balls are arranged on the bottom surface of the carrier plate and are connected with the PCB.
9. The AIP package antenna structure of claim 8,
the solder balls are symmetrically arranged.
10. A system in a package structure, comprising: the AIP package antenna structure of any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021538094.5U CN212542663U (en) | 2020-07-28 | 2020-07-28 | AIP packaging antenna structure and system-in-package structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021538094.5U CN212542663U (en) | 2020-07-28 | 2020-07-28 | AIP packaging antenna structure and system-in-package structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212542663U true CN212542663U (en) | 2021-02-12 |
Family
ID=74517228
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021538094.5U Expired - Fee Related CN212542663U (en) | 2020-07-28 | 2020-07-28 | AIP packaging antenna structure and system-in-package structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212542663U (en) |
-
2020
- 2020-07-28 CN CN202021538094.5U patent/CN212542663U/en not_active Expired - Fee Related
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210212 |
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| CF01 | Termination of patent right due to non-payment of annual fee |